Ceramic bearing device for thin glass processing and preparation method of ceramic supporting strip

Abstract

The invention discloses a ceramic bearing device for thin glass processing and a ceramic supporting strip preparation method, the ceramic bearing device for thin glass processing comprises a plurality of ceramic supporting strips and a supporting frame, the ceramic supporting strips are vertically arranged, and the plurality of ceramic supporting strips are arranged in parallel; the ceramic supporting strip comprises a continuous ceramic line, and the diameter of the ceramic line is 1-2 mm. The ceramic line is provided with a plurality of first arc-shaped ceramic line segments, every two adjacent first arc-shaped ceramic line segments are connected through a connecting part, and each connecting part comprises a horizontal ceramic line segment or a second arc-shaped ceramic line segment. The first arc-shaped ceramic line segment is of an arc-shaped structure; the arc-shaped ceramic line segment is of an arc-shaped structure; the ceramic support strip is prepared by integral forming; the prepared ultra-thin glass bearing device is resistant to acid and alkali corrosion and stable at high temperature, and the supporting strips used for bearing ultra-thin glass are integrally formed and long in service life.

Description

Technical Field

[0001] This invention relates to the field of ceramic support device technology, and in particular to a ceramic support device for thin glass processing and a method for preparing ceramic support strips. Background Technology

[0002] Foldable screen phones use ultra-thin glass with a thickness of about 30μm. In the current production process of ultra-thin glass, it is necessary to clamp and move it. Metal racks are commonly used as tooling components for clamping or carrying, which are used to support the sequential transfer of ultra-thin glass in multiple processes such as cleaning, tempering and re-cleaning. The ultrathin glass manufacturing process involves strong alkaline cleaning solutions and high-temperature potassium nitrate molten salt (approximately 420°C). The surface of the metal rack is easily corroded and needs to be coated with a fiber protective layer, resulting in multiple coating processes during the production of the metal rack. The process is complex and the coating layer is prone to peeling off, resulting in a short service life. In addition, different clamping devices need to be switched between different processes in ultrathin glass manufacturing, which leads to low efficiency.

[0003] Therefore, how to manufacture ultra-thin glass support devices that are resistant to acid and alkali corrosion, stable at high temperatures, and have a long service life due to the integrated molding of the support strips used to support ultra-thin glass has become an urgent problem to be solved in this field. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a ceramic support device and a method for preparing ceramic support strips for thin glass processing. This method enables the preparation of ultra-thin glass support devices that are resistant to acid and alkali corrosion, stable at high temperatures, and features integrated molding of support strips for supporting ultra-thin glass with a long service life.

[0005] One aspect of the present invention provides a ceramic support device for thin glass processing, characterized in that it comprises a plurality of ceramic support bars and a support frame, wherein the ceramic support bars are arranged vertically and the plurality of ceramic support bars are arranged in parallel. The ceramic support strip includes a continuous ceramic line with a diameter of 1-2 mm; The ceramic wire is provided with a plurality of first arc-shaped ceramic wire segments, and two adjacent first arc-shaped ceramic wire segments are connected by a connecting component, the connecting component including a horizontal ceramic wire segment or a second arc-shaped ceramic wire segment; The support frame includes a first support plate, a second support plate, and a third support plate, with the first support plate and the second support plate arranged in parallel. The ceramic support strips are connected at both ends to the first support plate and the second support plate, respectively; The ceramic support strip is perpendicular to the first support plate and the second support plate; The first arc-shaped ceramic line segment has an arc-shaped structure; the arc-shaped ceramic line segment has an arc-shaped structure; The ceramic support strip is integrally molded; The preferred support frame is a ceramic support frame, which includes yttrium-stabilized zirconium oxide and alumina.

[0006] Compared with the prior art, the present invention has the following beneficial effects: through thin glass processing... The ceramic support device includes several ceramic support strips, which are resistant to acid and alkali corrosion and stable at high temperatures. The ceramic support strips include a continuous ceramic line, which avoids damage to the ultra-thin glass when supporting it, and at the same time improves the strength of the ceramic support strips. The ceramic wire is provided with a plurality of first arc-shaped ceramic wire segments, the first arc-shaped ceramic wire segments being used... It can support ultra-thin glass; by connecting two adjacent first arc-shaped ceramic segments through connecting components, it can support multiple ultra-thin glass pieces simultaneously; By vertically setting the ceramic support strips and parallel setting the ceramic support strips, a groove is formed by several first arc-shaped ceramic segments that are located on a straight line. The ultra-thin glass is placed in the groove, so that the ceramic support device for thin glass processing can support the ultra-thin glass. At the same time, when the cleaning fluid cleans the ultra-thin glass, the cleaning fluid after cleaning flows out through the gaps between the ceramic support strips. The operation is simple and the cleaning efficiency is improved. The inclusion of a second arc-shaped ceramic segment in the connecting component facilitates a smoother connection between the first arc-shaped ceramic segment and the connecting component, thus preventing damage to the ultra-thin glass at the connection point. The ceramic support strips are connected to the first support plate and the second support plate at both ends, respectively, and the ceramic support strips are perpendicular to the first support plate and the second support plate, thereby fixing the ceramic support strips. The ceramic support strip is manufactured by integral molding, resulting in a ceramic support strip with high strength and long service life.

[0007] Furthermore, the ceramic support strip has a length of 12-36cm; The depth of the first arc-shaped ceramic line segment is 3-9cm; the maximum width of the first arc-shaped ceramic line segment is 1.5-4.5mm.

[0008] Furthermore, the first arc-shaped ceramic segments of the plurality of ceramic support strips form a plurality of grooves; and / or The ceramic support strip also includes two connectors, and the two ends of the ceramic support strip are connected to the first support plate and the second support plate respectively through the connectors.

[0009] Another aspect of the present invention provides a method for preparing a ceramic support strip, used for preparing... The ceramic support strip described.

[0010] Compared with the prior art, the present invention has the following beneficial effects: It achieves the preparation of ceramic supports... The support bars are integrally molded, resulting in high strength and a long service life. The prepared ceramic support strip includes a continuous ceramic line, wherein the ceramic line is provided with Several first arc-shaped ceramic segments will not deform or collapse, and the overall ceramic support strip will not deform. This avoids the problem of damage to the ultra-thin glass caused by several first arc-shaped ceramic segments forming several grooves to support the ultra-thin glass when several ceramic support strips are set in parallel.

[0011] Furthermore, the method for preparing the ceramic support strip includes the following steps: preparing a first photocurable... The slurry, the first UV-curable slurry includes materials from the first UV-curable resin system and ceramic powder; Prepare a second photocurable slurry, the second photocurable slurry comprising a second photocurable resin system. Materials, phenyl silicone resin; The first and second photocurable slurries are processed by a multi-material 3D printing device. A ceramic support blank is prepared by integral molding; The ceramic support strip includes a first arc-shaped ceramic segment blank, a connecting component blank, and an arc... Shaped support blank; The arc-shaped support blank includes a first arc-shaped support blank; The two adjacent first arc-shaped ceramic line segment blanks are connected by connecting component blanks. The first arc-shaped support blank is located inside the first arc-shaped ceramic segment blank, and both ends of the first arc-shaped support blank are connected to the first arc-shaped ceramic segment blank. After removing the binder from the ceramic support strip blank, it is sintered. After sintering, the first arc shape... The support blank disappears, resulting in the ceramic support strip.

[0012] The beneficial effect of the previous step is that the ceramic support strip blank is prepared by integral molding of the first photocurable slurry and the second photocurable slurry using a multi-material 3D printing device, thereby realizing the integral molding of the ceramic support strip and achieving high strength and no deformation of the ceramic support strip. Prepare a second photocurable slurry, the second photocurable slurry comprising a second photocurable resin system. Materials: phenyl silicone resin; the first arc-shaped support blank is located inside the first arc-shaped ceramic segment blank, and both ends of the first arc-shaped support blank are connected to the first arc-shaped ceramic segment blank; the first arc-shaped support blank supports the first arc-shaped ceramic segment blank, thus preventing deformation of the first arc-shaped ceramic segment blank; After the glue is removed from the support strip blank, it is sintered. After sintering, the first arc-shaped support blank disappears, and the first arc-shaped ceramic segment obtained after sintering the first arc-shaped ceramic segment blank is an arc-shaped structure. Thus, when several ceramic support strips are set in parallel, several grooves composed of several first arc-shaped ceramic segments are used to support the ultra-thin glass.

[0013] Furthermore, the connecting component blank is a horizontal ceramic line segment blank or a second arc-shaped ceramic blank. Porcelain segment blank; When the connecting component blank is the second arc-shaped ceramic segment blank, the arc-shaped support The blank body includes the second arc-shaped support blank body; Both ends of the second arc-shaped support blank are connected to the second arc-shaped ceramic line segment blank.

[0014] The beneficial effect of the previous step is that when the connecting component blank is the second arc-shaped ceramic... When preparing the ceramic segment blank, the arc-shaped support blank includes a second arc-shaped support blank; both ends of the second arc-shaped support blank are connected to the second arc-shaped ceramic segment blank, thereby realizing the preparation. The ceramic support strip will not deform, thus enabling two adjacent first arc-shaped ceramic segments of the ceramic support strip to be connected by a second arc-shaped ceramic segment. This facilitates a smoother connection between the first arc-shaped ceramic segment and the connecting component, avoiding damage to the ultra-thin glass at the connection point.

[0015] Furthermore, the first arc-shaped ceramic segment blank and the connecting component blank are obtained by photocuring the first photocurable slurry; The arc-shaped support blank is obtained by photocuring with a second photocurable slurry.

[0016] Furthermore, the process of preparing the first photocurable slurry includes the following steps: Prepare ceramic powder, wherein the ceramic powder comprises yttrium-stabilized zirconium oxide powder, alumina powder, rare earth oxide powder, titanium oxide powder, fiber powder, and zirconium silicate powder in a mass ratio of (60-85):(5-20):(2-8):(0-5):(0-10):(1-10); The ceramic powder has an average particle size of 0.3-2 μm; The materials for preparing the first photocurable resin system include trimethylolpropane triacrylate, polyurethane acrylate, photoinitiator, and tert-octylphenyl polyethylene glycol ether in a mass ratio of (50-70):(30-40):(0.2-0.4):(1-2). Then, the ceramic powder and the first photocurable resin system materials are mixed at a mass ratio of (50-60):(40-50) to obtain the first curing slurry. The viscosity of the first photocurable slurry is 2-4 Pa·s; The rare earth oxides include yttrium oxide or cerium oxide; The photoinitiator is one or more of trimethylbenzoyl-diphenylphosphine oxide, 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 1-hydroxycyclohexylphenyl ketone; Preferably, the fiber powder includes zirconium oxide fibers or alumina fibers; The beneficial effects of the previous step are that, by including yttrium-stabilized zirconia powder, alumina powder, rare earth oxide powder, titanium oxide powder, fiber powder, and zirconium silicate powder in a mass ratio of (60-85):(5-20):(2-8):(0-5):(0-10):(1-10), the ceramic support strip mainly comprises yttrium-stabilized zirconia, thereby achieving acid and alkali corrosion resistance; the ceramic support strip includes alumina, thereby achieving high strength; the ceramic support strip includes rare earth oxide powder, thereby achieving small grain size and stable structure; the ceramic support strip includes titanium oxide, further contributing to small grain size and stable structure, and smooth surface; the ceramic support strip includes fiber powder, thereby achieving acid and alkali resistance while improving toughness; and the ceramic support strip includes zirconium silicate powder, thereby achieving high internal structural stability and high degree of densification, and smooth surface. Then, the ceramic powder and the first photocurable resin system material are mixed at a mass ratio of (50-60):(40-50) to obtain the first curing slurry. This results in a ceramic support strip with a high solid content, which is beneficial for achieving high strength of the ceramic support strip. At the same time, it helps to avoid the problem of an uneven surface of the ceramic support strip caused by excessive content of the first photocurable resin system material. The first photocurable resin system comprises trimethylolpropane triacrylate, polyurethane acrylate, photoinitiator, and tert-octylphenyl polyethylene glycol ether in a mass ratio of (50-70):(30-40):(0.2-0.4):(1-2). This ensures the first photocurable resin system contains a high content of trimethylolpropane triacrylate, avoiding the problems of high viscosity and poor flowability caused by high ceramic powder content in the first photocurable slurry. Furthermore, because trimethylolpropane triacrylate contains multiple double bonds and has a high degree of crosslinking, it avoids the problem of low strength of the ceramic support strip blank caused by high ceramic powder content in the first photocurable slurry. The first UV-curable slurry includes polyurethane acrylate, which has a high molecular weight and is mainly a linear polymer. However, the amount of polyurethane acrylate in the first UV-curable slurry is relatively low. This allows the viscosity of the first UV-curable slurry to be reduced without significantly decreasing it. At the same time, it helps to avoid the problem that the preform has high strength but is too brittle after curing due to trimethylolpropane triacrylate, which is prone to damage during heating.

[0017] Furthermore, the process of preparing the second photocurable slurry includes the following steps: The organosilicon monomer and solvent are mixed in a container and heated to 48-52℃. Then, hydrochloric acid is added dropwise to adjust the pH to 0.8-1.2, with a drop rate of 0.8-1.3 mL / min. The reaction is carried out for 2.8-3.5 h after the temperature is raised to 48-52℃. The solvent is anhydrous ethanol. Then tetramethylammonium hydroxide is added, and the reaction is carried out at 78-82℃ for 1.8-2.2h. The solvent is then removed by vacuum distillation to obtain liquid phenyl silicone resin. The mass ratio of the organosilicon monomer, solvent, and tetramethylammonium hydroxide is (70-90):(80-100):(5-10); the solvent is anhydrous ethanol; the organosilicon monomer includes one of phenyltrimethoxysilane and diphenyldimethoxysilane. Trimethylolpropane triacrylate, polyurethane acrylate, photoinitiator, tert-octyl The phenyl polyethylene glycol ether was mixed in a mass ratio of (50-90):(30-40):(0.3-0.4):(1-2) to obtain the second photocurable resin system material; The second photocurable slurry is obtained by mixing phenyl silicone resin and the second photocurable resin system materials at a mass ratio of (60-80):(20-40). The viscosity of the third slurry is 2-3 Pa·s.

[0018] The beneficial effect of the previous step is that tetramethylammonium hydroxide is then added, and the reaction is carried out at 78-82℃ for 1.8-2.2h. Then, the solvent is removed by vacuum distillation to obtain liquid phenyl silicone resin. The obtained liquid phenyl silicone resin has high strength after subsequent photocuring, which helps to avoid deformation of the first arc-shaped ceramic segment of the ceramic support strip blank. At the same time, it can also achieve the decomposition of the first arc-shaped support blank after subsequent glue removal and sintering.

[0019] Furthermore, the process of removing adhesive from the ceramic support strip blank includes the following steps: The ceramic support strip blank was debinded under a nitrogen atmosphere, and the temperature was raised from room temperature to 90-110℃ at a rate of 3-5℃ / min, and held at 90-110℃ for 0.5-1.0h. Then, the temperature is increased from 90-110℃ to 280-320℃ at a rate of 2-3℃ / min, and held at 280-320℃ for 1.0-1.5 hours; then, the temperature is increased from 280-320℃ to 580-610℃ at a rate of 0.5-0.8℃ / min; then, the temperature is increased from 580-610℃ to 850-900℃ at a rate of 3-4℃ / min. The sintering process of the ceramic support strip blank after debinding includes the following steps: The ceramic support strip blank after debinding is heated to 1180-1220℃ in a nitrogen atmosphere at a heating rate of 1-2℃ / min; then heated from 1180-1220℃ to 1450-1600℃ at a heating rate of 0.5-0.8℃ / min, and sintered for 1-4 hours.

[0020] The beneficial effects of the previous step are that by raising the temperature from room temperature to 90-110℃ at a rate of 3-5℃ / min and holding it at 90-110℃ for 0.5-1.0h, the small-molecule volatiles in the ceramic support strip blank are rapidly volatilized, creating through-pores. This facilitates the subsequent volatilization of large-molecule volatiles along these through-pores after decomposition, avoiding the problem of blank cracking or deformation. Raising the temperature from 90-110℃ to 280-320℃ at a rate of 2-3℃ / min and holding it at 280-320℃ for 1.0-1.5h promotes the decomposition of polyurethane acrylate. Heating from 20℃ to 580-610℃ at a rate of 0.5-0.8℃ / min allows the cross-linked macromolecular volatiles during photocuring to slowly decompose into smaller volatile molecules. The slow evaporation of these smaller volatile molecules helps prevent deformation or cracking of the ceramic support strip and also contributes to a smooth surface. Heating from 580-610℃ to 850-900℃ at a rate of 3-4℃ / min provides a faster heating rate, preventing a low decomposition rate in the first and second arc-shaped support blanks at this temperature, thus maintaining strong support capacity. Heating the ceramic support strip blank after debinding to 1180-1220℃ in a nitrogen atmosphere at a heating rate of 1-2℃ / min helps to quickly improve the strength between ceramic powders and avoid deformation of the ceramic support strip, while also preventing the problem of grain engulfment during grain growth. Heating from 1180-1220℃ to 1450-1600℃ at a heating rate of 0.5-0.8℃ / min, with a slower heating rate, further avoids the problems of grain engulfment or large grains. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the ceramic support strip in Embodiment 2 of the present invention; Figure 2This is a schematic diagram of the ceramic support strip blank structure in Embodiment 2 of the present invention.

[0022] 1-First arc-shaped ceramic segment; 2-Second arc-shaped ceramic segment; 3-First arc-shaped ceramic segment blank; 4-Second arc-shaped ceramic segment blank; 5-First arc-shaped support blank; 6-Second arc-shaped support blank. Detailed Implementation

[0023] To better understand the technical solution of the present invention, the present invention will be further described below with reference to specific embodiments.

[0024] Example 1: According to one aspect of this embodiment, a ceramic support device for thin glass processing is provided, including a plurality of ceramic support bars and a support frame, wherein the ceramic support bars are arranged vertically and the plurality of ceramic support bars are arranged in parallel. The ceramic support strip includes a continuous ceramic line with a diameter of 1.5 mm; the ceramic line has several first arc-shaped ceramic segments 1, and two adjacent first arc-shaped ceramic segments 1 are connected by a connecting component, the connecting component including a horizontal ceramic segment; The support frame includes a first support plate, a second support plate, and a third support plate, with the first support plate and the second support plate arranged in parallel. The ceramic support strips are connected at both ends to the first support plate and the second support plate, respectively; The ceramic support strip is perpendicular to the first support plate and the second support plate; The first arc-shaped ceramic line segment 1 has an arc-shaped structure; the arc-shaped ceramic line segment has an arc-shaped structure; The support frame is a ceramic support frame, which includes yttrium-stabilized zirconium oxide and aluminum oxide; The ceramic support strip is integrally formed; the length of the ceramic support strip is... 24cm; The depth of the first arc-shaped ceramic line segment is 6cm; the maximum width of the first arc-shaped ceramic line segment is 3mm. The first arc-shaped ceramic segments 1 of the several ceramic support bars form several grooves.

[0025] According to another aspect of this embodiment, a method for preparing a ceramic support strip is provided, for use in manufacturing... The ceramic support strip is described in the accompanying text.

[0026] The method for preparing ceramic support strips includes the following steps: preparing the first photocurable... The slurry, the first UV-curable slurry includes materials from the first UV-curable resin system and ceramic powder; The process of preparing the first photocurable slurry includes the following steps: The ceramic powder is prepared by comprising yttrium-stabilized zirconium oxide powder, alumina powder, rare earth oxide powder, titanium oxide powder, fiber powder, and zirconium silicate powder in a mass ratio of 73:23:5:2.5:5:5. The ceramic powder has an average particle size of 1.1 μm; Materials for preparing the first photocurable resin system; the materials for the first photocurable resin system include trimethylolpropane triacrylate, polyurethane acrylate, photoinitiator, and tert-octylphenyl polyethylene glycol ether in a mass ratio of 60:35:0.3:1.5; Then, the ceramic powder and the first photocurable resin system materials are mixed at a mass ratio of 55:45 to obtain the first curing slurry. The viscosity of the first photocurable slurry is 3 Pa·s; The rare earth oxide includes yttrium oxide; the photoinitiator is trimethylbenzoyl-diphenylphosphine oxide; the fiber powder includes zirconium oxide fiber; Prepare a second photocurable slurry, the second photocurable slurry comprising a second photocurable resin system. Materials: phenyl silicone resin; The process of preparing the second photocurable slurry includes the following steps: The organosilicon monomer and solvent were added to a container and mixed. The mixture was heated to 50°C, and then hydrochloric acid was added dropwise to adjust the pH to 1 at a rate of 1 mL / min. The reaction was carried out for 3 hours after the temperature was raised to 50°C. The solvent was anhydrous ethanol. Then tetramethylammonium hydroxide was added, and the mixture was reacted at 80°C for 2 hours. The solvent was then removed by vacuum distillation to obtain liquid phenyl silicone resin. The mass ratio of the organosilicon monomer, solvent, and tetramethylammonium hydroxide is 80:90:8; the solvent is anhydrous ethanol; the organosilicon monomer includes phenyltrimethoxysilane. Trimethylolpropane triacrylate, polyurethane acrylate, photoinitiator, and tert-octylphenyl polyethylene glycol ether were mixed in a mass ratio of 70:35:0.35:1.5 to obtain the second... Materials in a light-curable resin system; The second photocurable slurry is obtained by mixing phenyl silicone resin and the second photocurable resin system materials at a mass ratio of 70:30. The viscosity of the third slurry is 2.5 Pa·s.

[0027] The first and second photocurable slurries are processed by a multi-material 3D printing device. A ceramic support blank is prepared by integral molding; The ceramic support strip includes a first arc-shaped ceramic segment blank 3, a connecting component blank, and an arc-shaped ceramic segment blank. The support blank is a shaped support blank; the connecting component blank is a horizontal ceramic line segment blank. The arc-shaped support blank includes a first arc-shaped support blank 5; The two adjacent first arc-shaped ceramic line segment blanks 3 are connected by connecting component blanks. The first arc-shaped support blank 5 is located inside the first arc-shaped ceramic segment blank 3, and both ends of the first arc-shaped support blank 5 are connected to the first arc-shaped ceramic segment blank 3; The first arc-shaped ceramic segment blank 3 and the connecting component blank are obtained by photocuring the first photocurable slurry; The arc-shaped support blank is obtained by photocuring with a second photocurable slurry.

[0028] After removing the binder from the ceramic support strip blank, it is sintered. After sintering, the first arc shape... The support blank disappears, resulting in the ceramic support strip; the process of removing adhesive from the ceramic support strip blank includes the following steps: The ceramic support strip blank was debinded under a nitrogen atmosphere, and the temperature was increased from room temperature to 100℃ at a rate of 4℃ / min, and held at 100℃ for 0.8h; then the temperature was increased from 100℃ to 300℃ at a rate of 2.5℃ / min, and held at 300℃ for 1.25h; then the temperature was increased from 300℃ to 598℃ at a rate of 0.7℃ / min; and then the temperature was increased from 598℃ to 885℃ at a rate of 3.5℃ / min. The sintering process of the ceramic support strip blank after debinding includes the following steps: The ceramic support strip blank after debinding was heated to 1200℃ in a nitrogen atmosphere at a heating rate of 1.5℃ / min; then heated from 1200℃ to 1525℃ at a heating rate of 0.7℃ / min, and sintered for 2.5h.

[0029] Example 2: The contents that are the same as in Example 1 will not be repeated here; this embodiment is different from Example 1. The same solution is as follows: According to one aspect of this embodiment, a ceramic support device for thin glass processing is provided, wherein the connecting component includes a second arc-shaped ceramic line segment; The ceramic support strip is 32cm long; The depth of the first arc-shaped ceramic segment 1 is 8.6 cm; the maximum width of the first arc-shaped ceramic segment 1 is 4.3 mm; According to one aspect of this embodiment, a method for preparing a ceramic support strip is provided for preparing... The ceramic support strip described above; also includes the following steps: The connecting component blank is a second arc-shaped ceramic line segment blank 4; When the connecting component blank is the second arc-shaped ceramic line segment blank 4, the arc-shaped support The support blank includes the second arc-shaped support blank 6; Both ends of the second arc-shaped support blank 6 are connected to the second arc-shaped ceramic line segment blank 4.

[0030] The process of preparing the first photocurable slurry includes the following steps: The ceramic powder is prepared by comprising yttrium-stabilized zirconium oxide powder, alumina powder, rare earth oxide powder, titanium oxide powder, fiber powder, and zirconium silicate powder in a mass ratio of 83:18:7:4:9:9. The ceramic powder has an average particle size of 1.6 μm; Materials for preparing the first photocurable resin system; the materials for the first photocurable resin system include trimethylolpropane triacrylate, polyurethane acrylate, photoinitiator, and tert-octylphenyl polyethylene glycol ether in a mass ratio of 68:38:0.38:1.8. Then, the ceramic powder and the first photocurable resin system materials are mixed at a mass ratio of 59:41 to obtain the first curing slurry. The viscosity of the first photocurable slurry is 3.6 Pa·s; The rare earth oxide includes cerium oxide; the photoinitiator is 2-hydroxy-2-methyl-1-phenyl-1-propanone; the fiber powder includes alumina fiber; The process of preparing the second photocurable slurry includes the following steps: The organosilicon monomer and solvent were added to a container and mixed. The mixture was heated to 51°C, and then hydrochloric acid was added dropwise to adjust the pH to 1.1 at a rate of 0.9 mL / min. The reaction was carried out for 2.9 h after the temperature was raised to 51°C. Then tetramethylammonium hydroxide was added, and the mixture was reacted at 81°C for 2.1 h. The solvent was then removed by vacuum distillation to obtain liquid phenyl silicone resin. The mass ratio of the organosilicon monomer, solvent, and tetramethylammonium hydroxide is 88:98:9; the organosilicon monomer includes diphenyldimethoxysilane. Trimethylolpropane triacrylate, polyurethane acrylate, photoinitiator, tert-octyl The phenyl polyethylene glycol ether was mixed at a mass ratio of 89:38:0.38:1.6 to obtain the second photocurable resin system material; The second photocurable slurry was obtained by mixing phenyl silicone resin and the second photocurable resin system materials at a mass ratio of 78:22. The viscosity of the third slurry is 2.8 Pa·s.

[0031] The ceramic support strip blank was debinded under a nitrogen atmosphere, and the temperature was raised from room temperature to 108℃ at a rate of 4.8℃ / min, and held at 108℃ for 0.6h; then the temperature was raised from 108℃ to 318℃ at a rate of 2.8℃ / min, and held at 310℃ for 1.1h; then the temperature was raised from 310℃ to 605℃ at a rate of 0.78℃ / min; and then the temperature was raised from 605℃ to 895℃ at a rate of 3.8℃ / min. The sintering process of the ceramic support strip blank after debinding includes the following steps: The ceramic support strip blank after debinding was heated to 1215℃ in a nitrogen atmosphere at a heating rate of 1.8℃ / min; then heated from 1210℃ to 1598℃ at a heating rate of 0.78℃ / min, and sintered for 1.5h.

[0032] Example 3: The contents that are the same as in Example 1 will not be repeated here; this embodiment is different from Example 1. The same solution is as follows: According to one aspect of this embodiment, a ceramic support device for thin glass processing is provided, wherein the connecting component includes a second arc-shaped ceramic line segment; The ceramic support strip is 15cm long; the depth of the first arc-shaped ceramic segment is... 4.8cm; the maximum width of the first arc-shaped ceramic line segment is 1.6mm; According to one aspect of this embodiment, a method for preparing a ceramic support strip is provided for preparing... The ceramic support strip described above; also includes the following steps: The connecting component blank is a second arc-shaped ceramic line segment blank; When the connecting component blank is the second arc-shaped ceramic segment blank, the arc-shaped support The blank body includes the second arc-shaped support blank body; Both ends of the second arc-shaped support blank are connected to the second arc-shaped ceramic line segment blank.

[0033] The process of preparing the first photocurable slurry includes the following steps: A ceramic powder is prepared, comprising yttrium-stabilized zirconium oxide powder, alumina powder, rare earth oxide powder, titanium oxide powder, fiber powder, and zirconium silicate powder in a mass ratio of 61:8:3:1:1.5:2; the ceramic powder has an average particle size of 0.35 μm. Materials for preparing the first photocurable resin system; the materials for the first photocurable resin system include trimethylolpropane triacrylate, polyurethane acrylate, photoinitiator, and tert-octylphenyl polyethylene glycol ether in a mass ratio of 55:35:0.26:1.5; Then, the ceramic powder and the first photocurable resin system materials were mixed at a mass ratio of 52:48 to obtain the first curing slurry; the viscosity of the first photocurable slurry was 2.2 Pa·s. The rare earth oxide includes cerium oxide; the photoinitiator is one or more of 1-hydroxycyclohexylphenyl ketone; the fiber powder includes alumina fiber; The process of preparing the second photocurable slurry includes the following steps: The organosilicon monomer and solvent were added to a container and mixed. The mixture was heated to 49°C, and then hydrochloric acid was added dropwise to adjust the pH to 0.9 at a rate of 0.9 mL / min. The reaction was carried out for 3.3 h after the temperature was raised to 49°C. Then tetramethylammonium hydroxide was added, and the reaction was carried out at 79°C for 2.1 h. The mass ratio of the organosilicon monomer, solvent, and tetramethylammonium hydroxide is 72:82:6; the organosilicon monomer includes diphenyldimethoxysilane. Trimethylolpropane triacrylate, polyurethane acrylate, photoinitiator, tert-octyl The phenyl polyethylene glycol ether was mixed at a mass ratio of 52:32:0.35:1.2 to obtain the second photocurable resin system material; The second photocurable slurry is obtained by mixing phenyl silicone resin and the second photocurable resin system materials at a mass ratio of 62:22; the viscosity of the third slurry is 2.2 Pa·s.

[0034] The ceramic support strip blank was debinded under a nitrogen atmosphere, and then heated from room temperature to 92℃ at a rate of 3.2℃ / min, and held at 92℃ for 0.9h; then heated from 92℃ to 282℃ at a rate of 2.2℃ / min, and held at 282℃ for 1.4h; then heated from 282℃ to 585℃ at a rate of 0.55℃ / min; and then heated from 585℃ to 855℃ at a rate of 3.2℃ / min. The sintering process of the ceramic support strip blank after debinding includes the following steps: The ceramic support strip blank after debinding was heated to 1185℃ in a nitrogen atmosphere at a heating rate of 1.2℃ / min; then heated from 1185℃ to 1460℃ at a heating rate of 0.6℃ / min, and sintered for 3.8h.

[0035] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to the technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, the above-described features have similar functions to (but are not limited to) those disclosed in this application.

Claims

1. A ceramic support device for thin glass processing, characterized in that, It includes several ceramic support strips and a support frame, wherein the ceramic support strips are arranged vertically and the ceramic support strips are arranged in parallel. The ceramic support strip includes a continuous ceramic line with a diameter of 1-2 mm; The ceramic wire is provided with a plurality of first arc-shaped ceramic wire segments, and two adjacent first arc-shaped ceramic wire segments are connected by a connecting component, the connecting component including a horizontal ceramic wire segment or a second arc-shaped ceramic wire segment; The support frame includes a first support plate, a second support plate, and a third support plate, with the first support plate and the second support plate arranged in parallel. The ceramic support strips are connected at both ends to the first support plate and the second support plate, respectively; The ceramic support strip is perpendicular to the first support plate and the second support plate; The first arc-shaped ceramic line segment has an arc-shaped structure; the arc-shaped ceramic line segment has an arc-shaped structure; The ceramic support strip is prepared by integral molding.

2. The ceramic support device for thin glass processing according to claim 1, characterized in that, The ceramic support strip is 12-36cm in length; The depth of the first arc-shaped ceramic line segment is 3-9cm; the maximum width of the first arc-shaped ceramic line segment is 1.5-4.5mm.

3. The ceramic support device for thin glass processing according to claim 1, characterized in that, The first arc-shaped ceramic segments of the aforementioned ceramic support strips form several grooves; and / or The ceramic support strip also includes two connectors, and the two ends of the ceramic support strip are connected to the first support plate and the second support plate respectively through the connectors.

4. A method for preparing a ceramic support strip, used to prepare the ceramic support strip according to any one of claims 1-3.

5. The method for preparing a ceramic support strip according to claim 4, characterized in that, Includes the following steps: Prepare a first photocurable slurry, the first photocurable slurry comprising a first photocurable resin system material and ceramic powder; Prepare a second photocurable slurry, the second photocurable slurry comprising a second photocurable resin system. Materials, phenyl silicone resin; A ceramic support blank was prepared by integrally molding a first photocurable slurry and a second photocurable slurry using a multi-material 3D printing device. The ceramic support strip includes a first arc-shaped ceramic segment blank, a connecting component blank, and an arc-shaped support blank; The arc-shaped support blank includes a first arc-shaped support blank; The two adjacent first arc-shaped ceramic line segment blanks are connected by connecting component blanks. The first arc-shaped support blank is located inside the first arc-shaped ceramic line segment blank, and both ends of the first arc-shaped support blank are connected to the first arc-shaped ceramic line segment blank. After removing the adhesive from the ceramic support strip blank, it is sintered. After sintering, the first arc-shaped support blank disappears, and the ceramic support strip is obtained.

6. The method for preparing a ceramic support strip according to claim 5, characterized in that, The connecting component blank is a horizontal ceramic line segment blank or a second arc-shaped ceramic line segment blank; When the connecting component blank is the second arc-shaped ceramic line segment blank, the arc-shaped support blank includes the second arc-shaped support blank; Both ends of the second arc-shaped support blank are connected to the second arc-shaped ceramic line segment blank.

7. The method for preparing a ceramic support strip according to claim 5, characterized in that, The first arc-shaped ceramic segment blank and the connecting component blank are obtained by photocuring the first photocurable slurry. The arc-shaped support blank is obtained by photocuring with a second photocurable slurry.

8. The method for preparing a ceramic support strip according to claim 5, characterized in that, The process of preparing the first photocurable slurry includes the following steps: Prepare ceramic powder, wherein the ceramic powder comprises yttrium-stabilized zirconium oxide powder, alumina powder, rare earth oxide powder, titanium oxide powder, fiber powder, and zirconium silicate powder in a mass ratio of (60-85):(5-20):(2-8):(0-5):(0-10):(1-10); The ceramic powder has an average particle size of 0.3-2 μm; The materials for preparing the first photocurable resin system include trimethylolpropane triacrylate, polyurethane acrylate, photoinitiator, and tert-octylphenyl polyethylene glycol ether in a mass ratio of (50-70):(30-40):(0.2-0.4):(1-2). Then, the ceramic powder and the first photocurable resin system materials are mixed at a mass ratio of (50-60):(40-50) to obtain the first curing slurry. The viscosity of the first photocurable slurry is 2-4 Pa·s; The rare earth oxides include yttrium oxide or cerium oxide; The photoinitiator is one or more of trimethylbenzoyl-diphenylphosphine oxide, 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 1-hydroxycyclohexylphenyl ketone.

9. The method for preparing a ceramic support strip according to claim 5, characterized in that, The process of preparing the second photocurable slurry includes the following steps: The organosilicon monomer and solvent are mixed in a container and heated to 48-52℃. Then, hydrochloric acid is added dropwise to adjust the pH to 0.8-1.2, with a drop rate of 0.8-1.3 mL / min. The reaction is carried out for 2.8-3.5 h after the temperature is raised to 48-52℃. The solvent is anhydrous ethanol. Then tetramethylammonium hydroxide is added, and the reaction is carried out at 78-82℃ for 1.8-2.2h. The solvent is then removed by vacuum distillation to obtain liquid phenyl silicone resin. The organosilicon monomer includes one of phenyltrimethoxysilane and diphenyldimethoxysilane; The mass ratio of the organosilicon monomer, solvent, and tetramethylammonium hydroxide is (70-90):(80-100):(5-10); the solvent is anhydrous ethanol; the organosilicon monomer includes one of phenyltrimethoxysilane and diphenyldimethoxysilane. Trimethylolpropane triacrylate, polyurethane acrylate, photoinitiator, tert-octyl The phenyl polyethylene glycol ether was mixed in a mass ratio of (50-90):(30-40):(0.3-0.4):(1-2) to obtain the second photocurable resin system material; The second photocurable slurry is obtained by mixing phenyl silicone resin and the second photocurable resin system materials at a mass ratio of (60-80):(20-40). The viscosity of the second photocurable slurry is 2-3 Pa·s.

10. The method for preparing a ceramic support strip according to claim 5, characterized in that, The process of removing adhesive from the ceramic support strip blank includes the following steps: The ceramic support strip blank was debinded under a nitrogen atmosphere, and the temperature was raised from room temperature to 90-110℃ at a rate of 3-5℃ / min, and held at 90-110℃ for 0.5-1.0h. Then, the temperature is increased from 90-110℃ to 280-320℃ at a rate of 2-3℃ / min, and held at 280-320℃ for 1.0-1.5 hours; then, the temperature is increased from 280-320℃ to 580-610℃ at a rate of 0.5-0.8℃ / min; then, the temperature is increased from 580-610℃ to 850-900℃ at a rate of 3-4℃ / min. The sintering process of the ceramic support strip blank after debinding includes the following steps: The ceramic support strip blank after debinding is heated to 1180-1220℃ in a nitrogen atmosphere at a heating rate of 1-2℃ / min; then heated from 1180-1220℃ to 1450-1600℃ at a heating rate of 0.5-0.8℃ / min, and sintered for 1-4 hours.

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