Circuit board and electronic device including the same

Abstract

A circuit board according to an embodiment of the disclosure can include a substrate layer on a first portion of the circuit board and a second portion of the circuit board different from the first portion, a power line on the first portion of the circuit board, a signal line on the second portion of the circuit board, a shield layer spaced apart from the power line and the signal line, and a cover layer between the substrate layer and the shield layer, wherein the cover layer includes a cover substrate layer on the first portion and the second portion of the circuit board, a conductive layer on the first portion of the circuit board corresponding to the power line and between the cover substrate layer and the shield layer, and an insulating layer on the second portion of the circuit board corresponding to the signal line and disposed between the cover substrate layer and the shield layer.

Description

Technical Field

[0001] Various embodiments of this disclosure relate to an electronic device, such as an electronic device including a circuit board. More specifically, various embodiments of this disclosure relate to an electronic device including a flexible printed circuit board (PCB). Background Technology

[0002] The continuous advancement of information and communication technologies and semiconductor technologies has accelerated the dissemination and use of various electronic devices. Specifically, recent electronic devices are being developed to perform communications while the user is carrying them.

[0003] The term "electronic device" can refer to a device that performs a specific function according to its equipped programs, such as home appliances, electronic schedulers, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop or laptop PCs, car navigation systems, etc. For example, an electronic device can output stored information as voice or images. With the increasing integration of electronic devices and the widespread adoption of high-speed, high-capacity wireless communication, electronic devices such as mobile communication terminals have recently been equipped with a variety of functions. For example, electronic devices have integrated functions including entertainment functions (such as playing video games), multimedia functions (such as playing music / videos), communication and security functions such as those for mobile banking, and calendar or e-wallet functions. These electronic devices have been miniaturized for easy carrying by users.

[0004] The electronic device includes a housing and a circuit board disposed within the housing. The electronic device includes a port insertion hole into which an external device (e.g., a USB or charging device) can be inserted. The electronic device can be connected to an external device (e.g., a charging device) to charge a battery. The electronic device may include a flexible circuit board, such as a PCB, connecting the external device to the circuit board. The flexible circuit board includes a power line VBUS and a signal line USB3+. The power line VBUS of the flexible circuit board has a DC resistance, and the signal line USB3+ requires impedance matching.

[0005] The above information may be provided as relevant technical information to aid in understanding the purposes of this disclosure. No statement or determination is made as to whether any of the foregoing content can be used as background technology in connection with this disclosure. Summary of the Invention

[0006] Technical solution A circuit board according to an embodiment of the present disclosure may include: a base layer located in a first portion and a second portion of the circuit board, the second portion being different from the first portion; power lines located in the first portion of the circuit board; signal lines located in the second portion of the circuit board; a shielding layer spaced apart from the power lines and the signal lines; and a cover layer disposed between the base layer and the shielding layer. The cover layer may include: a cover layer located in the first and second portions of the circuit board; a conductive layer located in the first portion of the circuit board corresponding to the power lines and disposed between the cover layer and the shielding layer; and an insulating layer located in the second portion of the circuit board corresponding to the signal lines and disposed between the cover layer and the shielding layer.

[0007] A circuit board according to an embodiment of the present disclosure may include: power lines located in a first portion of the circuit board; signal lines located in a second portion of the circuit board different from the first portion; and a cover layer spaced apart from the power lines and the signal lines. The cover layer may include: a conductive layer located in the first portion of the circuit board corresponding to the power lines; and an insulating layer located in the second portion of the circuit board corresponding to the signal lines.

[0008] An electronic device according to an embodiment of the present disclosure may include: a housing; and a circuit board disposed inside the housing. The circuit board may include: a base layer located in a first portion and a second portion of the circuit board, the second portion being different from the first portion; power lines located in the first portion of the circuit board; signal lines located in the second portion of the circuit board; a shielding layer spaced apart from the power lines and the signal lines; and a cover layer disposed between the base layer and the shielding layer. The cover layer may include: a cover base layer located in the first and second portions of the circuit board; a conductive layer located in the first portion of the circuit board corresponding to the power lines and disposed between the cover base layer and the shielding layer; and an insulating layer located in the second portion of the circuit board corresponding to the signal lines and disposed between the cover base layer and the shielding layer. Attached Figure Description

[0009] The foregoing and other aspects, configurations and / or advantages of embodiments of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings.

[0010] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to various embodiments; Figure 2 This is a perspective view illustrating an electronic device according to an embodiment of the present disclosure; Figure 3 This is a perspective view illustrating an electronic device according to an embodiment of the present disclosure; Figure 4 This is an exploded perspective view illustrating an electronic device according to an embodiment of the present disclosure; Figure 5a This is an exploded perspective view illustrating an electronic device according to an embodiment of the present disclosure; Figure 5b This is a partial exploded view illustrating an electronic device according to an embodiment of the present disclosure; Figure 6 A portion of an electronic device according to an embodiment of the present disclosure is shown; Figure 7 This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure; Figure 8 It is shown Figure 7 A magnified view of region M; Figure 9 This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure; Figure 10 A portion of an electronic device according to an embodiment of the present disclosure is shown; Figure 11a This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure; Figure 11b This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure; Figure 12 This is a block diagram illustrating a method for manufacturing an electronic device according to embodiments of the present disclosure; and Figure 13 This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure.

[0011] Throughout the accompanying drawings, the same reference numerals may be assigned to the same parts, components, and / or structures. Detailed Implementation

[0012] The following description, taken in conjunction with the accompanying drawings, provides an understanding of various exemplary embodiments of the present disclosure, including the claims and their equivalents. The specific embodiments disclosed in the following description require various specific details to aid understanding, but are considered as one of various embodiments. Therefore, those skilled in the art will understand that various changes and modifications can be made to the various embodiments described in this disclosure without departing from the scope and spirit of the disclosure. Furthermore, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0013] The terms and words used in the following description and claims are not limited to their literal meaning, but are intended to clearly and consistently describe embodiments of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is for descriptive purposes only and is not intended to limit the scope of the present disclosure as defined by the claims and their equivalents.

[0014] Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well. Thus, as an example, “component surface” can be interpreted as including one or more surfaces of a component.

[0015] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0016] Reference Figure 1 In network environment 100, electronic device 101 can communicate with at least one of electronic devices 102 via a first network 198 (e.g., a short-range wireless communication network), or with electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In an embodiment, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. According to an embodiment, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be integrated into a single component (e.g., display module 160).

[0017] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) coupled to electronic device 101 and may perform various data processing or calculations. According to embodiments, as at least part of the data processing or calculations, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be configured to use less power than the main processor 121, or be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0018] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0019] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0020] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0021] Input module 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by other components of electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0022] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0023] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force generated by touch.

[0024] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0025] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0026] Interface 177 may support one or more specific protocols used to enable electronic device 101 to be directly (e.g., wired) or wirelessly coupled to external electronic device (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0027] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0028] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0029] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0030] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0031] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0032] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and supporting direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). A corresponding one of these communication modules can communicate via a first network 198 (e.g., a short-range communication network, such as Bluetooth). TM The wireless communication module 192 can communicate with external electronic devices via a Wi-Fi Direct or Infrared Data Association (IrDA) network or a second network 199 (e.g., a long-range communication network, such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can use user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196 to identify and verify the electronic device 101 in the communication network (such as a first network 198 or a second network 199).

[0033] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0034] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiator formed of conductive material or conductive patterns formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, other components besides the radiator (e.g., a radio frequency integrated circuit (RFIC)) may additionally form part of antenna module 197.

[0035] According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0036] At least some of the aforementioned components can be coupled to each other and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0037] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that will run on electronic device 101 can be run on one or more of external electronic devices 102, 104, or 108. For example, if electronic device 101 is to automatically perform a function or service or should perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In an embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0038] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0039] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the particular embodiments, but rather to include various changes, equivalents, or substitutions of the corresponding embodiments. In relation to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the singular form of a noun corresponding to an item may include one or more such items. As used herein, each of phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include all possible combinations of the items listed together in the corresponding phrase. As used herein, terms such as “first” and “second” or “first” and “second” may be used simply to distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “coupled to another element (e.g., a second element),” “coupled to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0040] As used herein, the term "module" can include units implemented in hardware, software, or firmware, and is used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module can be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to an embodiment, a module can be implemented in the form of an application-specific integrated circuit (ASIC).

[0041] The various embodiments set forth herein can be implemented as software (e.g., program 140) comprising one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke at least one of the instructions stored in the storage medium and execute it with or without one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0042] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded) or distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0043] According to various embodiments, each of the above components (e.g., a module or program) may include a single entity or multiple entities. Some of the multiple entities may be located in different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0044] Figure 2 This is a front perspective view showing an electronic device according to an embodiment of the present disclosure.

[0045] Figure 3 This is a rear perspective view showing an electronic device according to an embodiment of the present disclosure.

[0046] Figure 2 and Figure 3 The embodiments can be related to Figure 1 Implementation examples or Figures 4 to 13 Examples of combinations.

[0047] Reference Figure 2 and Figure 3 According to an embodiment, electronic device 101 (e.g., Figure 1 The electronic device 101 may include a housing 210, the housing 210 including a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding the space between the first surface 210A and the second surface 210B. According to an embodiment (not shown), the housing 210 may represent a structure forming... Figure 2 First surface 210A, Figure 3The second surface 210B and side surfaces 210C are structured as follows. According to an embodiment, at least a portion of the first surface 210A may have a substantially transparent front panel 202 (e.g., a glass or polymer panel including various coatings). The second surface 210B may be formed from a substantially opaque back panel 211. The back panel 211 may be formed from, for example, laminated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these. The back panel 211 may form the second surface 210B. The side surfaces 210C may be formed from side structures (or “side frame structures”) 218 ​​coupled to the front panel 202 and the back panel 211 and comprising metal and / or polymer. In an embodiment, the back panel 211 and the side structure 218 may be integrally formed together and comprise the same material (e.g., a metal such as aluminum).

[0048] Although not shown, the front panel 202 may include a region that curves and extends seamlessly from at least a portion of its edge toward the rear panel 211. In embodiments, only one region of the area of ​​the front panel 202 (or rear panel 211) that curves and extends toward the rear panel 211 (or front panel 202) may be included in one edge of the first surface 210A. According to embodiments, the front panel 202 or the rear panel 211 may have a substantially flat plate shape. For example, the curved and extending region may not be included. When the curved and extending region is included, the thickness of the electronic device 101 at the portion including the curved and extending region may be less than the thickness of the remaining portion.

[0049] According to an embodiment, the electronic device 101 may include at least one or more of the following: a display 220, audio modules 203, 207 and 214, sensor modules 204 and 219, camera modules 205, 212 and 213, a key input device 217, a light-emitting device 206, and connector holes 208 and 209. In an embodiment, the electronic device 101 may not include at least one of the above components (e.g., key input device 217 or light-emitting device 206), or other components may be added.

[0050] Display 220 can be visually exposed through a considerable portion of the front panel 202. In an embodiment, at least a portion of display 220 can be visually exposed through the front panel 202 forming the first surface 210A or through a portion of the side surface 210C. In an embodiment, the edges of display 220 can be formed to be substantially identical in shape to the adjacent outer edges of the front panel 202. In an embodiment (not shown), the spacing between the outer edges of display 220 and the outer edges of the front panel 202 can be kept substantially uniform to give display 220 a larger visual exposure area.

[0051] In one embodiment (not shown), the screen display area of ​​the display 220 may have a recess or opening in a portion thereof, and at least one or more of the audio module 214, sensor module 204, camera module 205, and light-emitting device 206 may be aligned with the recess or opening. In another embodiment (not shown), at least one or more of the audio module 214, sensor module 204, camera module 205, fingerprint sensor (not shown), and light-emitting device 206 may be included on the rear surface of the screen display area of ​​the display 220. In another embodiment (not shown), the display 220 may be configured to be coupled to or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digital converter for detecting a magnetic field type stylus.

[0052] Audio modules 203, 207, and 214 may include a microphone hole 203 and speaker holes 207 and 214. A microphone for acquiring external sound may be disposed in the microphone hole 203. In an embodiment, multiple microphones may be disposed to detect the direction of sound. Speaker holes 207 and 214 may include an external speaker hole 207 and a telephone receiver hole 214. In an embodiment, speaker holes 207 and 214 and microphone hole 203 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be placed without speaker holes 207 and 214.

[0053] Sensor modules 204 and 219 can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of electronic device 101. For example, sensor modules 204 and 219 may include a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface 210A of housing 210, and / or a third sensor module 219 and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface 210B of housing 210. The fingerprint sensor may be disposed on the second surface 210B or side surface 210C of housing 210 and the first surface 210A (e.g., display 220). Electronic device 101 may also include at least one of, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0054] Camera modules 205, 212, and 213 may include a first camera device 205 disposed on a first surface 210A of electronic device 101, and a second camera device 212 disposed on a second surface 210B and / or a flash 213. Camera devices 205 and 212 may include one or more lenses, an image sensor, and / or an image signal processor. Flash 213 may include, for example, a light-emitting diode (LED) or a xenon lamp. In embodiments, two or more lenses (infrared (IR) cameras, wide-angle lenses, and telephoto lenses) and an image sensor may be disposed on one surface of electronic device 101. In embodiments, flash 213 may emit infrared light. Infrared light emitted by flash 213 and reflected by an object may be received by a third sensor module 219. Electronic device 101 or its processor may detect depth information about an object based on the time point at which infrared light is received from the third sensor module 219.

[0055] Key input device 217 may be disposed on side surface 210C of housing 210. In embodiments, electronic device 101 may not include all or some of the key input devices 217 described above, and the excluded key input devices 217 may be implemented on display 220 in other forms, such as soft keys. In embodiments, the key input device may include a sensor module disposed on second surface 210B of housing 210.

[0056] The light-emitting device 206 may be disposed, for example, on a first surface 210A of the housing 210. The light-emitting device 206 may provide information, for example, about the state of the electronic device 101, in the form of light. In an embodiment, the light-emitting device 206 may provide a light source that interacts with, for example, a camera module 205. The light-emitting device 206 may include, for example, a light-emitting diode (LED), an infrared (IR) LED, or a xenon lamp.

[0057] Connector holes 208 and 209 may include: a first connector hole 208 for receiving a connector (e.g., a Universal Serial Bus (USB) connector) for sending power and / or data to or receiving power and / or data from an external electronic device; and / or a second connector hole 209 (e.g., a headphone jack) for receiving a connector for sending or receiving audio signals from an external electronic device.

[0058] Figure 4 This is an exploded front perspective view showing an electronic device according to an embodiment of the present disclosure.

[0059] Figure 5 is a rear exploded perspective view illustrating an electronic device according to an embodiment of the present disclosure.

[0060] Figure 4 The embodiments shown in Figure 5 can be compared with Figures 1 to 3 Implementation examples or Figures 6 to 13 Examples of combinations.

[0061] Reference Figure 3 and Figure 4 Electronic device 101 (e.g., Figure 1 or Figure 2 The electronic device 101 may include a side structure 310, a first support member 311 (e.g., a bracket), and a front panel 320 (e.g., Figure 1 Front panel 202), display 330 (e.g., Figure 1 The display 220), at least one printed circuit board (or board assembly) 340a or 340b, battery 350, second support member 360 (e.g., rear housing), antenna, camera assembly 307, and rear plate 380 (e.g., Figure 2 (Rear panel 211). When multiple printed circuit boards 340a and 340b are included, the electronic device 101 may include at least one flexible printed circuit board 340c for electrically connecting the different printed circuit boards. For example, printed circuit boards 340a and 340b may include a first circuit board 340a disposed above the battery 350 (e.g., in the +Y axis direction) and a second circuit board 340b disposed below the battery 350 (e.g., in the -Y axis direction), and the flexible circuit board 340c can electrically connect the first circuit board 340a and the second circuit board 340b.

[0062] According to embodiments, electronic device 101 may not include at least one of the aforementioned components (e.g., the first support member 311 or the second support member 360), or other components may be added. At least one of the components of electronic device 101 may be combined with... Figure 1 or Figure 2 At least one of the components of the electronic device 101 is the same or similar, and will not be described again below.

[0063] At least a portion of the first support member 311 may be configured as a flat plate. In embodiments, the first support member 311 may be disposed within the electronic device 101 to connect to or integrate with the side structure 310. The first support member 311 may be formed of, for example, a metallic material and / or a non-metallic material (e.g., a polymer). When the first support member 311 is at least partially formed of a metallic material, the side structure 310 or a portion of the first support member 311 may serve as an antenna. The display 330 may be bonded to one surface of the first support member 311, and printed circuit boards 340a and 340b may be bonded to opposite surfaces of the first support member 311. A processor, memory, and / or interface may be mounted on the printed circuit boards 340a and 340b. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing device, an image signal processor, a sensor hub central processor, or a communication processor.

[0064] According to an embodiment, housing 301 may include a first support member 311 and a side structure 310. According to an embodiment, housing 301 can be understood as a structure for housing, protecting, or housing printed circuit boards 340a and 340b or battery 350. In an embodiment, housing 301 can be understood as including structures that a user can visually or tactilely identify from the exterior of electronic device 101, such as side structure 310, front panel 320, and / or rear panel 380. For example, housing 301 may include structures forming the outer surface of electronic device 101 (e.g., side structure 310, front panel 320, and rear panel 380). Housing 301 can be combined with... Figure 2 and Figure 3 The housing 210 described is the same. In the embodiment, "the front surface or rear surface of the housing 301" may refer to... Figure 1 First surface 210A or Figure 2 The second surface 210B. In an embodiment, the first support member 311 may be provided on the front plate 320 (e.g., Figure 2 First surface 210A) and rear plate 380 (e.g. Figure 3 Between the second surface 210B, and can be used as a structure for placing electrical / electronic components such as printed circuit boards 340a and 340b or camera assembly 307.

[0065] The memory may include, for example, volatile or non-volatile memory.

[0066] The interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) card interface, and / or an audio interface. The interface can electrically or physically connect, for example, electronic device 101 to an external electronic device, and may include a USB connector, an SD card / Multimedia Card (MMC) connector, or an audio connector.

[0067] The second support member 360 may include, for example, an upper support member 360a or a lower support member 360b. In an embodiment, the upper support member 360a may be configured together with a portion of the first support member 311 to surround printed circuit boards 340a and 340b (e.g., the first circuit board 340a). For example, the upper support member 360a of the second support member 360 may be configured to face the first support member 311, with the first circuit board 340a located between the upper support member 360a and the first support member 311. In an embodiment, the lower support member 360b of the second support member 360 may be configured to face the first support member 311, with the second circuit board 340b located between the lower support member 360b and the first support member 311. Circuit devices (e.g., processors, communication modules, or memories) implemented in the form of integrated circuit chips or various electrical / electronic components may be disposed on the printed circuit boards 340a and 340b. According to an embodiment, an electromagnetic shielding environment may be provided to the printed circuit boards 340a and 340b through the second support member 360. In an embodiment, the lower support member 360b can serve as a structure in which electrical / electronic components, such as speaker modules or interfaces (e.g., USB connectors, SD card / MMC connectors, or audio connectors), can be disposed. In an embodiment, electrical / electronic components, such as speaker modules or interfaces (e.g., USB connectors, SD card / MMC connectors, or audio connectors), can be disposed on an additional printed circuit board (not shown). For example, the lower support member 360b can be configured together with another portion of the first support member 311 to surround an additional printed circuit board (e.g., a second printed circuit board 340b). The speaker module or interface disposed on the additional printed circuit board (not shown) or the lower support member 360b can be... Figure 2 The audio module 207 or connector holes 208 and 309 are set accordingly.

[0068] Battery 350 may be a device for supplying power to at least one component of electronic device 101. Battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable accumulator, or a fuel cell. At least a portion of battery 350 may be disposed on a plane substantially the same as printed circuit boards 340a and 340b. Battery 350 may be integrally or detachably disposed within electronic device 101.

[0069] Although not shown, the antenna may include a conductor pattern formed, for example, by direct laser forming on the surface of the second support member 360. In embodiments, the antenna may include a printed circuit pattern formed on the surface of a thin film. A thin-film antenna may be disposed between the rear panel 380 and the battery 350. The antenna may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. The antenna may perform short-range communication with, for example, an external device, or may wirelessly transmit or receive power required for charging. In embodiments of the invention, another antenna structure may be formed from a portion or combination of the side structure 310 and / or the first support member 311.

[0070] According to an embodiment, camera assembly 307 may include at least one camera module. Inside electronic device 101, camera assembly 307 (or at least one camera module) may receive at least a portion of light incident through an optical aperture or camera window. In an embodiment, camera assembly 307 may be disposed on a first support member 311 adjacent to printed circuit boards 340a and 340b. In an embodiment, the camera module of camera assembly 307 may be substantially aligned with either of the camera windows and is at least partially surrounded by a second support member 360 (e.g., upper support member 360a).

[0071] According to an embodiment, electronic device 101 may include camera holes 312, 313, and 319. The plurality of camera holes 312, 313, and 319 may be arranged to be spaced apart from each other. Camera assembly 307 may receive light passing through camera holes 312, 313, and 319.

[0072] According to an embodiment, the first support member 311 may include a receiving portion 3111. A battery 350 may be disposed in the receiving portion 3111. The battery 350 may include a platform 353. The platform 353 may protrude toward the printed circuit board 340. The battery 350 may include a battery connection member 3501 connecting the platform 353 to the printed circuit board 340.

[0073] According to an embodiment, the electronic device 101 may include a port insertion hole 308. The port insertion hole 308 may be formed in a portion of the housing 301. The port insertion hole 308 may communicate with an external space of the housing 301. The electronic device 101 may be connected to an external device (e.g., a USB port, a charging cable, etc.), and the external device may be inserted into the port insertion hole 308.

[0074] According to an embodiment, the electronic device 101 may include an antenna 309. The antenna 309 may be disposed adjacent to the port insertion hole 308.

[0075] Figure 5b This shows the back cover of electronic device 101 (e.g., Figure 5a The view shows the state where the back panel (380) has been removed. (See reference...) Figure 5b Some or all of the components described may be related to the reference. Figures 1 to 5a All or some of the components described are the same. (See reference) Figure 5b Some or all of the components described may be related to the reference. Figures 6 to 13 All or some of the components described are the same.

[0076] According to an embodiment, the electronic device 101 may include a first printed circuit board 340a, a second printed circuit board 340b, and a flexible printed circuit board 340c. (See also...) Figures 1 to 5a The descriptions of printed circuit boards 340a, 340b, and 340c can be applied in the same way to the descriptions of printed circuit boards (e.g., first printed circuit board 340a, second printed circuit board 340b, and flexible printed circuit board 340c).

[0077] According to an embodiment, the first printed circuit board 340a and the second printed circuit board 340b can be disposed inside the housing 301. The first printed circuit board 340a and the second printed circuit board 340b can be spaced apart from each other. The flexible printed circuit board 340c can connect the first printed circuit board 340a and the second printed circuit board 340b.

[0078] According to an embodiment, the electronic device 101 may include a circuit board 400. The circuit board 400 may be a flexible printed circuit board. The circuit board 400 may be disposed inside the housing 301. (See also...) Figures 1 to 5a The described flexible printed circuit board 340c can be compared with the reference Figures 5b to 13 The circuit board 400 described is the same. Circuit board 400 can connect the first printed circuit board 340a to the second printed circuit board 340b.

[0079] According to an embodiment, circuit board 400 may be disposed inside housing 301. Circuit board 400 may be connected to second printed circuit board 340b. Circuit board 400 may connect first printed circuit board 340a to second printed circuit board 340b. Circuit board 400 may transmit signals related to power transmitted from an external device (e.g., a charging device) inserted through port insertion hole 308. Circuit board 400 may transmit power from an external device (e.g., a charging device) inserted through port insertion hole 308. Circuit board 400 may transmit signals transmitted from an external device (e.g., a USB) inserted through port insertion hole 308 to first printed circuit board 340a. Circuit board 400 may transmit signals transmitted from antenna 309 to first printed circuit board 340a.

[0080] According to an embodiment, electronic device 101 may include device connector 308a. Device connector 308a may face port insertion hole 308. Device connector 308a may be coupled to a second printed circuit board 340b. An external device (e.g., a charging device or USB) inserted into port insertion hole 308 may be connected to device connector 308a. Device connector 308a can connect the external device to the second printed circuit board 340b.

[0081] According to an embodiment, electronic device 101 may include a substrate connector 340d. The substrate connector 340d may be coupled to a second printed circuit board 340b. The substrate connector 340d may connect the second printed circuit board 340b to a circuit board 400. At least a portion of the circuit board 400 may be inserted into the substrate connector 340d.

[0082] Figure 6 This is a view showing a portion of circuit board 400. (See reference...) Figure 6 Some or all of the components described may be related to the reference. Figures 1 to 5b All or some of the components described are the same. (See reference) Figure 6 Some or all of the components described may be related to the reference. Figures 7 to 13 All or some of the components described are the same. Figure 6 It can be shown that it has been removed. Figure 7 A view showing the state of the shielding layer 440 and the membrane layer 450.

[0083] According to an embodiment, circuit board 400 may include power lines 410 and 420. Power lines 410 and 420 can supply power to a battery (e.g., Figures 1 to 5a Powered by a battery (350). Power lines 410 and 420 may include multiple power lines 410 and 420. Power lines 410 and 420 may include a first power line 410 and a second power line 420. The first power line 410 and the second power line 420 may be spaced apart from each other. Power lines 410 and 420 may be referred to as "first lines". Power lines 410 and 420 may be referred to as "first signal lines". Power lines 410 and 420 may be referred to as "charging lines". Power lines 410 and 420 may be referred to as "VBUS lines".

[0084] According to an embodiment, circuit board 400 may include signal lines 430. Signal lines 430 can transmit signals to a first printed circuit board (e.g., Figure 5b The first printed circuit board 340a). Signal lines 430 can be inserted into port insertion holes (e.g., Figure 5bAn external device (e.g., a USB port) in the port insertion hole 308 receives signals. A signal line 430 may be provided between the first power line 410 and the second power line 420. The signal line 430 may be referred to as a "second line." The signal line 430 may be referred to as a "second signal line." The signal line 430 may be referred to as a "USB cable." The signal line 430 may be referred to as a "communication line." The signal line 430 may be referred to as a "data line."

[0085] According to an embodiment, electronic device 101 may include connection pin 408. Connection pin 408 may be coupled to circuit board 400. Connection pin 408 may be coupled to substrate connector (e.g., Figure 5b The substrate connector 340d). Connection pin 408 can connect to a second printed circuit board (e.g., Figure 5b The second printed circuit board 340b and the circuit board 400. Signals generated from external devices (e.g., signals related to information transmitted via USB or power transmitted via a charging device) can be transmitted to the circuit board 400 via connection pin 408.

[0086] Figure 7 It shows along Figure 6 The cross-sectional view of circuit board 400 taken by reference line A-A' is shown. Figure 8 yes Figure 7 An enlarged view of region M shown in the image. (Refer to...) Figure 7 and Figure 8 Some or all of the components described may be related to the reference. Figures 1 to 6 All or some of the components described are the same. (See reference) Figure 7 and Figure 8 Some or all of the components described may be related to the reference. Figures 9 to 13 All or some of the components described are the same.

[0087] According to an embodiment, the circuit board 400 may include first portions 401 and 402. First portions 401 and 402 may be parts of the circuit board 400. First portions 401 and 402 may be portions of the circuit board 400 on which power lines 410 are disposed. First portions 401 and 402 may include multiple first portions 401 and 402. For example, first portions 401 and 402 may include first-1 portion 401 and first-2 portion 402 spaced apart from each other.

[0088] According to an embodiment, the circuit board 400 may include a second portion 403. The second portion 403 may be a part of the circuit board 400. The second portion 403 may be a portion of the circuit board 400 on which signal lines 430 are disposed. The second portion 403 may be located between the first portion 401 and the first portion 402.

[0089] According to an embodiment, the circuit board 400 may include power lines 410 and 420 and signal line 430. Power lines 410 and 420 may include a first power line 410 and a second power line 420. Power lines 410 and 420 may be disposed in first portions 401 and 402. The first power line 410 may be disposed in the first-1 portion 401. The second power line 420 may be disposed in the first-2 portion 402. The signal line 430 may be disposed in the second portion 403.

[0090] According to an embodiment, signal line 430 may include signal line 431 and ground line 432. Signal line 431 and ground line 432 may be indirectly connected to each other. Circuit board 400 may include a connecting wire (not shown) connecting signal line 431 and ground line 432. Signal line 431 and ground line 432 may be connected to each other via the connecting wire.

[0091] According to an embodiment, circuit board 400 may include a base layer 470. The base layer 470 may be located inside circuit board 400. Power lines 410 and 420 and signal line 430 may be coupled to the base layer 470. Power lines 410 and 420 may be disposed between the base layer 470 and the cover layer 460. Signal line 430 may be disposed between the base layer 470 and the cover layer 460.

[0092] According to an embodiment, circuit board 400 may include an adhesive layer 480. The adhesive layer 480 may adhere to a base layer 470. The adhesive layer 480 may surround at least a portion of power lines 410 and 420 and signal lines 430. The adhesive layer 480 may be disposed between the base layer 470 and the cover layer 460. The adhesive layer 480 may connect the base layer 470 and the cover layer 460.

[0093] According to an embodiment, the circuit board 400 may include a shielding layer 440. The shielding layer 440 can block signals from outside the circuit board 400. The shielding layer 440 can block electromagnetic interference (EMI). The shielding layer 440 may be disposed between the film layer 450 and the cover layer 460. The shielding layer 440 may be referred to as a "barrier layer." The shielding layer 440 may be referred to as a "shielding layer" or a "protective layer."

[0094] According to an embodiment, the circuit board 400 may include a film layer 450. The film layer 450 may form the surface of the circuit board 400. The film layer 450 may be coupled to a shielding layer 440. The film layer 450 may be referred to as a "surface layer." The film layer 450 may be referred to as a "protective layer." The film layer 450 may be referred to as an "outer layer."

[0095] According to an embodiment, the circuit board 400 may include a cover layer 460. The cover layer 460 may be spaced apart from the base layer 470. The cover layer 460 may be disposed between the base layer 470 and the shielding layer 440. The cover layer 460 may be disposed between the adhesive layer 480 and the shielding layer 440.

[0096] According to an embodiment, the shielding layer 440, the film layer 450, and the cover layer 460 may be symmetrically arranged with respect to the base layer 470. For example, the shielding layer 440 may include a plurality of shielding layers 440 spaced apart from each other, and the base layer 470 is located between the plurality of shielding layers 440. For example, the film layer 450 may include a plurality of film layers 450 spaced apart from each other, and the base layer 470 is located between the plurality of film layers 450. For example, the cover layer 460 may include a plurality of cover layers 460 spaced apart from each other, and the base layer 470 is located between the plurality of cover layers 460.

[0097] According to an embodiment, the cover layer 460 may include a cover base layer 461. The cover base layer 461 may be disposed between the base layer 470 and the shielding layer 440. The cover base layer 461 may be disposed between the adhesive layer 480 and the shielding layer 440. The adhesive layer 480 may be attached to the cover base layer 461. The cover base layer 461 may be correspondingly disposed with respect to all of the first portions 401 and 402 and the second portion 403 of the circuit board 400. For example, a portion of the cover base layer 461 may be located in the first portions 401 and 402, and another portion of the cover base layer 461 may be located in the second portion 403.

[0098] According to an embodiment, the cover layer 460 may include conductive layers 462 and 463. Conductive layers 462 and 463 may also contain conductive materials. Conductive layers 462 and 463 may include copper (Cu) material. Conductive layers 462 and 463 may be disposed between the base layer 470 and the shielding layer 440. Conductive layers 462 and 463 may be disposed between the base layer 461 and the shielding layer 440. Conductive layers 462 and 463 may be disposed between power lines 410 and 420 and the shielding layer 440. Conductive layers 462 and 463 may be located in the first portions 401 and 402 of the circuit board 400. Conductive layers 462 and 463 may include a first conductive layer 462 located in the first-1 portion 401 and a second conductive layer 463 located in the first-2 portion 402. The first conductive layer 462 may be disposed between the first power line 410 and the shielding layer 440. The second conductive layer 463 can be disposed between the second power line 420 and the shielding layer 440.

[0099] According to an embodiment, the cover layer 460 may include an insulating layer 464. The insulating layer 464 may include a dielectric material. The insulating layer 464 may include a non-conductive material. The insulating layer 464 may include a material having a dielectric constant. The insulating layer 464 may be disposed between the base layer 470 and the shielding layer 440. The insulating layer 464 may be disposed between the base layer 461 and the shielding layer 440. The insulating layer 464 may be disposed between the signal line 430 and the shielding layer 440. The insulating layer 464 may be located in the second portion 403 of the circuit board 400. The insulating layer 464 may be referred to as a "non-conductive layer". The insulating layer 464 may be referred to as a "dielectric layer". The insulating layer 464 may be referred to as an "insertion layer".

[0100] According to an embodiment, conductive layers 462 and 463 and insulating layer 464 may be located on the same plane. For example, conductive layers 462 and 463 and insulating layer 464 may be disposed between the base layer 461 and the shielding layer 440. Insulating layer 464 may be disposed between the first conductive layer 462 and the second conductive layer 463.

[0101] According to an embodiment, the cover layer 460 may include a first cover layer 461 and second cover layers 462, 463, and 464. The base cover layer 461 may be referred to as the "first cover layer." Each of the conductive layers 462 and 463 and the insulating layer 464 may be referred to as a "second cover layer." The second cover layers 462, 463, and 464 may include conductive layers 462 and 463 and an insulating layer 464. Conductive layers 462 and 463 may be referred to as "conductive portions." The insulating layer 464 may be referred to as an "insulating portion." Conductive portions 462 and 463 may include a first conductive portion 462 and a second conductive portion 463.

[0102] According to an embodiment, boundary surfaces P1 and P2 may be formed between the first portions 401 and 402 and the second portion 403 of the circuit board 400. For example, the first boundary surface P1 may be formed between the first portion 401 and the second portion 403. For example, the second boundary surface P2 may be formed between the first portion 402 and the second portion 403. The first boundary surface P1 and the second boundary surface P2 may be virtual planes separating portions 401, 402, and 403 of the circuit board 400. A first power line 410 may be located in a first direction relative to the first boundary surface P1, and a signal line 430 may be located in a second direction opposite to the first direction relative to the boundary surface P1. A second power line 420 may be located in the second direction relative to the second boundary surface P2, and a signal line 430 may be located in the first direction relative to the second boundary surface P2.

[0103] According to the embodiment, the width w1 of the first-1 portion 401 can be smaller than the width w3 of the second portion 403. The width w2 of the first-2 portion 402 can be smaller than the width w3 of the second portion 403.

[0104] According to an embodiment, the base layer 461 may include a first covering portion 4611 and a second covering portion 4612. The first covering portion 4611 and the second covering portion 4612 may be integral. The first covering portion 4611 may be the portion of the base layer 461 located in the first portion 401. The second covering portion 4612 may be the portion of the base layer 461 located in the second portion 403. The first covering portion 4611 and the second covering portion 4612 may be bounded by a boundary surface P1. The first covering portion 4611 may be disposed between the power line 410 and the conductive layer 462. The first covering portion 4611 may be correspondingly disposed with respect to the power line 410. The first covering portion 4611 may be correspondingly disposed with respect to the conductive layer 462. The second covering portion 4612 may be disposed between the signal line 430 and the insulating layer 464. The second covering portion 4612 may be correspondingly disposed with respect to the signal line 430. The second covering portion 4612 may be correspondingly disposed with respect to the insulating layer 464.

[0105] According to an embodiment, the shielding layer 440 may include a first shielding portion 441 and a second shielding portion 442. The first shielding portion 441 and the second shielding portion 442 may be integral. The first shielding portion 441 may be the portion of the shielding layer 440 located in the first portion 401. The second shielding portion 442 may be the portion of the shielding layer 440 located in the second portion 403. The first shielding portion 441 and the second shielding portion 442 may be bounded by a boundary surface P1. The first shielding portion 441 may be disposed between the power line 410 and the film layer 450. The first shielding portion 441 may be disposed between the conductive layer 462 and the film layer 450. The first shielding portion 441 may be correspondingly disposed with respect to the power line 410. The first shielding portion 441 may be correspondingly disposed with respect to the conductive layer 462. The second shielding portion 442 may be disposed between the signal line 430 and the film layer 450. The second shielding portion 442 may be correspondingly disposed with respect to the signal line 430. The second shielding portion 442 may be correspondingly disposed with respect to the insulating layer 464.

[0106] According to an embodiment, the film layer 450 may include a first film portion 451 and a second film portion 452. The first film portion 451 and the second film portion 452 may be integral. The first film portion 451 may be the portion of the film layer 450 located in the first portion 401. The second film portion 452 may be the portion of the film layer 450 located in the second portion 403. The first film portion 451 and the second film portion 452 may be bounded by a boundary surface P1. The first film portion 451 may be correspondingly disposed with respect to the power line 410. The first film portion 451 may be correspondingly disposed with respect to the conductive layer 462. The second film portion 452 may be correspondingly disposed with respect to the signal line 430. The second film portion 452 may be correspondingly disposed with respect to the insulating layer 464.

[0107] According to an embodiment, power line 410 may be disposed between base layer 470 and first cover portion 4611. Power line 410 may be disposed between base layer 470 and conductive layer 462. Power line 410 may be disposed between base layer 470 and first shielding portion 441. Power line 410 may be disposed between base layer 470 and first film portion 451.

[0108] According to an embodiment, signal line 430 may be disposed between base layer 470 and second cover portion 4612. Signal line 430 may be disposed between base layer 470 and insulating layer 464. Signal line 430 may be disposed between base layer 470 and second shielding portion 442. Signal line 430 may be disposed between base layer 470 and second membrane portion 452.

[0109] According to an embodiment, conductive layer 462 may be disposed between the first covering portion 4611 and the first shielding portion 441. Conductive layer 462 may be disposed between the power line 410 and the first shielding portion 441. Conductive layer 462 may be disposed between the power line 410 and the first film portion 451. Conductive layer 462 may be disposed between the first covering portion 4611 and the first film portion 451.

[0110] According to an embodiment, an insulating layer 464 may be disposed between the second covering portion 4612 and the second shielding portion 442. An insulating layer 464 may be disposed between the signal line 430 and the second shielding portion 442. An insulating layer 464 may be disposed between the signal line 430 and the second membrane portion 452. An insulating layer 464 may be disposed between the second covering portion 4612 and the second membrane portion 452.

[0111] According to an embodiment, the cover layer 460 may include a first cover layer 461 and second cover layers 462, 463, and 464. The second cover layers 462, 463, and 464 may include a boundary portion 465. The boundary portion 465 may form the boundary between the conductive layer 462 and the insulating layer 464. The boundary surface P1 may be formed to extend through the boundary portion 465.

[0112] According to an embodiment, conductive layer 462 may be disposed at a position corresponding to power line 410. Insulating layer 464 may be formed at a position corresponding to signal line 430. The first gaps h1 and h2 between power lines 410 and 420 and conductive layers 462 and 463 may be smaller than the second gap h3 between signal line 430 and shielding layer 440.

[0113] Figure 9 It is a conceptual representation Figure 7 and Figure 8 This is a view showing the relationship between the layers of circuit board 400. (Refer to...) Figure 9 Some or all of the components described may be related to the reference. Figures 1 to 8 The components described are the same. (See reference...) Figure 9 Some or all of the components described may be related to the reference. Figures 10 to 13 All or some of the components described are the same.

[0114] According to an embodiment, the circuit board 400 may include a first portion 401 and a second portion 403. (See also...) Figure 7 and Figure 8 The descriptions of the first parts 401, 402, and 403 can be applied in the same way to the descriptions of the first part 401 and the second part 403.

[0115] According to an embodiment, circuit board 400 may include a conductive via 490. The conductive via 490 may penetrate at least a portion of circuit board 400. The conductive via 490 may provide grounding to power line 410. The conductive via 490 may allow power line 410 to pass through. The conductive via 490 may be connected to adhesive layer 480. The conductive via 490 may be referred to as a "ground wire".

[0116] According to an embodiment, layers 410, 440, 450, 461, 462, 464, 470, and 480 constituting circuit board 400 may have thicknesses t1 to t15. The thicknesses t7 and t9 of power lines 410 may be less than the thickness t8 of the base layer 470. The thicknesses t4 and t12 of the base layer 461 covering layer 461 may be greater than the thicknesses t7 and t9 of power lines 410. The thicknesses t4 and t12 of the base layer 461 covering layer 461 may be greater than the thicknesses t3 and t13 of conductive layer 462. The thicknesses t4 and t12 of the base layer 461 covering layer 461 may be greater than the thicknesses t3 and t13 of insulating layer 464. The thicknesses t3 and t13 of conductive layer 462 may be substantially the same as the thicknesses t3 and t13 of insulating layer 464. The thickness t8 of base layer 470 may be in the range of 10 μm to 14 μm. The thickness t8 of base layer 470 may be 12 μm. The thicknesses t7 and t9 of the power line 410 can be in the range of 5 μm to 7 μm. The thicknesses t7 and t9 of the power line 410 can be 6 μm. The thicknesses t4 and t12 of the cover base layer 461 can be in the range of 6 μm to 9 μm. The thicknesses t4 and t12 of the cover base layer 461 can be 7.5 μm. The thicknesses t3 and t13 of the conductive layer 462 can be in the range of 4 μm to 6 μm. The thicknesses t3 and t13 of the conductive layer 462 can be 5 μm. The thicknesses t3 and t13 of the insulating layer 464 can be in the range of 4 μm to 6 μm. The thicknesses t3 and t13 of the insulating layer 464 can be 5 μm.

[0117] The circuit board 400 according to an embodiment of the present disclosure can generate the desired DC resistance of power lines 410 and 420 due to the above-described structure. The circuit board 400 according to an embodiment of the present disclosure can improve battery (e.g., ...) performance through power lines 410 and 420 due to the above-described structure. Figure 5a The charging efficiency of the battery 350. The circuit board 400 according to the embodiment of the present disclosure can generate the desired amount of heat generated in the power lines 410 and 420 due to the above structure. The circuit board 400 according to the embodiment of the present disclosure can maintain the spacing distance between the signal line 430 and the shielding layer 440 due to the above structure. The circuit board 400 according to the embodiment of the present disclosure can ensure sufficient impedance of the signal line 430 due to the above structure. In the circuit board 400 according to the embodiment of the present disclosure, the shielding effect of EMI for the power line 410 and the signal line 430 can be enhanced due to the above structure. For example, the circuit board 400 according to the embodiment of the present disclosure can also provide a second power line 420 by providing a first conductive layer 462 in the first-1 portion 401 where the first power line 410 is provided (to form a charging line structure between the first conductive layer 462 and the first power line 410). For example, the circuit board 400 according to the embodiment of the present disclosure can increase the length of all power lines 410 and 420 by providing a second power line 420 in addition to the first power line 410 (e.g., Figure 7 The sum of the first width W1 and the second width W2 (W1+W2). For example, the circuit board 400 according to an embodiment of the present disclosure can reduce the DC resistance generated in the power lines 410 and 420 by increasing the length W1+W2 of all power lines 410 and 420. Therefore, the length W1+W2 can be configured to generate the desired DC resistance in the power lines 410 and 420. As a result of the length W1+W2 and the desired DC resistance, the circuit board 400 maintains signal integrity. For example, the circuit board 400 according to an embodiment of the present disclosure can ensure a sufficient distance between the signal line 430 and the shielding layer 440 by providing an insulating layer 464 with a dielectric constant in the second portion 403 where the signal line 430 is disposed (e.g., Figure 7 (gap h3). For example, the circuit board 400 according to an embodiment of the present disclosure can provide sufficient impedance to the signal line 430 by ensuring a sufficient distance h3 between the signal line 430 and the shielding layer 440.

[0118] Figure 10 This is an enlarged view of a portion of circuit board 400. (See reference...) Figure 10 Some or all of the components described may be related to the reference. Figures 1 to 9 Some or all of the components described are the same. (See reference) Figure 10 Some or all of the components described may be related to the reference. Figures 11a to 13 All or some of the components described are the same.

[0119] According to an embodiment, the circuit board 400 may include a power line 410, a signal line 430, and a shielding layer 440. (See also...) Figures 7 to 9 The descriptions of the components described (e.g., power line 410, signal line 430, and shielding layer 440) can be applied in the same way to the descriptions of the components described above (e.g., power line 410, signal line 430, and shielding layer 440).

[0120] According to an embodiment, the circuit board 400 may include a ground portion 405. The ground portion 405 may be formed at a location corresponding to the power line 410. The ground portion 405 may include a portion of a shielding layer 440.

[0121] Figure 11a It shows along Figure 6 The cross-sectional view of circuit board 400 taken by reference line B-B' is shown. Figure 11b It shows along Figure 6 The cross-sectional view of circuit board 400 taken along reference line A-A' is shown. (Refer to...) Figure 11a and Figure 11b Some or all of the components described may be related to the reference. Figures 1 to 9 All or some of the components described are the same. (See reference) Figure 11a and Figure 11b Some or all of the components described may be related to the reference. Figure 12 and Figure 13 All or some of the components described are the same.

[0122] According to an embodiment, the circuit board 400 may include layers 410, 440, 450, 461, 462, 470, and 480 stacked on top of each other. (See also...) Figures 7 to 9 The descriptions of the layers (e.g., power line 410, shielding layer 440, film layer 450, covering base layer 461, conductive layer 462, base layer 470, and adhesive layer 480) can be applied in the same way to the descriptions of layers 410, 440, 450, 461, 462, 470, and 480.

[0123] According to an embodiment, circuit board 400 may include a ground wire 490. The ground wire 490 may pass through at least a portion of circuit board 400. The ground wire 490 may connect power line 410 to shielding layer 440. The ground wire 490 may penetrate overlay base layer 461 and adhesive layer 480.

[0124] According to an embodiment, the first part 401 may include a power supply part 401a and a grounding part 401b. The power supply part 401a and the grounding part 401b may be integrated. The grounding wire 490 may be disposed in the grounding part 401b.

[0125] According to an embodiment, the circuit board 400 may include a first portion 401 and a ground portion 405. The first portion 401 and the ground portion 405 may be bounded by a boundary surface P10. The boundary surface P10 may be a virtual plane that separates the first portion 401 from the ground portion 405.

[0126] According to an embodiment, the circuit board 400 may include conductive adhesive layers 495 and 496. At least a portion of the conductive adhesive layers 495 and 496 may be disposed between the conductive layer 462 and the shielding layer 440. The conductive adhesive layers 495 and 496 may include a first conductive adhesive layer 495 and a second conductive adhesive layer 496 respectively disposed at positions opposite to each other relative to the base layer 470.

[0127] According to an embodiment, the conductive adhesive layer 496 may include a first conductive adhesive portion 497 located in the first portion 401. The conductive adhesive layer 496 may include a second conductive adhesive portion 498 located in the ground portion 405. The first conductive adhesive portion 497 and the second conductive adhesive portion 498 may be integral. A boundary surface P10 may demarcate the first conductive adhesive portion 497 and the second conductive adhesive portion 498. The thickness t20 of the first conductive adhesive portion 497 may be less than the thickness t21 of the second conductive adhesive portion 498. The second conductive adhesive portion 498 may be disposed in the space formed by removing at least a portion of the cover layer 460.

[0128] According to an embodiment, circuit board 400 may include circuit assembly 415. Circuit assembly 415 may be located in a first portion 401. Circuit assembly 415 may be connected to power line 410. Circuit board 400 may include ground layer 416. Ground layer 416 may be connected to power line 410 and circuit assembly 415. Ground layer 416 may be coupled to base layer 470. Ground layer 416 may be disposed between conductive adhesive layer 496 and base layer 470. Power line 410, circuit assembly 415 and ground layer 416 may be located on substantially the same plane.

[0129] According to an embodiment, the conductive adhesive layer 496 can provide a grounding wire to the power line 410. A second conductive adhesive portion 498 can be disposed between the shielding layer 440 and the grounding layer 416. The second conductive adhesive portion 498 can connect the shielding layer 440 and the grounding layer 416.

[0130] Figure 12 This is a block diagram illustrating a method for manufacturing a circuit board 400 according to an embodiment of the present disclosure. (Refer to...) Figure 12 Some or all of the components described may be related to the reference. Figures 1 to 11b All or some of the components described are the same. (See reference) Figure 12 Some or all of the components described may be related to the reference. Figure 13 All or some of the components described are the same.

[0131] According to an embodiment, a method for manufacturing a circuit board 400 may include an operation P100 for forming a conductive layer. The operation P100 for forming the conductive layer may include manufacturing a circuit board 400... Figures 7 to 11b Operation of the integrated conductive plate with conductive layers 462 and 463 shown.

[0132] According to an embodiment, a method for manufacturing circuit board 400 may include an operation P200 of adjusting the thickness of a cover layer. The operation P200 of adjusting the thickness of the cover layer may include an operation of adjusting the thickness of a conductive plate. The conductive plate may be processed to the thickness required for impedance matching of signal lines 430. The conductive plate may be processed by an etching method.

[0133] According to an embodiment, a method for manufacturing a circuit board 400 may include an operation P300 of processing a pattern of a cover layer. The operation P300 of processing the pattern of the cover layer may include an operation of removing a portion of a conductive plate. The conductive plate may be processed by an etching method. The operation P300 of processing the pattern of the cover layer may include removing and... Figure 7 and Figure 8 The operation of the corresponding portion of the signal line 430 shown in the diagram. After the removal operation, a first conductive layer 462 and a second conductive layer 463 spaced apart from each other can be formed.

[0134] According to an embodiment, a method for manufacturing a circuit board 400 may include an operation P400 for forming a dielectric layer. The operation P400 for forming the dielectric layer may include... Figure 7 and Figure 8 The operation shown is applying the insulating layer 464 to the removed portion of the conductive plate. The operation of forming the dielectric layer P400 may include applying an insulating material between the first conductive layer 462 and the second conductive layer 463.

[0135] According to an embodiment, a method for manufacturing a circuit board 400 may include an operation P500 of forming a ground wire. The operation P500 of forming the ground wire may include grounding power lines 410 and 420 and conductive layers 462 and 463. The operation P500 of forming the ground wire may include setting... Figure 11a and Figure 11b The operation of grounding wires 490, 495 and 496 shown.

[0136] Figure 13 This is a cross-sectional view showing a circuit board 500 according to an embodiment of the present disclosure. (Refer to...) Figure 13 Some or all of the components described may be related to the reference. Figures 1 to 12 Some or all of the components described are the same.

[0137] According to an embodiment, the circuit board 500 may include a base layer 570, signal lines 530, a shielding layer 540, a film layer 550, a cover base layer 561, and an adhesive layer 580. (See also...) Figures 1 to 12 The descriptions of the components (e.g., base layer 470, signal line 430, shielding layer 440, membrane layer 450, covering base layer 461, and adhesive layer 480) can be applied in the same way to the descriptions of the components described above (e.g., base layer 570, signal line 530, shielding layer 540, membrane layer 550, covering base layer 561, and adhesive layer 580).

[0138] According to an embodiment, the circuit board 500 may include a first portion 501 and a second portion 503. (See also...) Figures 1 to 12The descriptions of the first part 401 and the second part 403 can be applied in the same way to the descriptions of the first part 501 and the second part 503. A power line 510 can be located in the first part 501. A signal line 530 can be located in the second part 503. A cover base layer 561 can be positioned correspondingly to both the first part 501 and the second part 503.

[0139] According to an embodiment, the circuit board 500 may include an insulating layer 564 located in the second portion 503. (See also...) Figures 1 to 12 The description of insulating layer 464 can be applied in the same way to the description of insulating layer 564. Insulating layer 564 can be disposed between signal line 530 and shielding layer 540.

[0140] According to an embodiment, the circuit board 500 may include conductive layers 562 and 563 located in the first portion 501. (See also...) Figures 1 to 12 The descriptions of conductive layers 462 and 463 can be applied in the same way to the descriptions of conductive layers 562 and 563. Conductive layers 562 and 563 can be disposed between the power line 510 and the shielding layer 540.

[0141] Figure 13 Circuit board 500 and Figure 7 The circuit board 400 may differ in that the first conductive layer 562 and the second conductive layer 563 are integrally extended. For example, the circuit board 500 may include integrated conductive layers 562 and 563. Figure 13 The length W6 of the first part 501 of the circuit board 500 can be greater than Figure 7 The length w1 of the first-1 portion 401 or the length w2 of the first-2 portion 402 of the circuit board 400. Conductive layers 562 and 563 can be integrally elongated and can be greater than... Figure 7 The length of the first conductive layer 462 or the second conductive layer 463 shown.

[0142] According to an embodiment, the first portion 501 and the second portion 503 can be demarcated by a boundary surface P4. The first portion 501 can be divided into a first-1 portion 501a and a first-2 portion 501b with respect to a boundary surface P5 located inside the first portion 501. For ease of description, the first-1 portion 501a and the first-2 portion 501b can be arbitrarily divided, and the first-1 portion 501a and the first-2 portion 501b can form an integral first portion 501. Conductive layers 562 and 563 can be divided into a first conductive layer 562 located in the first-1 portion 501a and a second conductive layer 563 located in the first-2 portion 501b. The sum w6 of the length w4 of the first-1 portion 501a and the length w5 of the first-2 portion 501b can be substantially equal to... Figure 7The sum of the length w1 of the first-1 portion 401 and the length w2 of the first-2 portion 402 shown.

[0143] An electronic device includes a housing and a circuit board disposed within the housing. The electronic device includes a port insertion hole into which an external device (e.g., a USB or charging device) can be inserted. The electronic device can be connected to an external device (e.g., a charging device) to charge a battery. The electronic device may include a flexible circuit board connecting the external device to the circuit board. The flexible circuit board includes a power line VBUS and a signal line USB3+. The power line VBUS of the flexible circuit board has a DC resistance, and the signal line USB3+ requires impedance matching.

[0144] The purpose of this disclosure may be to generate the desired DC resistance of the power supply line.

[0145] The purpose of this disclosure may be to match the impedance of signal lines.

[0146] The purpose of this disclosure is not limited to those mentioned herein, but can be determined in various ways without departing from the spirit or scope of this disclosure.

[0147] Electronic devices according to various embodiments of the present disclosure can generate the desired DC resistance of a power line by providing a conductive layer at a location corresponding to the power line.

[0148] Electronic devices according to various embodiments of the present disclosure can match the impedance of signal lines by providing an insulating layer at a location corresponding to the signal line.

[0149] The effects available from this disclosure are not limited to those described above, and other effects not mentioned herein will be apparent to those skilled in the art based on the following description.

[0150] A circuit board according to an embodiment of the present disclosure (e.g., Figures 1 to 13 The 400) may include those located on a circuit board (e.g., Figures 1 to 13 The first part of (e.g., 400) Figures 1 to 13 (401 or 402) and with the first part (e.g., Figures 1 to 13 The second part (e.g., different from 401 or 402) Figures 1 to 13 The base layer in (e.g., 403) Figures 1 to 13 (470).

[0151] Circuit boards according to embodiments of this disclosure (e.g., Figures 1 to 13 The 400) may include those located on a circuit board (e.g., Figures 1 to 13 The first part of (e.g., 400) Figures 1 to 13 The power cord in (e.g., 401 or 402) Figures 1 to 13 (410 and 420).

[0152] Circuit boards according to embodiments of this disclosure (e.g., Figures 1 to 13 The 400) may include those located on a circuit board (e.g., Figures 1 to 13 The second part of (e.g., of 400) Figures 1 to 13 The signal lines in (e.g., 403) Figures 1 to 13 (430).

[0153] Circuit boards according to embodiments of this disclosure (e.g., Figures 1 to 13 The 400) may include a power cord (e.g., Figures 1 to 13 (410 and 420) and signal lines (e.g., Figures 1 to 13 Shielding layers spaced apart at 430 (e.g., Figures 1 to 13 (440).

[0154] Circuit boards according to embodiments of this disclosure (e.g., Figures 1 to 13 The 400) can include settings in the base layer (e.g., Figures 1 to 13 470) and shielding layer (e.g., Figures 1 to 13 The overlay layers between (e.g., 440) Figures 1 to 13 (460).

[0155] Coverage layer according to embodiments of this disclosure (e.g., Figures 1 to 13 The 460) may include the circuit board (e.g., Figures 1 to 13 The first part of (e.g., 400) Figures 1 to 13 (401 or 402) and the second part (e.g., Figures 1 to 13 The 403) in the coverage base layer (e.g., Figures 1 to 13 (461).

[0156] Coverage layer according to embodiments of this disclosure (e.g., Figures 1 to 13 The 460) may include a conductive layer (e.g., Figures 1 to 13 (462 or 463), the conductive layer is connected to the power line (e.g., Figures 1 to 13 The 410 or 420 are respectively set on the circuit board (e.g., Figures 1 to 13 The first part of (e.g., 400) Figures 1 to 13 In 401 or 402) and set in the overlay base layer (e.g., Figures 1 to 13 461) and shielding layer (e.g., Figures 1 to 13 Between 440).

[0157] Coverage layer according to embodiments of this disclosure (e.g., Figures 1 to 13 460) may include an insulating layer (e.g., Figures 1 to 13(464), the insulation layer is connected to the signal line (e.g., Figures 1 to 13 430) is correspondingly located on the circuit board (e.g., Figures 1 to 13 The second part of (e.g., of 400) Figures 1 to 13 In 403), and set in the overlay base layer (e.g., Figures 1 to 13 461) and shielding layer (e.g., Figures 1 to 13 Between 440).

[0158] The conductive layer according to embodiments of this disclosure (e.g., Figures 1 to 13 462 or 463) can be located on the power line (e.g., Figures 1 to 13 (410 or 420) and shielding layer (e.g., Figures 1 to 13 Between 440).

[0159] The insulating layer according to embodiments of this disclosure (e.g., Figures 1 to 13 464) can be located on the signal line (e.g., Figures 1 to 13 (410 or 420) and shielding layer (e.g., Figures 1 to 13 Between 440).

[0160] According to embodiments of the present disclosure, the power cord (e.g., Figures 1 to 13 The 410 or 420 may include a first power line (e.g., Figures 1 to 13 (410).

[0161] According to embodiments of the present disclosure, the power cord (e.g., Figures 1 to 13 (410 or 420) may include a first power supply line (e.g., Figures 1 to 13 The second power line (e.g., 410) is spaced apart. Figures 1 to 13 (420).

[0162] The conductive layer according to embodiments of this disclosure (e.g., Figures 1 to 13 (462 or 463) may include a first power line (e.g., Figures 1 to 13 The corresponding first conductive layer (e.g., 410) Figures 1 to 13 (462).

[0163] The conductive layer according to embodiments of this disclosure (e.g., Figures 1 to 13 (462 or 463) may include a second power supply line (e.g., Figures 1 to 13 The corresponding second conductive layer (e.g., 420) Figures 1 to 13 (463).

[0164] The conductive layer according to embodiments of this disclosure (e.g., Figures 1 to 13 (462 or 463) may include first conductive layers spaced apart from each other (e.g., Figures 1 to 13 462) and the second conductive layer (e.g., Figures 1 to 13 (463).

[0165] The insulating layer according to embodiments of this disclosure (e.g., Figures 1 to 13 (464) can be set in the first conductive layer (e.g., Figures 1 to 13 462) and the second conductive layer (e.g., Figures 1 to 13 Between 463).

[0166] Coverage layer according to embodiments of this disclosure (e.g., Figures 1 to 13 The 460) may include boundary portions (e.g., Figures 1 to 13 (of 465), in the boundary section (e.g., Figures 1 to 13 At position 465), the conductive layer (e.g., Figures 1 to 13 (462 or 463) and insulating layer (e.g., Figures 1 to 13 (464) connection.

[0167] The conductive layer according to embodiments of this disclosure (e.g., Figures 1 to 13 (462 or 463) and insulating layer (e.g., Figures 1 to 13 (464) can have essentially the same thickness.

[0168] Coverage base layer according to embodiments of this disclosure (e.g.) Figures 1 to 13 461) may include a conductive layer (e.g. Figures 1 to 13 The corresponding first coverage portion (e.g., 462 or 463) Figures 1 to 13 (4611).

[0169] The coverage base layer according to embodiments of this disclosure (e.g., Figures 1 to 13 461) may include an insulating layer (e.g., Figures 1 to 13 The corresponding second coverage portion (e.g., 464) Figures 1 to 13 (4612).

[0170] According to embodiments of this disclosure, a shielding layer (e.g., Figures 1 to 13 440) may include a conductive layer (e.g., Figures 1 to 13 The corresponding first shielding portion (e.g., 462 or 463) Figures 1 to 13 (441).

[0171] According to embodiments of this disclosure, a shielding layer (e.g., Figures 1 to 13 440) may include an insulating layer (e.g., Figures 1 to 13 The corresponding second shielding portion (e.g., of 464) Figures 1 to 13 442).

[0172] Circuit boards according to embodiments of this disclosure (e.g., Figures 1 to 13 The 400) may include a shielding layer (e.g., Figures 1 to 13 440) and power cord (e.g., Figures 1 to 13 The grounding wire connected to (e.g., 410 and 420) Figures 1 to 13 (490).

[0173] Circuit boards according to embodiments of this disclosure (e.g., Figures 1 to 13 The 400) may include a conductive adhesive layer (e.g., Figures 1 to 13 (496), the conductive adhesive layer is at least partially disposed in the cover layer (e.g., Figures 1 to 13 (460) and shielding layer (e.g., Figures 1 to 13 Between 440) and connected to the power cord (e.g., Figures 1 to 13 (410 or 420).

[0174] The conductive adhesive layer according to embodiments of this disclosure (e.g., Figures 1 to 13 496) may include settings in the overlay (e.g., Figures 1 to 13 (460) and shielding layer (e.g., Figures 1 to 13 The first conductive adhesive portion (e.g., 440) between the two sides. Figures 1 to 13 (497).

[0175] The conductive adhesive layer according to embodiments of this disclosure (e.g., Figures 1 to 13 496) may include from the first conductive adhesive portion (e.g., Figures 1 to 13 (497) extends and the shielding layer (e.g., Figures 1 to 13 440) and power cord (e.g., Figures 1 to 13 The second conductive adhesive portion (e.g., 410 or 420) is connected to the second conductive adhesive portion. Figures 1 to 13 (498).

[0176] The conductive layer according to embodiments of this disclosure (e.g., Figures 1 to 13 (462 or 463) can be electrically connected to the power cord (e.g., Figures 1 to 13 (410 or 420), and can be configured to supply power to the power line (e.g., Figures 1 to 13 (410 or 420) provides grounding.

[0177] According to embodiments of the present disclosure, the power cord (e.g., Figures 1 to 13 (410 or 420) and conductive layer (e.g., Figures 1 to 13 The first gap between (e.g., 462 or 463) Figures 1 to 13 h1 or h2) can be smaller than the signal line (e.g., Figures 1 to 13 430) and shielding layer (e.g., Figures 1 to 13 The second gap between (e.g., 440) Figures 1 to 13 h3).

[0178] Circuit boards according to embodiments of this disclosure (e.g., Figures 1 to 13 The 400) may include settings on the power line (e.g., Figures 1 to 13 (410 or 420) and cover layer (e.g., Figures 1 to 13 Between 460 and around the power cord (e.g., Figures 1 to 13 The adhesive layer of 410 or 420 (e.g., Figures 1 to 13 (480).

[0179] Circuit boards according to embodiments of this disclosure (e.g., Figures 1 to 13 The 400) may include those located on a circuit board (e.g., Figures 1 to 13 The first part of (e.g., 400) Figures 1 to 13 The power cord in (e.g., 401 or 402) Figures 1 to 13 (410 or 420).

[0180] Circuit boards according to embodiments of this disclosure (e.g., Figures 1 to 13 The 400) may include those located on a circuit board (e.g., Figures 1 to 13 (of 400) and the first part (e.g., Figures 1 to 13 The second part of 401 and 402 is different (e.g., Figures 1 to 13 The signal lines in (e.g., 403) Figures 1 to 13 (430).

[0181] Circuit boards according to embodiments of this disclosure (e.g., Figures 1 to 13 The 400) may include a power cord (e.g., Figures 1 to 13 (410 or 420) and signal lines (e.g., Figures 1 to 13 430) spaced-apart cover layers (e.g., Figures 1 to 13 (460).

[0182] Coverage layer according to embodiments of this disclosure (e.g., Figures 1 to 13 The 460) may include a power cord (e.g., Figures 1 to 13 The 410 or 420 are respectively located on the circuit board (e.g., Figures 1 to 13 The first part of (e.g., 400) Figures 1 to 13 The conductive layer in (e.g., 401 or 402) Figures 1 to 13 (462 or 463).

[0183] According to embodiments of this disclosure, the overlay layer (e.g., Figures 1 to 13 The 460) may include signal lines (e.g., Figures 1 to 13 The 410 or 420 are respectively located on the circuit board (e.g., Figures 1 to 13 The second part of (e.g., of 400) Figures 1 to 13 The insulating layer in (e.g., 403) Figures 1 to 13 (464).

[0184] Electronic devices according to embodiments of the present disclosure (e.g., Figures 1 to 13 101) may include a housing (e.g., Figures 1 to 13 (301).

[0185] Electronic devices according to embodiments of the present disclosure (e.g., Figures 1 to 13 101) may include a housing (e.g., Figures 1 to 13 The internal circuit board of 301 (e.g., Figures 1 to 13 (of 400).

[0186] While this disclosure has been shown and described with reference to exemplary embodiments thereof, it will be apparent to those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of this disclosure as defined by the appended claims.

[0187] While this disclosure has been described and illustrated with reference to embodiments thereof, it should be understood that the embodiments are not intended to limit the invention, but rather to be illustrative. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

Claims

1. A circuit board (400), comprising: A base layer (470) is located in a first part (401, 402) and a second part (403) of the circuit board (400), the second part (403) being different from the first part (401, 402); Power cables (410, 420) are located in the first portion (401, 402) of the circuit board (400); Signal line (430) is located in the second part (403) of the circuit board (400); A shielding layer (440) is spaced apart from the power lines (410, 420) and the signal lines (430); as well as A cover layer (460) is disposed between the base layer (470) and the shielding layer (440). The covering layer (460) includes: A base layer (461) is covered and located in the first part (401, 402) and the second part (403) of the circuit board (400); Conductive layers (462, 463), corresponding to the power lines (410, 420), are located in the first portion (401, 402) of the circuit board (400) and are disposed between the cover base layer (461) and the shielding layer (440); and An insulating layer 464 is located in the second portion 403 of the circuit board 400, corresponding to the signal line 430, and is disposed between the cover base layer 461 and the shielding layer 440.

2. The circuit board (400) as described in claim 1. in, The conductive layers (462, 463) are located between the power lines (410, 420) and the shielding layer (440).

3. The circuit board (400) as described in claim 1 or 2. in, The insulating layer (464) is located between the signal line (430) and the shielding layer (440).

4. The circuit board (400) as described in any one of claims 1 to 3. in, The power cords (410, 420) include: First power line (410); and The second power line (420) is spaced apart from the first power line (410), and The conductive layers (462, 463) include: The first conductive layer (462) corresponds to the first power line (410); and The second conductive layer (463) corresponds to the second power line (420).

5. The circuit board (400) as described in any one of claims 1 to 4. in, The conductive layers (462, 463) include a first conductive layer (462) and a second conductive layer (463) spaced apart from each other, and The insulating layer (464) is disposed between the first conductive layer (462) and the second conductive layer (463).

6. The circuit board (400) as described in any one of claims 1 to 5. in, The cover layer (460) includes a boundary portion (465), wherein the conductive layer (462, 463) and the insulating layer (464) are connected at the boundary portion (465).

7. The circuit board (400) as described in any one of claims 1 to 6. in, The conductive layer (462, 463) and the insulating layer (464) have approximately the same thickness.

8. The circuit board (400) as described in any one of claims 1 to 7. in, The underlying layer (461) includes: The first covering portion (4611) corresponds to the conductive layers (462, 463); and The second covering portion (4612) corresponds to the insulating layer (464).

9. The circuit board (400) as described in any one of claims 1 to 8. in, The shielding layer (440) includes: The first shielding portion (441) corresponds to the conductive layers (462, 463); and The second shielding portion (442) corresponds to the insulating layer (464).

10. The circuit board (400) as claimed in any one of claims 1 to 9, further comprising: A grounding wire (490) connects the shielding layer (440) to the power lines (410, 420).

11. The circuit board (400) as claimed in any one of claims 1 to 10, further comprising: A conductive adhesive layer (496) is disposed at least partially between the cover layer (460) and the shielding layer (440) and is connected to the power lines (410, 420).

12. The circuit board (400) as described in claim 11. in, The conductive adhesive layer (496) includes: A first conductive adhesive portion (497) is disposed between the cover layer (460) and the shielding layer (440); and The second conductive adhesive portion (498) extends from the first conductive adhesive portion (497) and connects the shielding layer (440) to the power lines (410, 420).

13. The circuit board (400) as described in any one of claims 1 to 12. in, The conductive layers (462, 463) are electrically connected to the power lines (410, 420) and are configured to provide grounding to the power lines (410, 420).

14. The circuit board (400) as described in any one of claims 1 to 13. in, The first gap (h1, h2) between the power lines (410, 420) and the conductive layer (462, 463) is smaller than the second gap (h3) between the signal line (430) and the shielding layer (440).

15. The circuit board (400) as claimed in any one of claims 1 to 14, further comprising: An adhesive layer (480) is disposed between the power lines (410, 420) and the cover layer (460), and surrounds the power lines (410, 420).

Images