Radiating device

Abstract

The invention discloses a heat dissipation device, and belongs to the technical field of semiconductor heat dissipation, the heat dissipation device comprises an evaporation cavity, a condensation cavity and at least one fluid loop, the evaporation cavity is internally provided with a cooling medium, the condensation cavity is internally provided with a cooling medium, and the fluid loop comprises an exhaust channel and a liquid return channel; the exhaust channel is configured to guide a gaseous cooling medium in the evaporation cavity into the condensation cavity, the liquid return channel is configured to guide a liquid cooling medium in the condensation cavity into the evaporation cavity, and the heat dissipation device is configured to control the evaporation cavity to communicate with the exhaust channel when the internal pressure of the evaporation cavity reaches a preset value; the heat dissipation device can control the evaporation cavity to be communicated with the exhaust channel when the internal pressure of the evaporation cavity reaches the preset value, the gaseous cooling medium is prevented from being discharged continuously and disorderly, the working temperature of the part to be subjected to heat dissipation is not prone to frequent oscillation, and it is ensured that the heat dissipation device can operate stably.

Description

Technical Field

[0001] This application belongs to the field of semiconductor heat dissipation technology, and specifically relates to a heat dissipation device. Background Technology

[0002] With the increasing integration and power of electronic devices, efficient heat dissipation has become crucial for ensuring device performance and reliability. Liquid cooling technology has attracted much attention due to its excellent thermal conductivity. To address heat dissipation in compact spaces at the chip or micrometer level, passive cooling solutions that utilize phase change of the cooling medium to generate self-driven heat have emerged, eliminating the need for external power to drive pumps for forced convection.

[0003] In related technologies, passive heat dissipation solutions typically include an evaporation chamber, a condensation chamber, and an exhaust channel and a return channel connecting the two. The cooling medium in the evaporation chamber vaporizes upon heating; the gaseous cooling medium enters the condensation chamber through the exhaust channel and liquefies; the liquid cooling medium then flows back to the evaporation chamber through the return channel, thus achieving self-circulating heat dissipation. However, because the evaporation chamber and the exhaust channel remain directly connected, as long as the cooling medium temperature reaches its boiling point, the gaseous cooling medium continues to be discharged disorderly, easily causing frequent fluctuations in the operating temperature of the components to be cooled, affecting the stable operation of the heat dissipation device. Summary of the Invention

[0004] One of the objectives of this application is to provide a heat dissipation device that ensures stable operation, thereby at least partially solving the aforementioned technical problems.

[0005] To achieve the above objectives, this application provides a heat dissipation device, comprising:

[0006] Evaporation chamber, which contains a cooling medium;

[0007] The condensation chamber contains a cooling medium.

[0008] At least one fluid circuit, the fluid circuit including an exhaust passage and a return passage, the exhaust passage being configured to introduce gaseous cooling medium in the evaporation chamber into the condensation chamber, and the return passage being configured to introduce liquid cooling medium in the condensation chamber into the evaporation chamber.

[0009] The heat dissipation device is configured to connect the evaporation chamber to the exhaust channel when the internal pressure of the evaporation chamber reaches a preset value.

[0010] In one or more embodiments of this application, the heat dissipation device includes at least one exhaust check valve, which is disposed in the evaporation chamber or the exhaust channel to connect the evaporation chamber and the exhaust channel when the internal pressure of the evaporation chamber reaches a preset value.

[0011] In one or more embodiments of this application, the heat dissipation device includes a first fluid circuit, a second fluid circuit, a first exhaust check valve, and a second exhaust check valve. The first fluid circuit includes a first exhaust passage, and the second fluid circuit includes a second exhaust passage.

[0012] The first exhaust check valve is configured to connect the evaporator chamber to the first exhaust passage when the internal pressure of the evaporator chamber reaches a first preset value.

[0013] The second exhaust check valve is configured to connect the evaporator chamber to the second exhaust passage when the internal pressure of the evaporator chamber reaches a second preset value.

[0014] The first preset value is less than the second preset value.

[0015] In one or more embodiments of this application, the path length of the first exhaust channel is less than the path length of the second exhaust channel.

[0016] In one or more embodiments of this application, the first exhaust passage includes at least one first path whose longitudinal section is configured as a straight line, and the second exhaust passage includes at least one second path whose longitudinal section is configured as a wavy line.

[0017] In one or more embodiments of this application, the heat dissipation device further includes a third fluid circuit and a third exhaust check valve. The third fluid circuit includes a third exhaust passage, and the third exhaust check valve is configured to connect the evaporation chamber to the third exhaust passage when the internal pressure of the evaporation chamber reaches a third preset value.

[0018] The first preset value is less than the third preset value, and the third fluid circuit is located on the periphery of the first fluid circuit.

[0019] In one or more embodiments of this application, the heat dissipation device further includes at least one liquid return check valve, which is disposed on the liquid return channel and configured to connect the evaporation chamber to the liquid return channel when the temperature in the liquid return channel is lower than the target temperature.

[0020] In one or more embodiments of this application, the liquid return channel has a liquid return path and a temperature control path. The liquid return path is connected to the condensation chamber, and the temperature control path is connected to the evaporation chamber. The liquid return check valve selectively connects the liquid return path and the temperature control path, and at least a portion of the longitudinal section of the temperature control path is configured as a straight line.

[0021] In one or more embodiments of this application, the path length of the exhaust channel is greater than the path length of the return channel.

[0022] In one or more embodiments of this application, the heat dissipation device includes a pressure sensor and a switch. The pressure sensor is configured to control the switch to connect the evaporation chamber to the exhaust channel when the internal pressure of the evaporation chamber reaches a preset value.

[0023] Compared with the prior art, the heat dissipation device of this application can control the connection between the evaporation chamber and the exhaust channel when the internal pressure of the evaporation chamber reaches a preset value, so as to avoid the continuous and disorderly discharge of gaseous cooling medium, making the working temperature of the component to be dissipated less prone to frequent oscillation, and ensuring that the heat dissipation device can operate stably. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic cross-sectional view along the vertical direction of the heat dissipation device when it dissipates heat from the component to be cooled, according to an embodiment of this application.

[0026] Figure 2 This is a schematic cross-sectional view of the heat dissipation device along the horizontal direction in one embodiment of this application;

[0027] Figure 3 This is a cross-sectional schematic diagram of the heat dissipation device fabrication process at step S10 in one embodiment of this application.

[0028] Figure 4 This is a cross-sectional schematic diagram of the heat dissipation device fabrication process at step S20 in one embodiment of this application;

[0029] Figure 5 This is a cross-sectional schematic diagram of the heat dissipation device fabrication process at step S30 in one embodiment of this application.

[0030] Figure 6 This is a cross-sectional schematic diagram of the heat dissipation device fabrication process at step S40 in one embodiment of this application. Detailed Implementation

[0031] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.

[0032] According to the first aspect of this application, referring to Figure 1 The present disclosure provides a heat dissipation device, including an evaporation chamber 10, a condensation chamber 20 and at least one fluid circuit 30.

[0033] In some embodiments, a cooling medium (not shown in the figure) is provided in the evaporation chamber and a cooling medium is provided in the condensation chamber.

[0034] For example, the cooling medium may be perfluorohexane.

[0035] In some embodiments, the fluid circuit 30 includes an exhaust passage 31 and a return passage 32. The exhaust passage 31 is configured to introduce gaseous cooling medium in the evaporation chamber 10 into the condensation chamber 20, and the return passage 32 is configured to introduce liquid cooling medium in the condensation chamber 20 into the evaporation chamber 10.

[0036] In this embodiment, the heat dissipation device may include one or more fluid circuits 30. Different fluid circuits 30 are connected in parallel. Each fluid circuit 30 includes an exhaust passage 31 and a return passage 32, thereby realizing the circulation of the cooling medium between the evaporation chamber 10 and the condensation chamber 20.

[0037] In some embodiments, the heat dissipation device is configured to control the evaporation chamber 10 to connect with the exhaust channel 31 when the internal pressure of the evaporation chamber 10 reaches a preset value.

[0038] In this embodiment, when the internal pressure of the evaporation chamber 10 reaches a preset value, the heat dissipation device can control the evaporation chamber 10 to connect with the exhaust channel 31, thereby preventing the continuous and disorderly discharge of the gaseous cooling medium, making it less likely for the operating temperature of the component to be cooled to fluctuate frequently, and ensuring that the heat dissipation device can operate stably.

[0039] In some embodiments, the heat dissipation device includes at least one exhaust check valve 40.

[0040] In this embodiment, the number of exhaust check valves 40 can be less than or equal to the number of fluid circuits.

[0041] In some embodiments, the exhaust check valve 40 is provided in a one-to-one correspondence with the fluid circuit 30, that is, each fluid circuit 30 (e.g., the evaporator chamber 10 or the exhaust channel 31) is provided with an independent exhaust check valve 40. This configuration can realize independent control of each fluid circuit 30, which is beneficial for fine adjustment of heat dissipation capacity.

[0042] In other embodiments, the number of exhaust check valves 40 may be less than the number of fluid circuits 30, that is, some fluid circuits 30 are provided with exhaust check valves 40, while other fluid circuits 30 are not provided with exhaust check valves 40.

[0043] In some embodiments, an exhaust check valve 40 is disposed in the evaporation chamber 10 or the exhaust passage 31 to connect the evaporation chamber 10 and the exhaust passage 31 when the internal pressure of the evaporation chamber 10 reaches a preset value.

[0044] In this embodiment, the exhaust check valve 40 can be located at the inlet of the exhaust channel 31 or at the outlet of the evaporation chamber 10.

[0045] In this embodiment, the exhaust check valve 40 is used to selectively connect the evaporation chamber 10 and the exhaust channel 31. That is, it opens when the internal pressure of the evaporation chamber 10 reaches a preset value, so as to achieve stable and reliable control of the connection and blockage between the evaporation chamber 10 and the exhaust channel 31.

[0046] Of course, the exhaust channel 31 can also be connected to the evaporation chamber 10 when the internal pressure of the evaporation chamber 10 reaches a preset value by setting its own structure, such as controlling the viscous resistance and surface tension in the exhaust channel 31.

[0047] In this embodiment, the exhaust check valve 40 is equipped with a preset opening pressure threshold (which may correspond to the target operating temperature of the component 200 to be cooled). When the pressure in the evaporation chamber 10 is lower than the preset value, the valve closes, and the gaseous cooling medium stops flowing into the exhaust channel 31; the valve only opens when the internal pressure of the evaporation chamber 10 exceeds the preset value, discharging the gaseous cooling medium in the evaporation chamber 10 to achieve efficient heat dissipation. Through the hysteresis control mechanism of the exhaust check valve 40, the temperature of the component 200 to be cooled (e.g., a chip) can be stabilized near the target value, avoiding frequent temperature fluctuations, which is beneficial to the stable operation of electronic components and extends their service life.

[0048] Furthermore, by presetting valve parameters, the opening pressure can be kept at a fixed difference relative to the ambient pressure, thereby offsetting the influence of altitude changes or sudden changes in air pressure on the boiling point of the cooling medium, stabilizing the start-up temperature of the heat dissipation device near the design value, and improving the performance consistency under different environments.

[0049] In this embodiment, when the component to be cooled 200 (e.g., a chip) is in a low-power state, the exhaust check valve 40 remains closed, accumulating gaseous cooling medium until the pressure reaches a preset value before being released in a concentrated manner, ensuring that each exhaust can form a complete phase change reflux cycle. This effectively avoids the ineffective loss of a small amount of steam slowly escaping but unable to reflux, reduces the long-term consumption of cooling medium, and maintains the long-term heat dissipation capability of the heat dissipation device.

[0050] Furthermore, when the pressure reaches the opening threshold, the exhaust check valve 40 is opened, and the accumulated high-pressure gas is released instantly, generating a pressure shock wave. This effectively overcomes the initial flow resistance and surface tension of the micron-level channel, forcibly driving the flow of steam and liquid, thereby reliably starting the self-circulating heat dissipation.

[0051] In some embodiments, in conjunction with reference Figure 2 As shown, the heat dissipation device includes a first fluid circuit 33, a second fluid circuit 34, a first exhaust check valve 41, and a second exhaust check valve 42. The first fluid circuit 33 includes a first exhaust passage 331, and the second fluid circuit 34 includes a second exhaust passage 341.

[0052] In this embodiment, the first fluid circuit 33 and the second fluid circuit 34 are connected in parallel. The first exhaust check valve 41 is disposed at the inlet of the first exhaust channel 331, and the second exhaust check valve 42 is disposed at the inlet of the second exhaust channel 341.

[0053] In some embodiments, the first exhaust check valve 41 is configured to connect the evaporator 10 to the first exhaust passage 331 when the internal pressure of the evaporator 10 reaches a first preset value.

[0054] In some embodiments, the second exhaust check valve 42 is configured to connect the evaporator chamber 10 to the second exhaust passage 341 when the internal pressure of the evaporator chamber 10 reaches a second preset value.

[0055] In some embodiments, the first preset value is less than the second preset value.

[0056] In this embodiment, when the heat generated by the component to be cooled 200 is low and the pressure inside the evaporation chamber 10 is low (below the first preset value), both the first exhaust check valve 41 and the second exhaust check valve 42 are closed, and heat dissipation is temporarily not initiated to avoid overcooling. When the pressure reaches the first preset value but not the second preset value, only the first exhaust check valve 41 opens, and steam is discharged through the first exhaust channel 331, achieving low-power heat dissipation. When the heat generated increases and the pressure reaches the second preset value, both the first exhaust check valve 41 and the second exhaust check valve 42 open simultaneously, and steam is discharged through the first exhaust channel 331 and the second exhaust channel 341, significantly improving the heat dissipation power. Thus, the heat dissipation device can automatically switch the heat dissipation level according to the heat load, achieving "on-demand heat dissipation" and avoiding excessive heat dissipation causing excessively low temperatures under low heat loads and insufficient heat dissipation causing overheating under high heat loads.

[0057] In this embodiment, by setting multiple pressure thresholds (i.e., multiple preset values), pressure oscillations caused by frequent opening and closing of single-stage valves are avoided. For example, when the pressure fluctuates around the first preset value, only the first exhaust check valve 41 opens intermittently, while the second exhaust check valve 42 remains closed, ensuring a smooth transition in overall heat dissipation capacity. Once the pressure stabilizes above the second preset value, both the first exhaust check valve 41 and the second exhaust check valve 42 simultaneously and continuously open, providing sufficient exhaust flow to ensure that the condensate can be fully driven back, maintaining the continuity and stability of the self-circulation.

[0058] In this embodiment, the coordinated operation of multiple exhaust channels (such as the first exhaust channel 331 and the second exhaust channel 341) allows the total exhaust cross-sectional area to increase stepwise with the increase of heat load, thereby significantly improving the peak heat dissipation power of the heat dissipation device without increasing the size of a single exhaust channel, and meeting the heat dissipation requirements of instantaneous high heat generation of components such as chips.

[0059] In some embodiments, continue to refer to Figure 2 As shown, the path length of the first exhaust channel 331 is less than the path length of the second exhaust channel 341.

[0060] In this embodiment, when the pressure inside the evaporation chamber 10 reaches a relatively high second preset value, the second exhaust check valve 42 opens, and high-pressure steam enters the second exhaust channel 42 with a longer path. The longer path increases the contact time and contact area between the steam and the inner wall of the exhaust channel, allowing the kinetic and pressure energy of the high-pressure gas to be gradually dissipated. This avoids the high-pressure steam directly impacting the condensation chamber 20 or the weak structure of the heat dissipation device, thereby reducing the risk of damage to the heat dissipation device caused by gas impact and improving the long-term reliability of the heat dissipation device under high temperature and high pressure conditions.

[0061] In this embodiment, the first exhaust channel 331 (short path, low opening pressure) is used for low-pressure, low-flow exhaust, with low flow resistance, allowing low-pressure steam to be quickly and smoothly discharged into the condenser chamber 20, achieving low-power heat dissipation and rapid response. The second exhaust channel 341 (long path, high opening pressure) is used for high-pressure, high-flow exhaust. The longer path can appropriately increase flow resistance to match the higher driving pressure, preventing circulation interruption due to insufficient condensate return in the condensate chamber 20 caused by excessive exhaust. Through the differentiated design of path lengths, the multi-stage exhaust channels (e.g., the first exhaust channel 331 and the second exhaust channel 341) can maintain a dynamic balance of gas-liquid circulation in different pressure ranges.

[0062] In this embodiment, the longer exhaust channel (e.g., the second exhaust channel 341) provides a more adequate heat dissipation path for the steam, allowing it to be partially pre-cooled before reaching the condenser chamber 20. This helps reduce the heat load on the condenser chamber 20 and improves the overall condensation efficiency. Simultaneously, this also reduces pressure fluctuations within the condenser chamber 20, making the heat dissipation process more stable.

[0063] In some embodiments, continue to refer to Figure 2 As shown, the first exhaust passage 331 includes at least one first path 3311, the longitudinal section of which is configured as a straight line.

[0064] In this embodiment, at least a portion of the first exhaust channel 331 (low opening pressure) (e.g., the first path 3311) adopts a straight longitudinal section, with a straight path and minimal flow resistance. When the pressure in the evaporation chamber 10 reaches the first preset value, the steam can be discharged into the condensation chamber 20 at the fastest speed to achieve instant heat dissipation response and avoid pressure fluctuations caused by the retention of low-pressure steam in the first exhaust channel 331.

[0065] In some embodiments, the second exhaust passage 341 includes at least one second path 3411, the longitudinal section of which is configured as a wavy line.

[0066] In this embodiment, at least a portion of the second exhaust channel 341 (high opening pressure) (e.g., the second path 3411) adopts a wavy longitudinal section. When high-pressure steam enters, the wavy path forces the steam to continuously change its flow direction and fully collide with the wall of the second exhaust channel 341, effectively dissipating the kinetic and pressure energy of the high-pressure gas, playing a buffering role, and preventing high-pressure impact from damaging the device.

[0067] In this embodiment, the wavy longitudinal section has a longer actual path length and a larger inner wall surface area compared to the straight longitudinal section. When high-pressure steam flows in the wavy channel, the heat exchange with the wall is more thorough, achieving a significant pre-condensation effect. Some of the steam liquefies in advance, reducing the heat load on the condensation chamber 20 and improving the overall heat dissipation efficiency.

[0068] In this embodiment, the first path 3311 extends from the evaporator 10 to the condenser 20 in a straight line, which is the shortest path and has the least flow resistance. The second path 3411 is constructed as a wavy line, that is, it exhibits periodic oscillation in the extension direction, thereby significantly increasing the actual length of the second exhaust channel 341 while keeping the straight-line distance between the evaporator 10 and the condenser 20 unchanged. Both the straight-line and wavy-line longitudinal sections can be realized by photolithography, etching, or 3D printing processes.

[0069] In this embodiment, the second exhaust channel 341 first achieves initial buffering through the difference in path length, and then further enhances the buffering effect through the wavy cross section. The combination of the two causes the high-pressure steam to undergo dual dissipation of "long distance + wavy shape" in the second exhaust channel 341, thereby improving the reliability of the heat dissipation device under high heat load.

[0070] In some embodiments, continue to refer to Figure 2 As shown, the heat dissipation device also includes a third fluid circuit 35 and a third exhaust check valve 43. The third fluid circuit 35 includes a third exhaust passage 351.

[0071] In this embodiment, the third exhaust check valve 43 is located at the inlet of the third exhaust channel 351.

[0072] For example, the first fluid circuit 33, the second fluid circuit 34, and the third fluid circuit 35 are connected in parallel.

[0073] In some embodiments, the third exhaust check valve 43 is configured to connect the evaporator chamber 10 to the third exhaust passage 351 when the internal pressure of the evaporator chamber 10 reaches a third preset value.

[0074] In some embodiments, the first preset value is less than the third preset value, and the third fluid circuit 35 is located around the first fluid circuit 33.

[0075] In this embodiment, the first exhaust channel 331 (i.e., the low-pressure exhaust channel) is arranged in the central region, and the third exhaust channel 351 (i.e., the high-pressure exhaust channel) is arranged on the periphery, making full use of the two-dimensional space of the heat dissipation device in the horizontal direction. The central region is usually more compact, suitable for arranging exhaust channels with short paths; the peripheral region has a larger area, suitable for arranging exhaust channels with long paths. This layout avoids channel stacking or congestion, improves space utilization, and is conducive to the miniaturization and high-density integration of the heat dissipation device.

[0076] For example, the path length of the first exhaust channel 331 is less than the path length of the third exhaust channel 351. The third exhaust channel 351 includes at least one third path 3511, the longitudinal section of which is configured as a wavy line. The ample space in the peripheral area of ​​the heat dissipation device allows for the design of a longer path and wavy cross-section for the third exhaust channel 351, thus buffering high-pressure steam and enhancing the pre-condensation effect. The central area is reserved for a short, straight low-pressure channel (i.e., the first exhaust channel 331) to achieve rapid response. This layout achieves a functional zoning of "fast central exhaust and peripheral buffering," resulting in superior overall performance.

[0077] In this embodiment, the lower the preset value, the closer the exhaust channel is to the center of the heat dissipation device. This means that under most normal operating conditions (when the pressure only reaches the first preset value), only the exhaust channels in the central area are operational, while the outer exhaust channels remain closed. The valves and channel structures of the outer exhaust channels therefore experience less thermal cycling and pressure shocks, extending the overall lifespan of the heat dissipation device.

[0078] For example, such as Figure 2 The second preset value is less than the third preset value, and the path length of the second exhaust passage 341 is less than the path length of the third exhaust passage 351. The first fluid circuit 33 (at least partially linear) can be located around the second fluid circuit 34, which can make full use of the arrangement space between the two wavy second fluid circuits 34 and the third fluid circuit 35.

[0079] In a different embodiment not shown, the second fluid circuit 34 may also be located around the first fluid circuit 33.

[0080] In some embodiments, continue to refer to Figure 1 As shown, the heat dissipation device also includes at least one return check valve 50, which is disposed on the return channel 32.

[0081] In this embodiment, the return check valve 50 is configured in a one-to-one correspondence with the fluid circuit 30, that is, each fluid circuit 30 has an independent return check valve 50 on its return channel 32. This configuration enables independent control of each fluid circuit.

[0082] For example, such as Figure 2 The heat dissipation device includes a first return check valve 51, a second return check valve 52, and a third return check valve 53. The first fluid circuit 33 includes a first return channel 332, the second fluid circuit 34 includes a second return channel 342, and the third fluid circuit 35 includes a third return channel 352. The first return check valve 51 is disposed on the first return channel 332, the second return check valve 52 is disposed on the second return channel 342, and the third return check valve 53 is disposed on the third return channel 352.

[0083] Of course, the number of return check valves 50 can also be less than the number of fluid circuits 30.

[0084] In some embodiments, the return liquid check valve 50 is configured to connect the evaporation chamber 10 to the return liquid channel 32 when the temperature in the return liquid channel 32 is lower than the target temperature.

[0085] In this embodiment, when the cooling medium in the condensing chamber 20 is close to or exceeds its boiling point due to insufficient heat dissipation or high ambient temperature, if it flows directly into the evaporating chamber 10, it may vaporize during the liquid inlet process, leading to pressure disturbances, liquid level fluctuations, or even steam backflow within the evaporating chamber 10. This application utilizes the temperature control mechanism of the return liquid check valve 50 to allow the cooling medium in the return liquid channel 32 to flow into the evaporating chamber 10 only when its temperature is below the target temperature (e.g., within the safe range below the boiling point), thereby ensuring that the cooling medium entering the evaporating chamber 10 is in a liquid state and maintaining a stable phase change cycle.

[0086] For example, the exhaust check valve 40 and / or the return check valve 50 can adopt a pressure differential driven check valve structure. When the pressure on one side of the valve is greater than that on the other side and the difference reaches a preset threshold, the valve core (or valve disc) automatically opens under the action of the pressure difference; when the medium flows back or the upstream pressure drops to near zero, the valve core automatically closes, thereby preventing the medium from flowing back.

[0087] For example, the target temperature can be set to the boiling point temperature of the cooling medium or a temperature slightly below the boiling point (e.g., 1 to 5°C below the boiling point).

[0088] In some embodiments, continue to refer to Figure 1 and Figure 2 As shown, the return liquid channel 32 has a return liquid path 321 and a temperature control path 322. The return liquid path 321 is connected to the condensation chamber 20, and the temperature control path 322 is connected to the evaporation chamber 10. The return liquid check valve 50 selectively connects the return liquid path 321 and the temperature control path 322.

[0089] In this embodiment, the liquid return check valve 50 is disposed between the liquid return path 321 and the temperature control path 322, with the temperature control path 322 located between the liquid return check valve 50 and the evaporation chamber 10. When the liquid return check valve 50 is open, the cooling medium first passes through the liquid return path 321 (connected to the condensation chamber 20), and then through the temperature control path 322 (connected to the evaporation chamber 10) into the evaporation chamber 10. The temperature control path 322 acts as a buffer zone, effectively isolating the high temperature of the evaporation chamber 10 from being conducted to the liquid return path 321, preventing the cooling medium in the liquid return path 321 from prematurely vaporizing due to heat, ensuring that the cooling medium entering the evaporation chamber 10 remains liquid and maintains a stable phase change cycle.

[0090] In some embodiments, continue to refer to Figure 1 and Figure 2 As shown, at least a portion of the longitudinal section of the temperature control path 322 is configured as a straight line.

[0091] In this embodiment, at least a portion of the longitudinal section of the temperature control path 322 is configured as a straight line, minimizing flow resistance and maximizing flow velocity when the liquid flows through this section. This ensures that when the return check valve 50 is opened, the cooling medium can quickly flow from the temperature control path 322 into the evaporation chamber 10, shortening the residence time of the liquid in the high-temperature region and further reducing the risk of it being heated to its boiling point before entering the evaporation chamber 10.

[0092] In some embodiments, continue to refer to Figure 1 As shown, the exhaust channel 31 is connected to the top of the condensation chamber 20, and the liquid return channel 32 is connected to the bottom of the condensation chamber 20.

[0093] In this embodiment, steam is introduced into the condenser chamber 20 from the top via the exhaust channel 31, where it liquefies and accumulates at the bottom. Due to the continuous influx of steam, the pressure at the top of the condenser chamber 20 is higher than the pressure at the bottom liquid surface, creating a pressure gradient. The return channel 32 connects to the bottom of the condenser chamber 20; this pressure difference forces the bottom liquid into the return channel 32, driving it back to the evaporator chamber 10 without requiring additional power. This "top intake, bottom discharge" layout fully utilizes the natural pressure distribution during the phase change process, enhancing the self-circulation driving force.

[0094] In this embodiment, after entering from the top, the steam flows downward in the condensation chamber 20, making full contact with the wall of the condensation chamber 20. The liquefied liquid drips down the wall or directly to the bottom. This flow path prolongs the residence time of the steam in the condensation chamber 20, improving the condensation efficiency. At the same time, the bottom liquid surface is relatively calm, which is conducive to the natural separation of gas and liquid, reducing the possibility of steam carrying liquid droplets into the return liquid channel 32.

[0095] In this embodiment, the return liquid channel 32 is located at the lowest point (bottom) of the condensation chamber 20, so that the liquid generated by condensation can naturally collect to the inlet of the return liquid channel 32 by gravity, avoiding the accumulation of liquid in the corner of the condensation chamber 20 and preventing it from flowing back, thereby improving the recovery rate of condensate and ensuring that the evaporation chamber 10 has sufficient cooling medium replenishment.

[0096] In some embodiments, continue to refer to Figure 1 As shown, the horizontal height of the exhaust channel 31 gradually decreases from the evaporator chamber 10 toward the condenser chamber 20.

[0097] In this embodiment, the exhaust channel 31 gradually decreases in elevation from the evaporation chamber 10 to the condensation chamber 20 (i.e., it slopes downwards along the steam flow direction), so that while the steam is driven by the pressure difference, it is also assisted by the component of gravity along the flow direction. This reduces the driving pressure required for steam flow, reduces pressure loss caused by channel resistance, and allows steam to reach the condensation chamber 20 more smoothly, which is especially suitable for scenarios with low steam pressure in micron-level channels.

[0098] In some embodiments, the horizontal height of the return liquid channel 32 gradually decreases from the condensation chamber 20 toward the evaporation chamber 10.

[0099] In this embodiment, the return channel 32 gradually decreases in elevation from the condensation chamber 20 to the evaporation chamber 10 (i.e., it slopes downwards along the liquid flow direction), allowing the liquid cooling medium in the condensation chamber 20 to flow naturally to the evaporation chamber 10 by gravity without the need for an additional pressure difference. This design fully utilizes gravity as the driving force for liquid return, enhancing the reliability of self-circulation, especially when there is a height difference between the evaporation chamber 10 and the condensation chamber 20.

[0100] In this embodiment, the lowest point of the exhaust channel 31 (near the condenser chamber 20) is still higher than the highest point of the return liquid channel 32 (near the condenser chamber 20), meaning that the overall horizontal height of the exhaust channel 31 is higher than that of the return liquid channel 32. This height difference effectively prevents liquid in the condenser chamber 20 from flowing back into the exhaust channel 31, avoiding blockage of the exhaust channel 31 and loss of exhaust capacity. Simultaneously, it also prevents vapor from carrying liquid droplets from the exhaust channel 31, improving the gas-liquid separation effect.

[0101] In some embodiments, continue to refer to Figure 1 and Figure 2 As shown, the path length of the exhaust channel 31 is greater than the path length of the return channel 32.

[0102] In this embodiment, when the liquid flows in the micron-level channel, it is significantly affected by viscous resistance and surface tension, and the flow resistance is proportional to the channel length. Designing the return liquid channel 32 to be shorter than the exhaust channel 31 can effectively reduce the pressure loss on the liquid return path, making it easier and faster for the cooling medium in the condensation chamber 20 to flow into the evaporation chamber 10, and avoiding the evaporation chamber 10 from "drying up" and failing to dissipate heat due to the lag in liquid return.

[0103] In this embodiment, the steam is driven mainly by the pressure difference within the evaporation chamber 10. The gas has low viscosity and can overcome the resistance of a long channel. The liquid, on the other hand, is driven mainly by gravity or a small pressure difference, resulting in limited driving force. By making the length of the exhaust channel 31 greater than the length of the return liquid channel 32, an optimized configuration of "long gas path and short liquid path" is achieved, enabling the steam and liquid to be transported efficiently within their respective suitable channel lengths, maintaining the dynamic balance of the circulation.

[0104] In this embodiment, the shorter the return liquid channel 32, the shorter the contact time between the cooling medium and the surrounding high-temperature environment when flowing through the return liquid channel 32, and the smaller the temperature rise, thereby reducing the risk of premature vaporization before entering the evaporation chamber 10. This complements the linear design of the temperature control path 322 in the previous embodiment, jointly ensuring the quality of the return liquid.

[0105] For example, the aperture of the exhaust channel 31 can be between 10µm and 300µm, and the aperture of the return channel 32 can be between 10µm and 300µm. The apertures of the exhaust channel 31 and the return channel 32 can be set to be the same to facilitate the differentiation of the lengths of the exhaust channel 31 and the return channel 32.

[0106] In some embodiments, continue to refer to Figure 1 and Figure 2 As shown, the volume of the evaporation chamber 10 is smaller than the volume of the condensation chamber 20.

[0107] In this embodiment, the evaporation chamber 10 has a relatively small volume, meaning that it contains a relatively small amount of cooling medium. When the component to be cooled 200 heats up, a small amount of cooling medium can be rapidly heated to its boiling point and vaporized, generating sufficient steam pressure in a short time to open the exhaust check valve 40 and initiate the heat dissipation cycle. This avoids thermal inertia delay caused by an excessively large evaporation chamber 10, thus improving the response speed of the heat dissipation device.

[0108] In this embodiment, the evaporation chamber volume is small, reducing the total amount of cooling medium required. For applications using high-cost cooling media such as perfluorohexane, this effectively reduces material costs. Simultaneously, reducing the liquid charge also lightens the overall weight of the device, which is beneficial for applications in portable electronic devices.

[0109] In this embodiment, the condensing chamber 20 has a larger volume than the evaporating chamber 10, providing ample space for the diffusion and condensation of the incoming steam. The steam resides in the condensing chamber 20 for a longer time, resulting in more thorough heat exchange with the condensing walls and higher condensation efficiency. Simultaneously, the large-volume condensing chamber 20 can accommodate more liquid cooling medium, preventing excessive liquid from blocking the steam inlet or affecting gas-liquid separation.

[0110] In this embodiment, during the self-circulating heat dissipation process, the evaporator 10 continuously generates steam, and the condenser 20 continuously receives and liquefies the steam. If the volume of the condenser 20 is too small, the steam will quickly fill the condenser 20, causing the pressure to rise, which will hinder the entry of subsequent steam and reduce the circulation efficiency. A larger volume of the condenser 20 can act as a pressure buffer, keeping the pressure inside the condenser 20 at a low level, ensuring a stable pressure difference between the evaporator 10 and the condenser 20, and driving the steam to flow smoothly.

[0111] Continue to cooperate with reference Figure 1 The evaporation chamber 10 is positioned above the component 200 (such as a chip) to be cooled, and heat exchange is achieved between the evaporation chamber 10 and the condensation chamber 20 through thermally conductive adhesive. Both the evaporation chamber 10 and the condensation chamber 20 are filled with a cooling medium. As a specific example, the cooling medium is perfluorohexane, which has a boiling point of 56°C (e.g., at standard atmospheric pressure). When the component 200 to be cooled is operating, its temperature gradually increases, and heat is transferred to the cooling medium within the evaporation chamber 10 through thermal conduction.

[0112] When the temperature inside the evaporation chamber 10 reaches the boiling point of the cooling medium (e.g., 56°C), the cooling medium begins to boil and vaporize. During this process, the cooling medium absorbs a large amount of latent heat of vaporization, thereby carrying away the heat generated by the component 200 to be cooled. The volume of the vaporized cooling medium expands rapidly, generating significant gas pressure inside the evaporation chamber 10.

[0113] The gas pressure acts on the exhaust check valve 40 at the inlet of the exhaust channel 31. Because this application includes the exhaust check valve 40 (instead of the evaporation chamber 10 being normally connected to the exhaust channel 31), the steam will not be discharged immediately, but will accumulate in the evaporation chamber 10 until the pressure reaches the preset opening threshold of the exhaust check valve 40 (for example, the pressure inside the evaporation chamber 10 reaches a preset value). When the pressure reaches the preset value, the exhaust check valve 40 opens, and the high-pressure steam enters the condensation chamber 20 through the exhaust channel 31.

[0114] After steam enters the condenser chamber 20, it comes into contact with the wall of the condenser chamber 20, releases heat, and liquefies into a liquid cooling medium. The liquefied cooling medium accumulates at the bottom of the condenser chamber 20. As the steam in the evaporator chamber 10 is discharged, the pressure inside the chamber decreases, while the pressure inside the condenser chamber 20 is relatively high. Driven by the pressure difference or gravity, the liquid cooling medium at the bottom of the condenser chamber 20 flows back to the evaporator chamber 10 through the return liquid channel 32 to replenish the liquid lost due to vaporization. This cycle repeats continuously, forming a self-circulating heat dissipation system that requires no external power.

[0115] Reference Figure 2 As shown, when the component to be cooled 200 is under low load and the pressure in the evaporator chamber 10 is low but has reached the first preset value, only the first exhaust check valve 41 is opened. Steam enters the condenser chamber 20 through the first exhaust channel 331 (usually the shortest path, with a straight cross-section, and located in the central area of ​​the heat dissipation device), achieving low-power heat dissipation. At this time, since the steam discharge is moderate, the liquid return flow in the condenser chamber 20 is also small, and the liquid replenishment requirement can be met through a shorter liquid return channel 32 (e.g., the first liquid return channel 332).

[0116] When the load on the heat dissipation component 200 increases and the pressure in the evaporation chamber 10 reaches the second preset value, the first exhaust check valve 41 and the second exhaust check valve 42 open simultaneously. Steam enters the condensation chamber 20 through the first exhaust channel 331 and the second exhaust channel 341 (the second exhaust channel 341 can be designed with a longer path, a wavy cross-section, and located in the central area of ​​the heat dissipation device), significantly improving the heat dissipation power. At the same time, the return flow rate of liquid in the condensation chamber 20 also increases. Since the return liquid channel 32 (e.g., the first return liquid channel 332 and the second return liquid channel 342) has a fixed and relatively short length, it can accommodate greater return flow requirements.

[0117] When the component to be cooled 200 is under full load or transient peak heating, and the pressure in the evaporator chamber 10 reaches the third preset value, the first exhaust check valve 41, the second exhaust check valve 42, and the third exhaust check valve 43 all open. Steam is simultaneously discharged through the first exhaust channel 331, the second exhaust channel 341, and the third exhaust channel 351, achieving maximum heat dissipation power. Due to the large kinetic energy of high-pressure steam, the longer exhaust channels 31 (such as the second exhaust channel 341 and the third exhaust channel 351) can play a buffering and pre-condensing role, preventing high-pressure gas from directly impacting the internal structure of the condensation chamber.

[0118] Through this multi-level pressure threshold design, the heat dissipation device can automatically adjust the number of open exhaust channels and the total exhaust cross-sectional area according to the actual heat generated by the chip, thereby avoiding overcooling under low load and providing sufficient peak heat dissipation capacity under high load, achieving "heat dissipation on demand".

[0119] Furthermore, continue to cooperate with reference Figure 1 As shown, a return check valve 50 is provided on the return channel 32. The return check valve 50 is configured to open only when the temperature of the cooling medium in the return channel 32 is lower than the target temperature (e.g., below the boiling point of the cooling medium), allowing the cooling medium to flow from the condensation chamber 20 to the evaporation chamber 10; if the temperature of the cooling medium in the return channel 32 is too high (possibly due to insufficient condensation or excessively high ambient temperature), the return check valve 50 remains closed, preventing high-temperature liquid from entering the evaporation chamber 10, thus avoiding premature vaporization or interference with normal boiling in the evaporation chamber 10 before it enters the evaporation chamber 10.

[0120] Furthermore, the temperature control path 322 in the return channel 32, located between the return check valve 50 and the evaporation chamber 10, is designed to be straight and as short as possible. This ensures that when the return check valve 50 is open, the cooling medium can pass through the high-temperature region at the fastest speed, minimizing the heating time and ensuring that it enters the evaporation chamber 10 in a liquid state, maintaining a stable phase change interface.

[0121] Since the entire heat dissipation process relies entirely on the expansion force generated by the boiling of the coolant as the driving source, no external power supply, water pump, or other mechanical moving parts are required. Therefore, the heat dissipation device in this application embodiment can be made extremely small (micrometer scale), directly integrated into the chip package or on the chip surface, significantly improving packaging density. At the same time, due to the absence of moving parts, the heat dissipation device has higher reliability and a longer service life.

[0122] In another embodiment (not shown), the heat dissipation device includes a pressure sensor (not shown) and a switch (not shown), the pressure sensor being configured to control the switch to connect the evaporation chamber 10 to the exhaust passage 31 when the internal pressure of the evaporation chamber 10 reaches a preset value.

[0123] In this embodiment, the pressure sensor converts pressure signals into electrical signals, and the preset value can be flexibly set via software or external circuitry, eliminating the need for a fixed threshold value based on structural dimensions or spring preload, as is the case with mechanical check valves. This allows the heat dissipation device to be calibrated on-site or dynamically adjusted according to different application scenarios (such as the heat resistance temperature of different chips), improving the product's versatility and adaptability.

[0124] In this embodiment, the pressure sensor can monitor the pressure changes within the evaporation chamber 10 in real time and feed the data back to an external controller (such as the chip's own temperature management unit). Combined with active control of the switch, more complex heat dissipation strategies can be implemented.

[0125] In this embodiment, the mechanical check valve relies on the inertia of the valve core or the deformation of the elastic element, resulting in a certain opening delay (especially at low pressure differentials) and fatigue aging after long-term cycling. The pressure sensor and switch, on the other hand, are non-contact detection and electronic control actuators with fast response times (milliseconds), no mechanical wear, and theoretically, longer service life and higher reliability.

[0126] In this embodiment, in the multi-stage exhaust channel 31 scheme, multiple pressure sensors (or one sensor in conjunction with multiple comparison thresholds) can be set to control multiple switches respectively, with each switch corresponding to one exhaust channel 31. Since the setting accuracy of electronic thresholds is much higher than that of mechanical valves, the first preset value, the second preset value, and the third preset value can be distinguished more accurately, avoiding threshold overlap or sequence disorder caused by machining tolerances.

[0127] In this embodiment, integrating a micromechanical one-way valve within a micrometer-level channel places high demands on processes such as photolithography, etching, and bonding, resulting in limited yield. In contrast, pressure sensors (such as MEMS pressure sensors) and switches (such as micro-solenoid valves and piezoelectric valves) can be partially integrated externally into the heat sink or connected via lead holes, reducing the complexity of the internal microstructure and improving manufacturing yield.

[0128] In this embodiment, the readings from the pressure sensor can be used to determine whether the heat dissipation device is working properly. For example, if the pressure in the evaporator chamber 10 fails to build up for an extended period (potentially due to cooling medium leakage), or if the pressure rises abnormally and the switch does not respond, the system can issue an alarm signal for timely maintenance.

[0129] For example, a pressure sensor can be installed inside the evaporation chamber 10 or at a pressure measuring port connected to the evaporation chamber 10 to detect the gas pressure inside the evaporation chamber 10 in real time. A switch can be installed at the inlet of the exhaust channel 31 or on the connecting pipe between the evaporation chamber 10 and the exhaust channel 31 to physically block or open the gas path.

[0130] For example, the pressure sensor and the switch are electrically connected (via wires, flexible circuit boards, or wirelessly). When the pressure sensor detects that the pressure value inside the evaporator chamber 10 reaches a preset value, it outputs a control signal to drive the switch to open, thereby connecting the evaporator chamber 10 with the exhaust passage 31; when the pressure sensor detects that the pressure inside the evaporator chamber 10 is lower than the preset value, it controls the switch to close, thereby blocking the connection between the evaporator chamber 10 and the exhaust passage 31.

[0131] According to a second aspect of this disclosure, a method for fabricating a heat dissipation device is provided. This fabrication method is applicable to the aforementioned heat dissipation device, which possesses all the aforementioned beneficial effects, which will not be elaborated further herein.

[0132] Reference Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, a method for fabricating a heat dissipation device includes the following steps:

[0133] S10. Provide a first substrate 60, a second substrate 70, a third substrate 80 and a fourth substrate 90, form a first etched structure 601 on the first substrate 60, form a second etched structure 701 on the second substrate 70, form a third etched structure 801 on the third substrate 80 and form a fourth etched structure 901 on the fourth substrate 90.

[0134] S20. An exhaust check valve 40 is provided on the third etching structure 801 and / or the fourth etching structure 901.

[0135] S30. The first substrate 60, the second substrate 70 and the third substrate 80 are sequentially bonded together. The first etched structure 601, the second etched structure 701 and the third etched structure 801 enclose an evaporation cavity 10. The first etched structure 601, the second etched structure 701 and the third etched structure 801 enclose a portion of a condensation cavity 20. The second etched structure 701 and the third etched structure 801 enclose a liquid return channel 32. Cooling medium is injected into the evaporation cavity 10 and / or the condensation cavity 20.

[0136] S40, the fourth substrate 90 is bonded to the third substrate 80, and the first etched structure 601, the second etched structure 701, the third etched structure 801 and the fourth etched structure 901 surround to form a condensation cavity 20, and the third etched structure 801 and the fourth etched structure 901 surround to form an exhaust channel 31.

[0137] In this embodiment, as Figure 4 and Figure 5 In step S20, an exhaust check valve 40 is pre-set on the third etched structure 801 and / or the fourth etched structure 901 (e.g., installed in a micro-slot or integrally formed), and then the valve is encapsulated inside the heat dissipation device through multi-layer bonding, avoiding the difficulty of installing the valve after the sealed cavity is formed. This method is particularly suitable for the integration of check valves at the micron scale, ensuring precise positioning and reliable fixation of the valve.

[0138] In this embodiment, as Figure 5 In step S30, the first substrate 60, the second substrate 70, and the third substrate 80 are bonded together to form an evaporation chamber 10, a partial condensation chamber 20, and a return channel 32. At this stage, the heat dissipation device is not completely sealed, leaving an open injection port (e.g., through the unsealed portion of the condensation chamber 20). Injecting cooling medium at this stage ensures that the liquid fully fills the evaporation chamber 10, the condensation chamber 20, and the return channel 32, and the injection volume is easy to control. Of course, the third etched structure 801 has a partial venting channel 31, which can also be used to inject cooling medium into the evaporation chamber 10. Then, in step S40, the fourth substrate 90 is bonded to complete the overall sealing, avoiding the problems of residual air bubbles or insufficient filling that may occur when injecting liquid through a small injection hole.

[0139] In this embodiment, by etching different structures on four substrates and then bonding them layer by layer, a multi-layered, intersecting, or three-dimensional flow path layout, such as the evaporation chamber 10, condensation chamber 20, exhaust channel 31, and liquid return channel 32, can be formed in the vertical direction. This layered manufacturing method breaks through the planar limitations of single-layer etching, allowing the exhaust channel 31 and liquid return channel 32 to be routed on different height layers, optimizing space utilization. For example, the exhaust channel 31 can be located on the upper layer and the liquid return channel 32 on the lower layer, without interfering with each other.

[0140] In this embodiment, multilayer substrate bonding (such as SAB low-temperature bonding) is employed, forming a tight atomic or molecular bond between each layer. This results in excellent sealing performance, capable of withstanding the internal pressure generated by the vaporization of the cooling medium, and avoiding the risk of leakage during long-term use. Simultaneously, the layered structure clearly defines the boundaries of each functional area, reducing the possibility of cross-contamination or crosstalk.

[0141] In this embodiment, the method employs standard semiconductor processes such as photolithography, etching, and bonding, enabling mass production at the wafer level and offering advantages such as high precision, high consistency, and low cost. For ceramic or silicon substrates, the processes are mature; for metal or alloy substrates, similar multilayer bonding or 3D printing can be used as alternatives. This method provides a feasible technical path for the industrialization of micron-scale self-circulating heat dissipation devices.

[0142] In this embodiment, the four-substrate design allows for the use of different materials for each layer (e.g., the first substrate 60 and the second substrate 70 are made of high thermal conductivity metals, while the third substrate 80 and the fourth substrate 90 are made of glass or ceramics). Material selection is optimized based on functional requirements: substrates near the heat source are made of high thermal conductivity materials, exhaust channels 31 and condensation zones 20 are made of easily machinable materials, and the one-way valve mounting layer is made of a material with high mechanical strength. This flexibility in material combination is difficult to achieve with a single material solution.

[0143] In this embodiment, in step S20, a return liquid check valve 50 is provided on the first etching structure 601 and / or the second etching structure 701, and then the first substrate 60, the second substrate 70 and the third substrate 80 are sequentially bonded together.

[0144] For example, such as Figure 3 The system provides a first substrate 60, a second substrate 70, a third substrate 80, and a fourth substrate 90. The substrate material can be silicon, glass, ceramic, or an antioxidant alloy, etc.

[0145] For example, such as Figure 3 Etched structures are formed on each substrate:

[0146] A first etched structure 601 is formed on the first substrate 60. The first etched structure 601 may include the bottom outline of the evaporation chamber 10, a portion of the groove of the return channel 32, the bottom outline of the condensation chamber 10, and a miniature slot or positioning structure for mounting the return check valve 50.

[0147] A second etched structure 701 is formed on the second substrate 70. The second etched structure 701 may include the central contour of the evaporation chamber 10, another part of the trench of the liquid return channel 32, and the lower middle contour of the condensation chamber 20.

[0148] A third etched structure 801 is formed on the third substrate 80. The third etched structure 801 may include the top outline of the evaporation chamber 10, a portion of the exhaust passage 31, the upper middle outline of the condensation chamber 20, and a miniature slot or positioning structure for mounting the exhaust check valve 40.

[0149] A fourth etched structure 901 is formed on the fourth substrate 90. The fourth etched structure 901 may include the remainder of the exhaust channel 31 and the top closure structure of the condensation chamber 20.

[0150] For example, the etching process can be deep reactive ion etching (DRIE), wet etching or laser ablation, etc., and the etching depth is determined according to the functional requirements of each area (e.g., evaporation chamber depth 10, condensation chamber depth 20, exhaust channel 31, liquid return channel 32).

[0151] For example, the first substrate 60, the second substrate 70, and the third substrate 80 are sequentially aligned and bonded together. The bonding method can be selected according to the material. Figure 5 After bonding, the first etched structure 601, the second etched structure 701, and the third etched structure 801 enclose and form an evaporation chamber 10, which is exposed to the outside through the exhaust channel 31 in the upper part of the third etched structure 801. Simultaneously, the three etched structures also enclose and form a portion of the condensation chamber 20 (e.g., the lower and middle parts of the condensation chamber 20). The first etched structure 601 and the second etched structure 701 enclose and form a return channel 32. At this time, the condensation chamber 20 is not completely closed (e.g., with a top opening), and this opening can serve as a liquid injection port for the condensation chamber 20, allowing liquid to be injected into the evaporation chamber 10 through the return channel 32. Alternatively, the exhaust channel 31 in the upper part of the third etched structure 801 can serve as the liquid injection port for the evaporation chamber 10.

[0152] For example, the fourth substrate is aligned and bonded to the third substrate (e.g., SAB low-temperature bonding). Figure 6 After bonding, the first etched structure 601, the second etched structure 701, the third etched structure 801, and the fourth etched structure 901 together form a complete condensation chamber 20. Simultaneously, the third etched structure 801 and the fourth etched structure 901 together form an exhaust channel 31. The inlet of the exhaust channel 31 is selectively connected to the evaporation chamber 10 via an exhaust check valve 40, and the outlet is connected to the top of the condensation chamber 20.

[0153] It will be apparent to those skilled in the art that this disclosure is not limited to the details of the exemplary embodiments described above, and that this disclosure can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of this disclosure is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this disclosure. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0154] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A heat dissipation device, characterized in that, include: An evaporation chamber, wherein a cooling medium is provided; A condensation chamber is provided with the cooling medium. At least one fluid circuit, the fluid circuit including an exhaust passage and a return passage, the exhaust passage being configured to introduce the gaseous cooling medium in the evaporation chamber into the condensation chamber, and the return passage being configured to introduce the liquid cooling medium in the condensation chamber into the evaporation chamber; The heat dissipation device is configured to connect the evaporation chamber to the exhaust channel when the internal pressure of the evaporation chamber reaches a preset value.

2. The heat dissipation device as described in claim 1, characterized in that, The heat dissipation device includes at least one exhaust check valve, which is disposed in the evaporation chamber or the exhaust channel to connect the evaporation chamber and the exhaust channel when the internal pressure of the evaporation chamber reaches the preset value.

3. The heat dissipation device as described in claim 2, characterized in that, The heat dissipation device includes a first fluid circuit, a second fluid circuit, a first exhaust check valve, and a second exhaust check valve. The first fluid circuit includes a first exhaust passage, and the second fluid circuit includes a second exhaust passage. The first exhaust check valve is configured to connect the evaporation chamber to the first exhaust channel when the internal pressure of the evaporation chamber reaches a first preset value; The second exhaust check valve is configured to connect the evaporation chamber to the second exhaust channel when the internal pressure of the evaporation chamber reaches a second preset value; Wherein, the first preset value is less than the second preset value.

4. The heat dissipation device as described in claim 3, characterized in that, The path length of the first exhaust channel is less than the path length of the second exhaust channel.

5. The heat dissipation device as described in claim 3, characterized in that, The first exhaust passage includes at least one first path, the longitudinal section of which is configured as a straight line, and the second exhaust passage includes at least one second path, the longitudinal section of which is configured as a wavy line.

6. The heat dissipation device as described in claim 3, characterized in that, The heat dissipation device also includes a third fluid circuit and a third exhaust check valve. The third fluid circuit includes a third exhaust channel, and the third exhaust check valve is configured to connect the evaporation chamber to the third exhaust channel when the internal pressure of the evaporation chamber reaches a third preset value. Wherein, the first preset value is less than the third preset value, and the third fluid circuit is located on the periphery of the first fluid circuit.

7. The heat dissipation device as described in claim 1, characterized in that, The heat dissipation device also includes at least one liquid return check valve, which is disposed on the liquid return channel and is configured to connect the evaporation chamber to the liquid return channel when the temperature in the liquid return channel is lower than the target temperature.

8. The heat dissipation device as described in claim 7, characterized in that, The liquid return channel has a liquid return path and a temperature control path. The liquid return path is connected to the condensation chamber, and the temperature control path is connected to the evaporation chamber. The liquid return one-way valve selectively connects the liquid return path and the temperature control path. At least a portion of the longitudinal section of the temperature control path is configured as a straight line.

9. The heat dissipation device as described in claim 1, characterized in that, The path length of the exhaust channel is greater than the path length of the return channel.

10. The heat dissipation device as described in claim 1, characterized in that, The heat dissipation device includes a pressure sensor and a switch. The pressure sensor is configured to control the switch to connect the evaporation chamber to the exhaust channel when the internal pressure of the evaporation chamber reaches a preset value.

Images