An integrated process method for super-precision machining and detection of complex micro-component surface microstructure

Abstract

The application relates to an integrated process method for super-precision machining and detection of a complex micro-component surface microstructure, and belongs to the technical field of micro-component surface machining.The application is used for solving the problem that the single super-precision cutting, energy beam micro-nano machining technology and contact type detection technology cannot meet the high-precision and high-efficiency forming requirement of the microstructure of a micro-component surface due to the low manufacturing response capability, micro-space constraint, insufficient measurement range and the fact that the precision benchmarks of the technologies cannot be unified.The application realizes the preliminary high-efficiency forming of a micro-spherical crown structure by milling and removing the microstructure material based on a super-precision micro-milling machining device; the local profile and surface topography of the spherical crown are precisely controlled by an ultraviolet nanosecond laser machining device to realize laser reshaping; the machining precision of the micro-spherical crown after each process forming is quantified based on a special complex micro-component measuring system and a non-contact lossless detection method to realize machining quality characterization.The application is used for complex micro-component surface machining.

Description

Technical Field

[0001] This invention relates to the field of surface processing methods for micro-components, and specifically to an integrated process method for ultra-precision processing and inspection of microstructures on the surface of complex micro-components. Background Technology

[0002] With the rapid development of modern high-end equipment, various small-sized, multi-scale, high-precision, high-performance complex micro-components have been widely used in fields such as precision optics, micro-nano sensing, and medical devices. These components typically have overall dimensions in the millimeter to sub-millimeter range and several spherical cap-shaped functional microstructures distributed on their surfaces. The requirements for sub-micrometer-level surface shape accuracy and nanometer-level surface roughness pose severe challenges to microstructure forming processes and accuracy characterization methods.

[0003] Complex micro-components are thin-walled spherical shell parts composed of soft and brittle polymer materials. Their surfaces contain dozens to hundreds of micro-spherical cap structures with transverse diameters of 50–200 μm and longitudinal depths of 5–20 μm. Traditional single-technology manufacturing methods such as ultra-precision cutting, electrical discharge machining (EDM), and plastic forming cannot meet the high-precision forming requirements of these microstructures. For this deterministic material removal problem under constraints of limited space and extreme manufacturing precision, efficient cutting and forming processes are needed for initial material removal. Further, energy beam processing techniques are used to control the microstructure contour and surface morphology. Dedicated measurement methods are then used to characterize the surface accuracy and surface roughness of the microstructure after these processes, achieving high-precision forming of the microstructure. Therefore, ensuring stable and reliable material removal within each process and guaranteeing the accurate transfer of manufacturing precision between processes is crucial to ensuring the machining accuracy of microstructures. However, under the constraints of a weakly rigid process system consisting of thin-walled spherical shell workpieces and small-sized cutting tools, existing ultra-precision cutting equipment and processes have low manufacturing accuracy and response capabilities, failing to meet the requirements for efficient and stable removal of microstructures. Common ion beam-based energy beam micro-nano processing technologies are limited by small spatial constraints such as size effects and shading effects, achieving manufacturing accuracy only at the hundred-nanometer level, which cannot meet the control requirements for microstructure precision. Current mainstream contact detection technologies are limited by the probe principle, with their longitudinal measurement range only reaching tens of micrometers, unable to achieve ultra-precision characterization of complex configurations such as curved surfaces and multi-faceted bodies with multi-scale microstructures. At the same time, common workpiece transfer methods between processes cannot guarantee the accurate transfer of the pose accuracy of micro-components, directly affecting the machining accuracy of microstructures. Therefore, research on integrated processes and methods for ultra-precision machining and detection of microstructures on the surface of complex micro-components, addressing the engineering application requirements for high-precision and efficient forming of thin-walled spherical shell micro-spherical crown structures, has significant scientific and engineering application value. Summary of the Invention

[0004] The purpose of this invention is to address the limitations of existing technologies such as single ultra-precision cutting, energy beam micro / nano fabrication, and contact inspection, which cannot meet the high-precision and efficient forming requirements of microstructures on the surface of micro-components due to factors such as low manufacturing response capability, small spatial constraints, insufficient measurement range, and lack of unified precision benchmarks between processes. This invention provides an integrated process method for ultra-precision machining and inspection of microstructures on the surface of complex micro-components. This invention utilizes ultra-precision micro-milling equipment to remove microstructure materials through milling, achieving preliminary and efficient forming of micro-spherical cap structures. Further, a UV nanosecond laser processing device precisely controls the local contour and surface morphology of the cap, achieving laser shaping. A dedicated complex micro-component measurement system and non-contact non-destructive testing methods quantify the machining accuracy of the micro-spherical cap after each process, achieving machining quality characterization. A high-precision fast-change system enables high-precision and rapid switching of workpieces between processes. Laser marking and visual recognition methods are used to identify workpiece pose and transfer manufacturing precision, effectively solving problems such as weak rigidity of the machining system, energy beam obstruction effects, and insufficient longitudinal measurement range, providing technical support for the high-precision creation of microstructures on the surface of complex micro-components.

[0005] The technical solution adopted by this invention to solve the above problems is: an integrated process method for ultra-precision machining and inspection of the surface microstructure of complex micro-components, employing an ultra-precision micro-milling machining system, an ultraviolet nanosecond laser shaping device, and a non-contact measurement system; the ultra-precision micro-milling machining system includes a milling X-axis motion unit, a milling Y-axis motion unit, a milling C-axis motion unit, a milling quick-change system base, a milling CCD camera, a milling cutter, a milling B-axis motion unit, and a milling Z-axis motion unit;

[0006] The milling Y-axis motion unit is mounted on the milling X-axis motion unit, the milling C-axis motion unit is mounted on the milling Y-axis motion unit, and the milling quick-change system base is located at the end of the milling C-axis motion unit; the milling B-axis motion unit is mounted on the milling Z-axis motion unit, and the milling cutter is located at the end of the milling B-axis motion unit; the milling CCD camera is used to identify the surface features of complex micro-components with micro-spherical crown structures, and the milling cutter is used to mill and shape the complex micro-components with micro-spherical crown structures;

[0007] The ultraviolet nanosecond laser shaping device includes a laser Y-axis motion unit, a laser B-axis motion unit, a laser X-axis motion unit, a laser Z-axis motion unit, a microscopic vision module, a laser focusing component, a laser C-axis motion unit, and a laser quick-change system base;

[0008] The laser B-axis motion unit is mounted on the laser Y-axis motion unit, and the laser C-axis motion unit is located at the end of the laser B-axis motion unit. The laser quick-change system base is mounted on the laser C-axis motion unit. The laser X-axis motion unit is mounted on the laser Z-axis motion unit, and the microscopic vision module and the laser focusing component are both mounted on the laser X-axis motion unit. The laser focusing component is used for etching straight line marks and planarizing the surface of complex micro-component micro-spherical cap structures, and the microscopic vision module is used to capture the etched marks.

[0009] The non-contact measurement system includes a C-axis motion measurement unit, a CCD camera, a sensor, a B-axis motion measurement unit, an X-axis motion measurement unit, a Z-axis motion measurement unit, a vacuum chamber, and a quick-change fixture.

[0010] The X-axis motion unit is mounted on the Z-axis motion unit, the B-axis motion unit is mounted on the X-axis motion unit, and the sensor is located at the end of the B-axis motion unit. The vacuum chamber is connected to the C-axis motion unit via a quick-change fixture. The CCD camera is used to capture and identify complex micro-components and their surface microstructures, and the sensor is used to acquire the surface contour of the milled micro-spherical crown and identify the spatial pose of manufacturing defects such as protrusions and pits on the surface.

[0011] The integrated process for ultra-precision machining and inspection of the surface microstructures of complex micro-components includes the following steps:

[0012] Step S100: Material milling removal. A special vacuum suction head is used to clamp the complex micro-component. The chuck is connected to the base of the milling quick-change system via a milling laser quick-change fixture. The axes of the micro-milling machining system are adjusted to their initial state. The machining code for the spherical micro-cap is compiled. The program controls the linkage of the axes to achieve the initial shaping of the microstructure through milling. The outline and spatial pose of the micro-cap with CCD camera marking features are milled. The complex micro-component is then disassembled along with the milling laser quick-change fixture.

[0013] Step S200: Laser marking. Install the milling laser quick-change fixture and the complex micro-component onto the laser quick-change system base of the laser shaping device. Adjust the axes of the laser device so that the laser focusing component is above the vacuum suction head. Turn on the laser and etch the microsphere target pose mark on the conical surface of the vacuum suction head to provide a benchmark for subsequent quality characterization and local manufacturing defect control.

[0014] Step S300: Machining quality characterization. Connect the vacuum suction head to the measurement vacuum chamber of the measurement system via a thread. Adjust the position of the measurement system axis so that the complex micro-component is located on the axis of its measurement B-axis motion unit and measurement C-axis motion unit. Rotate the C-axis and capture the etched straight line mark through the measurement CCD camera, and set it as the measurement origin. Perform non-contact measurement with a high-precision sensor. After data processing, obtain the surface contour of the milled micro-spherical crown of the complex micro-component and mark the spatial pose of manufacturing defects such as surface protrusions and pits.

[0015] Step S400: Surface laser shaping. Based on the surface contour information of complex micro-components and surface defect data such as significant protrusions and pits obtained by the measurement system, the local contour and surface morphology of the spherical crown are precisely controlled using an ultraviolet nanosecond laser processing device. The vacuum suction head is disassembled and installed on the laser milling laser quick-change fixture of the laser device, and the negative pressure environment of the vacuum cavity is connected. The posture of the vacuum suction head is adjusted by the multi-axis motion unit, and the etching mark is captured by the microscopic vision module and set as the origin of the laser shaping. Based on coordinate transformation, the surface contour information of complex micro-components and the position coordinates of surface defects such as significant protrusions and pits are obtained. The laser focusing component is controlled by multi-axis linkage to precisely control the milling manufacturing defects, so as to achieve the flattening processing of the surface of the micro spherical crown structure.

[0016] The present invention has the following beneficial technical effects:

[0017] This invention addresses the limitations of current single ultra-precision cutting, energy beam micro / nano processing, and contact detection technologies, which cannot meet the high-precision and efficient forming requirements of microstructures on the surface of micro-components due to factors such as low manufacturing response capability, small space constraints, insufficient measurement range, and lack of unified precision benchmarks between processes. By integrating micro-milling for preliminary efficient forming, laser local precise control, and non-contact measurement and characterization into a single process, this invention improves the contour accuracy and surface roughness of microspherical cap structures, meeting the high-precision processing requirements of dozens to hundreds of microspherical cap structures on the surface of microspherical targets with a diameter of 0.5~2.5mm.

[0018] This invention employs a vacuum adsorption fixture. The vacuum suction head is sealed to the vacuum chamber via a pipe thread and is equipped with a main / auxiliary gas source interface, which can ensure efficient switching of negative pressure and stable clamping of workpieces during transfer. At the same time, the vacuum suction head can adaptively match the spherical shape of the microsphere target, making it suitable for stable clamping of microsphere target components with a diameter of 0.5~2.5mm.

[0019] This invention employs a high-precision quick-change clamping system, requiring only 0.6MPa for pneumatic opening and spring locking, with a repeatability accuracy better than ±0.5μm, which can meet the requirements for efficient and high-precision transfer of workpieces between milling removal and laser shaping processes.

[0020] The laser shaping device upon which this invention is based integrates a microscopic vision module and a laser focusing component into a single unit. It is equipped with a high-precision linear motion unit and a rotary motion unit, with X-axis and Y-axis positioning accuracy of 0.5μm and straightness of 1.5μm; Z-axis positioning accuracy of 0.3μm and straightness of 1.5μm; B-axis positioning accuracy of 5" with an axial error better than 2μm; and C-axis positioning accuracy of 5" with an axial error better than 2μm. This meets the manufacturing requirements for precise calibration of microspherical cap feature structures and high-precision laser local contour shaping.

[0021] The measurement system of this invention is equipped with a high-resolution camera with 26 million pixels and a field of view of up to 6.4mm×4.8mm, which can accurately capture the cone-shaped etching marks; it is equipped with a non-contact detection sensor with a resolution better than 1nm, a measurement range of 2mm, a sampling frequency of 100Hz~6kHz, and a maximum offset angle of ±2°, which meets the high-precision characterization requirements of the microspherical cap structure on the surface of the microspherical target.

[0022] The micro-parts processing technology of this invention has universality. It is not only applicable to the high-precision processing and inspection of microsphere crown-shaped microstructures on the surface of microsphere targets, but also applicable to the high-precision manufacturing of complex micro-components such as microsteps, grooves, and free-form surfaces. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the process for ultra-precision machining of the surface microstructure of complex micro-components according to the present invention;

[0024] Figure 2 This is a schematic diagram of the structure of the ultra-precision micro-milling machining system of the present invention;

[0025] Figure 3 This is a schematic diagram of the structure of the ultraviolet nanosecond laser shaping device of the present invention;

[0026] Figure 4 This is a schematic diagram of the non-contact measurement system of the present invention;

[0027] Figure 5 This is a schematic diagram of the structure of the two-degree-of-freedom displacement stage of the vacuum cavity of the present invention;

[0028] Figure 6 This is a schematic diagram of the two-degree-of-freedom displacement stage of the sensor of the present invention;

[0029] Figure 7 This is a schematic diagram of the microstructure of a microspherical crown structure formed by micromilling;

[0030] Figure 8 This is a schematic diagram of the microstructure of a laser-modified microspherical crown structure.

[0031] In the diagram: 1. Milling X-axis motion unit; 2. Milling Y-axis motion unit; 3. Milling C-axis motion unit; 4. Milling quick-change system base; 5. Milling laser quick-change fixture; 6. Milling CCD camera; 7. Complex micro-components; 8. Milling cutter; 9. Milling B-axis motion unit; 10. Milling Z-axis motion unit;

[0032] 11. Laser Y-axis motion unit; 12. Laser B-axis motion unit; 13. Laser X-axis motion unit; 14. Laser Z-axis motion unit; 15. Microscopic vision module; 16. Laser focusing component; 17. Laser C-axis motion unit;

[0033] 18. Measurement of C-axis motion unit; 19. Measurement of CCD camera; 20. Sensor; 21. Measurement of B-axis motion unit; 22. Measurement of X-axis motion unit; 23. Measurement of Z-axis motion unit; 24. Measurement of vacuum chamber; 25. Measurement of quick-change fixture; 26. Laser quick-change system base; 27. Two-degree-of-freedom displacement stage for vacuum chamber; 28. Two-degree-of-freedom displacement stage for sensor. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. The specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0035] Specific implementation method one: Combining Figures 1 to 8 This embodiment describes an integrated process for ultra-precision machining and inspection of the surface microstructure of complex micro-components. It employs an ultra-precision micro-milling system, an ultraviolet nanosecond laser shaping device, and a non-contact measurement system. The ultra-precision micro-milling system includes a milling X-axis motion unit 1, a milling Y-axis motion unit 2, a milling C-axis motion unit 3, a milling quick-change system base 4, a milling CCD camera 6, a milling cutter 8, a milling B-axis motion unit 9, and a milling Z-axis motion unit 10.

[0036] The milling Y-axis motion unit 2 is mounted on the milling X-axis motion unit 1, and the milling C-axis motion unit 3 is mounted on the milling Y-axis motion unit 2. The milling quick-change system base 4 is located at the end of the milling C-axis motion unit 3. The milling B-axis motion unit 9 is mounted on the milling Z-axis motion unit 10, and the milling cutter 8 is located at the end of the milling B-axis motion unit 9. The milling CCD camera 6 is used to identify the surface features of the complex micro-component 7, which is a micro-spherical crown structure, and the milling cutter 8 is used to mill and shape the complex micro-component 7, which is a micro-spherical crown structure.

[0037] The ultraviolet nanosecond laser shaping device includes a laser Y-axis motion unit 11, a laser B-axis motion unit 12, a laser X-axis motion unit 13, a laser Z-axis motion unit 14, a microscopic vision module 15, a laser focusing component 16, a laser C-axis motion unit 17, and a laser quick-change system base 26.

[0038] The laser B-axis motion unit 12 is mounted on the laser Y-axis motion unit 11, and the laser C-axis motion unit 17 is located at the end of the laser B-axis motion unit 12. The laser quick-change system base 26 is mounted on the laser C-axis motion unit 17. The laser X-axis motion unit 13 is mounted on the laser Z-axis motion unit 14, and the microscopic vision module 15 and the laser focusing component 16 are both mounted on the laser X-axis motion unit 13. The laser focusing component 16 is used for etching straight line marks and planarizing the surface of the complex micro-component 7 micro-spherical cap structure, and the microscopic vision module 15 is used for capturing the etched marks.

[0039] The non-contact measurement system includes a C-axis motion unit 18, a CCD camera 19, a sensor 20, a B-axis motion unit 21, an X-axis motion unit 22, a Z-axis motion unit 23, a vacuum chamber 24, and a quick-change fixture 25.

[0040] The X-axis motion unit 22 is mounted on the Z-axis motion unit 23, the B-axis motion unit 21 is mounted on the X-axis motion unit 22, and the sensor 20 is located at the end of the B-axis motion unit 21. The vacuum chamber 24 is connected to the C-axis motion unit 18 via the quick-change fixture 25. The CCD camera 19 is used to capture and identify the complex micro-component 7 and its surface microstructure. The sensor 20 is used to acquire the surface contour of the milled micro-spherical crown of the complex micro-component 7 and mark the spatial pose of manufacturing defects such as protrusions and pits on the surface.

[0041] The integrated process for ultra-precision machining and inspection of the surface microstructures of complex micro-components includes the following steps:

[0042] Step S100: Material milling removal. A special vacuum suction head is used to clamp the complex micro-component 7. The chuck is connected to the milling quick-change system base 4 through the milling laser quick-change fixture 5. Adjust each axis of the micro-milling machining system to the initial state, compile the machining code for the spherical micro-spherical crown, and control the linkage of the axis system to achieve the initial shaping of the microstructure by milling. Mill the outline of the micro-spherical crown and its spatial pose of the CCD camera 6. Then, the complex micro-component 7 is disassembled together with the milling laser quick-change fixture 5.

[0043] Step S200: Laser marking. Install the milling laser quick-change fixture 5 and the complex micro-component 7 onto the laser quick-change system base 26 of the laser shaping device. Adjust the axes of the laser device so that the laser focusing component is above the vacuum suction head. Turn on the laser and etch the microsphere target pose mark on the conical surface of the vacuum suction head to provide a benchmark for subsequent quality characterization and local manufacturing defect control.

[0044] Step S300: Machining quality characterization. The vacuum suction head is connected to the measurement vacuum chamber 24 of the measurement system via a thread. The position of the measurement system axis is adjusted so that the complex micro-component 7 is located on the axis of its measurement B-axis motion unit 21 and measurement C-axis motion unit 18. The C-axis is rotated and the etched straight line mark is captured by the measurement CCD camera 19 and set as the measurement origin. Non-contact measurement is performed by the high-precision sensor 20. After data processing, the spatial pose of the milled micro-spherical crown surface contour of the complex micro-component 7 and the manufacturing defects such as surface protrusions and pits are obtained.

[0045] Step S400: Surface laser shaping. Based on the surface contour information of the complex micro-component 7 and the surface defect data such as significant protrusions and pits obtained by the measurement system, the local contour and surface morphology of the spherical crown are precisely controlled by the ultraviolet nanosecond laser processing device. The vacuum suction head is disassembled and installed on the laser milling laser quick-change fixture 5 of the laser device, and the negative pressure environment of the vacuum cavity is connected. The position of the vacuum suction head is adjusted by the multi-axis motion unit, and the etching mark is captured by the microscopic vision module 15 and set as the origin of the laser shaping. Based on coordinate transformation, the surface contour information of the complex micro-component 7 and the position coordinates of the surface defects such as significant protrusions and pits are obtained. The laser focusing component 16 is controlled by multi-axis linkage to precisely control the milling manufacturing defects in order to achieve the flattening processing of the surface of the micro spherical crown structure.

[0046] In a preferred embodiment, step S100, material milling removal, includes the following steps:

[0047] Step S110: Use a vacuum adsorption fixture to adsorb and clamp the complex micro component 7. The fixture is connected to the milling quick change system base 4 through a pneumatic spring chuck. Adjust the negative pressure to stably adsorb the complex micro component 7. The vacuum adsorption fixture includes a vacuum chamber, a main / auxiliary air source interface and a vacuum suction head. The end of the vacuum suction head has a conical structure and the vacuum suction head is connected to the vacuum chamber through a sealing pipe thread.

[0048] Step S120: Start the micro-milling machining system, execute the enable and zero-return operations for each axis, load the coordinates of the uniformly distributed point set of the complex micro-component 7 micro-spherical crown and the machining sequence into the CNC system; perform trial cutting and tool setting, and achieve the initial milling and shaping of the micro-spherical crown structure through multi-axis linkage;

[0049] Step S130: Rotate the milling C-axis motion unit 3 and observe, capture and mark the outline and spatial pose of the three micro-spherical cap structures to be finally machined on the spherical surface through the milling CCD camera 6, and disassemble the machined complex micro-components 7 workpiece together with the milling laser quick-change fixture 5 from the milling system.

[0050] In a preferred embodiment, step S200, laser marking, includes the following steps:

[0051] Step S210: Connect the main gas source port of the vacuum adsorption fixture to the negative pressure port of the laser device, and close its auxiliary gas source valve; open the pneumatic switch of the quick-change base of the laser device, and install the milling laser quick-change fixture 5 along with the complex micro-component 7 into the laser quick-change system base 26; after the milling laser quick-change fixture 5 is installed in the quick-change base of the laser device, the negative pressure required for adsorption of the complex micro-component 7 is provided by the laser device.

[0052] Step S220: Turn on the laser device, perform shaft initialization and laser preheating operations; the program moves each axis so that the laser focusing component is above the vacuum suction head cone surface and turns on the laser, etching straight line marks along the vertical plane where the vacuum suction fixture axis is located; then remove the complex micro-component 7 with the etched marks and the vacuum suction head together from the laser device.

[0053] In a preferred embodiment, step S300, which characterizes the processing quality, includes the following steps:

[0054] Step S310: Install the vacuum suction head with etched straight lines onto the measuring vacuum chamber 24 of the measuring system through a sealing pipe thread. The measuring vacuum chamber 24 is connected to the end face of the two-degree-of-freedom displacement stage 27 of the vacuum chamber and connected to the negative pressure interface of the measuring system. The two-degree-of-freedom displacement stage 27 of the vacuum chamber is connected to the end of the measuring C-axis motion unit 18. Fine-tune the two-degree-of-freedom displacement stage 27 of the vacuum chamber and observe the complex micro-component 7 through the measuring CCD camera 19 to make the center of the complex micro-component 7 coaxial with the center of rotation of the C-axis. Fix the high-precision sensor 20 to the measuring B-axis motion unit 21 through the sensor two-degree-of-freedom displacement stage 28, adjust the position of the linear axis and observe through the measuring CCD camera 19 to make the complex micro-component 7 located on the B-axis rotation axis.

[0055] Step S320: The program rotates the C-axis motion unit 18 and observes the conical area of ​​the vacuum suction head through the measuring CCD camera 19 until the etching mark is located at the high point of the positive Y-axis, which is set as the measurement origin; the C-axis is rotated at low speed so that the complex micro-component 7 rotates around the C-axis rotation center, and the measuring B-axis motion unit 21 rotates back and forth in the ±90° direction to drive the high-precision sensor 20 to perform a non-contact circular scan on the spherical surface of the complex micro-component 7 to obtain the contour information of the surface of the complex micro-component 7; after data processing and measurement error elimination, the surface contour information, surface roughness Ra and contour accuracy PV of the milled micro-spherical crown of the complex micro-component 7 are obtained, and significant surface defects such as protrusions and pits are marked and their position data are recorded.

[0056] In a preferred embodiment, step S400, surface laser shaping, includes the following steps:

[0057] Step S410: Remove the vacuum suction head along with the complex micro-component 7 from the measuring vacuum chamber 24 of the measuring system and install it on the milling laser quick-change fixture 5 of the laser device. Connect the vacuum chamber to the negative pressure to stably adsorb the complex micro-component 7. Adjust the position and orientation of the linear and rotary axes of the laser device to move the vacuum suction head to the visible area of ​​the microscopic vision module 15. Program the rotation of the laser C-axis motion unit 17, and the microscopic vision module 15 monitors the conical area of ​​the vacuum suction head.

[0058] Step S420: The microscopic vision module 15 captures the etched straight line mark and adjusts it to the highest point in the Z direction. It obtains the spatial data of the surface contour of the milled complex micro-component 7 characterized by the measurement system and the location information of surface defects such as significant protrusions and pits. The coordinate transformation method is used to transform it into the processing coordinate system of the laser device. The manufacturing defect shaping CNC program is compiled, and the XZ axis linkage grating motion mode is used to control the laser focusing component 16 to trim the surface high points and micro-pits to improve the manufacturing accuracy of the micro-spherical crown surface.

[0059] Step S430: After laser shaping, the complex micro-component 7 is removed from the laser device along with the vacuum suction head and installed on the measurement vacuum chamber 24 of the measurement system. Steps S310 and S320 are executed to characterize the surface quality of the micro-spherical crown of the complex micro-component 7 after laser shaping, and the surface roughness Ra and contour accuracy PV of the microstructure are obtained to achieve high-precision manufacturing of the micro-spherical crown structure on the surface of the complex micro-component 7.

[0060] In this embodiment, the spatial data of the surface contour of the milled complex micro-component 7 and the location information of surface defects such as significant protrusions and pits are converted to the processing coordinate system of the laser device by a coordinate transformation method. The coordinate transformation method adopts the prior art disclosed in the patent application No. CN2023117604493, entitled "Method and Device for Processing Micro-pit Structure on Surface of Complex Micro-components of Thin-walled Spherical Shell Based on Coordinate Transformation".

[0061] In a preferred embodiment, the laser used in step S220 is a 266nm wavelength ultraviolet nanosecond laser with a pulse repetition frequency of 1Hz~1000Hz, a pulse width better than 10ns@1kHz, an average output power ≥100W@1KHz, and a maximum power >1W.

[0062] During the laser etching process, the laser power was set to 100mW, the quarter-wave plate angle was set to 45°, the scanning speed was set to 0.2mm / s, and the defocusing amount was set to -0.1μm.

[0063] In a preferred embodiment, the laser device used in step S220 has a laser X-axis motion unit 13 and a laser Y-axis motion unit 11 with a linear motion unit travel range of 300 mm, a positioning accuracy of 0.5 μm, a bidirectional repeatability better than 0.3 μm, and a straightness of 1.5 μm; and a laser Z-axis motion unit 14 with a travel range of 100 mm, a positioning accuracy of 0.3 μm, a bidirectional repeatability better than 0.2 μm, and a straightness of 1.5 μm.

[0064] In a preferred embodiment, the laser device used in step S220 has a laser B-axis motion unit 12 with a stroke range of ±90°, a positioning accuracy of 5", a bidirectional repeatability of 3", and an axial error better than 2μm; and a laser C-axis motion unit 17 with a stroke range of 360°, a positioning accuracy of 5", a bidirectional repeatability of 3", and an axial error better than 2μm.

[0065] In a preferred embodiment, the measurement and detection CCD camera 19 used in steps S310 and S320 is a high-resolution camera with 26 megapixels and a field of view of 6.4mm × 4.8mm; the sensor 20 has a resolution better than 1nm, a measurement range of 2mm, a sampling frequency of 100Hz~6kHz, and a maximum offset angle of ±2°.

[0066] In a preferred embodiment, the laser energy density during laser shaping in step S420 is 0.02~0.06 J / cm². 2 The focal spot diameter is 3μm, the scanning spacing is 1μm, and the scanning speed is set to 25μm / s.

[0067] In a preferred embodiment, the measurement and detection CCD camera 19 used in steps S310 and S320 is a high-resolution camera with 26 megapixels and a field of view of 6.4mm × 4.8mm; the sensor 20 has a resolution better than 1nm, a measurement range of 2mm, a sampling frequency of 100Hz~6kHz, and a maximum offset angle of ±2°.

[0068] In a preferred embodiment, the laser energy density during laser shaping in step S420 is 0.02~0.06 J / cm². 2 The focal spot diameter is 3μm, the scanning spacing is 1μm, and the scanning speed is set to 25μm / s.

[0069] Specific Implementation Method Two: Combining Figures 1 to 8 This embodiment describes the integrated process and method for ultra-precision machining and inspection of microstructures on the surface of complex micro-components, as illustrated in the following diagram. Figure 1 As shown; the basic manufacturing equipment upon which the integrated process and method for ultra-precision machining and inspection of the surface microstructures of complex micro-components relies is, for example... Figure 2 As shown.

[0070] The integrated process and method for ultra-precision machining and inspection of the surface microstructures of complex micro-components relies on ultra-precision basic manufacturing equipment, mainly including a dedicated ultra-precision micro-milling system, an ultraviolet nanosecond laser shaping device, and a non-contact measurement system. The dedicated ultra-precision micro-milling system mainly consists of a milling X-axis motion unit 1, a milling Y-axis motion unit 2, a milling Z-axis motion unit 10 (linear motion), a milling B-axis motion unit 9, a milling C-axis motion unit 3 (rotary motion), a quick-change system, and milling cutters 8. The complex micro-component 7 is connected to the quick-change system via negative pressure adsorption. A high-resolution milling CCD camera 6 can identify the micro-spherical crown structure and markings on the surface of the complex micro-component 7, enabling the initial milling shaping of the complex micro-spherical crown structure. The ultraviolet nanosecond laser shaping device mainly consists of a laser Y-axis motion unit 11, a laser X-axis motion unit 13, and a laser Z-axis motion unit 14. The system comprises a linear motion unit 14, a laser B-axis motion unit 12 and a laser C-axis motion unit 17, a rotary motion unit, a quick-change system, a laser focusing component 16, and a microscopic vision module 15, which can achieve precise control of the local contour and morphology of the microspherical crown. The non-contact measurement system mainly consists of a linear motion unit 22 and a linear motion unit 23 for measuring the X-axis and a linear motion unit 23 for measuring the Z-axis, a rotary motion unit 21 for measuring the B-axis and a rotary motion unit 18 for measuring the C-axis, a sensor 20, and a high-resolution measuring CCD camera 19, which can realize laser marking identification, workpiece pose identification, and detection and characterization of the contour accuracy and surface roughness of the microspherical crown.

[0071] The other components and connections are the same as in Specific Implementation Method 1.

[0072] Specific implementation method three: Combining Figures 1 to 8 This embodiment describes an integrated process and method for ultra-precision machining and inspection of the microstructures on the surface of complex micro-components, which relies on ultra-precision basic manufacturing equipment. Figure 2 As shown, it mainly includes four parts: material milling removal, laser marking, machining quality characterization, and surface laser shaping. Figure 1As shown, the complex microsphere target component is connected to the milling laser quick-change fixture 5 of a dedicated ultra-precision micro-milling system via negative pressure adsorption. The milling laser quick-change fixture 5 and the quick-change system can achieve high repeatability in assembly and disassembly. The program controls the linkage of each axis of the milling system to achieve efficient milling removal of the microsphere cap structure material on the surface of the microsphere target. Further utilizing the high repeatability of the quick-change system, the microsphere target and the milling laser quick-change fixture 5 are detached from the milling system and installed in the laser shaping device. The program adjusts the fixture's pose and etches pose marks on the conical surface of the vacuum suction head of the milling laser quick-change fixture 5 using the laser focusing component 16, providing a pose reference for quality characterization. The vacuum suction head of the adsorption fixture is detached and installed at the end of the measurement vacuum chamber 24 of the measurement system. The measurement system captures the laser mark pose using the measurement CCD camera 19 and sets it as the measurement origin. Further non-contact measurement is performed using a high-precision sensor 20. Data processing is used to obtain the surface contour of the milled spherical microsphere cap and mark the spatial pose of milling defects such as protrusions and pits. The measuring vacuum chamber 24 and vacuum suction head are disassembled and installed on the laser milling quick-change fixture 5 for laser shaping. The microscopic vision module captures the marker pose and sets it as the laser shaping origin. Based on the manufacturing defect spatial data acquired by the measurement system, the multi-axis linkage control laser focusing component 16 precisely controls the milling manufacturing defects to achieve planarization of the microspherical crown structure surface. Furthermore, the vacuum suction head on the laser milling quick-change fixture 5 is disassembled and reinstalled at the end of the measuring vacuum chamber 24 of the measurement system. The measurement system captures the laser marker pose through the measuring CCD camera 19 and sets it as the measurement origin. A high-precision sensor 20 is then used for non-contact measurement to evaluate the contour morphology of the laser-trimmed microspherical crown, obtaining the microspherical crown contour accuracy and surface roughness, thereby achieving high-precision machining and inspection of complex microspherical crown structures.

[0073] For example, the specific instructions and operating procedures for the microspherical cap structure material on the surface of the microspherical target are as follows:

[0074] I. Material Milling Removal: A specialized vacuum suction head is used to clamp the microsphere target component. The chuck is connected to the milling quick-change system base 4 via a milling laser quick-change fixture 5. The axes of the micro-milling system are adjusted to their initial state, and the machining code for the spherical microsphere cap is programmed. The program controls the axis linkage to achieve the initial milling and shaping of the microstructure. The CCD camera 6 is milled to mark the contour and spatial pose of the feature microsphere cap. The micro-milled microsphere target workpiece is then disassembled along with the milling laser quick-change fixture 5. The specific operational steps are as follows:

[0075] Step 1.1: The microsphere target component is adsorbed and clamped using a vacuum adsorption fixture, and an appropriate amount of water-soluble adhesive is used for bonding to ensure airtightness. The fixture is connected to the milling quick-change system base 4 via a high-precision pneumatic spring chuck. The negative pressure is adjusted to stabilize the adsorption of the microsphere target. The water-soluble adhesive has strong adhesion, a viscosity of 8000~15000 mPa·s, a solid content of 8%, and a curing time of about 30 minutes.

[0076] Furthermore, the vacuum adsorption fixture includes a vacuum chamber, a main / auxiliary gas source interface, and a vacuum nozzle. The end of the vacuum nozzle has a conical structure, and the negative pressure is adjustable within a range of -77.89 kPa. The vacuum nozzle is connected to the vacuum chamber via a sealed pipe thread, allowing for quick disassembly and replacement. It is suitable for the stable clamping of microsphere target components with a diameter of 0.5~2.5 mm.

[0077] Furthermore, the quick-change system includes a base, a pull stud, and a quick-change clamp. The quick-change clamp is connected to the pull stud by a snap-fit, and the pull stud is connected to the base by a pneumatic spring clamp. The required pneumatic opening pressure is only 0.6MPa, which can achieve quick assembly and disassembly of workpieces with a repeatability accuracy better than ±0.5μm.

[0078] Step 1.2: Start the micro-milling system, execute the enable and homing operations for each axis, obtain the coordinates of the uniformly distributed micro-spherical crowns from the spherical diameter Φ and the number of micro-spherical crowns N to be machined, generate the micro-structure machining code based on the CNC system programming module, perform trial cutting and tool setting, and achieve the initial milling of the micro-spherical crown structure through multi-axis linkage.

[0079] Furthermore, when the milling system axis returns to zero, after the X-axis, Z-axis and Y-axis perform the zero-return operation, the Z-axis and X-axis move to the positive limit position, and the B-axis and C-axis return to zero;

[0080] Furthermore, given that the number of microspheres N to be processed is in the tens to hundreds, the spatial coordinates of the microspheres in the workpiece coordinate system are generated based on the Fibonacci sequence principle, and then transformed to the processing coordinate system using a homogeneous coordinate transformation method;

[0081] Furthermore, during milling, a single-flute diamond micro-diameter milling cutter with a radius of 0.3 mm is selected as the machining tool. During trial cutting and tool setting, the Z-axis is first moved in a large increment in the positive direction. When the tool is close to the workpiece, a small increment of 0.1 μm is selected for feed. The generation of chips is observed through the milling CCD camera 6. After a small amount of chips are generated, the Z-axis feed is stopped and the origin is set.

[0082] Step 1.3: Rotate the milling C-axis motion unit 3 and observe, capture and mark the contours and spatial poses of the three micro-spherical cap structures to be finally machined on the spherical surface through the milling CCD camera 6, and disassemble the machined micro-spherical target workpiece from the milling system together with the milling laser quick-change fixture 5.

[0083] Furthermore, during observation, the milling CCD camera 6 acquires images and depth of field of the three micro-spherical caps after the final machining of the spherical surface, and obtains the micro-spherical cap aperture and center coordinates based on the spherical diameter Φ and the corresponding image processing method; when disassembling the micro-spherical target and fixture, after connecting the auxiliary gas source port of the vacuum adsorption fixture, the main gas source valve is closed, the pneumatic switch of the quick-change system is opened, and the milling laser quick-change fixture 5 is removed from the milling quick-change system base 4.

[0084] II. Laser Marking: The milling laser quick-change fixture 5 and the microsphere target workpiece are mounted onto the laser quick-change system base 26 of the laser shaping device. The axes of the laser device are adjusted so that the laser focusing component is positioned above the vacuum suction head. The laser is turned on, and the microsphere target's pose markings are etched on the conical surface of the vacuum suction head, providing a reference for subsequent quality characterization and local manufacturing defect control. The specific operating steps are as follows:

[0085] Step 2.1: Connect the main air source port of the vacuum adsorption fixture to the negative pressure port of the laser device, and close its auxiliary air source valve; open the pneumatic switch of the quick-change base of the laser device, and install the milling laser quick-change fixture 5 along with the micro-milling target into the laser quick-change system base 26; after the milling laser quick-change fixture 5 is installed in the quick-change base of the laser device, the negative pressure required for the adsorption of the micro-target is provided by the laser device.

[0086] Step 2.2: Turn on the laser device, perform axis initialization and laser preheating operations; the program moves each axis so that the laser focusing component is above the vacuum suction head cone surface and turns on the laser, etching straight line marks along the vertical plane where the vacuum suction fixture axis is located; then remove the marked micro-milled ball target and vacuum suction head from the laser device together.

[0087] Furthermore, the laser is a 266nm wavelength ultraviolet nanosecond laser with a pulse repetition frequency of 1Hz~1000Hz, a pulse width better than 10ns@1kHz, an average output power ≥100W@1KHz, a maximum power >1W, and functions such as output power adjustment and external triggering.

[0088] Furthermore, during the laser etching process, the laser power is set to 100mW, the quarter-wave plate angle is set to 45°, the scanning speed is set to 0.2mm / s, and the defocusing amount is set to -0.1μm.

[0089] Furthermore, the laser X-axis motion unit 13 and laser Y-axis motion unit 11 of the laser device have a linear motion unit travel range of 300mm, a positioning accuracy of 0.5μm, a bidirectional repeatability better than 0.3μm, and a straightness of 1.5μm; the laser Z-axis motion unit 14 has a travel range of 100mm, a positioning accuracy of 0.3μm, a bidirectional repeatability better than 0.2μm, and a straightness of 1.5μm.

[0090] Furthermore, the laser B-axis motion unit 12 of the laser device has a stroke range of ±90°, a positioning accuracy of 5", a bidirectional repeatability of 3", and an axial error better than 2μm; the laser C-axis motion unit 17 has a stroke range of 360°, a positioning accuracy of 5", a bidirectional repeatability of 3", and an axial error better than 2μm.

[0091] III. Processing Quality Characterization: The vacuum suction head is connected to the measuring vacuum chamber 24 of the measuring system via a thread. The axis position of the measuring system is adjusted so that the microsphere target is located on the axes of its measuring B-axis motion unit 21 and measuring C-axis motion unit 18. The C-axis is rotated, and the etched straight line mark is captured by the measuring CCD camera 19 and set as the measuring origin. Non-contact measurement is performed by the high-precision sensor 20. After data processing, the surface contour of the microsphere target milled is obtained, and the spatial pose of manufacturing defects such as surface protrusions and pits is marked. The specific operation steps are as follows:

[0092] Step 3.1: The vacuum suction head with etched linear markings is screwed onto the measuring vacuum chamber 24 of the measuring system via a sealing pipe thread. The microsphere shell component is connected to the end of the vacuum suction head by the adhesive force of the water-soluble adhesive. The vacuum chamber is connected to the end face of the two-degree-of-freedom displacement stage 27 of the vacuum chamber and connected to the negative pressure interface of the measuring system. The two-degree-of-freedom displacement stage 27 of the vacuum chamber is connected to the end of the measuring C-axis motion unit 18 by screws. The two-degree-of-freedom displacement stage 27 of the vacuum chamber is finely adjusted and the microsphere target is observed through the measuring CCD camera 19 to make the center of the microsphere target coaxial with the center of rotation of the C-axis. The high-precision sensor 20 is fixed on the horizontal B-axis through the sensor two-degree-of-freedom displacement stage 28. The position of the linear axis is adjusted and observed through the measuring CCD camera 19 to make the microsphere target located on the B-axis rotation axis.

[0093] Furthermore, the end of the aforementioned vacuum chamber is a G1 / 8 sealing pipe thread, which can be precisely connected to the vacuum suction head to ensure the airtightness of the chamber; the measuring CCD camera 19 is a 26-megapixel high-resolution camera, which can capture and identify the microsphere target and its surface microstructure.

[0094] Furthermore, the aforementioned displacement stage is driven by two coarse and fine adjustment micrometers, which can be adjusted linearly along two vertical directions respectively. The coarse adjustment accuracy of the micrometer is 10μm, and the fine adjustment accuracy is 0.5μm, which can ensure that the center of the microsphere target is located on the B-axis and C-axis. It is also equipped with a locking knob to facilitate locking the position after adjustment.

[0095] Step 3.2: The program rotates the C-axis and observes the conical area of ​​the vacuum suction head through the measuring CCD camera 19 until the etching mark is located at the high point of the positive Y-axis, which is set as the measurement origin; the C-axis is rotated at low speed so that the microsphere target rotates around the C-axis rotation center, and the B-axis reciprocates in the ±90° direction to drive the high-precision sensor 20 to perform a non-contact circular scan of the microsphere target surface to obtain the contour information of the microsphere target surface; after data processing and measurement error elimination, the contour information, surface roughness Ra and contour accuracy PV of the microsphere target milled microsphere crown are obtained, and significant surface defects such as protrusions and pits are marked and their position data are recorded.

[0096] Furthermore, the measuring CCD camera 19 is a high-resolution camera with 26 megapixels and a field of view of 6.4mm × 4.8mm, which can accurately capture the cone-shaped etched marks; the sensor 20 has a resolution better than 1nm, a measurement range of 2mm, a sampling frequency of 100Hz~6kHz, and a maximum offset angle of ±2°.

[0097] Furthermore, based on non-contact ring scanning to obtain the surface shape of the microsphere target, a numerical fitting method is used to obtain the fitted point cloud surface shape of the ideal surface of the microsphere target, and the difference is calculated with the scanned point cloud surface shape with the microsphere cap structure to obtain the surface contour information of the microsphere cap structure.

[0098] IV. Surface Laser Shaping: Based on the surface contour information of the microsphere target and the data of surface defects such as significant protrusions and pits obtained by the measurement system, the local contour and surface morphology of the spherical crown are precisely controlled by an ultraviolet nanosecond laser processing device. The vacuum chuck is disassembled and screwed onto the laser milling laser quick-change fixture 5 of the laser device, and the negative pressure environment of the vacuum cavity is connected; the posture of the vacuum suction head is adjusted by the multi-axis motion unit, and the etching mark is captured by the microscopic vision module 15 and set as the origin of the laser shaping; based on coordinate transformation, the surface contour information of the microsphere target and the position coordinates of surface defects such as significant protrusions and pits are obtained, and the laser focusing component 16 is controlled by multi-axis linkage to precisely control the milling manufacturing defects, so as to achieve the flattening of the surface of the microsphere crown structure.

[0099] Step 4.1: Remove the vacuum suction head along with the microsphere target from the measurement vacuum chamber 24 of the measurement system and screw it onto the milling laser quick-change fixture 5 of the laser device. Connect the vacuum chamber to the negative pressure to stabilize the adsorption of the microsphere target. Adjust the position and orientation of the linear and rotary axes of the laser device to move the vacuum suction head to the visible area of ​​the microscopic vision module 15. Rotate the C-axis in the program, and the microscopic vision module 15 monitors the conical area of ​​the vacuum suction head.

[0100] Furthermore, the vacuum suction head is connected to the pipe thread of the measuring vacuum chamber 24 of the quick-change fixture of the laser device, and the negative pressure system has an adjustable range of -77.89 kPa;

[0101] Furthermore, the laser device integrates the microscopic vision module 15 and the laser focusing component 16 into one unit. The vision module includes an illumination light, a beam splitter, a dichroic mirror, and an imaging lens. The dichroic mirror has a reflectivity of 97% for 266nm wavelength laser and a transmittance of 93% for visible light. The CCD corresponding to the imaging lens is used to acquire the intermediate image formed by the imaging lens and transmit the image information to the industrial control computer for display on the monitor.

[0102] Step 4.2: The microscopic vision module 15 captures the etched straight line mark and adjusts it to the highest point in the Z direction. It obtains the spatial data of the milled microsphere target surface contour characterized by the measurement system and the location information of surface defects such as significant protrusions and pits. The coordinate transformation method is used to transform it into the processing coordinate system of the laser device. The manufacturing defect shaping CNC program is compiled, and the XZ axis linkage grating motion mode is used to control the laser focusing component 16 to trim the surface high points and micro-pits to improve the manufacturing accuracy of the microsphere cap surface.

[0103] Furthermore, the coordinate transformation method includes translation and rotation transformations, which can transform the contour information based on the microsphere target center coordinate system to the laser device processing coordinate system;

[0104] Furthermore, during the pose adjustment, the rotation axis angle and the position of the linear axis are adjusted so that the first micro-spherical crown structure to be modified and its outer edge are clearly imaged under microscopic vision; the center position is obtained from the outer edge, and the surface contour is modified by a grating reciprocating scanning process according to the programmed modification procedure.

[0105] Furthermore, the laser energy density during laser shaping is 0.02~0.06 J / cm². 2 The focal spot diameter is 3μm, the scanning spacing is 1μm, and the scanning speed is set to 25μm / s.

[0106] Step 4.3: After laser shaping, the microspherical target is removed from the laser device along with the vacuum suction head and installed on the measurement vacuum chamber 24 of the measurement system. Steps 3.1 and 3.2 are executed to characterize the surface quality of the microspherical cap after laser shaping, and the surface roughness Ra and contour accuracy PV of the microstructure are obtained to achieve high-precision manufacturing of the microspherical cap structure on the surface of the microspherical target.

[0107] In this embodiment, the vacuum suction head and vacuum chamber are connected to the end of the quick-change fixture, and the microsphere target 7 is connected to the vacuum suction head; the measurement vacuum chamber 24 of the measurement system is only installed to the end of the measurement quick-change fixture 25 by screws. The quick-change fixture is large in size and weight, and precision measurement devices cannot be installed; therefore, the quick-change fixture is only used for switching between the ultra-precision micro-milling system and the ultraviolet nanosecond laser shaping device, and the steps involving the measurement system only involve disassembling the vacuum suction head.

[0108] Material milling removal → laser marking: disassembly of quick-change fixture (the vacuum chamber and vacuum head connected to its end are transferred accordingly; the microsphere target is also transferred with the vacuum head);

[0109] Laser scribing marking → Measurement: Only the vacuum head is removed (the quick-change fixture remains stationary, while the microsphere target is moved with the vacuum head);

[0110] Measurement → Surface Laser Shaping: Only the vacuum head is disassembled (the quick-change fixture remains stationary, while the microsphere target moves with the vacuum head);

[0111] Surface laser shaping → Measurement: Only the vacuum head is removed (the quick-change fixture remains stationary, while the microsphere target moves with the vacuum head).

[0112] The other components and connections are the same as in Specific Implementation Method 1.

[0113] Specific implementation method four: Combination Figures 1 to 8 This embodiment describes an integrated process and method for ultra-precision machining and inspection of microstructures on the surface of complex micro-components. This method addresses the limitations of current single ultra-precision cutting, energy beam micro / nano machining, and contact inspection technologies, which suffer from low manufacturing response capabilities, limited space constraints, insufficient measurement range, and inconsistent precision standards between processes. It is suitable for high-precision machining and inspection of microspherical crown-shaped microstructures on the surface of micro-spherical targets, and can also be applied to the high-precision manufacturing of complex micro-components such as microsteps, grooves, and freeform surfaces. A specific implementation example using microspherical targets is as follows:

[0114] Step 1: Adjust the negative pressure to -20kPa, and use a vacuum adsorption fixture to adsorb the 0.910mm diameter microsphere target. Then, connect it to the end of the milling C-axis motion unit 3 of the milling system through the milling laser quick-change fixture 5. Enable and return each axis of the milling system to zero. Based on the 32 microstructures to be processed, generate the coordinate set of microsphere crown points using the Fibonacci sequence, compile the CNC program, and complete the surface microsphere crown milling after trial cutting and tool setting.

[0115] Step 2: The microsphere target is disassembled along with the milling laser quick-change fixture 5 and installed onto the laser quick-change system base 26 of the laser device. The fixture position is adjusted and a straight line mark is etched on the conical surface of the vacuum suction head by the laser focusing component 16. Then, the microsphere target is disassembled along with the vacuum suction head and installed onto the measurement vacuum chamber 24 of the measurement system. The measurement system's measurement CCD camera 19 captures the etched mark and defines the measurement origin. The high-precision sensor 20 non-contactly measures the microsphere target morphology Ra: 25nm, PV: 0.36μm and records the position data.

[0116] Step 3: The microsphere target, along with the chuck, is disassembled and installed onto the laser milling quick-change fixture 5 of the laser device. The microscopic vision module 15 captures the etching marks and defines the shaping starting point. The multi-axis linkage control laser focusing component 16 uses a grating-type reciprocating scanning process to repair the surface contour of the microsphere target. The microsphere target and vacuum suction head are disassembled and installed into the measurement vacuum chamber 24 of the measurement device. According to Step 2, the surface contour of the microsphere crown after laser shaping is characterized by the measurement system (Ra: 16nm, PV: 0.28μm). The surface roughness and contour accuracy of the microsphere crown structure are significantly improved.

[0117] The other components and connections are the same as in Specific Implementation Method 1.

[0118] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An integrated process for ultra-precision machining and inspection of the surface microstructure of complex micro-components, characterized in that: The ultra-precision machining and inspection process for the surface microstructure of complex micro-components employs an ultra-precision micro-milling system, an ultraviolet nanosecond laser shaping device, and a non-contact measurement system. The ultra-precision micro-milling system includes a milling X-axis motion unit (1), a milling Y-axis motion unit (2), a milling C-axis motion unit (3), a milling quick-change system base (4), a milling CCD camera (6), a milling tool (8), a milling B-axis motion unit (9), and a milling Z-axis motion unit (10). The milling Y-axis motion unit (2) is mounted on the milling X-axis motion unit (1), the milling C-axis motion unit (3) is mounted on the milling Y-axis motion unit (2), and the milling quick-change system base (4) is located at the end of the milling C-axis motion unit (3); the milling B-axis motion unit (9) is mounted on the milling Z-axis motion unit (10), and the milling cutter (8) is located at the end of the milling B-axis motion unit (9); the milling CCD camera (6) is used to identify the surface features of the micro-spherical crown structure of the complex micro-component (7), and the milling cutter (8) is used to mill the micro-spherical crown structure of the complex micro-component (7); The ultraviolet nanosecond laser shaping device includes a laser Y-axis motion unit (11), a laser B-axis motion unit (12), a laser X-axis motion unit (13), a laser Z-axis motion unit (14), a microscopic vision module (15), a laser focusing component (16), a laser C-axis motion unit (17), and a laser quick-change system base (26). The laser B-axis motion unit (12) is mounted on the laser Y-axis motion unit (11), the laser C-axis motion unit (17) is located at the end of the laser B-axis motion unit (12), and the laser quick-change system base (26) is mounted on the laser C-axis motion unit (17); the laser X-axis motion unit (13) is mounted on the laser Z-axis motion unit (14), and the microscopic vision module (15) and the laser focusing component (16) are both mounted on the laser X-axis motion unit (13); the laser focusing component (16) is used for etching straight line marks and planarization processing of the surface of the microspherical crown structure of complex micro-components (7), and the microscopic vision module (15) is used for capturing the etched marks; The non-contact measurement system includes a C-axis motion unit (18), a CCD camera (19), a sensor (20), a B-axis motion unit (21), an X-axis motion unit (22), a Z-axis motion unit (23), a vacuum chamber (24), and a quick-change fixture (25). The X-axis motion unit (22) is mounted on the Z-axis motion unit (23), the B-axis motion unit (21) is mounted on the X-axis motion unit (22), and the sensor (20) is located at the end of the B-axis motion unit (21). The vacuum chamber (24) is connected to the C-axis motion unit (18) via a quick-change fixture (25). The CCD camera (19) is used to capture and identify the complex micro-components (7) and their surface microstructures. The sensor (20) is used to acquire the spatial pose of the complex micro-components (7) milling the micro-spherical crown surface contour and marking the surface protrusions, pits and other manufacturing defects. The integrated process for ultra-precision machining and inspection of the surface microstructures of complex micro-components includes the following steps: Step S100: Material is removed by milling. A special vacuum suction head is used to clamp the complex micro-component (7). The chuck is connected to the base (4) of the milling quick-change system via the milling laser quick-change fixture (5). The axes of the micro-milling system are adjusted to their initial state. The machining code for the spherical micro-spherical crown is compiled. The program controls the linkage of the axes to achieve the initial forming of the micro-structure by milling. The CCD camera (6) is milled to mark the outline of the feature micro-spherical crown and its spatial pose. Then the complex micro-component (7) is milled and disassembled together with the milling laser quick-change fixture (5). Step S200: Laser marking. Install the milling laser quick-change fixture (5) and the complex micro component (7) onto the laser quick-change system base (26) of the laser shaping device. Adjust the axes of the laser device so that the laser focusing component is above the vacuum suction head. Turn on the laser and etch the microsphere target pose mark on the cone surface of the vacuum suction head to provide a benchmark for subsequent quality characterization and local manufacturing defect control. Step S300: Processing quality characterization, connect the vacuum suction head to the measurement vacuum chamber (24) of the measurement system through a thread, adjust the position of the measurement system axis so that the complex micro component (7) is located on the axis of its measurement B-axis motion unit (21) and measurement C-axis motion unit (18); rotate the C-axis and capture the etched straight line mark through the measurement CCD camera (19) and set it as the measurement origin; perform non-contact measurement by high-precision sensor (20), and obtain the spatial pose of the complex micro component (7) milling the micro spherical crown surface contour and marking the surface protrusions, pits and other manufacturing defects through data processing; Step S400: Surface laser shaping. Based on the surface contour information of the complex micro-component (7) and the surface defect data such as significant protrusions and pits obtained by the measurement system, the local contour and surface morphology of the spherical crown are precisely controlled by the ultraviolet nanosecond laser processing device. The vacuum suction head is disassembled and installed on the laser device milling laser quick-change fixture (5), and the negative pressure environment of the vacuum cavity is connected. The position of the vacuum suction head is adjusted by the multi-axis motion unit, and the etching mark is captured by the microscopic vision module (15) and set as the origin of the laser shaping. Based on the coordinate transformation, the surface contour information of the complex micro-component (7) and the position coordinates of the surface defects such as significant protrusions and pits are obtained. The laser focusing component (16) controlled by the multi-axis linkage is used to precisely control the milling manufacturing defects in order to achieve the flattening processing of the surface of the micro spherical crown structure.

2. The integrated process for ultra-precision machining and inspection of the surface microstructure of complex micro-components according to claim 1, characterized in that: The material milling removal step S100 includes the following steps: Step S110: Use a vacuum adsorption fixture to adsorb and clamp complex micro components (7). The fixture is connected to the milling quick change system base (4) through a pneumatic spring chuck. Adjust the negative pressure to stably adsorb complex micro components (7). The vacuum adsorption fixture includes a vacuum chamber, a main / auxiliary air source interface and a vacuum suction head. The end of the vacuum suction head has a conical structure and is connected to the vacuum chamber through a sealing pipe thread. Step S120: Start the micro milling system, execute the enable and zero return operations of each axis, load the coordinates of the micro spherical crown uniform distribution point set and the machining sequence of the complex micro component (7) generated in the CNC system; perform trial cutting and tool setting and realize the initial milling of the micro spherical crown structure by multi-axis linkage; Step S130: Rotate the milling C-axis motion unit (3) and observe, capture and mark the outline and spatial pose of the three micro-spherical crown structures to be finally processed on the spherical surface through the milling CCD camera (6), and disassemble the processed complex micro-components (7) along with the milling laser quick-change fixture (5) from the milling system.

3. The integrated process for ultra-precision machining and inspection of the surface microstructure of complex micro-components according to claim 1, characterized in that: The laser marking step S200 includes the following steps: Step S210: Connect the main gas source port of the vacuum adsorption fixture to the negative pressure port of the laser device, and close its auxiliary gas source valve; open the pneumatic switch of the quick-change base of the laser device, and install the milling laser quick-change fixture (5) along with the complex micro component (7) in the laser quick-change system base (26); after the milling laser quick-change fixture (5) is installed in the quick-change base of the laser device, the negative pressure required for the adsorption of the complex micro component (7) is provided by the laser device; Step S220: Turn on the laser device, perform shaft initialization and laser preheating operation; the program moves each axis so that the laser focusing component is above the vacuum suction head cone surface and turns on the laser, and etches straight line marks along the vertical plane where the vacuum suction fixture axis is located; then remove the complex micro-component (7) with the etched marks and the vacuum suction head from the laser device.

4. The integrated process for ultra-precision machining and inspection of the surface microstructure of complex micro-components according to claim 1, characterized in that: The processing quality characterization step S300 includes the following steps: Step S310: Install the vacuum suction head with etched straight lines onto the measuring vacuum chamber (24) of the measuring system through the sealing pipe thread. The measuring vacuum chamber (24) is connected to the end face of the two-degree-of-freedom displacement stage (27) of the vacuum chamber and connected to the negative pressure interface of the measuring system. The two-degree-of-freedom displacement stage (27) of the vacuum chamber is connected to the end of the measuring C-axis motion unit (18). Fine-tune the two-degree-of-freedom displacement stage (27) of the vacuum chamber and observe the complex micro-component (7) through the measuring CCD camera (19) to make the center of the complex micro-component (7) coaxial with the center of rotation of the C-axis. Fix the high-precision sensor (20) onto the measuring B-axis motion unit (21) through the sensor two-degree-of-freedom displacement stage (28), adjust the position of the linear axis and observe through the measuring CCD camera (19) to make the complex micro-component (7) located on the B-axis rotation axis. Step S320: The program rotates the C-axis motion unit (18) and observes the conical area of ​​the vacuum suction head through the measuring CCD camera (19) until the etching mark is located at the high point of the positive Y-axis, which is set as the measurement origin; rotate the C-axis at low speed so that the complex micro component (7) rotates around the C-axis rotation center, and the measuring B-axis motion unit (21) rotates back and forth in the ±90° direction to drive the high-precision sensor (20) to perform non-contact ring scanning on the spherical surface of the complex micro component (7) to obtain the contour information of the surface of the complex micro component (7); after data processing and measurement error elimination, the contour information, surface roughness Ra and contour accuracy PV of the milled micro spherical crown of the complex micro component (7) are obtained, and significant protrusions, pits and other surface defects are marked and the position data is recorded.

5. The integrated process for ultra-precision machining and inspection of the surface microstructure of complex micro-components according to claim 1, characterized in that: The surface laser shaping step S400 includes the following steps: Step S410: Remove the vacuum suction head along with the complex micro-component (7) from the measurement vacuum chamber (24) of the measurement system and install it on the milling laser quick-change fixture (5) of the laser device. Connect the vacuum chamber to the negative pressure to stably adsorb the complex micro-component (7); adjust the pose of the linear axis system and rotary axis system of the laser device to move the vacuum suction head to the visible area of ​​the microscopic vision module (15); program the rotation of the laser C-axis motion unit (17), and the microscopic vision module (15) monitors the conical area of ​​the vacuum suction head; Step S420: The microscopic vision module (15) captures the etched straight line mark and adjusts it to the highest point in the Z direction. It obtains the spatial data of the surface contour of the milled complex micro-component (7) characterized by the measurement system and the location information of surface defects such as significant protrusions and pits. The coordinate transformation method is used to transform it into the processing coordinate system of the laser device. The manufacturing defect shaping CNC program is compiled, and the XZ axis linkage grating motion mode is used to control the laser focusing component (16) to trim the surface high points and micro-pits to improve the manufacturing accuracy of the micro-spherical crown surface. Step S430: After laser shaping, the complex micro-component (7) is removed from the laser device along with the vacuum suction head and installed on the measurement vacuum cavity (24) of the measurement system. Steps S310 and S320 are executed to characterize the surface quality of the micro-spherical crown of the complex micro-component (7) after laser shaping, and to obtain the surface roughness Ra and contour accuracy PV of the microstructure, so as to realize the high-precision manufacturing of the micro-spherical crown structure on the surface of the complex micro-component (7).

6. The integrated process for ultra-precision machining and inspection of the surface microstructure of complex micro-components according to claim 3, characterized in that: The laser used in step S220 is a 266nm wavelength ultraviolet nanosecond laser with a pulse repetition frequency of 1Hz~1000Hz, a pulse width better than 10ns@1kHz, an average output power ≥100W@1KHz, and a maximum power >1W. During the laser etching process, the laser power was set to 100mW, the quarter-wave plate angle was set to 45°, the scanning speed was set to 0.2mm / s, and the defocusing amount was set to -0.1μm.

7. The integrated process for ultra-precision machining and inspection of the surface microstructure of complex micro-components according to claim 3, characterized in that: The laser device used in step S220 has a laser X-axis motion unit 13 and a laser Y-axis motion unit 11 with a linear motion unit stroke range of 300mm, a positioning accuracy of 0.5μm, a bidirectional repeatability greater than 0.3μm, and a straightness of 1.5μm; the laser Z-axis motion unit 14 has a stroke range of 100mm, a positioning accuracy of 0.3μm, a bidirectional repeatability greater than 0.2μm, and a straightness of 1.5μm.

8. The integrated process for ultra-precision machining and inspection of the surface microstructure of complex micro-components according to claim 3, characterized in that: The laser device used in step S220 has a travel range of ±90° for the laser B-axis motion unit 12, a positioning accuracy of 5", a bidirectional repeatability of 3", and an axial error greater than 2μm; and a travel range of 360° for the laser C-axis motion unit 17, a positioning accuracy of 5", a bidirectional repeatability of 3", and an axial error greater than 2μm.

9. The integrated process for ultra-precision machining and inspection of the surface microstructure of complex micro-components according to claim 4, characterized in that: The measurement and detection CCD camera (19) used in steps S310 and S320 is a high-resolution camera with 26 million pixels and a field of view of 6.4mm×4.8mm; the sensor (20) has a resolution greater than 1nm, a measurement range of 2mm, a sampling frequency of 100Hz~6kHz, and a maximum offset angle of ±2°.

10. The integrated process for ultra-precision machining and inspection of the surface microstructure of complex micro-components according to claim 5, characterized in that: During the laser shaping process in step S420, the laser energy density is 0.02~0.06 J / cm². 2 The focal spot diameter is 3μm, the scanning spacing is 1μm, and the scanning speed is set to 25μm / s.

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