A barrel plating drum and a barrel plating device

Abstract

This application provides a barrel plating roller and a barrel plating apparatus, relating to the field of semiconductor packaging technology. The barrel plating roller includes a roller frame and a cylinder wall disposed on the roller frame. The cylinder wall forms an inner cavity for accommodating the packaged product. The cylinder wall includes conductive panels and adsorption panels alternately spaced along the circumference of the barrel plating roller. The conductive panels are electrically connected to the negative terminal of a power source, and the adsorption panels are electrically insulated from the conductive panels. At least a portion of the adsorption panels facing the inner cavity is made of an ion exchange material for adsorbing anions from the surface of the packaged product. This barrel plating roller, through the circumferentially alternating arrangement of the conductive and adsorption panels, can significantly suppress the continuous local accumulation of harmful anions on the surface of the packaged product, reduce the probability of anions invading the interior of the packaged product along the micro-gap between the molding compound and the metal structure, and improve the electrical performance stability, moisture and heat resistance reliability, and long-term service reliability of the semiconductor packaged product; it can also improve the uniformity and density of the plating layer.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and more specifically, to a barrel plating roller and a barrel plating apparatus. Background Technology

[0002] In the mass production of semiconductor packaged devices, due to the small size and large quantity of the packages, and the difficulty in using mounting fixtures, the industry generally uses barrel plating to process the metal plating of the external leads. During barrel plating, a large number of semiconductor packaged products are placed in a porous barrel. The continuous rolling of the barrel causes the products to tumble and reposition within the barrel, ensuring that the surface of each package can fully contact the plating solution and obtain a uniform plating layer, meeting the needs of high-volume, high-efficiency production.

[0003] However, existing barrel plating equipment has significant drawbacks in practical applications. The plating solution typically contains chloride ions, and during the plating process, harmful impurities such as chloride ions tend to accumulate continuously on the surface of the packaged product, which serves as the cathode. Furthermore, the continuous conduction of the plating current means that chloride ions on the cathode surface lack sufficient diffusion time, further exacerbating their localized accumulation. For packaged structures with integrated chips, such as SMA (Surface Mount Assembly), the accumulated chloride ions easily penetrate the package interior along the micro-gap between the molding compound and the metal structure, continuously eroding the chip's passivation layer. Simultaneously, under the high temperature and electrochemical environment of the plating process, metal ion transitions easily occur within the erosion channels, directly causing electrical failures in the product. Because chloride ions that have penetrated the package interior are difficult to completely remove, their corrosive effect is continuous. When the product is used under humid and electrically powered conditions, the failure problem will continue to worsen, severely impacting device reliability. Summary of the Invention

[0004] The purpose of this application is to address the shortcomings of the prior art by providing a barrel plating roller and a barrel plating apparatus, which aims to solve the technical problem in the existing semiconductor packaging barrel plating process where chloride ions easily accumulate at the cathode and invade the inside of the package, eroding the chip passivation layer and causing metal ion transitions that lead to product failure.

[0005] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows: In one aspect of this application, a barrel plating roller is provided, including a roller frame and a cylinder wall disposed on the roller frame. The cylinder wall forms an inner cavity for accommodating a packaged product. The cylinder wall includes a conductive panel and an adsorption panel that are alternately spaced along the circumference of the barrel plating roller. The conductive panel is used to be electrically connected to the negative electrode of a power source. The adsorption panel is electrically insulated from the conductive panel. At least a portion of the adsorption panel facing the inner cavity is made of an ion exchange material for adsorbing anions on the surface of the packaged product.

[0006] Optionally, the adsorption panel is provided with a plurality of first through holes, the diameter of which is smaller than the width of the packaged product.

[0007] Optionally, the diameter of the first through-hole is less than 1 / 3 of the width of the packaged product.

[0008] Optionally, the roller frame includes multiple parallel columnar supports, which are parallel to the axial direction of the barrel plating roller. Adjacent supports are connected by insulating panels, and conductive panels and adsorption panels are fixed to the inner side of different insulating panels.

[0009] Optionally, the conductive panel is snapped into the insulating panel, and the adsorption panel is snapped into the insulating panel.

[0010] Optionally, the insulating panel is provided with a second through hole for the flow of plating solution.

[0011] Optionally, the ion exchange material is an ion exchange resin.

[0012] Alternatively, the adsorption panel is made of ion exchange material, and the conductive panel is made of copper.

[0013] Alternatively, the stent may be made of polypropylene.

[0014] In another aspect of this application, a barrel plating apparatus is provided, including a plating bath, an electrode plate, a power supply, a drive mechanism, and a barrel plating drum as described above. The barrel plating drum and the electrode plate are both disposed in the plating bath and immersed in the plating solution. The electrode plate is electrically connected to the positive terminal of the power supply, and the conductive panel of the barrel plating drum is connected to the negative terminal of the power supply. The drive mechanism is used to drive the barrel plating drum to rotate.

[0015] The beneficial effects of this application include: This application provides a barrel plating roller, including a roller frame and a cylinder wall disposed on the roller frame. The cylinder wall forms an inner cavity for accommodating a packaged product. The cylinder wall includes conductive panels and adsorption panels arranged alternately along the circumference of the barrel plating roller. The conductive panels are electrically connected to the negative terminal of a power source, and the adsorption panels are electrically insulated from the conductive panels. At least a portion of the adsorption panels facing the inner cavity is made of an ion exchange material for adsorbing anions on the surface of the packaged product. This barrel plating roller, through the circumferentially alternating arrangement of conductive and adsorption panels, can significantly suppress the continuous local accumulation of harmful anions on the surface of the packaged product, reduce the probability of anions invading the interior of the packaged product along the micro-gap between the molding compound and the metal structure, mitigate the risk of erosion of the chip passivation layer, and further suppress metal ion transition phenomena that may occur under high temperature and electrochemical environments. Ultimately, it improves the electrical performance stability, damp heat resistance reliability, and long-term service reliability of semiconductor packaged products. Furthermore, it can achieve periodic current switching during the barrel plating process, simulating the effect of pulse plating, which is beneficial for improving the uniformity and density of the plating layer and providing sufficient time for anions to diffuse away from the surface of the packaged product. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the barrel plating roller provided in the embodiments of this application; Figure 2 This is a schematic diagram of the barrel plating apparatus provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the adsorption panel in the barrel plating drum provided in the embodiments of this application; Figure 4 This is a schematic diagram of the structure of the insulating panel in the barrel plating cylinder provided in an embodiment of this application.

[0018] Icons: 10-Barrel plating roller; 11-Roller frame; 111-Support; 112-Insulating panel; 1121-Second through hole; 12-Cylinder wall; 121-Conductive panel; 122-Adsorption panel; 1221-First through hole; 13-Inner cavity; 20-Encapsulated product; 30-Plating solution; 100-Barrel plating device; 110-Plating solution tank; 120-Electrode plate; 130-Power supply; 140-Drive mechanism. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. It should be noted that, unless otherwise specified, the various features in the embodiments of this application can be combined with each other, and the combined embodiments are still within the protection scope of this application.

[0021] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0022] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0023] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0024] Please refer to Figure 1 and Figure 2This application provides a barrel plating roller 10, including a roller frame 11 and a cylinder wall 12 disposed on the roller frame 11. The cylinder wall 12 forms an inner cavity 13 for accommodating a packaged product 20. The cylinder wall 12 includes a conductive panel 121 and an adsorption panel 122 disposed alternately along the circumference of the barrel plating roller 10. The conductive panel 121 is used for electrical connection with the negative electrode of a power supply 130. The adsorption panel 122 is electrically insulated from the conductive panel 121. At least a portion of the adsorption panel 122 facing the inner cavity 13 is made of an ion exchange material for adsorbing anions on the surface of the packaged product 20.

[0025] The barrel wall 12 of the barrel plating roller 10 is not constructed from a single material or a single-function panel, but rather consists of alternating conductive panels 121 and adsorption panels 122 arranged circumferentially along the barrel plating roller 10. The number of conductive panels 121 and adsorption panels 122 are equal, forming an inner cavity 13 for accommodating the packaged product 20 in a sequence of "conductive panel 121—adsorption panel 122—conductive panel 121—adsorption panel 122…". The conductive panels 121 are electrically connected to the negative terminal of the power supply 130, thereby enabling the packaged product 20 to operate in a cathodic state and undergo electrodeposition when it comes into contact with the conductive panels 121. The adsorption panels 122 are electrically insulated from the conductive panels 121, and at least a portion of the adsorption panels 122 facing the inner cavity 13 is made of an ion exchange material, so that when the packaged product 20 tumbles to the corresponding area of ​​the adsorption panels 122, it adsorbs anions from the liquid film adhering to the surface of the packaged product 20 and its adjacent boundary layer.

[0026] "Adsorbed anions on the surface of the packaged product 20" can be understood as adsorbing anions in the plating solution 30 carried on the surface of the packaged product 20, especially harmful anions such as chloride ions that are adsorbed and enriched near the packaged product 20.

[0027] With the conductive panel 121 and the adsorption panel 122 arranged alternately in a circumferential pattern, the packaged product 20 periodically undergoes a conductive electroplating stage and an ion adsorption stage during the continuous rotation of the barrel plating drum 10. On the one hand, the conductive panel 121 ensures that the packaged product 20 can obtain the cathode conduction path required for normal electroplating, realizing the continuous formation of the metal plating layer on the outer pins or outer surface. On the other hand, when the packaged product 20 moves to the area of ​​the adsorption panel 122 and temporarily leaves the conductive electroplating state, the chloride ions originally enriched on the surface of the packaged product 20 have the opportunity to diffuse, migrate, and be adsorbed, thereby significantly inhibiting the retention of harmful anions on the surface of the packaged product 20. Continued local enrichment reduces the probability of anions invading the packaged product 20 through the micro-gap between the molding compound and the metal structure, mitigating the risk of erosion of the chip passivation layer, and further suppressing metal ion transition phenomena that may occur under high temperature and electrochemical environments, ultimately improving the electrical performance stability, damp heat resistance reliability, and long-term service reliability of the semiconductor packaged product 20; at the same time, the alternating arrangement of the conductive panel 121 and the adsorption panel 122 can also realize the periodic switching of current during the barrel plating process, simulating the effect of pulse electroplating, which is beneficial to improving the uniformity and density of the plating layer, and providing sufficient time for anions to diffuse away from the surface of the packaged product 20.

[0028] In practical applications, the area of ​​the conductive panel 121 and the adsorption panel 122, as well as the rotation speed of the barrel plating roller 10, can be adjusted according to requirements, thereby adjusting the current conduction duty cycle and plating speed of pulse electroplating.

[0029] Optionally, the ion exchange material is an ion exchange resin.

[0030] As a mature ion exchange functional material, ion exchange resin is suitable for use in conditions such as continuous tumbling, repeated impact and long-term contact with chemical media in barrel plating. For anions such as chloride ions that are prone to cause encapsulation failure in electroplating systems, ion exchange resin can continuously exchange and adsorb harmful ions in the liquid film attached to the surface of the encapsulated product 20 in the adsorption zone. Thus, without adding a complicated external purification system, the ion treatment function can be directly integrated into the barrel plating drum 10.

[0031] The principle of ion exchange resin adsorbing chloride ions in plating solution 30 is as follows: When the ion exchange resin is immersed in the plating solution 30, the quaternary ammonium groups (which are positively charged and can be represented by RN) on its surface + (CH3)3 indicates that it will affect the negatively charged chloride ions (Cl) in the plating solution 30. - This generates a strong electrostatic attraction, pulling chloride ions from the plating solution 30 to the surface of the ion exchange resin.

[0032] When chloride ions approach an ion exchange resin, they exchange positions with existing exchangeable ions on the functional groups of the resin. The reaction is as follows: RN·Cl+Cl - (solution) → RN·Cl + Cl - (resin source) In simple terms, chloride ions in plating solution 30 are "captured" by the ion exchange resin, while a chloride ion originally carried by the ion exchange resin is "pushed" back into plating solution 30. Since the chloride ion concentration in plating solution 30 is much higher than the local concentration on the surface of the ion exchange resin, this equilibrium reaction continues to proceed to the right, which macroscopically manifests as the effective adsorption of chloride ions by the ion exchange resin.

[0033] When the temperature of the plating solution 30 is 60~80℃, the adsorption capacity of the ion exchange resin is maximized.

[0034] Optionally, the adsorption panel 122 is made of an ion exchange material, and the conductive panel 121 is made of copper.

[0035] By making the adsorption panel 122 entirely from ion exchange material, rather than only coating a functional layer on a localized surface, the effective adsorption volume and functional continuity can be significantly increased. This allows the adsorption panel 122 to maintain a strong ion exchange capacity even if the surface wears down during long-term use, thereby improving adsorption lifespan and functional stability. At the same time, the integral adsorption panel 122 is also easier to process.

[0036] By making the conductive panel 121 entirely of copper, the excellent conductivity, low contact resistance, good processing and forming capabilities, and ease of obtaining stable electrical connections of copper can be fully utilized. This makes it easier for the packaged product 20 to form a stable and effective cathode path when rolling into contact with the conductive panel 121, ensuring coating deposition efficiency and conductivity uniformity. At the same time, the integral conductive panel 121 is also easier to process.

[0037] Alternatively, please refer to Figure 1 and Figure 3 The adsorption panel 122 is provided with a plurality of first through holes 1221, the diameter of the first through holes 1221 being smaller than the width of the packaged product 20.

[0038] The first through hole 1221 can be understood as a channel formed through the thickness direction of the adsorption panel 122. Its number, distribution position and arrangement can be set according to the size of the barrel plating roller 10, the specifications of the packaged product 20 and the viscosity of the plating solution 30. The fact that "the diameter is smaller than the width of the packaged product 20" means that the packaged product 20 cannot pass through the first through hole 1221 in the normal barrel plating posture, so as to ensure that the packaged product 20 is always confined in the inner cavity 13 of the barrel plating roller 10 and will not have leakage or jamming due to the excessively large hole diameter.

[0039] By providing multiple first through holes 1221 on the adsorption panel 122, a more sufficient exchange path for the plating solution 30 can be formed near the adsorption panel 122. This makes it easier for the liquid film of the plating solution 30 attached to the surface of the packaged product 20 to exchange with the external plating solution 30 when it rolls to the adsorption area. Combined with the adsorption effect of the ion exchange material on anions, the removal efficiency of harmful anions such as chloride ions is further improved. At the same time, the first through holes 1221 can also reduce the weight of the adsorption panel 122 and reduce the overall rotational load of the barrel plating drum 10.

[0040] Optionally, the diameter of the first through-hole 1221 is less than 1 / 3 of the width of the packaged product 20.

[0041] The "width of the packaged product 20" can be understood as the minimum lateral dimension of the overall shape of the packaged product 20. By controlling the diameter of the first through hole 1221 to less than 1 / 3 of the width of the packaged product 20, the risk of local corners of the packaged product 20 being embedded in the hole can be significantly reduced, thereby avoiding edge damage or pin damage to the packaged product 20 due to jamming or abnormal collision. At the same time, this proportional relationship still retains the plating solution 30 exchange capacity that the first through hole 1221 should have, so that the adsorption panel 122 can still achieve better liquid renewal and anion migration path while maintaining structural strength and support continuity, further improving the stability and consistency of the anion adsorption stage.

[0042] Alternatively, please refer to Figure 1 and Figure 2 The roller frame 11 includes multiple parallel columnar supports 111, which are parallel to the axial direction of the barrel plating roller 10. Two adjacent supports 111 are connected by an insulating panel 112. The conductive panel 121 and the adsorption panel 122 are respectively fixed on the inner side of different insulating panels 112.

[0043] The bracket 111 extends in a direction parallel to the axial direction of the barrel plating drum 10. Adjacent brackets 111 are connected by an insulating panel 112. A conductive panel 121 or an adsorption panel 122 is fixed to the inner side of the insulating panel 112. Here, "inner side of the insulating panel 112" refers to the side of the insulating panel 112 facing the inner cavity 13 of the barrel plating drum 10, which can come into contact with or be relatively close to the packaged product 20.

[0044] The columnar support 111 forms the skeleton of the barrel plating roller 10, ensuring sufficient strength, stability, and resistance to deformation when the barrel plating roller 10 carries a large number of packaged products 20 and rotates continuously. The insulating panel 112 provides a carrier for mounting the conductive panel 121 and the adsorption panel 122. At the same time, the columnar support 111 serves as a boundary between the conductive and non-conductive areas, allowing the conductive panel 121 and the adsorption panel 122 to be arranged side by side structurally and electrically isolated from each other, thereby preventing current leakage from the conductive panel 121 to the adsorption panel 122.

[0045] Optionally, the conductive panel 121 is snapped into the insulating panel 112, and the adsorption panel 122 is snapped into the insulating panel 112.

[0046] A snap-fit ​​connection can be understood as a detachable connection achieved using slots, latches, claws, limiting shoulders, or elastic fitting parts. The snap-fit ​​connection with the insulating panel 112 allows the conductive panel 121 and the adsorption panel 122 to be assembled and replaced separately. Therefore, when the conductive panel 121 or the adsorption panel 122 needs to be replaced, there is no need to scrap the entire barrel plating roller 10; only the corresponding panel needs to be disassembled and maintained, significantly reducing operating costs and downtime. Secondly, for the adsorption panel 122, the snap-fit ​​installation facilitates the rapid replacement of ion exchange material panels of different types and exchange groups according to different electroplating systems to adapt to the treatment needs of different harmful anions. For the conductive panel 121, it facilitates the replacement of conductive sheets of different materials, thicknesses, or surface morphologies to adapt to the conductivity requirements and mechanical tumbling barrel plating requirements of different packaged products 20.

[0047] Optionally, please refer to the following: Figure 4 The insulating panel 112 is provided with a second through hole 1121, which is used to supply plating solution 30 for flow.

[0048] Because the number of packaged products 20 is large and the barrel plating drum 10 rotates continuously in the barrel plating process, uneven areas of plating solution 30 can easily form in the inner cavity 13 of the barrel plating drum 10. If the drum rotation alone is insufficient and there is a lack of sufficient internal and external flow channels, the function of the conductive panel 121 and the adsorption panel 122 may be affected. By providing a second through hole 1121 on the insulating panel 112, the exchange of plating solution 30 between the inside and outside of the barrel plating drum 10 can be enhanced, the concentration of plating solution 30 can be made more uniform, and the ability of the adsorption panel 122 to "carry away" and "replace" the enriched anions can be improved. At the same time, the second through hole 1121 can also help the barrel plating drum 10 to achieve smoother liquid entry and exit during rotation, reduce liquid resistance, reduce driving load, and improve the operational stability of the barrel plating drum 10.

[0049] Optionally, the stent 111 is made of polypropylene.

[0050] Polypropylene has good electrical insulation properties, acid and alkali corrosion resistance, light weight, mature molding process and relatively low cost. As the columnar support 111 material of the barrel plating roller 10, it can maintain good structural stability and chemical stability under the working conditions of long-term immersion in plating solution 30 and continuous rotation and collision load.

[0051] This embodiment also provides a barrel plating apparatus 100, including a plating bath 110, an electrode plate 120, a power supply 130, a drive mechanism 140, and a barrel plating drum 10 as described above. The barrel plating drum 10 and the electrode plate 120 are both disposed in the plating bath 110 and immersed in the plating solution 30. The electrode plate 120 is electrically connected to the positive terminal of the power supply 130, and the conductive panel 121 of the barrel plating drum 10 is connected to the negative terminal of the power supply 130. The drive mechanism 140 is used to drive the barrel plating drum 10 to rotate.

[0052] The plating bath 110 stores the plating solution 30 required for barrel plating. The barrel plating drum 10 is horizontally positioned within the plating bath 110 and immersed in the plating solution 30. A drive mechanism 140 is connected to the barrel plating drum 10 to drive it to rotate within the plating bath 110. During rotation, the conductive panel 121 and the adsorption panel 122 of the barrel plating drum 10 alternately reach their lowest positions. An electrode plate 120 is also provided within the plating bath 110, and the electrode plate 120 is also immersed in the plating solution 30. The electrode plate 120 is electrically connected to the positive terminal of the power supply 130, and the conductive panel 121 of the barrel plating drum 10 is electrically connected to the negative terminal of the power supply 130, thereby forming a current loop of "positive terminal of power supply 130 — electrode plate 120 — plating solution 30 — packaged product 20 — conductive panel 121 — negative terminal of power supply 130" to achieve electroplating deposition.

[0053] As the drive mechanism 140 drives the barrel plating drum 10 to rotate continuously, the packaged product 20 will continuously detach from the conductive panel 121 and transfer to the adsorption panel 122. In this area, the anions in the liquid film attached to the surface of the packaged product 20 are adsorbed by the ion exchange material in the adsorption panel 122. At the same time, the local liquid film gets the opportunity to diffuse and renew, thus forming a periodic alternating "electroplating-deionization-re-electroplating" working process at the level of the entire barrel plating device 100.

[0054] Compared with existing continuous conduction barrel plating equipment, the barrel plating equipment 100 of this application does not require a separate anion adsorption device. Instead, the anion treatment function is directly integrated into the barrel plating drum 10, so that barrel plating and harmful anion suppression are completed in the same equipment, the same station, and the same process. Therefore, without significantly increasing the production cycle and equipment complexity, it can reduce the continuous enrichment of harmful anions such as chloride ions on the surface of the packaged product 20, reduce the risk of them invading the packaged body along the micro-seam and eroding the chip passivation layer, suppress the occurrence of metal ion transition and electrical failure, and improve the long-term reliability of the product under service conditions such as humid power supply and high temperature bias, while maintaining the original advantages of barrel plating process in terms of large batch and high efficiency. It has significant engineering practical value and industrial promotion value.

[0055] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A barrel plating roller, characterized in that, The device includes a roller frame and a cylinder wall disposed on the roller frame. The cylinder wall forms an inner cavity for accommodating the packaged product. The cylinder wall includes conductive panels and adsorption panels that are alternately spaced along the circumference of the roller plating roller. The conductive panels are used for electrical connection to the negative terminal of a power source. The adsorption panels are electrically insulated from the conductive panels. At least a portion of the adsorption panels facing the inner cavity is made of an ion exchange material for adsorbing anions from the surface of the packaged product.

2. The barrel plating roller as described in claim 1, characterized in that, The adsorption panel is provided with a plurality of first through holes, the diameter of which is smaller than the width of the packaged product.

3. The barrel plating roller as described in claim 2, characterized in that, The diameter of the first through hole is less than 1 / 3 of the width of the packaged product.

4. The barrel plating roller as described in claim 1, characterized in that, The roller frame includes multiple parallel columnar supports, which are parallel to the axial direction of the plating roller. Adjacent supports are connected by insulating panels, and the conductive panel and the adsorption panel are respectively fixed inside different insulating panels.

5. The barrel plating roller as described in claim 4, characterized in that, The conductive panel is snapped into the insulating panel, and the adsorption panel is snapped into the insulating panel.

6. The barrel plating roller as described in claim 4, characterized in that, The insulating panel is provided with a second through hole, which is used for the flow of plating solution.

7. The barrel plating roller as described in claim 1, characterized in that, The ion exchange material is an ion exchange resin.

8. The barrel plating roller as described in claim 1, characterized in that, The adsorption panel is made of the ion exchange material, and the conductive panel is made of copper.

9. The barrel plating roller as described in claim 4, characterized in that, The support is made of polypropylene.

10. A barrel plating apparatus, characterized in that, The device includes a plating bath, an electrode plate, a power supply, a drive mechanism, and a barrel plating drum as described in any one of claims 1 to 9. The barrel plating drum and the electrode plate are both disposed in the plating bath and immersed in the plating solution. The electrode plate is electrically connected to the positive terminal of the power supply, and the conductive panel of the barrel plating drum is connected to the negative terminal of the power supply. The drive mechanism is used to drive the barrel plating drum to rotate.

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