Temperature uniformity structure and thin film deposition apparatus

Abstract

This invention discloses a temperature uniformity structure and a thin film deposition apparatus. The temperature uniformity structure includes a flow guide shroud, which is positioned between the fan's outlet side and a ceramic ring, covering the entire outlet area of ​​the fan and conforming to the outline of the outlet area. A flow guide surface with a flow-guiding angle is formed on the lower side of the shroud, and multiple unevenly distributed vent holes are formed on the shroud. After the fan starts, the airflow directly acts on the flow guide shroud; part of it flows along the flow guide surface and changes direction, while the other part passes through the vent holes and through the flow guide shroud, ultimately flowing evenly onto the surface of the ceramic ring. This invention, through the guiding flow surface and the diversion of airflow by the unevenly distributed vent holes, avoids the fan blowing directly onto the ceramic ring, allowing the airflow to be evenly diffused to all areas of the ceramic ring, reducing its surface temperature difference. This solves the problem in existing equipment where the ceramic ring is easily broken due to thermal stress caused by uneven airflow distribution and excessive temperature difference, ensuring stable operation of the ceramic ring and the equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of thin film deposition, in particular to a temperature uniform structure and a thin film deposition device. BACKGROUND

[0002] As a key thin film deposition technology in the field of semiconductor manufacturing, atomic layer deposition technology is widely used in the manufacturing process of precision products such as integrated circuits and semiconductor devices, due to its advantages of uniform film thickness, high step coverage, stable film quality, etc. The ceramic ring of the upper cover plate of the thin film deposition device is a core temperature control and structural component inside the device, which mainly cooperates with the temperature control system of the device to maintain the temperature stability inside the reaction chamber, thereby ensuring the process consistency and product yield of thin film deposition. The temperature uniformity of the ceramic ring directly determines the quality of the thin film deposition and the long-term operation stability of the device. In the existing thin film deposition device, in order to realize the temperature regulation of the ceramic ring, a fan is usually used to directly blow air to cool the surface of the ceramic ring. This cooling method is simple in structure and low in cost, so it is widely used in existing devices. However, in actual operation, this direct blowing cooling method has obvious structural defects. The air flow blown by the fan cannot be uniformly distributed, and the air flow is mainly concentrated in the area of the ceramic ring opposite to the fan, while the area of the ceramic ring far from the fan is difficult to obtain sufficient air flow, resulting in a serious temperature difference between different areas of the surface of the ceramic ring. According to actual detection, the temperature difference between the side close to the fan and the side far from the fan of the ceramic ring can reach about 30℃. The large temperature difference will cause a large thermal stress in the ceramic ring. Under the action of long-term thermal stress, the ceramic ring is prone to cracking, fragmentation and other damage. Once the ceramic ring is damaged, not only the device needs to be shut down for replacement, increasing the maintenance cost and production downtime of the device, but also the continuity of the deposition process may be affected, leading to deviation of product quality. Therefore, how to solve the technical problem of the ceramic ring in the existing thin film deposition device, which is prone to cracking due to the large temperature difference caused by uneven air distribution, has become a key problem that needs to be solved in the process of optimizing the structure of the ALD device. SUMMARY

[0003] Embodiments of the present application provide a temperature uniform structure and a thin film deposition device, which solve the technical problem of the ceramic ring in the thin film deposition device, which is prone to cracking due to the large temperature difference caused by uneven air distribution.

[0004] In order to solve the above problems, according to one aspect of the present application, an embodiment of the present application provides a temperature uniform structure, which comprises a flow guide cover, the flow guide cover is arranged between the fan and the ceramic ring, the lower side of the flow guide cover forms a flow guide surface, the flow guide surface is arranged to have a flow guide angle, a plurality of air holes are formed in the flow guide cover, the air holes are unevenly distributed on the flow guide cover, and the flow guide cover covers the entire air outlet area of the fan, and the flow guide cover and the air outlet area of the fan are matched in outline.

[0005] In some embodiments, the guide angle of the guide surface is 18°-25°, a fixed included angle is formed between the guide surface and the body mounting surface of the guide cover, and the guide surface is a smooth curved surface.

[0006] In some embodiments, the plurality of vent holes includes first vent holes and second vent holes, the first vent holes are located in the area of the guide cover opposite to the fan, the second vent holes are located in the area of the guide cover away from the fan, and the first vent holes and the second vent holes both penetrate the upper and lower plate surfaces of the guide cover, and the hole axes are both perpendicular to the plate surfaces of the guide cover.

[0007] In some embodiments, the diameter of the first vent hole is greater than the diameter of the second vent hole, and the difference between the two hole diameters is 0-1 mm.

[0008] In some embodiments, the diameter of the first vent hole is 4-5 mm, and the diameter of the second vent hole is 4 mm.

[0009] In some embodiments, the spacing between adjacent first vent holes is greater than the spacing between adjacent second vent holes, and the difference between the two spacings is 0-2 mm.

[0010] In some embodiments, the first vent holes are arranged in a sparse arrangement on the guide cover, the second vent holes are arranged in a dense arrangement on the guide cover, and the sparse arrangement area and the dense arrangement area are divided by the air outlet boundary of the fan.

[0011] In some embodiments, the spacing between adjacent first vent holes is 8-10 mm, and the spacing between adjacent second vent holes is 8 mm, which matches the diameter of the corresponding vent hole.

[0012] In some embodiments, the guide cover is a rounded streamline structure.

[0013] In some embodiments, the guide cover is located on the air outlet side of the fan, and the airflow output by the fan flows to the ceramic ring through the vent holes of the guide cover.

[0014] According to another aspect of the present application, embodiments of the present application provide a thin film deposition device, comprising a device body, a fan, a ceramic ring, and the above-mentioned temperature uniform structure, the ceramic ring is installed in the upper cover plate assembly of the device body, the guide cover of the temperature uniform structure is fixedly assembled to the upper cover plate assembly, and is arranged between the fan and the ceramic ring, for adjusting the airflow distribution of the fan blowing to the ceramic ring.

[0015] Compared with the prior art, the temperature uniform structure of the present application has the following beneficial effects: The temperature uniform structure provided by the application comprises a flow guide cover arranged between a fan and a ceramic ring, a flow guide surface is formed on the lower side of the flow guide cover, the flow guide surface is arranged to have a flow guide angle, a plurality of air holes are arranged on the flow guide cover, the air holes are unevenly distributed on the flow guide cover, and the flow guide cover covers the whole air outlet area of the fan and is matched with the contour of the air outlet area of the fan.

[0016] The technical problem that the ceramic ring is easily broken due to large temperature difference caused by uneven air distribution in the prior art thin film deposition equipment is effectively solved by the above structure: the flow guide cover covers the whole air outlet area of the fan, the direct blowing of the fan on the ceramic ring is avoided, the air flow blown by the fan is guided and shunted by the flow guide surface and the uneven distribution of the air holes, the air flow originally concentrated in the area directly opposite to the fan is uniformly diffused, the ceramic ring can obtain uniform air flow in each area, the temperature difference on the surface of the ceramic ring is reduced, and the ceramic ring is prevented from being broken due to excessive thermal stress.

[0017] The thin film deposition equipment provided by the application is designed based on the above temperature uniform structure, and the beneficial effects thereof are described in the beneficial effects of the temperature uniform structure, which will not be described here.

[0018] The above description is only a summary of the technical solutions of the application, in order to more clearly understand the technical means of the application, and the content of the description can be implemented, the following preferred embodiments of the application are described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced as follows: obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the structures shown in the drawings.

[0020] Figure 1 A structural schematic view of a temperature uniform structure provided by the embodiments of the application is shown in the figure. Figure 2 A front view of a temperature uniform structure provided by the embodiments of the application is shown in the figure. Figure 3 A front view of a temperature uniform structure provided by the embodiments of the application is shown in the figure. Figure 2 A sectional view along the direction of C-C is shown in the figure. Figure 4 A structural schematic view of a thin film deposition equipment provided by the embodiments of the application is shown in the figure. Figure 5 A ZX sectional velocity nephogram of the fan without the flow guide cover in the thin film deposition equipment is shown in the figure. Figure 6The velocity trace diagram of the ZX section in a thin film deposition equipment when the fan is not equipped with a shroud; Figure 7 This is an XY cross-sectional trace diagram of a fan in a thin film deposition apparatus without a shroud. Figure 8 For thin film deposition equipment, the velocity contour plot of the ZX section when a uniform aperture shroud is added to the fan; Figure 9 For thin film deposition equipment, velocity trace diagram of ZX section when a uniform aperture shroud is added to the fan; Figure 10 XY cross-sectional trace diagram of a fan with a uniform aperture shroud added to a thin film deposition equipment; Figure 11 The velocity cloud diagram of the ZX section when a non-uniform aperture guide shroud is added to the fan in the thin film deposition equipment provided by the present invention; Figure 12 The velocity trace diagram of the ZX section in the thin film deposition apparatus provided by the present invention when a non-uniform aperture guide shroud is added to the fan; Figure 13 XY cross-sectional trace diagram of the fan when a non-uniform aperture guide shroud is added to the thin film deposition apparatus provided by the present invention; Figure 14 The thin film deposition equipment provided by the present invention provides a schematic diagram of the sampling points when performing temperature detection on the ceramic ring. In the figure, boxes 1 to 8 are schematic diagrams of the distribution of vent holes in different areas, corresponding to test points C1 to C8. Figure 15 The graph shows the temperature test comparison curves of the ceramic rings. The horizontal axis represents the test points C1~C8, and the vertical axis represents the surface temperature of the ceramic rings. Figure label explanation: 1. Flow guide; 11. Flow guide surface; 12. Vent hole; 121. First vent hole; 122. Second vent hole; 2. Fan; 3. Ceramic ring; 4. Equipment body; 5. Top cover plate assembly. Detailed Implementation

[0021] To further illustrate the technical means and effects adopted by the present invention to achieve the intended purpose, the specific embodiments, structures, features, and effects according to the present invention will be described in detail below with reference to the accompanying drawings and preferred embodiments. In the following description, different "an embodiment" or "an embodiment" do not necessarily refer to the same embodiment. Furthermore, specific features, structures, or characteristics in one or more embodiments can be combined in any suitable form.

[0022] In the description of this invention, it should be clearly stated that the terms "first," "second," etc., in the specification, claims, and accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence; the terms "vertical," "lateral," "longitudinal," "front," "rear," "left," "right," "up," "down," "horizontal," etc., indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, and are merely for the convenience of describing this invention, and do not mean that the device or element referred to must have a specific orientation or position, and therefore should not be construed as a limitation of this invention.

[0023] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0024] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0025] Example 1 This embodiment provides a temperature uniform structure, such as Figures 1-3 As shown, it includes a flow guide shroud 1, which is disposed between the fan 2 and the ceramic ring 3. A flow guide surface 11 is formed on the lower side of the flow guide shroud 1, and the flow guide surface 11 is configured to have a flow guide angle. Multiple ventilation holes 12 are opened on the flow guide shroud 1. The ventilation holes 12 are unevenly distributed on the flow guide shroud 1, and the flow guide shroud 1 covers the entire air outlet area of ​​the fan 2. The flow guide shroud 1 is adapted to the outline of the air outlet area of ​​the fan 2.

[0026] The air deflector 1, as the core supporting component of the temperature uniformity structure, has an overall structure adapted to the outline of the air outlet area of ​​the fan 2. Its assembly position is between the fan 2 and the ceramic ring 3, completely covering the entire air outlet area of ​​the fan 2, ensuring that the airflow from the fan 2 does not directly bypass the air deflector 1 and act on the surface of the ceramic ring 3. An integrally formed air guide surface 11 is formed on the lower side of the air deflector 1. This air guide surface 11 has a preset air guide angle, providing guidance for airflow. Multiple vent holes 12 are formed through the air deflector 1, serving as the main channel for airflow from the fan 2 to the ceramic ring 3. The vent holes 12 are unevenly distributed to accommodate the uneven airflow distribution in the air outlet area of ​​the fan 2, laying the foundation for uniform airflow regulation. The fan 2, as the airflow supply component, has its airflow direction facing the upper surface of the air deflector 1. The ceramic ring 3, as the temperature control object, is located below the air deflector 1, opposite the lower air guide surface 11 of the air deflector 1. The assembly position of these three components ensures that the airflow is regulated by the air deflector 1 before acting on the ceramic ring 3.

[0027] During assembly, the flow guide shroud 1 is fixedly mounted to the upper cover plate assembly of the thin film deposition equipment, ensuring that the flow guide shroud 1 is precisely positioned between the fan 2 and the ceramic ring 3, with the edge of the flow guide shroud 1 flush with the edge of the air outlet area of ​​the fan 2, thus achieving complete coverage of the air outlet area of ​​the fan 2. After the fan 2 is started, the airflow is blown out from the air outlet end of the fan 2, first acting on the upper surface of the flow guide shroud 1. Part of the airflow changes its flow direction through the guide surface 11 of the flow guide shroud 1, while the other part of the airflow passes through the vent holes 12 on the flow guide shroud 1. Since the vent holes 12 are unevenly distributed, they can perform preliminary diversion and adjustment of the airflow, avoiding excessive concentration of airflow in a single area.

[0028] This embodiment effectively solves the technical problem of ceramic rings being easily broken due to large temperature differences caused by uneven airflow distribution in existing thin film deposition equipment through the above-described structural design: the guide shroud 1 covers the entire air outlet area of ​​the fan 2, preventing the fan 2 from blowing directly on the ceramic ring 3. At the same time, the guiding effect of the guide surface 11 and the uneven distribution of the vent holes 12 are used to guide and divert the airflow blown out by the fan 2, so that the airflow originally concentrated in the area directly in front of the fan 2 can be evenly diffused, ensuring that each area of ​​the ceramic ring 3 can obtain uniform airflow, thereby reducing the temperature difference on the surface of the ceramic ring 3 and preventing the ceramic ring 3 from breaking due to excessive thermal stress.

[0029] In a specific embodiment, the guiding angle of the guiding surface 11 is 18°~25°, the guiding surface 11 forms a fixed angle with the main mounting surface of the guide cover 1, and the guiding surface 11 is a smooth curved surface.

[0030] The guide surface 11, as a key airflow guiding structure on the lower side of the guide cover 1, forms a fixed angle with the main mounting surface of the guide cover 1. This angle is the guide angle, and its value is limited to 18°~25°. This angle range allows the airflow to flow smoothly along the guide surface 11, avoiding turbulence on the surface of the guide surface 11. The guide surface 11 adopts a smooth curved surface design without any protrusions or depressions, further optimizing the airflow path, reducing airflow resistance, and ensuring that the airflow can be smoothly guided to the outer peripheral surface of the ceramic ring 3 along the guide surface 11. In the actual assembly process, the guide surface 11 and the main body of the guide cover 1 are integrally formed, ensuring the stability of the connection between the two and avoiding airflow leakage due to assembly gaps, which would affect the airflow regulation effect and thus ensure the temperature uniformity of the ceramic ring 3 surface.

[0031] In a specific embodiment, the plurality of ventilation holes 12 include a first ventilation hole 121 and a second ventilation hole 122. The first ventilation hole 121 is located in the area of ​​the guide shroud 1 facing the fan 2, and the second ventilation hole 122 is located in the area of ​​the guide shroud 1 away from the fan 2. Both the first ventilation hole 121 and the second ventilation hole 122 penetrate the upper and lower surfaces of the guide shroud 1, and the hole axes are perpendicular to the surfaces of the guide shroud 1.

[0032] Dividing the vent 12 into a first vent 121 and a second vent 122 further refines the uneven distribution of the vent 12. Both vents penetrate the upper and lower surfaces of the flow guide 1, and their axes are perpendicular to the surfaces of the flow guide 1, ensuring that airflow can pass perpendicularly through the flow guide 1 and reducing flow loss within the vents. The first vent 121 is located in the area of ​​the flow guide 1 directly opposite the fan 2, where the airflow from the fan 2 directly impacts, resulting in relatively high airflow velocity and pressure. The second vent 122 is located in the area of ​​the flow guide 1 away from the fan 2, where airflow velocity and pressure are relatively low. This partitioning allows for differentiated adjustment of airflow characteristics in different areas, resulting in more uniform airflow output across the flow guide 1. This, in turn, ensures a uniform airflow supply to the corresponding areas of the ceramic ring 3, laying a structural foundation for further optimization of airflow distribution.

[0033] In a specific embodiment, the diameter of the first vent 121 is larger than the diameter of the second vent 122, and the difference between the two vent diameters is 0~1mm.

[0034] Based on the placement of the first vent 121 and the second vent 122, their diameters are designed differently, with the diameter of the first vent 121 being larger than that of the second vent 122, and the difference in diameter controlled within the range of 0~1mm. Since the first vent 121 is located in the area of ​​the shroud 1 directly opposite the fan 2, where the airflow pressure and velocity are high, a larger diameter design increases the airflow volume in this area, preventing excessive airflow accumulation. The second vent 122 is located in the area of ​​the shroud 1 away from the fan 2, where the airflow pressure and velocity are low. A relatively smaller diameter design appropriately increases the airflow resistance in this area, allowing the airflow to diffuse evenly, thus achieving uniform airflow output across the shroud 1 and further optimizing the airflow distribution on the surface of the ceramic ring 3.

[0035] In a specific embodiment, the diameter of the first vent 121 is 4mm~5mm, and the diameter of the second vent 122 is 4mm.

[0036] This embodiment clearly defines the specific diameters of the first vent 121 and the second vent 122. The diameter of the first vent 121 ranges from 4mm to 5mm, while the diameter of the second vent 122 is fixed at 4mm. This specific size setting is adapted to the overall size of the guide shroud 1, the airflow of the fan 2, and the size of the ceramic ring 3. When the diameter of the first vent 121 is 4mm, the difference between its diameter and that of the second vent 122 is 0mm, which is suitable for scenarios where the airflow of the fan 2 is relatively small. When the diameter of the first vent 121 is 5mm, the difference between its diameter and that of the second vent 122 is 1mm, which is suitable for scenarios where the airflow of the fan 2 is relatively large. Through this selectable specific size design, this temperature uniformity structure can be adapted to thin film deposition equipment of different specifications, improving the versatility and practicality of the structure, while ensuring that the airflow can act uniformly on the surface of the ceramic ring 3.

[0037] In a specific embodiment, the distance between adjacent first vent holes 121 is greater than the distance between adjacent second vent holes 122, and the difference between the two distances is 0~2mm.

[0038] Based on the partitioned arrangement of the first vent 121 and the second vent 122, the spacing between them is differentiated, so that the spacing between adjacent first vents 121 is greater than the spacing between adjacent second vents 122, and the difference in spacing is controlled within the range of 0~2mm. This spacing design matches the placement position and airflow characteristics of the two vents. The first vent 121 is located in the area directly opposite the fan 2, where the airflow is relatively concentrated. The larger spacing can prevent the airflow in this area from becoming too dense and prevent the temperature of the corresponding area of ​​the ceramic ring 3 from becoming too low. The second vent 122 is located in the area far from the fan 2, where the airflow is relatively sparse. The smaller spacing can increase the airflow points in this area, supplement the airflow in this area, make the overall airflow output of the guide shroud 1 more uniform, further optimize the temperature distribution on the surface of the ceramic ring 3, and avoid excessive temperature difference.

[0039] In a specific embodiment, the first vent 121 is arranged in a sparse manner on the air guide shroud 1, and the second vent 122 is arranged in a dense manner on the air guide shroud 1. The sparse and dense areas are separated by the air outlet boundary of the fan 2.

[0040] The sparse arrangement of the first vent 121 and the dense arrangement of the second vent 122 further clarifies the differentiated design of their spacing. The air outlet boundary of the fan 2 serves as the dividing line between the sparse and dense areas, ensuring clear partition boundaries and facilitating manufacturing and assembly positioning. The sparse arrangement of the first vent 121 effectively disperses the concentrated airflow in the area directly opposite the fan 2, preventing the formation of localized strong airflow in that area. The dense arrangement of the second vent 122 increases the airflow channels away from the fan 2 area, enhancing the airflow supply to that area. This ensures that the airflow output from the guide shroud 1 evenly covers the entire surface of the ceramic ring 3, guaranteeing uniform cooling airflow across all areas of the ceramic ring 3, thereby reducing temperature differences and protecting the ceramic ring 3 from cracking due to thermal stress.

[0041] In a specific embodiment, the spacing between adjacent first vent holes 121 is 8mm~10mm, and the spacing between adjacent second vent holes 122 is 8mm. The spacing is matched with the diameter of the corresponding vent holes.

[0042] This embodiment clearly defines the specific spacing between the first vent 121 and the second vent 122. The spacing between adjacent first vents 121 ranges from 8mm to 10mm, while the spacing between adjacent second vents 122 is fixed at 8mm. This spacing is matched to the diameter of the corresponding vent, ensuring smooth airflow through the vents 121 while achieving uniform airflow distribution. When the spacing between adjacent first vents 121 is 8mm, the difference in spacing with the second vent 122 is 0mm, suitable for scenarios with smaller diameters of the first vents 121. When the spacing is 10mm, the difference in spacing with the second vent 122 is 2mm, suitable for scenarios with larger diameters of the first vents 121. This size-matching design further optimizes the airflow efficiency and uniformity, ensuring a more uniform surface temperature distribution on the ceramic ring 3, and improving the stability and reliability of the structure.

[0043] In a specific embodiment, the air guide shroud 1 has a rounded, streamlined structure. The rounded, streamlined design of the air guide shroud 1 eliminates sharp corners and irregular protrusions. This structural design optimizes the airflow path on the surface of the air guide shroud 1, preventing the formation of vortices at the corners of the air guide shroud 1. The generation of vortices leads to airflow turbulence, affecting the uniform distribution of airflow. The rounded, streamlined structure allows the airflow from the fan 2 to flow smoothly along the surface of the air guide shroud 1, reducing resistance and turbulence during airflow. This ensures that the airflow can be smoothly guided by the guide surface 11 and diverted by the vent holes 12, thereby achieving a uniform supply of airflow to the surface of the ceramic ring 3. This further ensures the temperature uniformity of the ceramic ring 3 surface and also improves the structural strength of the air guide shroud 1, extending its service life.

[0044] In a specific embodiment, the air guide shroud 1 is located on the air outlet side of the fan 2, and the airflow output by the fan 2 flows to the ceramic ring 3 through the air vent 12 of the air guide shroud 1.

[0045] This embodiment clearly defines the relative positional relationship between the air guide shroud 1 and the fan 2. The air guide shroud 1 is located on the air outlet side of the fan 2, ensuring that the airflow output by the fan 2 after startup can directly act on the air guide shroud 1, preventing airflow diffusion or loss before reaching it. After the airflow exits from the fan 2's outlet, part of the airflow flows along the guide surface 11 of the air guide shroud 1 and changes direction, while the other part passes through the vents 12 on the air guide shroud 1, ultimately flowing entirely to the surface of the ceramic ring 3. This defined airflow path ensures that the air guide shroud 1 fully exerts its guiding and diverting effect on the airflow, allowing the airflow to act evenly on the ceramic ring 3 after adjustment. This effectively solves the problem of excessive temperature difference in the ceramic ring 3 caused by uneven airflow distribution, ensuring the stable operation of the ceramic ring 3.

[0046] In a further preferred embodiment, a porous flow-equalizing damping layer can be provided on the upper surface of the air guide shroud 1. The damping layer has a uniform thickness and its porosity gradually changes along the fan's airflow direction, which can pre-equalize the airflow output by the fan, making the initial pressure of the airflow entering each area of ​​the air guide shroud more consistent, and further improving the overall airflow uniformity. Alternatively, a detachable flow-limiting plug can be installed in the first vent 121. The plug has a fine-tuning orifice at its center. By replacing the plug with different orifice diameters, it can adapt to the airflow characteristics of fans with different power, realize the on-site adjustment of the airflow distribution ratio, and improve the structural versatility.

[0047] When the equipment is running, fan 2 starts and outputs cooling airflow. The airflow first reaches the guide shroud 1 located between fan 2 and ceramic ring 3. Under the guidance of the guide surface 11, the airflow flows smoothly along the surface of the guide shroud 1, and the flow direction is effectively changed, thereby preventing the airflow from blowing directly vertically onto the ceramic ring 3 and eliminating the risk of sudden temperature changes caused by localized strong cooling. The guide shroud 1 adopts a rounded streamlined structure without straight surfaces, sharp corners, or other irregular contours, which can prevent the formation of vortices during the airflow process and ensure that the overall airflow is stable and orderly. The guide surface 11 is set with a guide angle of 18°~25°. This angle range can balance the windward area and the smoothness of the airflow: if the angle is too small, it will result in insufficient windward area and insufficient air intake; if the angle is too large, it will easily cause serious airflow separation, forming a high-pressure area in a local area and increasing wind resistance, affecting the airflow efficiency. The angle range adopted by this structure ensures sufficient air intake while avoiding airflow separation and additional wind resistance, so that the airflow can be stably and smoothly guided to the outer periphery of the ceramic ring 3. The vents 12 on the air deflector 1 are arranged in a zoned and differentiated manner: the area directly facing the fan 2 has high air pressure and high velocity, so the first vent 121 is set here, with a larger diameter and a sparse arrangement, in order to suppress excessive air volume concentration in this area; the area far from the fan 2 has low air pressure and low velocity, so the second vent 122 is set here, with a smaller diameter and a dense arrangement, in order to increase the local airflow resistance and force more airflow to replenish the far area, thereby achieving uniform overall airflow.

[0048] To verify the optimization effect of the temperature uniform structure of the present invention on airflow distribution, flow field simulation analysis was carried out under three different operating conditions for the flow field characteristics of the cover plate assembly of the thin film deposition equipment. The three operating conditions were: fan without a flow guide, fan with a uniform aperture flow guide, and fan with a non-uniform aperture flow guide. The simulation results are presented through the velocity cloud map of the ZX section, the velocity trace map of the ZX section, and the trace map of the XY section. Based on the simulation diagrams, the flow field characteristics of each operating condition can be analyzed as follows.

[0049] When the fan is not fitted with a shroud, such as Figures 5-7As shown in the diagram, the velocity cloud map and velocity trace map of the ZX section show that the airflow forms a significant high-speed concentration area in the region directly opposite the fan, with large local vortices and severely uneven airflow distribution. The XY section trace map further shows that there are obvious flow deviations and vortices in the flow field, and the overall flow field is highly turbulent. The high wind speed and uneven airflow distribution in the region directly opposite the fan are the direct causes of the excessive local temperature difference in the ceramic ring.

[0050] When the fan is equipped with a uniform aperture shroud, such as Figures 8-10 As shown, compared to the condition without a flow deflector, the addition of a uniform aperture flow deflector significantly suppresses the vortex in the area directly in front of the fan and reduces the turbulence of the flow field. The velocity cloud map shows that the wind speed in the area directly in front of the fan is reduced and the overall flow field distribution is more uniform, which improves the airflow deviation problem to some extent. However, due to the design of the uniform aperture, it cannot adapt to the airflow pressure difference in different areas, and the effect of improving the uniformity of the flow field is limited.

[0051] When the fan is equipped with a non-uniform aperture shroud, such as Figures 11-13 Compared to the previous two operating conditions, the non-uniform aperture guide shield used in this invention achieves the optimal flow field optimization effect. The trace diagram shows that the eddies in the area directly opposite the fan are further suppressed, and the flow field turbulence is significantly reduced. The velocity cloud diagram indicates that, compared to the uniform aperture guide shield, the maximum wind speed in the flow field is further reduced, and the overall airflow distribution is more uniform. Compared to the operating condition without the guide shield, the maximum wind speed at the same location in the area directly opposite the fan is reduced by 4 to 5 times, and the uniformity of airflow distribution is greatly improved. This fully verifies the effect of the structure of this invention on improving the temperature uniformity of the ceramic ring from the flow field perspective, providing flow field-level support for solving the technical problem of ceramic rings being easily broken due to excessive temperature differences.

[0052] To verify the actual improvement effect of the temperature uniformity structure of this invention on the temperature uniformity of the ceramic ring, the temperature of the ceramic ring was measured under the same process conditions (heating power 450℃, cooling condition 200℃) with and without the guide plate. The measurement points were distributed at 8 different locations around the circumference of the ceramic ring, such as... Figure 14 The temperature data of monitoring points 1-8 in the system are recorded during startup and 30-minute Cycle purge, forming a temperature comparison table and change curve.

[0053] Table 1 From Table 1 and Figure 15As can be seen, without the baffle plate, the temperature difference at different detection points of the ceramic ring is significant. During startup, the highest temperature reaches 130.35℃, the lowest is 100.05℃, and the maximum temperature difference is 30.3℃. During a 30-minute cycle purge, the highest temperature is 129.83℃, the lowest is 103.36℃, and the maximum temperature difference is 26.47℃. The overall temperature distribution is uneven, and excessive local temperature differences can easily lead to significant thermal stress on the ceramic ring. After installing the baffle plate of this invention, the temperature distribution at different detection points of the ceramic ring is significantly improved. During startup, the highest temperature is 129.19℃, the lowest is 119.83℃, and the maximum temperature difference is reduced to 9.92℃. During a 30-minute cycle purge, the highest temperature is 133.12℃, the lowest is 121.58℃, and the maximum temperature difference is reduced to 11.54℃, a decrease of 18.76℃ compared to the maximum temperature difference without the baffle plate. As can be seen from the temperature change curve, the temperature fluctuation at each point of the ceramic ring is smaller after the baffle is installed, and the overall temperature curve is more stable. This indicates that the temperature uniformity structure of the present invention can effectively improve the temperature uniformity of the ceramic ring, reduce local temperature difference, and alleviate thermal stress, thereby preventing the ceramic ring from breaking due to excessive temperature difference.

[0054] Example 2 This embodiment provides a thin film deposition apparatus, such as... Figure 4 As shown, the device includes a main body 4, a fan 2, a ceramic ring 3, and the temperature uniform structure described in Example 1. The ceramic ring 3 is installed inside the upper cover plate assembly 5 of the main body 4. The air guide shroud 1 of the temperature uniform structure is fixedly assembled to the upper cover plate assembly 5 and is disposed between the fan 2 and the ceramic ring 3 to adjust the airflow distribution of the fan 2 towards the ceramic ring 3.

[0055] In this embodiment of the thin film deposition equipment, the main body 4 serves as the supporting foundation for the entire equipment. A ceramic ring 3 is installed within the upper cover assembly 5 of the main body, acting as the core temperature control component to maintain temperature stability within the reaction chamber. A fan 2 is fixedly mounted on the main body 4 and positioned above the temperature-uniformity guide shroud 1, providing airflow for cooling the ceramic ring 3. The temperature-uniformity guide shroud 1 is fixedly mounted to the upper cover assembly 5 using bolts and other fasteners, precisely positioned between the fan 2 and the ceramic ring 3, achieving a proper assembly of the three components. After assembly, the fan 2 starts outputting airflow. After being guided and regulated by the guide shroud 1, the airflow acts evenly on the surface of the ceramic ring 3, effectively regulating the airflow distribution from the fan 2 towards the ceramic ring 3. This ensures uniform surface temperature of the ceramic ring 3, preventing it from cracking due to excessive temperature differences, thereby guaranteeing the normal operation of the thin film deposition equipment and the quality of thin film deposition, and improving the stability and service life of the equipment.

[0056] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A temperature-uniform structure, characterized in that, The device includes a shroud, which is disposed between the fan and the ceramic ring. A guide surface is formed on the lower side of the shroud, and the guide surface is configured to have a guide angle. Multiple vent holes are provided on the shroud, which are unevenly distributed on the shroud. The shroud covers the entire air outlet area of ​​the fan, and the outline of the shroud is adapted to the air outlet area of ​​the fan.

2. The temperature uniform structure according to claim 1, characterized in that, The guiding angle of the guiding surface is 18°~25°, and a fixed angle is formed between the guiding surface and the main mounting surface of the guide cover, and the guiding surface is a smooth curved surface.

3. The temperature uniform structure according to claim 1, characterized in that, The plurality of ventilation holes include a first ventilation hole and a second ventilation hole. The first ventilation hole is located in the area of ​​the shroud facing the fan, and the second ventilation hole is located in the area of ​​the shroud away from the fan. Both the first ventilation hole and the second ventilation hole penetrate the upper and lower surfaces of the shroud, and the axis of the holes is perpendicular to the surface of the shroud.

4. The temperature uniform structure according to claim 3, characterized in that, The diameter of the first vent is larger than the diameter of the second vent, and the difference between the two vent diameters is 0~1mm.

5. The temperature uniform structure according to claim 4, characterized in that, The diameter of the first vent is 4mm~5mm, and the diameter of the second vent is 4mm.

6. The temperature uniform structure according to claim 3, characterized in that, The distance between adjacent first vents is greater than the distance between adjacent second vents, and the difference between the two distances is 0~2mm.

7. The temperature uniform structure according to claim 3, characterized in that, The first vent is arranged in a sparse manner on the air guide cover, and the second vent is arranged in a dense manner on the air guide cover. The sparse and dense areas are separated by the air outlet boundary of the fan.

8. The temperature uniform structure according to claim 6, characterized in that, The spacing between adjacent first vent holes is 8mm~10mm, and the spacing between adjacent second vent holes is 8mm. The spacing is matched with the diameter of the corresponding vent holes.

9. The temperature uniform structure according to claim 1, characterized in that, The air deflector has a rounded, streamlined structure.

10. The temperature uniform structure according to claim 1, characterized in that, The air guide is located on the air outlet side of the fan, and the airflow output by the fan flows to the ceramic ring through the air vents of the air guide.

11. A thin film deposition apparatus, characterized in that, The device includes a main body, a fan, a ceramic ring, and a temperature uniform structure as described in any one of claims 1 to 10. The ceramic ring is installed inside the upper cover plate assembly of the main body, and the air guide shroud of the temperature uniform structure is fixedly assembled to the upper cover plate assembly and disposed between the fan and the ceramic ring for adjusting the airflow distribution of the fan towards the ceramic ring.

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