Liquid, one-component, moisture-curable polyurethane for bonding untreated metals

By using a liquid, single-component, moisture-curable polyurethane adhesive composition, the problems of insufficient adhesive strength and water resistance in composite structures are solved, achieving enhanced bonding of aluminum frames and simplifying the processing.

CN122095038APending Publication Date: 2026-05-26HENKEL KGAA
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Patent Information

Application Number
CN202480066475.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-10-16
Filing Date
2024-10-09
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

In existing technologies, adhesives for composite structures are insufficient in terms of bonding strength and water resistance, and traditional methods require complex equipment and manual wiping processes, resulting in low efficiency and potential omission risks.

Method used

A liquid, one-component, moisture-curable polyurethane adhesive composition, comprising isocyanate-functionalized prepolymers and silicone oligomers, is used for direct bonding of aluminum frames and skins. It forms an irreversible polyurethane network through moisture crosslinking, thereby improving bond strength and curing at room temperature.

Benefits of technology

It provides enhanced bond strength to aluminum frames, simplifies the process, reduces equipment requirements, improves the water resistance and bond stability of the adhesive, and is suitable for existing methods and equipment.

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Abstract

The present application discloses a one component, liquid, moisture curable polyurethane adhesive composition comprising a mixture comprising: at least one isocyanate functional prepolymer; one of a) a silane compound and a tackifier, or b) a silicone oligomer and optionally a tackifier; and optionally an additive. The adhesive composition has enhanced bond strength to metals such as aluminum compared to presently available adhesives. The composition is particularly useful in panel lamination applications.
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Citation Information

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