Finishing assembly and method of making same

Abstract

This invention discloses a trimming component and its manufacturing method, belonging to the field of semiconductor wafer fabrication technology. The trimming component includes a base and a grinding structure disposed on the base. The grinding structure includes: a first porous metal layer disposed on one side of the base; multiple grinding particles; the multiple grinding particles are embedded into the first porous metal layer through a first surface, with the tip of each grinding particle protruding from a second surface to form a grinding part; each drum-shaped part is covered by the first porous metal layer and mechanically held to form a support part; a solder layer is used to bond the first porous metal layer and the multiple grinding particles. A manufacturing method is also disclosed. This invention allows the drum-shaped part to be covered inside the first porous metal layer, forming a mechanical self-locking mechanism. At the same time, the metal solder directly enters from the first surface side and fully fills the deformation area caused by the insertion, achieving a deep fusion of mechanical holding and metallurgical bonding of the metal solder in the key areas of the drum-shaped part, forming a double reinforcement.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor wafer fabrication technology, and particularly relates to a trimming component and its manufacturing method. Background Technology

[0002] In semiconductor wafer fabrication, chemical mechanical polishing (CMP) is a key planarization technique used to remove material and ensure a high degree of flatness on the wafer surface.

[0003] In the CMP process, the surface condition of the polishing pad will gradually deteriorate over time. Therefore, it is necessary to periodically use a conditioning unit to condition the polishing pad in order to maintain the surface roughness and processing capability of the polishing pad.

[0004] Currently, CMP diamond dressing tools on the market typically consist of: multiple diamond abrasive particles + materials that hold the abrasive particles in place (such as metal solder, electroplating, epoxy resin) + a metal base (such as stainless steel).

[0005] Common fixing methods include: electroplating, high-temperature welding, resin or adhesive fixing.

[0006] However, the above fixing method has the following disadvantages: (1) The position of grinding particles is difficult to control Diamond abrasive grains are typically irregular particles with varying sizes and shapes, making it difficult to precisely control their fixed position during electroplating or welding processes.

[0007] (2) Grinding particles are prone to floating during the welding process. During high-temperature welding, the metal solder is in a molten or boiling state, and the diamond abrasive particles may be displaced due to buoyancy or liquid flow, making the position of the abrasive particles unstable.

[0008] (3) Insufficient fixing strength of grinding particles When the abrasive particles are not fixed and unstable, they are prone to falling off during the CMP dressing process.

[0009] (4) De-granulation causes wafer scratches The detached abrasive particles may enter the CMP polishing area and scratch the wafer surface, causing serious yield problems.

[0010] Therefore, preventing abrasive particles from falling off is one of the most critical technical requirements in the design of CMP diamond dressers.

[0011] However, existing technologies still lack a structural design that can keep the abrasive particles stable during high-temperature welding and effectively prevent them from falling off. Therefore, it is urgent to design a trimming component and its manufacturing method to solve the problems mentioned above. Summary of the Invention

[0012] The purpose of this invention is to provide a dressing component and its manufacturing method, which has the advantages of preventing abrasive grains from falling off, preventing abrasive grains from moving during the welding process, reducing the risk of abrasive grain breakage, improving the reliability of CMP process, and extending the service life of dressing components, thus solving the problems mentioned in the background art.

[0013] To achieve the above objectives, the specific technical solution of the trimming component and its manufacturing method according to the present invention is as follows: A dressing assembly includes a base and a grinding structure disposed on the base, the grinding structure comprising: A first porous metal layer is disposed on one side of the base and has opposing first and second surfaces; Multiple grinding particles, with a waist drum section; Multiple abrasive particles pierce through the first surface and embed into the first porous metal layer, so that the tip of each abrasive particle protrudes from the second surface to form an abrasive part, and each waist drum part is covered by the first porous metal layer and mechanically held to form a support part; A solder layer is disposed between the first surface side of the first porous metal layer and the base, for bonding the first porous metal layer with multiple abrasive particles.

[0014] Furthermore, the total thickness of the first porous metal layer and the height of the abrasive particles must satisfy the following formula: ; in, The total thickness of the first porous metal layer. The height of the grinding particles.

[0015] Furthermore, the height of the grinding section satisfies the following formula: ; in, The height of the grinding section, The height of the grinding particles.

[0016] Furthermore, the first surface is flush with the bottom of the abrasive particles.

[0017] Furthermore, the first surface is lower than the bottom of the abrasive particles.

[0018] Furthermore, the first porous metal layer is divided into an undeformed area and a deformed area by the waist drum section; The undeformed area is located between the waist drum and the second surface, and the first porous metal layer adheres to the surface of the abrasive particles in the undeformed area to form a mechanical hold. The deformation zone is located between the waist drum part and the first surface. The first porous metal layer is deformed by the expansion of the waist drum part in the deformation zone, so that the first porous metal layer and the abrasive particles are in a non-close contact state.

[0019] Furthermore, the solder layer is formed by metal solder. When the metal solder forming the solder layer melts, a portion of the metal solder melts into the pores of the first porous metal layer and fills the deformation area to combine the first porous metal layer with multiple abrasive particles, while the remaining unmelted metal solder forms the solder layer.

[0020] A method for manufacturing a trimming component, used to manufacture the aforementioned trimming component, includes the following steps: S1. Provides a first porous metal layer, multiple abrasive particles, a base, and metal solder; S2. Multiple abrasive particles are inserted into the first surface of the first porous metal layer, so that the tip of each abrasive particle protrudes from the opposite second surface to form an abrasive part, and the waist drum part of each abrasive particle is covered by the first porous metal layer and mechanically held. S3. Apply metal solder to the first surface of the first porous metal layer; S4. A portion of the molten metal solder penetrates into the pores of the first porous metal layer and fills the deformation zone, while the remaining unmelted metal solder forms a solder layer on the first surface.

[0021] Furthermore, S2 includes the following steps: S211. Provide a rigid support and a first flexible body, place the first flexible body on the rigid support, and place the second surface of the first porous metal layer on the first flexible body with the second surface facing down. S212. Place multiple abrasive particles on the first surface of the first porous metal layer; S213. A rigid pressure body is provided, which applies uniform pressure to the abrasive particles along the axial direction to pierce the first porous metal layer. Then, the tip of the abrasive particles continues to penetrate the first soft body until the tip of the abrasive particles protrudes relative to the second surface of the first porous metal layer to form a grinding part, and the bottom end of the abrasive particles is flush with the first surface. S214. The waist drum portion of each abrasive particle is covered by a first porous metal layer and mechanically held in place. S215, The first soft body is then removed.

[0022] Furthermore, S2 includes the following steps: S221. Provide a rigid support and a first flexible body, place the first flexible body on the rigid support, and place the second surface of the first porous metal layer on the first flexible body with the second surface facing down. S222, Place multiple abrasive particles on the first surface of the first porous metal layer; S223. A rigid pressure-applying body and a second soft body are provided. The pressure-applying surface of the rigid pressure-applying body is connected to the second soft body. The rigid pressure-applying body and the second soft body apply uniform pressure to the abrasive particles along the axial direction to pierce the first porous metal layer. Then, the tip of the abrasive particles continues to pierce the first soft body, so that the tip of the abrasive particles protrudes relative to the second surface of the first porous metal layer to form a grinding part. Under the reaction force, the bottom end of the abrasive particles pierces the second soft body until the bottom end of the abrasive particles is higher than the first surface of the first porous metal layer. S224. The waist drum part of each abrasive particle is covered by a first porous metal layer and mechanically held in place; S225, then remove the first and second soft bodies.

[0023] The present invention has the following advantages: Compared with the prior art, the present invention encapsulates the waist drum part inside the first porous metal layer, forming a mechanical self-locking mechanism. At the same time, the metal solder directly enters from the first surface side and fully fills the deformation area caused by the insertion, realizing the deep integration of mechanical holding and metallurgical bonding of the metal solder in the key area of ​​the waist drum part, forming a double strong locking mechanism. Furthermore, because the waist drum part is encapsulated and mechanically held by the first porous metal layer, the grinding particles lose the conditions for free movement during the subsequent high temperature of welding, thereby ensuring the high precision of the grinding particle position. Attached Figure Description

[0024] Figure 1 A structural diagram of a modified component based on existing technology; Figure 2 This is a schematic diagram of the structure of the grinding particles piercing the first porous metal layer in the first embodiment of S2 of the present invention; Figure 3 This is a schematic diagram of the first porous metal layer structure pierced by abrasive particles in the first embodiment S2 of the present invention; Figure 4 This is a schematic diagram of the structure of the grinding particles piercing the first porous metal layer in the second embodiment of S2 of the present invention; Figure 5 This is a schematic diagram of the first porous metal layer structure pierced by abrasive particles in the second embodiment of the present invention S2; Figure 6 This is a schematic diagram of the structure during the brazing process in the first embodiment of the present invention, S4. Figure 7 This is a schematic diagram of the structure of the trimming component formed in the first embodiment S4 of the present invention; Figure 8 This is a schematic diagram of the structure during the brazing process in the second embodiment of S4 of the present invention; Figure 9 This is a schematic diagram of the structure of the trimming component formed in the second embodiment of S4 of the present invention; Figure 10 This is a schematic diagram of the structure during the brazing process in the third embodiment of S4 of the present invention; Figure 11 This is a schematic diagram of the structure of the trimming component formed in the third embodiment of S4 of the present invention; Figure 12 This is a schematic diagram of the structure during the brazing process in the fourth embodiment of the present invention (S4); Figure 13 This is a schematic diagram of the structure of the trimming component in the fourth embodiment of the present invention (S4). The markings in the diagram are as follows: 1. Base; 2. Grinding structure; 21. Solder layer; 22. First porous metal layer; 221. First surface; 222. Second surface; 223. Undeformed area; 224. Deformed area; 23. Grinding particles; 231. Waist drum section; 232. Grinding section; 3. Rigid support; 31. Rigid pressure body; 32. First soft body; 33. Second soft body; 4. Resin adhesive layer; 5. Reinforcing structure; 51. Second porous metal layer; 52. Support; 6. Heavy pressure body. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] Those skilled in the art will understand that although some embodiments herein include certain features included in other embodiments but not others, combinations of features from different embodiments are intended to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments can be used in any combination.

[0027] The following is a reference to the appendix. Figure 1 To be continued Figure 13 This invention describes a trimming component and its manufacturing method.

[0028] Currently, the existing technology first embeds the abrasive particles 23 into the first porous metal layer 22 through the second surface 222. The part of the abrasive particles 23 that is reserved outside the second surface 222 is the abrasive part 232. The waist drum part 231 of the abrasive particles 23 expands the first porous metal layer 22 with an opening facing the second surface 222. The first surface 221 of the first porous metal layer 22 is connected to the base 1 through metal solder. During the subsequent high-temperature welding process of the abrasive particles 23, floating displacement may occur. When the metal solder melts from the first surface 221 to the second surface 222, the metal solder is difficult to melt and fill the opening deformation area 224 of the second surface 222 due to insufficient capillary force. This makes the abrasive particles 23 unstable and may fall off.

[0029] Therefore, this trimming assembly includes a base 1 and a grinding structure 2 disposed on the base 1. The grinding structure 2 includes: a first porous metal layer 22, a plurality of abrasive particles 23, and a solder layer 21. The first porous metal layer 22 is disposed on one side of the base 1 and has opposing first surfaces 221 and second surfaces 222. The plurality of abrasive particles 23 have a waist-drum portion 231. The plurality of abrasive particles 23 are pierced and embedded into the first porous metal layer 22 through the first surface 221, so that the tip of each abrasive particle 23 protrudes from the second surface 222 to form a grinding portion 232. Each waist-drum portion 231 is covered by the first porous metal layer 22 and mechanically held in place. A support portion is formed; a solder layer 21 is disposed between the first surface 221 end of the first porous metal layer 22 and the base 1, for bonding the first porous metal layer 22 with multiple abrasive particles 23. Specifically, the waist drum portion 231 of the abrasive particles 23 does not protrude from the second surface 222, ensuring that the waist drum portion 231 is completely placed within the body of the first porous metal layer 22. Thus, a continuous porous metal structure region without openings is formed between the waist drum portion 231 and the second surface 222. The porous metal in this region deforms under the extrusion of the particles and tightly wraps the surface of the abrasive particles 23 radially, forming a strong mechanical holding force on the abrasive particles 23.

[0030] Compared with the prior art, the present invention encapsulates the waist drum portion 231 within the first porous metal layer 22, forming a mechanical self-locking mechanism. Simultaneously, the metal solder directly enters from the first surface 221 side and fully fills the deformation area 224 caused by the insertion, achieving a deep fusion of mechanical holding and metallurgical bonding of the metal solder in the key area of ​​the waist drum portion 231, forming a double strong locking mechanism. Furthermore, because the waist drum portion 231 is encapsulated and mechanically held by the first porous metal layer 22, the grinding particles 23 lose the conditions for free movement during subsequent high-temperature welding, thereby ensuring the high-precision maintenance of the position of the grinding particles 23.

[0031] The abrasive particles 23 are preferably diamond. In other embodiments of the present invention, natural diamond, single crystal diamond, polycrystalline diamond, polycrystalline diamond (PCD), CVD diamond, cubic boron nitride (cBN) particles, silicon carbide particles or any combination thereof may also be selected, and the particle size is 0.05mm to 2mm, preferably 0.1mm to 1mm.

[0032] The waist drum section 231 refers to the part of the grinding particle 23 with the largest diameter or cross-sectional area in its axial direction.

[0033] Common crystal forms of diamond include hexagonal octahedrons, octahedrons, and polygons. These forms share a common geometric characteristic: their crystals exhibit a waist-shaped profile that is thick in the middle and gradually thins towards both ends. That is, the middle part of the crystal has a larger volume and a wider diameter, gradually narrowing towards both ends. This characteristic mainly stems from the growth mechanism of diamond crystals and is the result of the combined effects of crystal growth kinetics, differences in surface energy of each crystal facet, and carbon atom diffusion conditions in the growth environment.

[0034] The first porous metal layer 22 is a deformable porous metal structure with multiple pores inside and on the surface. The materials of the deformable porous metal structure include, but are not limited to: foamed nickel, foamed stainless steel, foamed titanium, porous nickel structure, porous stainless steel mesh, porous titanium, etc.

[0035] The present invention utilizes the elasticity and plasticity of the deformable porous metal structure itself to absorb and buffer some impacts, avoiding stress concentration that could cause microcracks or even breakage of the abrasive particles 23.

[0036] Specifically, the total thickness of the first porous metal layer 22 and the height of the abrasive particles 23 must satisfy the following formula: ; Where T is the total thickness of the first porous metal layer 22 and D is the height of the abrasive particles 23.

[0037] If the total thickness T of the first porous metal layer 22 is too small, i.e. <1 / 4D, then the first porous metal layer 22 is too thin and cannot effectively cover and hold the waist drum part 231; if the total thickness T of the first porous metal layer 22 is too large, i.e. >3 / 4D, then the first porous metal layer 22 is too thick, the abrasive particles 23 do not protrude sufficiently, and the metal solder may not be able to fully penetrate to the top of the first porous metal layer 22.

[0038] Furthermore, the height of the grinding section 232 satisfies the following formula: ; in, The height of the grinding section 232 The height of the grinding particles 23.

[0039] This ensures that the grinding particles 23 have sufficient protrusion height to serve as an effective grinding part 232, while also having enough portion embedded to form a stable mechanical hold, thus achieving a balance between efficient grinding and preventing them from falling off.

[0040] After multiple abrasive particles 23 are pierced by the first surface 221 and embedded into the first porous metal layer 22, the first porous metal layer 22 is divided into an undeformed area 223 and a deformed area 224 by the waist drum portion 231. The undeformed area 223 is located between the waist drum part 231 and the second surface 222. The first porous metal layer 22 adheres to the surface of the abrasive particles 23 at the undeformed area 223 to form a mechanical hold. It should be noted that the undeformed area 223 does not mean that the first porous metal layer 22 has not deformed, but rather that the first porous metal layer 22 is only compressed and has not caused pore expansion deformation. The deformation zone 224 is located between the waist drum portion 231 and the first surface 221. The first porous metal layer 22 is deformed by the expansion of the waist drum portion 231 at the deformation zone 224, so that the first porous metal layer 22 and the grinding particles 23 are in a non-close contact state. Specifically, when the deformable porous metal structure is compressed and deformed, the deformable porous metal structure will also fill the deformation zone 224. Due to the discreteness of the porous material's own structure and the limitation of its deformation ability, this filling generated by the matrix material itself is incomplete and cannot form a completely dense and gapless interface between the particles and the porous metal.

[0041] In the first embodiment regarding the relative positional relationship between the bottom end of the abrasive particle 23 and the first surface 221, the first surface 221 is flush with the bottom end of the abrasive particle 23, which facilitates subsequent processing and makes the overall thickness easy to control.

[0042] In the second embodiment regarding the relative positional relationship between the bottom end of the abrasive particle 23 and the first surface 221, the first surface 221 is lower than the bottom end of the abrasive particle 23. The bottom end of the abrasive particle 23 directly protrudes and is immersed in the subsequently formed solder layer 21, which greatly increases the contact area and bonding interface between the particle and the molten metal solder. The metal solder can not only wrap the side of the waist drum portion 231 of the particle, but also form a strong solder joint at its bottom end, realizing a three-dimensional metallurgical bond, making the weld stronger. The deformable porous metal structure is subjected to more compression and deformation. During the insertion process, it applies greater axial compression to the first porous metal layer 22, making the porous layer skeleton more tightly embedded in the particle surface, and the mechanical holding effect is stronger. At the same time, the deformation zone 224 after the hole expansion also provides a strong and tough matrix for the metal solder to penetrate.

[0043] The solder layer 21 is formed of metallic solder with a melting point between 900℃ and 1100℃. The metallic solder can be alloy metallic solder, such as nickel alloy metallic solder, silver alloy metallic solder, copper alloy metallic solder, etc.

[0044] When the metal solder forming solder layer 21 melts, a portion of the metal solder melts into the pores of the first porous metal layer 22 and fills the deformation zone 224 to bond the first porous metal layer 22 with multiple abrasive particles 23, while the remaining unmelted metal solder forms solder layer 21.

[0045] In the first embodiment of the connection between the grinding structure 2 and the base 1, the unmelted metal solder combines the first porous metal layer 22 with the base 1 when forming the solder layer 21.

[0046] In a second embodiment of the connection between the grinding structure 2 and the base 1, a resin adhesive layer 4 is provided between the solder layer 21 and the base 1, and the base 1 and the grinding structure 2 are bonded together by the resin adhesive layer 4.

[0047] The resin adhesive layer 4 includes, but is not limited to, low-temperature metal solder, polymer binder, epoxy resin, acrylic adhesive and phenolic resin, with a melting point of less than 400°C.

[0048] A reinforcing structure 5 is provided at the end of the solder layer 21 away from the first porous metal layer 22 to prevent the grinding structure 2 from warping due to stress concentration when the metal solder melts to form the solder layer 21.

[0049] In the first embodiment of the reinforcing structural member 5, the reinforcing structural member 5 is a second porous metal layer 51. The second porous metal layer 51 is located at the end of the solder layer 21 away from the first porous metal layer 22. When the metal solder melts to form the solder layer 21, a small portion of the metal solder melts into the pores of the second porous metal layer 51, a portion of the metal solder melts into the pores of the first porous metal layer 22, and the remaining unmelted metal solder forms the solder layer 21, thus combining the first porous metal layer 22 with the second porous metal layer 51.

[0050] The second porous metal layer 51 is the same as the first porous metal layer 22, both being deformable porous metal structures.

[0051] In the second embodiment of the reinforcing structural member 5, the reinforcing structural member 5 is a support body 52. ​​The support body 52 is located at the end of the solder layer 21 away from the first porous metal layer 22. When the metal solder melts to form the solder layer 21, a portion of the metal solder melts into the pores of the first porous metal layer 22, and the remaining unmelted metal solder forms the solder layer 21, thus combining the support body 52 with the first porous metal layer 22.

[0052] The support 52 can be made of metal or ceramic.

[0053] A resin adhesive layer 4 is provided between the reinforcing structural component 5 and the base 1, and the reinforcing structural component 5 and the base 1 are bonded together by the resin adhesive layer 4.

[0054] A manufacturing method for producing the above-mentioned trimming component includes the following steps: S1. Provide a first porous metal layer 22, multiple abrasive particles 23, a base 1, and metal solder; S2. Multiple abrasive particles 23 are inserted into the first surface 221 of the first porous metal layer 22, so that the tip of each abrasive particle 23 protrudes from the opposite second surface 222 to form an abrasive part 232, and the waist drum part 231 of each abrasive particle 23 is covered by the first porous metal layer 22 and mechanically held. The first embodiment of S2 specifically includes the following steps: S211. Provide a rigid support 3 and a first flexible body 32, place the first flexible body 32 on the rigid support 3, and place the second surface 222 of the first porous metal layer 22 facing down on the first flexible body 32. S212. Place multiple abrasive particles 23 on the first surface 221 of the first porous metal layer 22 according to a preset distribution; S213. A rigid pressure body 31 is provided. The rigid pressure body 31 applies uniform pressure to the abrasive particles 23 along the axial direction to pierce the first porous metal layer 22. Since the second surface 222 of the first porous metal layer 22 is a first soft body 32 that can be pierced, after the abrasive particles 23 pierce the first porous metal layer 22, their top end can continue to pierce the first soft body 32, providing the necessary space for the abrasive particles 23 to move downward as a whole, so that the top end of the abrasive particles 23 can protrude relative to the second surface 222 of the first porous metal layer 22 to form a grinding part 232, until the bottom end of the abrasive particles 23 is flush with the first surface 221. S214. The waist drum portion 231 of each abrasive particle 23 is covered by the first porous metal layer 22 and mechanically held in place. S215, then the first soft body 32 is removed.

[0055] The second embodiment of S2 specifically includes the following steps: S221. Provide a rigid support 3 and a first flexible body 32, place the first flexible body 32 on the rigid support 3, and place the second surface 222 of the first porous metal layer 22 on the first flexible body 32 with the second surface 222 facing down. S222: Place multiple abrasive particles 23 on the first surface 221 of the first porous metal layer 22 according to a preset distribution; S223. A rigid pressure-applying body 31 and a second soft body 33 are provided. The pressure-applying surface of the rigid pressure-applying body 31 is connected to the second soft body 33. The rigid pressure-applying body 31 and the second soft body 33 apply uniform pressure to the abrasive particles 23 along the axial direction to pierce the first porous metal layer 22. Then, the tip of the abrasive particles 23 continues to pierce the first soft body 32, providing the necessary space for the abrasive particles 23 to move downward as a whole, so that the tip of the abrasive particles 23 can protrude relative to the second surface 222 of the first porous metal layer 22 to form a grinding part 232. Under the reaction force, the bottom end of the abrasive particles 23 pierces the second soft body 33 connected to the top rigid pressure-applying body 31, providing additional upward displacement space for the abrasive particles 23 as a whole, until the bottom end of the abrasive particles 23 is higher than the first surface 221 of the first porous metal layer 22. S224, the waist drum portion 231 of each abrasive particle 23 is covered by the first porous metal layer 22 and mechanically held in place; S225, then the first soft body 32 and the second soft body 33 are removed.

[0056] The first flexible body 32 and the second flexible body 33 may be made of the same material, which is a deformable flexible material to control the thickness of the protrusion, such as, but not limited to, PET, PC, PMMA, etc.

[0057] Furthermore, the hardness of the deformable porous metal structure is higher than that of the first soft body 32 and the second soft body 33. The hardness of the deformable porous metal structure cannot be too low, otherwise the first porous metal layer 22 will also be trapped in the first soft body 32 during the pressure penetration of the abrasive particles 23, thus failing to achieve the expected effect. Preferably, the hardness of the deformable porous metal structure is Shore D 70-95.

[0058] S3. Apply metal solder to the first surface 221 of the first porous metal layer 22; S4. A portion of the molten metal solder penetrates into the pores of the first porous metal layer 22 and fills the deformation zone 224, while the remaining unmelted metal solder forms a solder layer 21 on the first surface 221.

[0059] The first embodiment of S4 specifically includes the following steps: S411. The base 1 is placed on the metal solder, and the first porous metal layer 22 and the metal solder pierced by the abrasive particles 23 form an assembly.

[0060] S412. Place the assembly in a high-temperature vacuum brazing furnace and perform the brazing process at a temperature of 900°C to 1100°C. S413. During the process, the metal solder melts and the molten metal solder penetrates into the pores of the first porous metal layer 22 under capillary action, and fully fills the deformation area 224 around the waist drum part 231 of the abrasive particles 23, thereby forming a metallurgical bond with the abrasive particles 23 and the porous metal. S414. At the same time, the molten metal solder that has not penetrated spreads on the first surface 221 of the first porous metal layer 22 and forms a continuous solder layer 21, which directly contacts and bonds with the base 1 in this liquid state. S415. After cooling, the solder layer 21 solidifies, bonding the first porous metal layer 22, the abrasive particles 23, and the base 1 together to form a trimming assembly.

[0061] The second embodiment of S4 specifically includes the following steps: S421, the first porous metal layer 22 pierced by the abrasive particles 23 and the metal solder form an assembly, and a heavy pressure body 6 is placed on top of the assembly, i.e. on top of the metal solder. S422. Place the assembly and the heavy-duty body 6 into a high-temperature vacuum brazing furnace and perform the brazing process at a temperature of 900°C to 1100°C. S423. During the process, the grinding structure 2 is pressed by the heavy pressure body 6 to prevent warping due to uneven stress. The metal solder melts and the molten metal solder penetrates into the pores of the first porous metal layer 22 under capillary action, and fully fills the deformation area 224 around the waist drum part 231 of the grinding particles 23, thereby forming a metallurgical bond with the grinding particles 23 and the porous metal. S424. After cooling, the grinding structure 2 is obtained; S425. Subsequently, the solder layer 21 of the grinding structure 2 is bonded and fixed to the base 1 by means of a resin binder, thereby forming a finishing assembly.

[0062] The third embodiment of S4 specifically includes the following steps: S431. Place the second porous metal layer 51 on the metal solder. The second porous metal layer 51, the first porous metal layer 22 pierced by the abrasive particles 23 and the metal solder form an assembly. Place the heavy pressure body 6 on the top of the assembly, i.e. above the second porous metal layer 51. S432. Place the assembly in a high-temperature vacuum brazing furnace and perform the brazing process at a temperature of 900°C to 1100°C. S433. During the process, the molten metal solder simultaneously penetrates upward into the second porous metal layer 51 and downward into the first porous metal layer 22. The second porous metal layer 51 plays a role in homogenizing the welding thermal stress, which can effectively suppress the warping deformation of the overall structure. The heavy pressure body 6 presses to prevent the grinding structure 2 from warping due to uneven stress. The metal solder melts, and under capillary action, the molten metal solder penetrates into the pores of the first porous metal layer 22 and the second porous metal layer 51, and combines the first porous metal layer 22 and the second porous metal layer 51. S434. After cooling, an abrasive structure 2 is formed, consisting of a second porous metal layer 51, a solder layer 21, and a first porous metal layer 22 pierced by abrasive particles 23. S435. Subsequently, the second porous metal layer 51 of the grinding structure 2 is bonded and fixed to the base 1 by a resin binder, thereby forming a finishing assembly.

[0063] The fourth embodiment of S4 specifically includes the following steps: S441. Place the support 52 on the metal solder. The support 52, the first porous metal layer 22 pierced by the abrasive particles 23 and the metal solder form an assembly. Place the heavy pressure body 6 on top of the assembly, i.e., on top of the support 52. S442. Place the assembly in a high-temperature vacuum brazing furnace and perform the brazing process at a temperature of 900°C to 1100°C. S443. In the process, the molten metal solder penetrates downward into the first porous metal layer 22. The support 52 plays a role in homogenizing the welding thermal stress, which can effectively suppress the warping deformation of the overall structure. The heavy pressure body 6 presses to prevent the grinding structure 2 from warping due to uneven stress. The metal solder melts and, under capillary action, penetrates into the pores of the first porous metal layer 22, and combines the first porous metal layer 22 with the support 52. S444 After cooling, an abrasive structure 2 is formed, consisting of a support 52, a solder layer 21, and a first porous metal layer 22 pierced by abrasive particles 23. S445. Subsequently, the support 52 of the grinding structure 2 is bonded and fixed to the base 1 by means of a resin adhesive, thereby forming a finishing assembly.

[0064] The pressure body 6 has a hard and flat pressing surface, which can be made of graphite block. It is mainly used to fix the abrasive particles 23 during the hard welding process. By pressing down by the pressure body 6, the displacement of the abrasive particles 23 in the brazing process can be suppressed, and the sintering process of the abrasive structure 2 can be made more stable. During the pressing process, the multiple abrasive particles 23 on the abrasive structure 2 can be subjected to uniform pressing, thereby making the top height of the multiple abrasive particles 23 tend to be consistent, forming a uniformly distributed abrasive part 232 of equal height.

[0065] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A dressing assembly, comprising a base and a grinding structure disposed on the base, characterized in that, The grinding structure includes: A first porous metal layer is disposed on one side of the base and has opposing first and second surfaces; Multiple grinding particles, with a waist drum section; The plurality of abrasive particles are pierced and embedded into the first porous metal layer through the first surface, so that the tip of each abrasive particle protrudes from the second surface to form an abrasive part, and each waist drum part is covered by the first porous metal layer and mechanically held to form a support part; A solder layer is disposed between the first surface side of the first porous metal layer and the base, for bonding the first porous metal layer with multiple abrasive particles.

2. The trimming assembly according to claim 1, characterized in that, The total thickness of the first porous metal layer and the height of the abrasive particles satisfy the following formula: ； in, The total thickness of the first porous metal layer is [missing information]. The height of the grinding particles.

3. The trimming component according to claim 1, characterized in that, The height of the grinding section satisfies the following formula: ； in, The height of the grinding section, The height of the grinding particles.

4. The trimming component according to any one of claims 1-3, characterized in that, The first surface is flush with the bottom of the abrasive particles.

5. The trimming component according to any one of claims 1-3, characterized in that, The first surface is lower than the bottom of the abrasive particles.

6. The trimming assembly according to claim 1, characterized in that, The first porous metal layer is divided into an undeformed area and a deformed area by the waist drum portion; The undeformed area is located between the waist drum and the second surface, and the first porous metal layer adheres to the surface of the abrasive particles in the undeformed area to form a mechanical hold. The deformation zone is located between the waist drum portion and the first surface. The first porous metal layer is deformed by the expansion of the waist drum portion at the deformation zone, so that the first porous metal layer and the abrasive particles are in a non-close contact state.

7. The trimming assembly according to claim 6, characterized in that, The solder layer is formed by metal solder. When the metal solder forming the solder layer melts, a portion of the metal solder melts into the pores of the first porous metal layer and fills the deformation area to combine the first porous metal layer with multiple abrasive particles, while the remaining unmelted metal solder forms the solder layer.

8. A method for manufacturing a trimming component, used to manufacture a trimming component as described in any one of claims 1-7, characterized in that, Includes the following steps: S1. Provides a first porous metal layer, multiple abrasive particles, a base, and metal solder; S2. Insert the plurality of abrasive particles into the first surface of the first porous metal layer, so that the tip of each abrasive particle protrudes from the opposite second surface to form an abrasive part, and make the waist drum part of each abrasive particle covered and mechanically held by the first porous metal layer. S3. Apply metal solder to the first surface of the first porous metal layer; S4. A portion of the molten metal solder penetrates into the pores of the first porous metal layer and fills the deformation zone, while the remaining unmelted metal solder forms the solder layer on the first surface.

9. The manufacturing method according to claim 8, characterized in that, S2 includes the following steps: S211. Provide a rigid support and a first flexible body, place the first flexible body on the rigid support, and place the second surface of the first porous metal layer on the first flexible body with the second surface facing down. S212. Place a plurality of the abrasive particles on the first surface of the first porous metal layer; S213. A rigid pressure body is provided, which applies uniform pressure to the abrasive particles along the axial direction to pierce the first porous metal layer. Subsequently, the tip of the abrasive particles continues to penetrate the first soft body until the tip of the abrasive particles protrudes relative to the second surface of the first porous metal layer to form an abrasive part, and the bottom end of the abrasive particles is flush with the first surface. S214. The waist drum portion of each of the abrasive particles is covered by the first porous metal layer and mechanically held in place; S215, The first soft body is then removed.

10. The manufacturing method according to claim 8, characterized in that, S2 includes the following steps: S221. Provide a rigid support and a first flexible body, place the first flexible body on the rigid support, and place the second surface of the first porous metal layer on the first flexible body with the second surface facing down. S222, Place a plurality of the abrasive particles on the first surface of the first porous metal layer; S223. A rigid pressure-applying body and a second soft body are provided. The pressure-applying surface of the rigid pressure-applying body is connected to the second soft body. The rigid pressure-applying body and the second soft body apply uniform pressure to the abrasive particles along the axial direction to pierce the first porous metal layer. Subsequently, the tip of the abrasive particles continues to pierce the first soft body, so that the tip of the abrasive particles protrudes relative to the second surface of the first porous metal layer to form a grinding part. Under the reaction force, the bottom end of the abrasive particles pierces the second soft body until the bottom end of the abrasive particles is higher than the first surface of the first porous metal layer. S224. The waist drum portion of each of the abrasive particles is covered by the first porous metal layer and mechanically held in place; S225, The first soft body and the second soft body are then removed.

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