An apparatus for improving the performance of a desktop computer processor heat dissipation component

Abstract

This invention relates to the field of absorption cooling technology, specifically to a device for improving the performance of heat dissipation components for desktop computer processors. The device includes a chassis and a motherboard installed inside the chassis. A CPU is mounted on the motherboard at a location corresponding to the processor. An absorption cooler is detachably connected inside the chassis. A commercially available heat dissipation module, corresponding to the CPU, can also be detachably mounted on the motherboard. The commercially available heat dissipation module and the absorption cooler work together to dissipate heat from the CPU. This invention conducts a portion of the processor's heat to the absorption cooler via a first 3D heat pipe and a second 3D heat pipe for pre-cooling; then, excess heat is dissipated via the commercially available heat dissipation module. This allows the processor to utilize both the absorption cooler and the commercially available heat dissipation module simultaneously, resulting in high heat dissipation efficiency and meeting the cooling requirements of high-power CPUs.

Description

Technical Field

[0001] This invention belongs to the field of absorption cooling technology, specifically relating to a device for improving the performance of heat dissipation components for desktop computer processors. Background Technology

[0002] As the computing performance of desktop computers continues to improve, the heat generated by various components is also constantly increasing.

[0003] To address this trend, while heatsink designs have continuously improved, their performance remains limited by space constraints, ambient temperature, and the physical properties of the components themselves. Especially under stringent space limitations, the volume occupied by traditional air-cooled or water-cooled systems is prone to boundary effects, resulting in insufficient heat dissipation performance from the heatsink components. Therefore, this invention proposes a device for improving the performance of heatsink components in desktop computer processors. Summary of the Invention

[0004] To address the aforementioned shortcomings in the existing technology, the present invention provides a device for improving the performance of heat dissipation components for desktop computer processors, including a chassis and a motherboard installed inside the chassis. A CPU is located on the motherboard corresponding to the processor position. An absorption cooler is detachably connected inside the chassis. A commercially available heat dissipation module corresponding to the CPU can also be detachably installed on the motherboard. The commercially available heat dissipation module and the absorption cooler work together to dissipate heat from the CPU. The absorption cooler includes a first 3D heat pipe and a second 3D heat pipe, both of which can be detachably installed on the motherboard and one end of which is attached to the CPU. The first 3D heat pipe is fixedly connected to the heat exchange plate, and the second 3D heat pipe is fixedly connected to the ammonia water storage tank. Secondly, the absorption chiller also includes a condenser tube installed on the top of the ammonia water storage tank. A heat exchange plate runs through the middle of the condenser tube. A fan is detachably installed on one side of the heat exchange plate, and the other side is detachably connected to the heat sink. Meanwhile, the contact area between the condenser tube and the heat exchange plate has a serpentine bend structure to improve heat exchange efficiency. The input end of the condenser tube is connected to the air outlet of the ammonia water storage tank, and the output end of the condenser tube is connected to the air inlet of the ammonia water storage tank. Furthermore, a connecting plate is fixedly installed at the connection end between the first 3D heat pipe and the second 3D heat pipe and the CPU, and the first 3D heat pipe and the second 3D heat pipe can be detachably installed on the motherboard through the connecting plate. Furthermore, the fan is an adjustable-speed DC cooling fan, which is electrically connected to the motherboard via wires. The motherboard is equipped with a speed control module adapted to the fan, and the fan's airflow direction is towards the heat sink. The front side wall of the chassis is equipped with a USB interface module, which is electrically connected to the USB interface slot on the motherboard via a data cable. Secondly, a power switch is also embedded in the front side wall of the chassis. The power switch is electrically connected to the power control interface on the motherboard through a wire. The outer side of the power switch is provided with an annular anti-accidental touch flange, which is integrally formed with the front side wall of the chassis. Meanwhile, the internal components of the chassis can be detachably installed, including the graphics card module, memory module, power supply module, and hard drive module.

[0005] Compared with the prior art, the present invention has the following beneficial effects: This invention conducts a portion of the processor's heat to an absorption cooler via a first 3D heat pipe and a second 3D heat pipe for pre-heat dissipation; then, excess heat is dissipated via a commercially available heat dissipation module, allowing the processor to use both an absorption cooler and a commercially available heat dissipation module for heat dissipation simultaneously, resulting in high heat dissipation efficiency and meeting the heat dissipation requirements of high-power CPUs.

[0006] 2. This invention has high energy utilization efficiency. By converting CPU waste heat into driving energy for the absorption refrigeration cycle through the second 3D heat pipe, there is no need to provide an additional heating power supply for the cooler, reducing the overall power consumption of the computer and achieving a waste heat utilization rate of over 30%. Attached Figure Description

[0007] Figure 1 This is a three-dimensional structural schematic diagram of an embodiment of a device for improving the performance of heat dissipation components for desktop computer processors according to the present invention; Figure 2 This is a three-dimensional structural diagram of an absorption cooler according to an embodiment of the present invention, which is a device for improving the performance of heat dissipation components for desktop computer processors. Figure 3 This is a side view of the absorption cooler structure of an embodiment of the device for improving the performance of heat dissipation components for desktop computer processors according to the present invention. Figure 4 This is a front view of the absorption cooler, an embodiment of the device for improving the performance of heat dissipation components for desktop computer processors according to the present invention.

[0008] The reference numerals in the accompanying drawings include: 1. Chassis; 2. Motherboard; 3. Commercially available heat dissipation module; 4. First 3D heat pipe; 5. Second 3D heat pipe; 6. Ammonia water storage tank; 7. Fan; 8. Heat exchange plate; 9. Heat sink; 10. Condenser inlet; 11. Condenser outlet; 12. Condenser; 13. Power switch; 14. USB interface module; 15. CPU; 16. Connector board. Detailed Implementation

[0009] To enable those skilled in the art to better understand the present invention, the technical solution of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0010] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual pictures. They should not be construed as limiting the invention. To better illustrate the embodiments of the invention, some parts in the drawings may be omitted, enlarged, or reduced, and do not represent the actual product dimensions. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0011] In the accompanying drawings of the embodiments of the present invention, the same or similar reference numerals correspond to the same or similar components. In the description of the present invention, it should be understood that if terms such as "upper," "lower," "left," "right," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting the present invention. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0012] In the description of this invention, unless otherwise explicitly specified and limited, the term "connection" or similar designation indicating a connection between components should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. Example

[0013] like Figure 1-4 The device shown is for improving the performance of heat dissipation components of a desktop computer processor. It includes a chassis 1 and a motherboard 2 installed inside the chassis 1. A CPU 15 is provided on the motherboard 2 at the corresponding position of the processor. The device is characterized in that an absorption cooler is detachably connected inside the chassis 1, and a commercially available heat dissipation module 3 corresponding to the CPU 15 can also be detachably installed on the motherboard 2. The commercially available heat dissipation module 3 and the absorption cooler work together to dissipate heat from the CPU 15. 1. Component installation Case and motherboard installation: Select standard ATX case 1. The motherboard 2 is ATX in size and is fixed to the bottom of case 1 with four copper pillars and bolts. The CPU socket of motherboard 2 is located in the middle of the motherboard. Install Intel i7-13700K CPU15, power 125W, and apply 0.5mm thick thermal paste to the surface of the CPU.

[0014] Installation of commercially available heatsink module: Select a commercially available heatsink module 3 from a certain brand of air cooler and fix it to the CPU bracket of the motherboard 2 with the fastener. The bottom of the heatsink should be in contact with the thermal paste on the surface of the CPU 15 to ensure heat conduction.

[0015] Absorption cooler installation: The first 3D heat pipe 4 and the second 3D heat pipe 4 are fixed by a connecting plate 16. One side of the connecting plate 16 is connected to the pre-drilled screw holes of the motherboard 2 by two M3 bolts, and the other side is welded to the 3D heat pipe. A thermally conductive silicone pad is glued to the end of the 3D heat pipe that contacts the CPU 15 to ensure tight contact. The other end of the first 3D heat pipe 4 is welded to the center of the heat exchange plate 8. A 120mm DC fan 7 (model ADDAAD0812HB-A73GL, speed 1000-2000RPM) is installed on the left side of the heat exchange plate 8 by two self-tapping screws, and an aluminum heat sink 9 is attached to the right side by thermally conductive adhesive.

[0016] The ammonia water storage tank 6 has a volume of 60mL and is filled with 28% ammonia water (the filling volume is 70% of the storage tank volume). The other end of the second 3D heat pipe 5 is welded to the bottom of the storage tank. The storage tank is fixed to the inner wall of the chassis 1 by two plastic cable ties, with a distance of not less than 15mm from the main board 2 to avoid short circuits. The serpentine bend in the middle of the condenser pipe 12 passes through the reserved hole of the heat exchange plate 8. The condenser pipe inlet 10 is sealed to the air outlet at the top of the storage tank by a nitrile rubber sealing ring. The condenser outlet 11 is similarly connected to the air inlet of the storage tank, forming a closed loop.

[0017] Other module installations: The graphics card module is plugged into the PCIe 4.0 slot of motherboard 2, the memory module is plugged into the DIMM slot of motherboard 2, the power supply module is fixed to the bottom of chassis 1, and the hard drive module is installed on the hard drive bracket of chassis 1; the USB interface module 14 is embedded in the front side wall of chassis 1 and connected to the USB 3.2 slot of motherboard 2 via a data cable; the power switch 13 is embedded on the left side of the USB interface module 14 and connected to the power control interface of motherboard 2 via a wire.

[0018] 2. Work Process Heat conduction stage: The CPU15 generates heat during operation, which is transferred to the first 3D heat pipe 4 and the second 3D heat pipe 5 through thermal grease and thermal pad; the thermal working fluid in the first 3D heat pipe 4 is vaporized by heat and quickly transfers the heat to the heat exchange plate 8; the second 3D heat pipe 5 similarly transfers the heat to the ammonia water storage tank 6.

[0019] Heat exchange and cooling cycle stage: After the heat exchange plate 8 is heated, the fan 7 starts (initially at 1000 RPM; when the CPU temperature exceeds 70℃, the speed control module of the motherboard 2 increases the speed to 2000 RPM). The fan airflow blows towards the heatsink 9, and the heat is diffused through the fins of the heatsink and discharged through the chassis ventilation holes. After receiving heat, the ammonia water tank 6 is heated to 60-70℃, producing ammonia vapor. The ammonia vapor enters the condenser pipe 12 through the condenser pipe inlet 10. The serpentine section of the condenser pipe 12 contacts the heat exchange plate 8 and is cooled to 30-35℃, where the ammonia vapor condenses into liquid ammonia. The liquid ammonia flows back to the ammonia water tank 6 through the condenser outlet 11, completing one cooling cycle and continuously reducing the temperature around the CPU. Collaborative cooling stage: The fans of the commercially available cooling module 3 operate simultaneously, conducting the remaining heat on the CPU surface to the inside of the chassis. Together with the heat discharged by the absorption cooler, it is discharged through the chassis ventilation holes, achieving dual cooling of the CPU.

[0020] The above are merely embodiments of the present invention. The circuits, electronic components, and modules involved are all prior art, fully achievable by those skilled in the art, and require no further explanation. The content protected by this application does not involve improvements to the software and methods. Commonly known structures and characteristics in the solutions are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are able to access all prior art in that field, and have the ability to apply conventional experimental methods prior to that date. Those skilled in the art can, under the guidance of this application, improve and implement this solution in combination with their own capabilities. Some typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of the present invention. These should also be considered within the scope of protection of the present invention, and will not affect the effectiveness of the implementation of the present invention or the practicality of the patent.

Claims

1. A device for improving the performance of heat dissipation components of a desktop computer processor, comprising a chassis (1) and a motherboard (2) installed inside the chassis (1), wherein a CPU (15) is provided on the motherboard (2) at a position corresponding to the processor, characterized in that, The chassis (1) is detachably connected to an absorption cooler, and the motherboard (2) is also detachably installed with a commercially available heat dissipation module (3) corresponding to the CPU (15). The commercially available heat dissipation module (3) works in conjunction with the absorption cooler to dissipate heat from the CPU (15). The absorption cooler includes a first 3D heat pipe (4) and a second 3D heat pipe (5), both of which can be detachably installed on the motherboard (2) and have one end attached to the CPU (15). The first 3D heat pipe (4) is fixedly connected to the heat exchange plate (8), and the second 3D heat pipe (5) is fixedly connected to the ammonia water storage tank (6). The absorption chiller also includes a condenser tube (12) installed on the top of the ammonia water storage tank (6). The heat exchange plate (8) runs through the middle of the condenser tube (12). A fan (7) is detachably installed on one side of the heat exchange plate (8), and the other side is detachably connected to the heat sink (9). The contact area between the condenser tube (12) and the heat exchange plate (8) is a serpentine bend structure to improve heat exchange efficiency. The input end of the condenser tube (12) is connected to the outlet of the ammonia water storage tank (6), and the output end of the condenser tube (12) is connected to the inlet of the ammonia water storage tank (6). A connecting plate (16) is fixedly installed at the connection end between the first 3D heat pipe (4) and the second 3D heat pipe (5) and the CPU (15). The first 3D heat pipe (4) and the second 3D heat pipe (5) are detachably installed on the motherboard (2) through the connecting plate (16).

2. The device for improving the performance of heat dissipation components for desktop computer processors as described in claim 1, characterized in that: The fan (7) is an adjustable DC cooling fan. The fan (7) is electrically connected to the motherboard (2) via wires. The motherboard (2) is equipped with a speed control module adapted to the fan (7), and the air outlet direction of the fan (7) is towards the heat sink (9).

3. The device for improving the performance of heat dissipation components for desktop computer processors as described in claim 2, characterized in that: A USB interface module (14) is embedded on the front side wall of the chassis (1), and the USB interface module (14) is electrically connected to the USB interface slot on the motherboard (2) via a data cable.

4. The device for improving the performance of heat dissipation components for desktop computer processors as described in claim 1, characterized in that: A power switch (13) is also embedded on the front side wall of the chassis (1). The power switch (13) is electrically connected to the power control interface on the motherboard (2) through a wire. The power switch (13) has an annular anti-accidental touch flange on its outer side. The anti-accidental touch flange is integrally formed with the front side wall of the chassis (1).

5. The device for improving the performance of heat dissipation components for desktop computer processors according to claim 4, characterized in that: The chassis (1) is internally equipped with a removable graphics card module, a memory module, a power supply module, and a hard disk module.

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