Optical drive base

Abstract

The application discloses an optical drive base, which comprises an insulating body, a conductive terminal, a high-density integrated circuit, connecting leads and an electronic component; the conductive terminal is embedded in the insulating body; the high-density integrated circuit comprises a plurality of first connecting parts for electrically connecting with the conductive terminal, and at least part of the first connecting parts are electrically connected with the conductive terminal through the connecting leads; the electronic component is electrically connected with the conductive terminal and is electrically connected with the high-density integrated circuit through the conductive terminal. The optical drive base is used for simplifying the manufacturing process of the optical drive base and reducing the cost of the optical drive base.

Description

Technical Field

[0001] This invention relates to the field of camera module technology, and more particularly to an optical driving base. Background Technology

[0002] Existing devices such as mobile phones, tablets, and automobiles typically integrate camera modules to provide users with video recording capabilities. Camera modules usually include components such as motors, which are used to achieve functions like focusing and image stabilization. One component of the motor is the optical drive base, which generally includes electronic components such as coils and sensing elements, as well as high-density integrated circuits connected to the coils and sensing elements. The high-density integrated circuits control the magnitude and / or direction of the coil's magnetic force based on data detected by the sensing elements to drive the camera movement, thereby achieving functions such as image stabilization and focusing.

[0003] In existing optical driving bases, coils, sensing elements, and high-density integrated circuits are directly or indirectly electrically connected to conductive terminals to achieve electrical connections between the coils and sensing elements and the high-density integrated circuits. The high-density integrated circuits have multiple pads, which are arranged relatively densely. Conductive terminals can be formed using two methods: etching and stamping. Etching can result in smaller gaps between conductive terminals, but due to its low efficiency and high cost, it is not suitable for conductive terminals with long extension paths and requiring mass production. Therefore, existing conductive terminals are generally manufactured using stamping. However, stamped conductive terminals have larger gaps, making it impossible to directly solder them to the multiple pads in the high-density integrated circuits.

[0004] Chinese invention patent CN116707227B discloses a motor base, which includes a metal branch, a first electronic component, and a high-density integrated circuit module. The high-density integrated circuit module includes a rigid circuit board and high-density integrated circuits soldered to the rigid circuit board. The high-density integrated circuits are electrically connected to the metal branch through the rigid circuit board, thereby electrically connecting the high-density integrated circuit circuit to the first electronic component. The rigid circuit board expands the area of ​​the high-density integrated circuit module for mounting solder joints, facilitating the connection between the metal branch and the solder joints of the high-density integrated circuit module. However, the rigid circuit board increases the cost of the motor base and complicates its manufacturing process. Summary of the Invention

[0005] The purpose of this invention is to provide an optical driving base that simplifies the manufacturing process of the optical driving base and reduces its cost.

[0006] The objective of this invention is achieved through the following technical solution:

[0007] An optical driving base, comprising:

[0008] Insulating body;

[0009] Conductive terminals are embedded in the insulating body;

[0010] A high-density integrated circuit includes a plurality of first connection portions for electrically connecting to the conductive terminals, at least a portion of which are electrically connected to the conductive terminals via connection leads;

[0011] An electronic component is electrically connected to the conductive terminal and, through the conductive terminal, to the high-density integrated circuit.

[0012] Preferably, the high-density integrated circuit includes at least three rows of first connection portions spaced apart along a first direction, and each row of first connection portions includes a plurality of first connection portions;

[0013] The conductive terminal is provided with a second connection portion for electrical connection with the first connection portion.

[0014] Preferably, the insulating body includes a receiving groove for accommodating the high-density integrated circuit and a receiving groove for accommodating the connecting leads, with at least a portion of the first connecting portions and at least a portion of the second connecting portions exposed in the receiving groove.

[0015] Preferably, each of the first connecting portions is electrically connected to the corresponding conductive terminal via the connecting lead;

[0016] At least two rows of second connection portions are provided along a first direction on at least one side of the high-density integrated circuit. The first connection portion located on the outer side is electrically connected to the second connection portion adjacent to the high-density integrated circuit through the connection lead, and the first connection portion located on the inner side is electrically connected to the second connection portion away from the high-density integrated circuit through the connection lead.

[0017] Preferably, the high-density integrated circuit has a second connection portion on at least one side along the second direction; the first connection portion located on the outermost side along the second direction in the forward and / or reverse direction is electrically connected to the second connection portion located on one side of the high-density integrated circuit along the second direction via the connection lead, and the first connection portion located on the inner side along the second direction is electrically connected to the second connection portion located on one side of the high-density integrated circuit along the first direction via the connection lead;

[0018] Alternatively, multiple first connection portions may be electrically connected to second connection portions located on one side of the high-density integrated circuit along a first direction via connection leads;

[0019] Wherein, the first direction and the second direction are perpendicular to each other.

[0020] Preferably, the spacing between two adjacent rows of second connection portions located on one side of the high-density integrated circuit along the first direction is the same as the spacing between two adjacent rows of first connection portions, and the spacing between adjacent second connection portions in each row of second connection portions is the same as the spacing between two corresponding first connection portions.

[0021] Preferably, the receiving groove is formed by a recess in the bottom wall of the receiving groove, and the receiving groove and the receiving groove are located on the same side of the insulating body and are interconnected.

[0022] All of the second connecting portions are located in the same plane and exposed to the receiving groove.

[0023] Preferably, the first connecting portion located on the outer side along the first direction is directly electrically connected to the second connecting portion, and the first connecting portion located on the inner side along the first direction is electrically connected to the second connecting portion through the connecting lead;

[0024] Alternatively, the first connecting portion located on the outer side along the first direction and the second connecting portion located on the outer side along the second direction are directly electrically connected to the second connecting portion, and the first connecting portion located on the inner side along both the first and second directions is electrically connected to the second connecting portion through the connecting lead.

[0025] Preferably, the plurality of second connection portions include a direct connection portion and an indirect connection portion; the direct connection portion extends to be directly electrically connected to the corresponding first connection portion, the indirect connection portion and the corresponding first connection portion are respectively exposed in the receiving groove, and the indirect connection portion is electrically connected to the corresponding first connection portion through the connection lead.

[0026] Preferably, the direct connection portion and the connection lead are insulated and separated by the insulating body.

[0027] Preferably, the receiving groove and the accommodating groove are disposed on opposite sides of the insulating body, and the insulating body has a connecting opening that penetrates the bottom wall of the accommodating groove to connect the receiving groove and the accommodating groove, and the first connecting portion corresponding to the indirect connecting portion is exposed to the accommodating groove through the connecting opening.

[0028] Preferably, the first surface of the direct connection portion is exposed to the receiving groove and electrically connected to the corresponding first connection portion, and the second surface opposite to the first surface is shielded by the bottom wall of the receiving groove to insulate and separate it from the connection lead.

[0029] Preferably, the insulating body is provided with a recessed cavity formed by further recessing from the bottom wall of the receiving groove, and the fourth surface of the indirect connection portion is exposed in the recessed cavity.

[0030] Preferably, the receiving groove and the accommodating groove are respectively filled with sealing material, and the sealing material covers the high-density integrated circuit and the connecting leads.

[0031] Preferably, the connecting lead is a metal lead, or the connecting lead includes a metal lead and an insulating layer covering the metal lead, the insulating layer being used to prevent electrical contact between adjacent connecting leads.

[0032] Preferably, the electronic component includes a coil and a sensing element with sensing function, wherein the coil and the sensing element are electrically connected to the conductive terminal and electrically connected to the high-density integrated circuit through the conductive terminal.

[0033] Preferably, the electronic component further includes a capacitor located on the side of the conductive terminal away from the connecting lead and electrically connected to the conductive terminal;

[0034] The coil, the sensing element, and the capacitor are each provided in multiple quantities and are simultaneously connected to the high-density integrated circuit through the conductive terminals.

[0035] Compared with the prior art, the beneficial effects of the present invention include at least the following:

[0036] By electrically connecting a portion of the first connecting parts to the conductive terminals via connecting leads, some conductive terminals can be directly electrically connected to the first connecting parts without extending to them. This allows for a larger arrangement space for the conductive terminals, facilitating their placement. Furthermore, by electrically connecting a portion of the first connecting parts to the conductive terminals via connecting leads, an additional rigid circuit board is unnecessary. High-density integrated circuits can be directly integrated onto the insulating body, simplifying the manufacturing process of the optical drive base and reducing its cost. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the optical driving base of Embodiment 1 of the present invention;

[0038] Figure 2 This is a structural schematic diagram of the optical driving base of Embodiment 1 of the present invention from another perspective;

[0039] Figure 3 This is a schematic diagram of a portion of the structure of the optical driving base in Embodiment 1 of the present invention;

[0040] Figure 4 This is a schematic diagram of the optical driving base of Embodiment 2 of the present invention;

[0041] Figure 5 This is a structural schematic diagram of the optical driving base of Embodiment 2 of the present invention from another perspective;

[0042] Figure 6 This is a schematic diagram of the optical driving base of Embodiment 2 of the present invention from another perspective;

[0043] Figure 7 yes Figure 6 A partial sectional view of section EE;

[0044] Figure 8 This is a schematic diagram of a portion of the structure of the optical driving base in Embodiment 2 of the present invention.

[0045] In the figure: 1. Insulating body; 11. Receiving groove; 12. Accommodating groove; 121. Bottom wall; 13. Connection opening; 14. Mounting groove; 15. Recessed cavity; 2. Conductive terminal; 21. Second connection part; 211. Direct connection part; 2111. First surface; 2112. Second surface; 212. Indirect connection part; 2121. Fourth surface; 22. Third connection part; 3. High-density integrated circuit; 31. First connection part; 4. Connecting lead; 5. Electronic component; 51. Coil; 52. Sensing element; 53. Capacitor. Detailed Implementation

[0046] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided to make the invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted.

[0047] The terms used to express position and direction in this invention are illustrated with reference to the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this invention.

[0048] Example 1

[0049] like Figures 1 to 3 As shown, this invention provides an optical driving base that can be used in the optical driving mechanism of a camera module to drive optical components such as lens assemblies or aperture assemblies. The optical driving base can be a focus motor base, an image stabilization motor base, a variable aperture assembly base, a periscope motor base, a voice coil motor base, etc. The optical driving base includes an insulating body 1, conductive terminals 2, a high-density integrated circuit 3, electronic components 5, and connecting leads 4.

[0050] The insulating body 1 is made of insulating material, for example, a plastic body made of plastic. The aforementioned conductive terminals 2, high-density integrated circuit 3, electronic components 5, and connecting leads 4 are all mounted on the insulating body 1. Specifically, the insulating body 1 may have a receiving slot 11 for housing the high-density integrated circuit 3, a receiving slot 12 for housing the connecting leads 4, and a mounting slot 14 for housing the electronic components 5. The high-density integrated circuit 3, electronic components 5, and connecting leads 4 are mounted in their respective slots.

[0051] Reference Figure 1 and Figure 2 The conductive terminal 2 is embedded in the insulating body 1, meaning the insulating body 1 is formed into a single structure by injection molding the conductive terminal 2. The insulating body 1 can be formed through a single injection molding process or multiple injection molding processes. The portion of the conductive terminal 2 used for connection with the electronic component 5 and the high-density integrated circuit 3 is exposed to facilitate electrical connection between the conductive terminal 2 and the electronic component 5 and the high-density integrated circuit 3. Specifically, the portion of the conductive terminal 2 used for connection with the high-density integrated circuit 3 forms a second connection portion 21, and the portion used for connection with the electronic component 5 forms a third connection portion 22. Both the second connection portion 21 and the third connection portion 22 are exposed on the insulating body 1. Multiple conductive terminals 2, and multiple second connection portions 21 and third connection portions 22 can be provided.

[0052] The high-density integrated circuit 3 includes a plurality of first connection portions 31. The first connection portions 31 are used for electrical connection with second connection portions 21 of the conductive terminal 2. At least a portion of the first connection portions 31 are electrically connected to the second connection portions 21 of the conductive terminal 2 via connecting leads 4. Specifically, the high-density integrated circuit 3 can be a driver IC, and the first connection portions 31 can be solder pads. The connecting leads 4 can be metal leads, such as gold wire; alternatively, the connecting leads 4 can also have an insulating layer covering the outer periphery of the metal leads, such as enameled wire. The insulating layer serves to insulate the metal leads from the outside environment, thereby preventing electrical contact between the metal leads and adjacent metal leads 4. Furthermore, the portions of the metal leads 4 that connect to the first connection portions 31 and the second connection portions 21 can be exposed relative to the insulating layer to facilitate electrical connection between the metal leads and the first connection portions 31 and the second connection portions 21.

[0053] The high-density integrated circuit 3 has a plurality of first connection portions 31 arranged in at least three rows spaced apart along a first direction. Each row of first connection portions 31 includes a plurality of first connection portions 31, and the plurality of first connection portions 31 in each row are spaced apart along a second direction. The first direction and the second direction are perpendicular to each other. Specifically, the first direction can be the width direction of the high-density integrated circuit 3, and the second direction can be the length direction of the high-density integrated circuit 3. In this embodiment, the high-density integrated circuit 3 has a plurality of first connection portions 31 arranged in four rows spaced apart along the first direction.

[0054] Multiple first connection portions 31 of the high-density integrated circuit 3 can be electrically connected to the conductive terminal 2 via connecting leads 4. In this case, the second connection portions 21 of the conductive terminal 2 can be distributed around the periphery of the high-density integrated circuit 3 without extending to the first connection portions 31 for direct connection. For example, the second connection portions 21 and the first connection portions 31 do not need to be directly soldered together for a fixed connection. Therefore, the second connection portions 21 of the conductive terminal 2 can have a relatively wide distribution space. The high-density integrated circuit 3 does not need to be pre-connected to a rigid circuit board or other circuit boards, and the high-density integrated circuit 3 can be directly integrated onto the insulating body 1. After the high-density integrated circuit 3 is integrated onto the insulating body 1, the electrical connection between the high-density integrated circuit 3 and the conductive terminal 2 can be achieved by connecting the corresponding first connection portions 31 and second connection portions 21 via connecting leads 4. This operation is convenient, and the elimination of the need for a rigid circuit board reduces the cost of the optical drive base and the assembly process.

[0055] Reference Figure 1 and Figure 3 Along the first direction, at least two rows of second connection portions 21 are provided on at least one side of the high-density integrated circuit 3. These two rows of second connection portions 21 are electrically connected to corresponding two rows of first connection portions 31. Specifically, along the first direction, at least two rows of second connection portions 21 are provided on the first side of the high-density integrated circuit 3, and these two rows of second connection portions 21 are electrically connected to two rows of first connection portions 31 adjacent to the first side of the high-density integrated circuit 3. Specifically, along the first direction, the row of second connection portions 21 adjacent to the first side of the high-density integrated circuit 3 is electrically connected via a connecting lead 4 to the outermost first connection portion 31 (the row of first connection portions 31 closest to the first side); the row of second connection portions 21 away from the first side of the high-density integrated circuit 3 is electrically connected via a connecting lead 4 to the innermost first connection portion 31 (the row of first connection portions 31 next to the first side). At this time, the connecting lead 4 formed between the second connecting portion 21 away from the high-density integrated circuit 3 and the corresponding first connecting portion 31 can cross the connecting lead 4 formed between the second connecting portion 21 and the corresponding first connecting portion 31 of the adjacent high-density integrated circuit 3, thus avoiding the connecting lead 4 from being crossed and distributed haphazardly.

[0056] In this configuration, along the first direction, the spacing between two adjacent rows of second connection portions 21 located on one side of the high-density integrated circuit 3 is the same as the spacing between two adjacent rows of first connection portions 31. For example, the spacing between two adjacent rows of second connection portions 21 located on the first side of the high-sealing integrated circuit is the same as the spacing between two rows of first connection portions 31 adjacent to the first side of the high-density integrated circuit 3. Furthermore, the spacing between adjacent second connection portions 21 in each row is the same as the spacing between the corresponding two first connection portions 31. Specifically, the spacing between two adjacent rows of first connection portions 31 is the spacing between two adjacent rows of first connection portions 31 along the first direction. Similarly, the spacing between two adjacent rows of second connection portions 21 is the spacing between two adjacent rows of second connection portions 21 along the first direction. Similarly, the spacing between adjacent second connection portions 21 in each row is the spacing between adjacent second connection portions 21 along the second direction. Likewise, the spacing between two first connection portions 31 corresponding to two adjacent second connection portions 21 is the spacing between two first connection portions 31 along the second direction.

[0057] In some specific embodiments, the plurality of second connection portions 21 are distributed only on opposite sides of the high-density integrated circuit 3 along the first direction, and the number of rows formed by the plurality of second connection portions 21 along the first direction is the same as the number of rows formed by the plurality of first connection portions 31 along the first direction. Each row of second connection portions 21 is correspondingly connected to each row of first connection portions 31. In this case, all the first connection portions 31 in each row of first connection portions 31 can be electrically connected to the second connection portions 21. In this case, the number of first connection portions 31 in each row of first connection portions 31 is the same as the number of second connection portions 21 in the corresponding row of second connection portions 21, and they are connected one-to-one. Alternatively, some of the first connection portions 31 in each row of first connection portions 31 need to be electrically connected to the second connection portions 21, while the remaining first connection portions 31 do not need to be connected. In this case, the number of first connection portions 31 in each row of first connection portions 31 that need to be connected to the second connection portions 21 is the same as the number of second connection portions 21 in the corresponding row of second connection portions 21, and they are connected one-to-one.

[0058] For example, when multiple first connecting portions 31 are arranged in three rows, multiple second connecting portions 21 are correspondingly arranged in three rows. Two rows of second connecting portions 21 are disposed on the first side of the high-density integrated circuit 3 and are correspondingly connected to the two rows of first connecting portions 31 adjacent to the first side of the high-density integrated circuit 3. The remaining row of second connecting portions 21 is disposed on the second side of the high-density integrated circuit 3 and is correspondingly connected to the row of first connecting portions 31 adjacent to the second side of the high-density integrated circuit 3. The first side and the second side are opposite sides of the high-density integrated circuit 3 along a first direction.

[0059] When multiple first connecting portions 31 are arranged in four rows, multiple second connecting portions 21 are correspondingly arranged in four rows. Two rows of second connecting portions 21 are disposed on the first side of the high-density integrated circuit 3 and are correspondingly connected to the two rows of first connecting portions 31 adjacent to the first side of the high-density integrated circuit 3. The remaining two rows of second connecting portions 21 are disposed on the second side of the high-density integrated circuit 3 and are correspondingly connected to the two rows of first connecting portions 31 adjacent to the second side of the high-density integrated circuit 3.

[0060] In some other specific embodiments, a number of second connection portions 21 are distributed on opposite sides of the high-density integrated circuit 3 along the first direction, and a number of second connection portions 21 are disposed on at least one side of the high-density integrated circuit 3 along the second direction, for example, a number of second connection portions 21 are disposed on opposite sides of the high-density integrated circuit 3 along the second direction. The outermost first connection portion 31 along the positive or negative direction of the second direction is electrically connected to the second connection portion 21 located on one side of the high-density integrated circuit 3 along the second direction via a connecting lead 4. The innermost first connection portion 31 along the second direction is electrically connected to the second connection portion 21 located on one side of the high-density integrated circuit 3 along the first direction via a connecting lead 4. The innermost first connection portions 31 along the second direction are arranged in multiple rows, and the arrangement and connection form of the innermost first connection portions 31 along the second direction and the second connection portion 21 are similar to the arrangement and connection form of the multiple second connection portions 21 distributed only on opposite sides of the high-density integrated circuit 3 along the first direction, so it will not be described in detail here.

[0061] To facilitate the electrical connection of the connecting lead 4 with the first connecting portion 31 and the second connecting portion 21, all of the first connecting portions 31 and all of the second connecting portions 21 can be exposed in the receiving groove 12, so that the connecting lead 4 disposed in the receiving groove 12 can be easily electrically connected to the first connecting portion 31 and the second connecting portion 21. Specifically, the receiving groove 11 can be recessed from the bottom wall 121 of the receiving groove 12, and the receiving groove 11 and the receiving groove 12 are located on the same side of the insulating body 1 and are interconnected. At this time, the high-density integrated circuit 3 can be installed from the receiving groove 12 into the receiving groove 11, and the first connecting portion 31 of the high-density integrated circuit 3 can be completely exposed in the receiving groove 12. All of the second connecting portions 21 can be located in the same plane, and one surface of the second connecting portion 21 can be exposed in the receiving groove 12. One end of the connecting lead 4 is electrically connected to the surface of the second connecting portion 21, and the other end is electrically connected to the corresponding first connecting portion 31.

[0062] In some specific embodiments, the receiving groove 11 and the accommodating groove 12 are respectively filled with sealing material. The sealing material covers the high-density integrated circuit 3 and the connecting leads 4, and can also cover the second connection portion 21 to prevent the high-density integrated circuit 3, the connecting leads 4 and the second connection portion 21 from being contaminated by external dust or other substances. The sealing material can also fix the position of the high-density integrated circuit 3 and the connecting leads 4. Specifically, the sealing material can be a solid adhesive or epoxy resin.

[0063] Reference Figure 1 and Figure 2 The electronic component 5 is electrically connected to the conductive terminal 2 and, through the conductive terminal 2, to the high-density integrated circuit 3. Specifically, the electronic component 5 may include a coil 51 and a sensing element 52 with sensing function; additionally, it may include a capacitor 53. Multiple mounting slots 14 for housing the electronic component 5 may be provided, each slot 14 being used to house the coil 51, sensing element 52, or capacitor 53. The coil 51, sensing element 52, and capacitor 53 are electrically connected to the conductive terminal 2. Specifically, the third connection portion 22 of the conductive terminal 2 is exposed in the mounting slot 14, allowing the third connection portion 22 to be electrically connected to the coil 51, sensing element 52, or capacitor 53 mounted in the corresponding mounting slot 14, so that the coil 51, sensing element 52, and capacitor 53 can be electrically connected to the high-density integrated circuit 3 through the conductive terminal 2. The sensing element 52 may specifically be a Hall sensor. In this patent, the electronic component 5 is directly connected to the third connection portion 22, such as by directly soldering the electronic component 5 to the third connection portion 2.

[0064] Capacitor 53 can be positioned on the side of conductive terminal 2 away from connecting lead 4. In this case, capacitor 53 will not affect the placement of connecting lead 4, and its installation is unaffected by connecting lead 4. Capacitor 53 can be installed near high-density integrated circuit 3 to improve its filtering effect. Coil 51 and sensing element 52 can be installed on the side of connecting terminal facing connecting lead 4.

[0065] In this design, one or more coils 51, sensing elements 52, and capacitors 53 are configured, and these coils 51, sensing elements 52, and capacitors 53 are simultaneously connected to the high-density integrated circuit 3 via conductive terminals 2. The sensing element 52 can be a Hall sensor (HS), an integrated circuit (IC) with an integrated Hall sensor, or a tunnel magnetoresistive sensor (TMR sensor). The density of the first connection portions 31 in the high-density integrated circuit 3 is much higher than that of traditional sensors or integrated circuits, and is at least eight in number, for example, ten, fifteen, twenty, or forty-two. The high-density integrated circuit 3 is electrically connected to multiple sensing elements 52 and coils 51 simultaneously via conductive terminals 2. The high-density integrated circuit 3 acts as the brain of the optical drive base, controlling parameters including current intensity and direction applied to the coils 51 based on the position information of the optical elements sensed and fed back by the sensing elements 52. This controls the magnetic thrust of the coils 51, thereby driving the movement of the optical elements and achieving various functions of the optical drive mechanism, such as optical image stabilization (OIS), zoom, and focus. This patent separates the high-density integrated circuit 3 from its controlled sensing elements 52 or coils 51, allowing for dispersed placement of the high-density integrated circuit 3 and the sensing elements 52 or coils 51, achieving a more flexible spatial layout and thus more precisely enhancing the control capabilities of the optical drive base.

[0066] Example 2

[0067] Reference Figures 4 to 8 The optical driving base of this embodiment includes an insulating body 1, conductive terminals 2, a high-density integrated circuit 3, electronic components 5, and connecting leads 4. The high-density integrated circuit 3, electronic components 5, and connecting leads 4 in this embodiment are basically the same as those in Embodiment 1, and therefore will not be described in detail here.

[0068] The insulating body 1 is similar to the insulating body 1 in Embodiment 1, except that the receiving groove 11 and the accommodating groove 12 of the insulating body 1 in this embodiment are arranged differently, and this application provides a connecting opening 13 and a recessed cavity 15. Specifically, in this embodiment, the receiving groove 11 and the accommodating groove 12 are arranged on opposite sides of the insulating body 1, and the bottom wall 121 of the accommodating groove 12 separates the accommodating groove 12 from the receiving groove 11. The connecting opening 13 penetrates the bottom wall 121 of the accommodating groove 12 to connect the accommodating groove 12 and the receiving groove 11. The recessed cavity 15 is formed by further recessing from the bottom wall 121 of the accommodating groove 12.

[0069] The conductive terminal 2 is embedded in the insulating body 1, and the portion of the conductive terminal 2 used for connection with the electronic component 5 and the high-density integrated circuit 3 is exposed to facilitate electrical connection between the conductive terminal 2 and the electronic component 5 and the high-density integrated circuit 3. Specifically, the portion of the conductive terminal 2 used for connection with the high-density integrated circuit 3 forms a second connection portion 21, and the portion of the conductive terminal 2 used for connection with the electronic component 5 forms a third connection portion 22, both of which are exposed.

[0070] Reference Figure 8 In some specific embodiments, a number of the first connecting parts 31 and the second connecting parts 21 are electrically connected via connecting leads 4, while a number of the first connecting parts 31 and the second connecting parts 21 are directly electrically connected. Specifically, among the multiple first connecting parts 31, the connection between the first connecting parts 31 arranged on the outer side and the conductive terminal 2 is relatively simple, allowing the first connecting parts 31 arranged on the outer side to be directly connected to the second connecting parts 21 of the conductive terminal 2. In this embodiment, the first connecting parts 31 arranged on the outer side are overlapped and directly soldered to the corresponding second connecting parts 21 of the conductive terminal 2 for a fixed connection. However, the conductive terminal 2 cannot extend to the first connecting parts 31 arranged on the inner side, or it is difficult to extend to the first connecting parts 31 arranged on the inner side. Therefore, the conductive terminal 2 cannot or has difficulty directly electrically connecting to the first connecting parts 31 arranged on the inner side. In this case, the first connecting parts 31 arranged on the inner side can be electrically connected to the second connecting parts 21 of the conductive terminal 2 via connecting leads 4.

[0071] By electrically connecting the first connecting portion 31 arranged on the inner side to the corresponding second connecting portion 21 using connecting leads 4, the second connecting portion 21 does not need to be located adjacent to the first connecting portion 31 arranged on the inner side. Furthermore, the second connecting portion 21 corresponding to the first connecting portion 31 arranged on the inner side can be located on the outer periphery of the high-density integrated circuit 3. This portion of the second connecting portion 21 has a larger arrangement space, facilitating its arrangement. Therefore, the high-density integrated circuit 3 can be directly integrated onto the insulating body 1 without the need for additional rigid circuit boards or other circuit board structures. This also reduces the cost of the optical driving base and simplifies its manufacturing process. By directly electrically connecting the first connecting portion 31 arranged on the outer side to the second connecting portion 21, the number of connecting leads 4 can be reduced, avoiding difficulties in wiring the connecting leads 4 due to excessive numbers and reducing the risk of overlapping and tangling caused by overly dense connecting leads 4.

[0072] In some specific embodiments, the first connecting portion 31 arranged on the outer side can be a first connecting portion 31 located on the outer side along the first direction, and the first connecting portion 31 arranged on the inner side can be a first connecting portion 31 located on the inner side along the first direction. For example, when multiple first connecting portions 31 are arranged to form a rectangular structure, the rectangular structure has opposing first sides along the first direction, and each first side is defined by a row of first connecting portions 31. The two rows of first connecting portions 31 forming opposing first sides are the first connecting portions 31 arranged on the outer side, and the first connecting portion 31 located between the two rows of first connecting portions 31 forming opposing first sides along the first direction is the first connecting portion 31 arranged on the inner side.

[0073] In some specific embodiments, the first connecting portion 31 arranged on the outer side can be a first connecting portion 31 located on the outer side along both the first and second directions, and the first connecting portion 31 arranged on the inner side can be a first connecting portion 31 located on the inner side along both the first and second directions. For example, when multiple first connecting portions 31 are arranged to form a rectangular structure, the rectangular structure has opposing first sides along the first direction and opposing second sides along the second direction. Each first side is defined by a row of first connecting portions 31, and each second side is defined by a row of first connecting portions 31. The row of first connecting portions 31 forming the first side consists of multiple first connecting portions 31 spaced apart along the second direction, and the row of first connecting portions 31 forming the second side consists of multiple first connecting portions 31 spaced apart along the first direction. The first connecting portions 31 forming opposing first sides and opposing second sides are the first connecting portions 31 arranged on the outer side, while the first connecting portions 31 disposed on the inner side of the first connecting portions 31 forming opposing first sides and opposing second sides are the first connecting portions 31 arranged on the inner side.

[0074] The plurality of second connection portions 21 include a direct connection portion 211 and an indirect connection portion 212. The direct connection portion 211 is used for direct electrical connection with the first connection portion 31 arranged on the outer side, and the indirect connection portion 212 is used for electrical connection with the first connection portion 31 arranged on the inner side via the connecting lead 4. Specifically, the direct connection portion 211 extends to the first connection portion 31 arranged on the outer side, and the direct connection portion 211 is exposed in the receiving groove 11. It can be stacked with the corresponding first connection portion 31 to facilitate direct electrical connection between the direct connection portion 211 and the first connection portion 31. Specifically, the direct connection portion 211 can be soldered to the corresponding first connection portion 31 by direct soldering. One end of a portion of the conductive terminal 2 is located outside the high-density integrated circuit 3 to form the indirect connection portion 212. To facilitate the connection between the indirect connection portion 212 and the connecting lead 4, the indirect connection portion 212 is exposed in the receiving groove 12 so that the connecting lead 4 installed in the receiving groove 12 can be connected to the indirect connection portion 212.

[0075] Reference Figure 7 To prevent the connecting lead 4 from making electrical contact with the conductive terminal 2 forming the direct connection portion 211 due to overlap or other reasons, the direct connection portion 211 can be insulated from the connecting lead 4 by an insulating body 1. Specifically, when the high-density integrated circuit 3 is installed in the receiving groove 11, the first connection portion 31 corresponding to the indirect connection portion 212 can face the connection opening 13, so that the first connection portion 31 corresponding to the indirect connection portion 212 can be exposed to the receiving groove 12 through the connection opening 13, thereby facilitating the connection operation between this part of the first connection portion 31 and the connecting lead 4. The first connecting portion 31, corresponding to the direct connecting portion 211, faces the bottom wall 121 of the receiving groove 12 and is insulated from the connecting lead 4 by the bottom wall 121. The direct connecting portion 211 includes a first surface 2111 and a second surface 2112 along its thickness direction. The first surface 2111 of the direct connecting portion 211 faces the corresponding first connecting portion 31 and is exposed in the receiving groove 11. It can be stacked with the corresponding first connecting portion 31 to facilitate the connection between the direct connecting portion 211 and the corresponding first connecting portion 31. The thickness of the bottom wall 121 of the receiving groove 12 is greater than the thickness of the direct connecting portion 211, so that the second surface 2112 of the direct connecting portion 211 is insulated from the connecting lead 4 by the bottom wall 121 of the receiving groove 12.

[0076] The indirect connection portion 212 includes opposing third and fourth surfaces 2121 along its thickness direction. The third surface is coplanar with the first surface 2111 of the direct connection portion 211, and the fourth surface 2121 is coplanar with the second surface 2112 of the direct connection portion 211. To allow the indirect connection portion 212 to be exposed to the receiving groove 12, the insulating body 1 may be provided with a recessed cavity 15 formed by further recessing from the bottom wall 121 of the receiving groove 12. The recessed cavity 15 communicates with the receiving groove 12, and the thickness of the recessed cavity 15 is at least the difference between the thickness of the bottom wall 121 of the receiving groove 12 and the thickness of the indirect connection portion 212, so that the fourth surface 2121 of the indirect connection portion 212 can be exposed to the receiving groove 12 through the recessed cavity 15. The fourth surface 2121 is used for electrical connection with the connecting lead 4.

[0077] In some specific embodiments, the receiving groove 11 and the accommodating groove 12 are respectively filled with sealing material. The sealing material covers the high-density integrated circuit 3 and the connecting lead 4, and can also cover the second connection portion 21 to prevent the high-density integrated circuit 3, the connecting lead 4 and the second connection portion 21 from being contaminated by external dust or other substances. The sealing material can also fix the position of the high-density integrated circuit 3 and the connecting lead 4. In this embodiment, in addition to filling the receiving groove 11 and the accommodating groove 12, the sealing material also fills the connection opening 13 and the recessed cavity 15. Specifically, the sealing material can be a solid adhesive or epoxy resin.

[0078] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the invention without departing from the principles and spirit of the invention, and all such changes should fall within the protection scope of the claims of the present invention.

Claims

1. An optical driving base, characterized in that, include: Insulating body (1); Conductive terminal (2) is embedded in the insulating body (1); The high-density integrated circuit (3) includes a plurality of first connection portions (31) for electrically connecting to the conductive terminal (2), at least a portion of the first connection portions (31) being electrically connected to the conductive terminal (2) via connection leads (4); The electronic component (5) is electrically connected to the conductive terminal (2) and is electrically connected to the high-density integrated circuit (3) through the conductive terminal (2).

2. The optical driving base according to claim 1, characterized in that, The high-density integrated circuit (3) includes at least three rows of first connection portions (31) spaced apart along a first direction, and each row of first connection portions (31) includes a plurality of first connection portions (31); The conductive terminal (2) is provided with a second connection portion (21) for electrical connection with the first connection portion (31).

3. The optical driving base according to claim 2, characterized in that, The insulating body (1) includes a receiving groove (11) for accommodating the high-density integrated circuit (3) and a receiving groove (12) for accommodating the connecting lead (4), with at least a portion of the first connecting portion (31) and at least a portion of the second connecting portion (21) exposed in the receiving groove (12).

4. The optical driving base according to claim 3, characterized in that, Each of the first connecting parts (31) is electrically connected to the corresponding conductive terminal (2) through the connecting lead (4); At least two rows of second connection portions (21) are provided on at least one side of the high-density integrated circuit (3) along a first direction. The first connection portion (31) located on the outer side is electrically connected to the second connection portion (21) adjacent to the high-density integrated circuit (3) through the connection lead (4). The first connection portion (31) located on the inner side is electrically connected to the second connection portion (21) away from the high-density integrated circuit (3) through the connection lead (4).

5. The optical driving base according to claim 4, characterized in that, The high-density integrated circuit (3) has a second connection portion (21) on at least one side along the second direction; the first connection portion (31) located on the outermost side along the second direction in the forward and / or reverse direction of the plurality of first connection portions (31) is electrically connected to the second connection portion (21) located on one side of the high-density integrated circuit (3) along the second direction through the connection lead (4); the first connection portion (31) located on the inner side along the second direction is electrically connected to the second connection portion (21) located on one side of the high-density integrated circuit (3) along the first direction through the connection lead (4). Alternatively, multiple first connection portions (31) are electrically connected to second connection portions (21) located on one side of the high-density integrated circuit (3) along the first direction via connection leads (4); Wherein, the first direction and the second direction are perpendicular to each other.

6. The optical driving base according to claim 4, characterized in that, The spacing between two adjacent rows of second connection portions (21) located on one side of the high-density integrated circuit (3) along the first direction is the same as the spacing between two adjacent rows of first connection portions (31). The spacing between adjacent second connection portions (21) in each row of second connection portions (21) is the same as the spacing between two corresponding first connection portions (31).

7. The optical driving base according to claim 4, characterized in that, The receiving groove (11) is recessed from the bottom wall (121) of the receiving groove (12), and the receiving groove (11) and the receiving groove (12) are located on the same side of the insulating body (1) and are interconnected. All of the second connecting portions (21) are located in the same plane and exposed to the receiving groove (12).

8. The optical driving base according to claim 3, characterized in that, The first connecting part (31) located on the outer side along the first direction is directly electrically connected to the second connecting part (21), and the first connecting part (31) located on the inner side along the first direction is electrically connected to the second connecting part (21) through the connecting lead (4); Alternatively, the first connecting portion (31) located on the outer side along the first direction and on the outer side along the second direction are directly electrically connected to the second connecting portion (21), and the first connecting portion (31) located on the inner side along both the first and second directions is electrically connected to the second connecting portion (21) through the connecting lead (4).

9. The optical driving base according to claim 8, characterized in that, The plurality of second connection portions (21) include a direct connection portion (211) and an indirect connection portion (212); the direct connection portion (211) extends to be directly electrically connected to the corresponding first connection portion (31), the indirect connection portion (212) and the corresponding first connection portion (31) are respectively exposed in the receiving groove (12), and the indirect connection portion (212) is electrically connected to the corresponding first connection portion (31) through the connection lead (4).

10. The optical driving base according to claim 9, characterized in that, The direct connection part (211) and the connection lead (4) are insulated and separated by the insulating body (1).

11. The optical driving base according to claim 10, characterized in that, The receiving groove (11) and the accommodating groove (12) are disposed on opposite sides of the insulating body (1), and the insulating body (1) has a bottom wall (121) that penetrates the accommodating groove (12) to connect the receiving groove (11) and the accommodating groove (12). The first connecting part (31) corresponding to the indirect connecting part (212) is exposed to the accommodating groove (12) through the connecting opening (13).

12. The optical driving base according to claim 11, characterized in that, The first surface (2111) of the direct connection portion (211) is exposed to the receiving groove (11) and electrically connected to the corresponding first connection portion (31). The second surface (2112) opposite to the first surface (2111) is shielded by the bottom wall (121) of the receiving groove (12) to be insulated from the connection lead (4).

13. The optical driving base according to claim 11, characterized in that, The insulating body (1) is provided with a recessed cavity (15) formed by further recessing from the bottom wall (121) of the receiving groove (12), and the fourth surface (2121) of the indirect connection part (212) is exposed to the recessed cavity (15).

14. The optical driving base according to claim 3, characterized in that, The receiving groove (11) and the accommodating groove (12) are respectively filled with sealing material, and the sealing material covers the high-density integrated circuit (3) and the connecting lead (4).

15. The optical driving base according to claim 1, characterized in that, The connecting lead (4) is a metal lead, or the connecting lead (4) includes a metal lead and an insulating layer covering the metal lead, the insulating layer being used to prevent electrical contact between adjacent connecting leads (4).

16. The optical driving base according to claim 1, characterized in that, The electronic component (5) includes a coil (51) and a sensing element (52) with sensing function. The coil (51) and the sensing element (52) are electrically connected to the conductive terminal (2) and electrically connected to the high-density integrated circuit (3) through the conductive terminal (2).

17. The optical driving base according to claim 16, characterized in that, The electronic component (5) also includes a capacitor (53), which is located on the side of the conductive terminal (2) away from the connecting lead (4) and is electrically connected to the conductive terminal (2); The coil (51), the sensing element (52) and the capacitor (53) are provided in multiples and are simultaneously connected to the high-density integrated circuit (3) through the conductive terminal (2).

Images