Lens drive device

Abstract

This invention belongs to the field of optical imaging equipment technology, specifically relating to a lens driving device, including a base, a frame, a carrier, and a circuit board. An AF position sensor is disposed on the outer wall of the frame and cooperates with an AF magnet disposed on the base to monitor the movement position in a third direction. The circuit board is disposed on the frame and located below the carrier. Two OIS position sensors are disposed on the circuit board and cooperate with two OIS magnets disposed on the carrier to monitor the movement position in a first direction and a second direction, respectively. An elastic connection portion is disposed on one side of the circuit board. One end of the elastic connection portion is connected to the base and electrically connected to the base's internal wiring or an external circuit. The monitoring signals from the two OIS position sensors and the AF position sensor are all output through the elastic connection portion. In this invention, the monitoring signals from all three position sensors are output through the elastic connection portion of the circuit board, facilitating position monitoring.

Description

Technical Field

[0001] This invention belongs to the field of optical imaging equipment technology, and specifically relates to a lens driving device. Background Technology

[0002] In recent years, with the development of technology, many electronic devices now have the function of taking pictures or recording videos. The use of these electronic devices is becoming more and more common, and they are developing towards a more convenient and thinner design to provide users with more choices.

[0003] In practice, in order to adapt to various shooting scenarios, the lens needs to be constantly focused and stabilized. In existing technologies, a lens drive device is generally used to drive the lens to move along the optical axis to adjust the focal length, and to drive the lens to move in a direction perpendicular to the optical axis to prevent lens shake.

[0004] Currently, common lens drive mechanisms typically employ a three-axis movement of the carrier and the lens fixed to it relative to the base to achieve autofocus (AF) and optical image stabilization (OIS). Specifically, during optical image stabilization, a movable frame structure is used to move the carrier and lens, allowing them to shift relative to the base in the horizontal directions of the X and Y axes, thereby compensating for image blur caused by hand tremors or external vibrations. During zooming, the carrier and lens are typically moved relative to the frame along the Z-axis (i.e., the optical axis) to change the focal length and achieve sharp imaging.

[0005] To achieve high-precision motion control, the system needs to monitor the actual position information of the carrier and frame in their respective motion directions in real time. Therefore, the structural design and control strategy must not only realize independent or combined motion of the carrier in the X, Y, and Z axes, but also effectively integrate position sensing mechanisms, such as Hall sensors or optical encoders, to achieve real-time feedback and closed-loop control of the motion state. Integrating motion execution and position monitoring has become one of the key challenges in improving the performance and reliability of the lens drive module. Summary of the Invention

[0006] The present invention addresses the above-mentioned technical problems by providing a lens driving device.

[0007] A lens driving device includes a base, a frame, and a carrier. The carrier is located within the frame and is configured to move relative to the frame along a first direction and a second direction. The frame is located on the base and is configured to move relative to the base along a third direction.

[0008] An AF position sensor is provided on the outer wall of the frame. The AF position sensor cooperates with an AF magnet provided on the side wall of the base to monitor the movement position in a third direction.

[0009] The lens driving device also includes a circuit board, which is disposed on the frame and located below the carrier. The circuit board is electrically connected to the AF position sensor through the frame's built-in circuitry. Two OIS position sensors are disposed on the circuit board, and the two OIS position sensors are respectively coupled with two OIS magnets disposed at the bottom of the carrier to monitor the movement position in the first direction and the second direction. An elastic connection part is disposed on one side of the circuit board, one end of which is connected to the base and electrically connected to the base's built-in circuitry or an external circuit. The monitoring signals of the two OIS position sensors and the AF position sensor are all output through the elastic connection part.

[0010] Optionally, the circuit board is an FPC board.

[0011] Optionally, two OIS position sensors are disposed at the bottom of the circuit board, and the frame is provided with two sensor clearance slots for avoiding the position sensors, with the two OIS position sensors respectively located in the two sensor clearance slots.

[0012] Optionally, the circuit board is provided with two OIS coils, each OIS coil is respectively arranged opposite to a corresponding OIS magnet, and after the OIS coil is energized, the carrier can move relative to the frame along a first direction and a second direction, and the circuit board supplies power to the two OIS coils.

[0013] Optionally, an AF coil is provided on the outer wall of the frame. The AF coil is positioned opposite to the AF magnet. After the AF coil is energized, the frame and the carrier can move relative to the base in a third direction. The circuit board supplies power to the AF coil through the built-in circuit of the frame.

[0014] Optionally, a plurality of friction-reducing components are provided between the bottom end of the carrier and the frame.

[0015] Optionally, the friction-reducing component is a ball bearing.

[0016] Optionally, ball grooves are provided at the four corners of the frame, and one or more balls are placed in each ball groove. The top of the ball contacts the four corners of the bottom of the carrier, and the carrier is supported in the frame by the balls.

[0017] Optionally, two OIS adsorption metals are fixedly installed at the bottom of the circuit board, and each OIS adsorption metal is respectively arranged opposite to and adsorbed by a corresponding OIS magnet.

[0018] Optionally, the friction-reducing component is a hemispherical protrusion.

[0019] Optionally, the flat ends of the hemispherical protrusion are located at the four corners of the bottom of the carrier and the protruding ends of the hemispherical protrusion are in contact with the four corners of the frame, or the flat ends of the hemispherical protrusion are located at the four corners of the frame and the protruding ends of the hemispherical protrusion are in contact with the four corners of the bottom of the carrier.

[0020] Optionally, a support is provided between the frame and the carrier, the support is disposed on the frame, the carrier is disposed on the support, the support and the carrier can move in a first direction relative to the frame, and the carrier can move in a second direction relative to the support;

[0021] Friction-reducing components are provided between the support and the frame, and between the carrier and the support, for support purposes.

[0022] Optionally, a frame guide groove is provided on one outer wall of the frame, and a base guide groove is provided on one inner wall of the base. The frame guide groove and the base guide groove are arranged opposite to each other to form a guide mounting groove, and a guide shaft is installed in the guide mounting groove.

[0023] Optionally, the bottom end of the guide shaft is fixed to the base, and the frame guide groove on the outer wall of the frame can slide in a third direction relative to the guide shaft.

[0024] Optionally, the frame sidewall is provided with a guide groove with built-in metal, and the guide groove with built-in metal is at least partially located on the inner wall of the frame guide groove.

[0025] Optionally, a built-in metal plate is provided inside one side of the base, and the inner wall of the built-in metal plate is arranged opposite to the AF magnet and attracts and fixes the AF magnet.

[0026] Optionally, the AF magnet has magnet notches at both ends, and a magnet limiting groove is provided between the metal plate inside the base and the inner wall of the base. The two ends of the AF magnet are located in the magnet limiting groove, and the AF magnet is installed and limited by the magnet limiting groove.

[0027] Optionally, the lens driving device further includes a housing, which is detachably connected to the base and forms a hollow cavity, and the frame, the carrier, and the circuit board are all disposed within the hollow cavity.

[0028] Optionally, an AF circuit board is provided on the outer wall of the frame. The AF circuit board is powered by the circuit board through the built-in circuit of the frame. The AF position sensor and AF coil are provided on the outside of the AF circuit board. The AF coil is arranged opposite to the AF magnet. After the AF coil is energized, the frame and the carrier can move relative to the base in a third direction. The AF circuit board powers the AF position sensor and AF coil. The monitoring signal of the AF position sensor passes through the AF circuit board, the built-in circuit of the frame and the circuit board in sequence, and is then output through the elastic connection.

[0029] Optionally, an AF adsorption metal is provided inside the sidewall of the frame. The AF adsorption metal is located inside the AF circuit board, and the AF adsorption metal and the AF magnet are arranged opposite to each other and adsorb each other.

[0030] Beneficial effects: The present invention has at least one or more of the following advantages:

[0031] 1. This invention uses a frame to drive the carrier to perform AF direction movements on the base, allowing the carrier to perform OIS image stabilization within the frame. With this design, during OIS image stabilization operation, it is only necessary to push the carrier to move in the first and second directions. The required thrust for OIS image stabilization is smaller, thus significantly reducing the installation size of the magnet or increasing the thrust of OIS image stabilization, allowing the lens to achieve a larger angle of image stabilization in the first and second directions.

[0032] 2. This invention designs a circuit board that not only meets power supply requirements, but its elastic connection portion also maintains the circuit's power supply unaffected when the circuit board moves in the AF direction with the frame. Furthermore, the circuit board improves the overall structural compactness by connecting the base and frame. When the frame moves in the AF direction, the elastic connection portion, possessing elastic potential energy, can assist in resetting. In addition, the monitoring signals from the three position sensors of this invention are all exported through the elastic connection portion of the circuit board, facilitating position monitoring.

[0033] 3. This invention places the position sensor and coil that require power on the frame, which greatly reduces the cumbersome power supply circuit design.

[0034] 4. The present invention adopts a friction-reducing component design, which enables the carrier to be supported within the frame by the friction-reducing component, and achieves the technical effect of reducing friction when the carrier moves in OIS. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of one structure of the present invention;

[0036] Figure 2 for Figure 1 AA section view;

[0037] Figure 3 for Figure 1 Exploded view;

[0038] Figure 4 for Figure 3 Further exploded view;

[0039] Figure 5 This is an exploded view showing the positional relationship between the base, AF magnet, and guide shaft of the present invention.

[0040] Figure 6 This is an exploded view showing the positional relationship between the frame, carrier, and OIS magnet of the present invention.

[0041] Figure 7 This is an exploded view showing the positional relationship between the carrier and the OIS magnet of the present invention.

[0042] Figure 8 An exploded view showing the positional relationship between the frame, AF magnet, and circuit board of this invention.

[0043] Figure 9 This is a schematic diagram of one structure of the AF circuit board portion of the present invention;

[0044] Figure 10 This is a schematic diagram of one structure of the circuit board portion of the present invention. Detailed Implementation

[0045] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so as to better understand the purpose, features and advantages of the present invention. It should be understood that the embodiments shown in the drawings are not intended to limit the scope of the present invention, but are only for illustrating the essential spirit of the technical solution of the present invention.

[0046] In the following description, certain specific details are set forth for the purpose of illustrating various disclosed embodiments in order to provide a thorough understanding of the various disclosed embodiments. However, those skilled in the art will recognize that the embodiments may be practiced without one or more of these specific details. In other instances, well-known apparatuses, structures, and techniques associated with this application may not have been shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

[0047] Throughout this specification, references to "an embodiment" or "an embodiment" indicate that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Therefore, the appearance of "in an embodiment" or "an embodiment" in various places throughout the specification does not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic may be combined in any manner in one or more embodiments.

[0048] In the following description, in order to clearly demonstrate the structure and operation of the present invention, a number of directional terms will be used. However, terms such as "front", "back", "left", "right", "outside", "inside", "outward", "inward", "up", and "down" should be understood as convenient terms and not as limiting terms.

[0049] In the following description, the first direction is defined as the X-axis, the second direction as the Y-axis, and the third direction as the Z-axis, which is the optical axis. The optical axis represents the direction of light propagation within an optical element; it is an abstract concept and does not refer to a physical axis.

[0050] Reference Figures 1 to 10 This invention provides a lens driving device, which mainly includes a housing 10, a base 20, a frame 30, a carrier 40, and a circuit board 50.

[0051] The outer shell 10 is an optional structure. The outer shell 10 and the base 20 are detachably connected and form a hollow cavity. The frame 30, the carrier 40, and the circuit board 50 are disposed within the hollow cavity. The outer shell 10 and the base 20 are preferably connected by a snap-fit ​​connection to form the hollow cavity.

[0052] The carrier 40 is located within the frame 30 and is configured to move relative to the frame 30 along the X-axis and Y-axis directions (also referred to as the OIS direction). The frame 30 is located on the base 20 and is configured to move relative to the base 20 along the Z-axis direction (also referred to as the AF direction).

[0053] In addition to the carrier 40, all other components of the lens driving device of the present invention are provided with a lens clearance opening that runs through the Z-axis to avoid the lens. The carrier 40 is provided with a lens mounting opening that runs through the Z-axis. The lens mounting opening and the lens clearance opening are coaxial (Z-axis). The lens is mounted on the lens mounting opening of the carrier 40. When the carrier 40 moves relative to the frame 30, it can drive the lens to move along the X-axis and Y-axis. When the frame 30 moves relative to the base 20, it can drive the carrier 40 and the lens on it to move along the Z-axis, thereby realizing the three-axis movement operation of the lens.

[0054] An AF position sensor 61 is provided on the outer wall of the frame 30. The AF position sensor 61 cooperates with the AF magnet 62 provided on the side wall of the base 20 to monitor the movement position in the Z-axis direction.

[0055] The circuit board 50 is mounted on the frame 30 and located below the carrier 40. The circuit board 50 is electrically connected to the AF position sensor 61 through the frame-in-frame wiring inside the frame 30. The circuit board 50 supplies power to the AF position sensor 61 and acquires the monitoring signal provided by the AF position sensor 61.

[0056] Two OIS position sensors 63 are provided on the circuit board 50. The two OIS position sensors 63 are respectively matched with two OIS magnets 64 provided at the bottom of the carrier 40 to monitor the movement position in the X-axis direction and the Y-axis direction. The circuit board 50 provides power to the two OIS position sensors 63 and acquires the monitoring signals provided by the two OIS position sensors 63.

[0057] A flexible connection part 51 is provided on one side of the circuit board 50. One end of the flexible connection part 51 is connected to the base 20. The flexible connection part 51 is electrically connected to the built-in circuitry or external circuitry inside the base 20. The built-in circuitry or external circuitry supplies power to the circuit board 50 through the flexible connection part 51. The monitoring signals of the two OIS position sensors 63 and the AF position sensor 61 are all exported through the flexible connection part 51 for easy position monitoring.

[0058] The present invention designs a circuit board 50 that not only meets the power supply requirements, but its elastic connection part 51 can keep the circuit energized when the circuit board 50 moves in the AF direction with the frame 30. Furthermore, the circuit board 50 improves the overall structural compactness by connecting the base 20 and the frame 30. When the frame 30 moves in the AF direction, the elastic connection part 51 with elastic potential energy can play an auxiliary reset role.

[0059] In one embodiment, the circuit board 50 is an FPC board.

[0060] In one embodiment, reference is made to Figures 3 to 5 The base 20 is provided with a circuit board connection protrusion 21, and one end of the elastic connection part 51 is electrically connected to the circuit board connection protrusion 21.

[0061] When the elastic connection part 51 needs to be electrically connected to the built-in circuit of the base, the circuit board connection protrusion 21 is electrically connected to the built-in circuit of the base, so that the elastic connection part 51 is electrically connected to the built-in circuit of the base through the circuit board connection protrusion 21.

[0062] When the elastic connection part 51 needs to be electrically connected to an external circuit, the base 20 may not have built-in wiring, and the circuit board connection protrusion 21 is not electrically connected to the built-in wiring. In this case, the circuit board connection protrusion 21 is only used to fix one end of the elastic connection part 51. One end of the elastic connection part 51 is also provided with several contact parts for electrical connection to an external circuit.

[0063] In one embodiment, reference is made to Figure 10 Two OIS position sensors 63 are mounted at the bottom of the circuit board 50. (Refer to...) Figure 8 The frame 30 is provided with two sensor clearance slots 31 for avoiding position sensors, and the two OIS position sensors 63 are respectively located in the two sensor clearance slots 31.

[0064] In a practical implementation, the circuit board can adopt a rectangular structure, with an elastic connecting portion 51 extending from one side of the circuit board. Two OIS position sensors 63 are respectively disposed on the adjacent bottom surfaces away from the elastic connecting portion 51.

[0065] In one embodiment, a drive assembly is used to achieve three-axis movement of the carrier 40 and the lens, as described above. Figures 4 to 9 The drive assembly includes an AF magnet 62, two OIS magnets 64, an AF coil 65, and two OIS coils 66.

[0066] Two OIS coils 66 are provided on the circuit board 50. The bottom of the carrier 40 is provided with a groove and an OIS magnet 64 is installed. Each OIS coil 66 is respectively positioned opposite to a corresponding OIS magnet 64. After the OIS coil 66 is energized, the carrier 40 can move relative to the frame 30 along the X-axis and Y-axis directions. The circuit board 50 supplies power to the two OIS coils 66.

[0067] At this point, both the carrier 40 and the circuit board 50 preferably adopt a rectangular structure. Two OIS coils 66 are respectively installed at the top positions of two adjacent sides of the circuit board 50, and correspondingly, two OIS magnets 64 are respectively installed at the bottom positions of two adjacent sides of the carrier 40. Each OIS position sensor 63 on the circuit board 50 is positioned opposite to a corresponding OIS magnet 64. Preferably, each OIS position sensor 63 is located at the bottom of the circuit board 50 and below its corresponding OIS coil 66.

[0068] An AF coil 65 is provided on the outer wall of the frame 30, and an AF magnet 62 is provided on the inner wall of the base 20. The AF coil 65 and the AF magnet 62 are arranged opposite each other. After the AF coil 65 is energized, the frame 30 and the carrier 40 can move relative to the base 20 along the Z-axis. The circuit board 50 supplies power to the AF coil 65 through the built-in circuit of the frame.

[0069] This invention employs a frame 30 to drive a carrier 40 to perform AF direction movements on a base 20, allowing the carrier 40 to perform OIS image stabilization within the frame 30. With this design, during OIS image stabilization operation, it is only necessary to push the carrier 40 to move in the X-axis and Y-axis directions, requiring less thrust for OIS image stabilization. Therefore, the installation size of the magnet can be significantly reduced or the thrust of OIS image stabilization can be increased, enabling the lens to achieve a larger angle of image stabilization in the first and second directions.

[0070] In one embodiment, the AF position sensor 61 and the AF magnet 62 are arranged opposite to each other. The relative displacement between the AF magnet 62 and the AF position sensor 61 can be detected by the AF position sensor 61, so as to realize the position monitoring of the frame 30 and the carrier 40 when they move along the Z-axis.

[0071] In one embodiment, the AF position sensor 61 is disposed in the middle or on the side of the AF coil 65. The AF position sensor 61 is connected to the AF coil 65, and the electrical connection between the two can be established through the built-in circuit of the frame. The AF position sensor 61 is used to detect the current value flowing through the AF coil 65, and the position monitoring of the frame 30 and the carrier 40 along the Z-axis is realized by the change of the current value.

[0072] In this embodiment, the current loop relationship between the AF position sensor 61 and the AF coil 65 can be: the current flowing from the circuit board 50 flows sequentially through the frame's built-in circuit, the AF position sensor 61, and the AF coil 65 to ground; or, the current flowing from the circuit board 50 flows sequentially through the frame's built-in circuit, the AF coil 65, and the AF position sensor 61 to ground.

[0073] In one embodiment, the OIS position sensor 63 is arranged opposite to the corresponding OIS magnet 64. The relative displacement between the OIS magnet 64 and the OIS position sensor 63 can be detected by the OIS position sensor 63, so as to realize the position monitoring of the carrier 40 relative to the frame 30 in the X-axis direction or the Y-axis direction.

[0074] In one embodiment, the OIS position sensor 63 is disposed in the middle or on the side of the corresponding OIS coil 66. The OIS position sensor 63 is connected to the OIS coil 66, and the electrical connection between the two can be established through the circuit board 50. The OIS position sensor 63 is used to detect the current value flowing through the OIS coil 66, and the position monitoring of the carrier 40 relative to the frame 30 in the X-axis or Y-axis direction is realized by the change of the current value.

[0075] In this embodiment, the current loop relationship between the OIS position sensor 63 and the OIS coil 66 can be: the current flowing from the circuit board 50 flows sequentially through the AF position sensor 61 and the AF coil 65 to ground; or, the current flowing from the circuit board 50 flows sequentially through the AF coil 65 and the AF position sensor 61 to ground.

[0076] In one embodiment, in the drive assembly designed above, the positions between the AF coil 65 and the AF magnet 62, and between the two OIS coils 66 and the two OIS magnets 64, can be interchanged. Only the corresponding power lines need to be modified, and the same drive technology effect of the present invention can be achieved.

[0077] For example, the positions of the AF coil 65 and the AF magnet 62 are interchanged. The AF coil is provided on the inner wall of one side of the base 20, and the AF magnet is provided on the outer wall of one side of the frame 30. The AF position sensor is located on the base 20. The base 20 has built-in circuitry, which powers the AF coil and the AF position sensor and acquires the monitoring signal provided by the AF position sensor.

[0078] For example, the positions of the OIS coil 66 and the OIS magnet 64 can be interchanged. The OIS magnet is mounted on the frame 30, the OIS coil is mounted at the bottom of the carrier 40, and the OIS position sensor 63 is mounted on the carrier 40. The carrier 40 contains built-in wiring that powers the OIS coil. This built-in wiring is connected to the base wiring within the base 20, the frame wiring within the frame, or the circuit board 50 via an OIS spring. The OIS spring maintains its connection to the base wiring, frame wiring, or circuit board 50 unaffected during the three-axis movement of the carrier 40.

[0079] In one embodiment, a plurality of friction-reducing components are provided between the bottom end of the carrier 40 and the frame 30.

[0080] The design of the friction-reducing component allows the carrier 40 to be supported within the frame 30, and it also reduces friction when the carrier 40 moves in OIS.

[0081] Reference Figure 6 and Figure 8 The friction-reducing component is a ball bearing 70.

[0082] In one embodiment, reference is made to Figure 6 and Figure 8 The frame 30 has ball grooves 71 at its four corners, and each ball groove 71 contains one or more balls 70. The top of the balls 70 contacts the four corners of the bottom of the carrier 40, and the carrier 40 is supported in the frame 30 by the balls 70.

[0083] At this time, both the frame 30 and the carrier 40 preferably adopt a rectangular structure so that the four corners of the frame 30 and the carrier 40 abut against each other through the ball bearings 70.

[0084] In this embodiment, the number of balls 70 in each ball groove 71 is not limited; it can be a single ball or multiple balls.

[0085] In one embodiment, reference is made to Figure 10 Two OIS adsorption metals 52 are fixedly installed at the bottom of the circuit board 50. Each OIS adsorption metal 52 is respectively positioned opposite to and attracted to a corresponding OIS magnet 64. The two OIS adsorption metals 52 and the two OIS magnets 64 respectively generate an adsorption force, causing the carrier 40 to abut against the four balls 70, thus preventing the balls 70 from detaching from the groove.

[0086] In practical implementation, the OIS adsorbed metal 52 can adopt a rectangular frame structure, and each OIS position sensor 63 can be installed in the middle of a corresponding OIS adsorbed metal 52.

[0087] In one embodiment, of course, the friction-reducing component can also be other friction-reducing components, such as hemispherical protrusions, which can also play a technical role in reducing friction when the carrier 40 moves in OIS.

[0088] In one embodiment, the flat ends of the hemispherical protrusions are located at the four corners of the bottom of the carrier 40, and the protruding ends of the hemispherical protrusions are in contact with the four corners of the frame 30.

[0089] In one embodiment, the planar ends of the hemispherical protrusions are located at the four corners of the frame 30, and the protruding ends of the hemispherical protrusions are in contact with the four corners of the bottom of the carrier 40.

[0090] In one embodiment, a support is provided between the frame 30 and the carrier 40. The support is disposed on the frame 30 and the carrier 40 is disposed on the support. The support and the carrier 40 can move relative to the frame 30 in the X-axis direction and the carrier 40 can move relative to the support in the Y-axis direction.

[0091] Friction-reducing components are provided between the support and the frame 30, and between the carrier 40 and the support for support.

[0092] The friction-reducing component is preferably a ball bearing, so that this embodiment forms a multi-layer ball bearing support structure.

[0093] In one embodiment, reference is made to Figures 3 to 6 , Figure 8A frame guide groove 32 is provided on one outer wall of the frame 30, and a base guide groove 22 is provided on one inner wall of the base 20. The frame guide groove 32 and the base guide groove 22 are arranged opposite to each other to form a guide mounting groove. A guide shaft 80 is installed in the guide mounting groove. The length direction of the guide shaft 80 is the Z-axis direction, and the Z-axis direction is guided by the guide shaft 80.

[0094] Preferably, the frame guide groove 32 and the AF coil 65 are located on the same outer wall of the frame 30. The base guide groove 22 and the AF magnet 62 are located on the same inner wall of the base 20.

[0095] Preferably, two frame guide grooves 32 are provided on one outer wall of the frame 30, and the two frame guide grooves 32 are respectively located on both sides of the AF coil 65. Two base guide grooves 22 are provided on one inner wall of the base 20, and the two base guide grooves 22 are respectively located on both sides of the AF magnet 62. This results in a guide shaft 80 being provided in each of the guide mounting grooves formed on both sides of the AF magnet 62 and the AF coil 65.

[0096] In one embodiment, the bottom end of the guide shaft 80 is fixed to the base 20, and the frame guide groove 32 on the outer side wall of the frame 30 can slide relative to the guide shaft 80 in the Z-axis direction.

[0097] In one embodiment, reference is made to Figure 9 The frame 30 has a guide groove with embedded metal 33 inside its side wall. The guide groove with embedded metal 33 is at least partially located on the inner wall of the frame guide groove 32. The guide groove with embedded metal 33 is pre-embedded on the inner side of the inner wall of the frame guide groove 32 and may be exposed or not exposed on the inner wall of the frame guide groove 32. The guide groove with embedded metal 33 can enhance the structural strength and wear resistance of the frame guide groove 32.

[0098] In one embodiment, reference is made to Figure 5 The base 20 has an internal metal plate 23 on one side. The inner wall of the internal metal plate 23 is positioned opposite to the AF magnet 62 and is attracted and fixed to the AF magnet 62.

[0099] In one embodiment, reference is made to Figure 5 The inner sides of both ends of the AF magnet 62 are provided with magnet notches 621. The inner metal plate 23 of the base is provided with a magnet limiting groove 24 between the inner wall of the base 20 and the magnet limiting groove 24. The magnet limiting groove 24 is adapted to the magnet notches 621 at both ends of the AF magnet 62. The two ends of the AF magnet 62 are located in the magnet limiting groove 24. The AF magnet 62 is installed and limited by the magnet limiting groove 24, thereby improving the installation stability of the AF magnet 62.

[0100] In one embodiment, reference is made to Figure 8 and Figure 9An AF circuit board 90 is provided on the outer wall of the frame 30. The AF circuit board 90 is powered by the circuit board 50 through the built-in circuit of the frame. An AF position sensor 61 and an AF coil 65 are provided on the outer side of the AF circuit board 90. Preferably, the AF position sensor 61 is located in the middle of the AF coil 65. The AF coil 65 is arranged opposite to the AF magnet 62. After the AF coil 65 is energized, the frame 30 and the carrier 40 can move relative to the base 20 along the Z-axis. The circuit board 50 powers the AF position sensor 61 and the AF coil 65 through the built-in circuit of the frame and the AF circuit board 90. The monitoring signal of the AF position sensor 61 passes through the AF circuit board 90, the built-in circuit of the frame and the circuit board 50 in sequence, and is then output through the elastic connection part 51.

[0101] In practice, a groove is provided on the outer side wall of the frame 30 and the AF circuit board 90 is fixedly installed thereon.

[0102] In one embodiment, reference is made to Figure 9 An AF adsorption metal 91 is provided inside the side wall of the frame 30. The AF adsorption metal 91 is located inside the AF circuit board 90. The AF adsorption metal 91 and the AF magnet 62 are arranged opposite each other and attract each other. An adsorption force is generated between the AF adsorption metal 91 and the AF magnet 62. This adsorption force can bring the side wall of the frame 30 and the inner wall of the base 20 closer together. When a guide shaft 80 is provided, it can prevent the guide shaft 80 from disengaging from the guide groove.

[0103] The preferred embodiments of the present invention have been described in detail above. However, it should be understood that after reading the above teachings, those skilled in the art can make various alterations or modifications to the present invention. These equivalent forms also fall within the scope defined by the appended claims.

Claims

1. A lens driving device, characterized in that, The lens driving device includes a base, a frame, and a carrier. The carrier is located within the frame and is configured to move relative to the frame in a first direction and a second direction. The frame is located on the base and is configured to move relative to the base in a third direction. An AF position sensor is provided on the outer wall of the frame. The AF position sensor cooperates with an AF magnet provided on the side wall of the base to monitor the movement position in a third direction. The lens driving device also includes a circuit board, which is disposed on the frame and located below the carrier. The circuit board is electrically connected to the AF position sensor through the frame's built-in circuitry. Two OIS position sensors are disposed on the circuit board, and the two OIS position sensors are respectively coupled with two OIS magnets disposed at the bottom of the carrier to monitor the movement position in the first direction and the second direction. An elastic connection part is disposed on one side of the circuit board, one end of which is connected to the base and electrically connected to the base's built-in circuitry or an external circuit. The monitoring signals of the two OIS position sensors and the AF position sensor are all output through the elastic connection part.

2. The lens driving device as described in claim 1, characterized in that, The circuit board is an FPC board.

3. The lens driving device as described in claim 1, characterized in that, Two OIS position sensors are disposed at the bottom of the circuit board, and the frame is provided with two sensor clearance slots for avoiding the position sensors. The two OIS position sensors are respectively located in the two sensor clearance slots.

4. The lens driving device as described in claim 1, characterized in that, The circuit board is provided with two OIS coils, each OIS coil is respectively positioned opposite to a corresponding OIS magnet, and after the OIS coil is energized, the carrier can move relative to the frame along the first direction and the second direction, and the circuit board supplies power to the two OIS coils; And / or, an AF coil is provided on the outer wall of the frame, the AF coil is arranged opposite to the AF magnet, and after the AF coil is energized, the frame and the carrier can move relative to the base in a third direction, and the circuit board supplies power to the AF coil through the built-in circuit of the frame.

5. The lens driving device as described in claim 1, characterized in that, Several friction-reducing components are provided between the bottom end of the carrier and the frame; Preferably, the friction-reducing component is a ball bearing; More preferably, ball grooves are provided at the four corners of the frame, and one or more balls are placed in each ball groove. The top of the ball contacts the four corners of the bottom of the carrier, and the carrier is supported in the frame by the balls. More preferably, two OIS adsorption metals are fixedly installed at the bottom of the circuit board, and each OIS adsorption metal is respectively arranged opposite to and attracted to a corresponding OIS magnet; Preferably, the friction-reducing component is a hemispherical protrusion; More preferably, the flat ends of the hemispherical protrusion are located at the four corners of the bottom end of the carrier and the protruding ends of the hemispherical protrusion are in contact with the four corners of the frame, or the flat ends of the hemispherical protrusion are located at the four corners of the frame and the protruding ends of the hemispherical protrusion are in contact with the four corners of the bottom end of the carrier.

6. The lens driving device as described in claim 5, characterized in that, A support is provided between the frame and the carrier. The support is disposed on the frame and the carrier is disposed on the support. The support and the carrier can move in a first direction relative to the frame and the carrier can move in a second direction relative to the support. Friction-reducing components are provided between the support and the frame, and between the carrier and the support, for support purposes.

7. The lens driving device as claimed in claim 1, characterized in that, The frame has a frame guide groove on one outer wall and the base has a base guide groove on one inner wall. The frame guide groove and the base guide groove are arranged opposite to each other to form a guide mounting groove. A guide shaft is installed in the guide mounting groove. Preferably, the bottom end of the guide shaft is fixed to the base, and the frame guide groove on the outer wall of the frame can slide in a third direction relative to the guide shaft; More preferably, the frame sidewall is provided with a guide groove built-in metal, and the guide groove built-in metal is at least partially located on the inner wall of the frame guide groove.

8. The lens driving device as claimed in claim 1, characterized in that, A built-in metal plate is provided inside one side of the base. The inner wall of the built-in metal plate is positioned opposite to the AF magnet and is attracted and fixed to the AF magnet. Preferably, the AF magnet has magnet notches at both ends, and a magnet limiting groove is provided between the metal plate inside the base and the inner wall of the base. The two ends of the AF magnet are located in the magnet limiting groove, and the AF magnet is installed and limited by the magnet limiting groove.

9. The lens driving device as claimed in claim 1, characterized in that, The lens driving device also includes a housing, which is detachably connected to the base and forms a hollow cavity. The frame, the carrier, and the circuit board are all disposed within the hollow cavity.

10. The lens driving device according to any one of claims 1 to 9, characterized in that, An AF circuit board is provided on the outer wall of the frame. The AF circuit board is powered by the built-in circuit of the frame. An AF position sensor and an AF coil are provided on the outside of the AF circuit board. The AF coil is arranged opposite to the AF magnet. After the AF coil is energized, the frame and the carrier can move relative to the base in a third direction. The AF circuit board powers the AF position sensor and the AF coil. The monitoring signal of the AF position sensor passes through the AF circuit board, the built-in circuit of the frame and the circuit board in sequence, and is then output through the elastic connection part. Preferably, an AF adsorption metal is provided inside the sidewall of the frame, the AF adsorption metal is located inside the AF circuit board, and the AF adsorption metal and the AF magnet are arranged opposite to each other and adsorb each other.

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