Three-phase drive circuit thermal balance regulation method, device, equipment and storage medium

Abstract

This invention relates to the field of circuit thermal equalization analysis technology, and particularly to a method, device, equipment, and storage medium for thermal equalization adjustment of three-phase drive circuits. The method analyzes the sampling voltages of the first, second, and third phases according to a preset linear mapping formula to obtain the maximum junction temperature difference. If the maximum junction temperature difference is less than a hysteresis threshold, the reference duty cycle of the first, second, and third phases is analyzed based on the current operating conditions and a preset amplitude coefficient to obtain a thermal equalization adjustment command. By acquiring the characteristic voltage of the IGBT and obtaining the maximum junction temperature difference through linear mapping, the degree of thermal imbalance is quantified. Adjustment is triggered using the hysteresis threshold, and an equalization command is generated by combining the three-phase reference duty cycle to accurately optimize the junction temperature distribution, reduce the temperature difference, extend device life, and improve the reliability and stability of the three-phase drive circuit.

Description

Technical Field

[0001] This invention relates to the field of circuit thermal equalization analysis technology, and in particular to a method, apparatus, equipment and storage medium for thermal equalization adjustment of three-phase drive circuits. Background Technology

[0002] In fields such as power electronics, new energy, and industrial control, three-phase drive circuits are widely used in various power equipment. IGBT devices, as the core switching elements of the circuit, directly determine the reliability and lifespan of the circuit. Currently, existing thermal equalization adjustment technologies for three-phase drive circuits generally have many shortcomings. Most solutions lack quantitative analysis methods that closely match the characteristics of the devices and the circuit, making it difficult to accurately quantify the degree of IGBT thermal imbalance. Furthermore, they lack reasonable adjustment trigger judgment mechanisms, easily leading to blind or insufficient adjustment. Simultaneously, existing adjustment schemes often ignore the compatibility between the actual operating conditions of the circuit and the adjustment intensity, resulting in adjustment commands that are easily detached from reality, causing thermal equalization adjustment failure. This not only affects the lifespan of IGBT devices but also reduces the operational stability and engineering practicality of the three-phase drive circuit, failing to meet the needs of various equipment for efficient and precise thermal equalization adjustment. Summary of the Invention

[0003] In order to overcome the shortcomings of the prior art, the purpose of this invention is to provide a method, apparatus, device and storage medium for thermal equalization adjustment of a three-phase drive circuit.

[0004] The first aspect of this invention provides a method for thermal equalization adjustment of a three-phase drive circuit, comprising: acquiring the first-phase sampling voltage, the second-phase sampling voltage, and the third-phase sampling voltage of the three-phase drive circuit; analyzing the first-phase sampling voltage, the second-phase sampling voltage, and the third-phase sampling voltage according to a preset linear mapping formula to obtain the maximum junction temperature difference; determining whether the maximum junction temperature difference is less than a preset hysteresis threshold; if the maximum junction temperature difference is less than the hysteresis threshold, acquiring the first-phase reference duty cycle, the second-phase reference duty cycle, and the third-phase reference duty cycle of the three-phase drive circuit; obtaining the current operating condition, and analyzing the first-phase reference duty cycle, the second-phase reference duty cycle, and the third-phase reference duty cycle according to the current operating condition and a preset amplitude coefficient to obtain a thermal equalization adjustment command.

[0005] Furthermore, the step of analyzing the first-phase sampling voltage, the second-phase sampling voltage, and the third-phase sampling voltage according to a preset linear mapping formula to obtain the maximum junction temperature difference includes: converting the first-phase sampling voltage, the second-phase sampling voltage, and the third-phase sampling voltage according to the linear mapping formula to obtain the first real-time junction temperature, the second real-time junction temperature, and the third real-time junction temperature; comparing and analyzing the first real-time junction temperature, the second real-time junction temperature, and the third real-time junction temperature to obtain the highest junction temperature and the lowest junction temperature; and calculating the difference between the highest junction temperature and the lowest junction temperature to obtain the maximum junction temperature difference.

[0006] Furthermore, the step of analyzing the first-phase reference duty cycle, the second-phase reference duty cycle, and the third-phase reference duty cycle based on the current operating conditions and preset amplitude coefficients to obtain a thermal equilibrium adjustment command includes: correcting the first-phase reference duty cycle, the second-phase reference duty cycle, and the third-phase reference duty cycle based on the maximum junction temperature difference to obtain a target duty cycle; calculating the target duty cycle based on a preset phase angle calculation formula to obtain the current phase angle; and generating a thermal equilibrium adjustment command based on the amplitude coefficients, the current operating conditions, and the current phase angle.

[0007] Furthermore, the step of correcting the first-phase reference duty cycle, the second-phase reference duty cycle, and the third-phase reference duty cycle based on the maximum junction temperature difference to obtain the target duty cycle includes: determining the adjustment amount based on the maximum junction temperature difference; and calculating the first-phase reference duty cycle, the second-phase reference duty cycle, and the third-phase reference duty cycle based on the adjustment amount to obtain the target duty cycle.

[0008] Furthermore, the step of calculating the target duty cycle according to the preset phase angle calculation formula to obtain the current phase angle includes: obtaining the thermal equilibrium requirement and the current timestamp; analyzing the thermal equilibrium requirement according to the maximum junction temperature difference and the preset equilibrium level library to obtain the target output frequency; and calculating the current timestamp, target output frequency and target duty cycle according to the phase angle calculation formula to obtain the current phase angle.

[0009] Furthermore, the step of generating a thermal equilibrium adjustment command based on the amplitude coefficient, the current operating condition, and the current phase angle includes: analyzing the current phase angle based on the amplitude coefficient to obtain a three-phase modulation signal; analyzing the current operating condition based on preset drive circuit conduction conditions to obtain an analysis result; if the analysis result indicates that the current operating condition meets the drive circuit conduction conditions, then generating a thermal equilibrium adjustment command based on the three-phase modulation signal and preset loading parameters.

[0010] Further, the step of analyzing the current phase angle based on the amplitude coefficient to obtain a three-phase modulated signal includes: determining the reference carrier amplitude based on the current phase angle; calculating the current phase angle, the reference carrier amplitude, and the amplitude coefficient to obtain a reference sine wave; determining the three-phase carrier amplitude based on the reference sine wave; calculating the ratio between the reference carrier amplitude and the three-phase carrier amplitude to obtain the modulation coefficient; and multiplying the preset basic sine wave and the modulation coefficient to obtain a three-phase modulated signal.

[0011] Furthermore, the three-phase drive circuit thermal equalization adjustment device includes: a first data acquisition module for acquiring the first-phase sampling voltage, the second-phase sampling voltage, and the third-phase sampling voltage of the three-phase drive circuit; a first analysis module for analyzing the first-phase sampling voltage, the second-phase sampling voltage, and the third-phase sampling voltage according to a preset linear mapping formula to obtain the maximum junction temperature difference; a judgment module for judging whether the maximum junction temperature difference is less than a preset hysteresis threshold; a second data acquisition module for acquiring the first-phase reference duty cycle, the second-phase reference duty cycle, and the third-phase reference duty cycle of the three-phase drive circuit if the maximum junction temperature difference is less than the hysteresis threshold; and a second analysis module for obtaining the current operating condition and analyzing the first-phase reference duty cycle, the second-phase reference duty cycle, and the third-phase reference duty cycle according to the current operating condition and a preset amplitude coefficient to obtain a thermal equalization adjustment command.

[0012] Furthermore, a three-phase drive circuit thermal equalization adjustment device includes: a memory and at least one processor, wherein the memory stores instructions; at least one processor invokes the instructions in the memory to cause the three-phase drive circuit thermal equalization adjustment device to execute the various steps of the three-phase drive circuit thermal equalization adjustment method described above.

[0013] Furthermore, a computer-readable storage medium stores instructions that, when executed by a processor, implement the various steps of the three-phase drive circuit thermal equalization adjustment method described above.

[0014] In the technical solution of this invention, the traveling speed and position information of the coil are collected in real time to accurately control the movement state of the coil, providing reliable data support for subsequent inspection and avoiding detection deviations caused by speed fluctuations and position offsets; the detection trigger interval is dynamically calculated to match the inspection rhythm with the movement state of the coil, preventing missed detections and reducing redundancy, while balancing coverage and production efficiency; defects are identified by relying on thermal imaging training models, which is more efficient and standardized than manual methods, avoiding subjective misjudgments; blank coil running instructions are generated in combination with calibration benchmarks to address defect problems in a targeted manner, providing support for quality control and adapting to the needs of large-scale continuous production of coils. Attached Figure Description

[0015] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a first flowchart of a three-phase drive circuit thermal equalization adjustment method provided in an embodiment of the present invention; Figure 2 This is a second flowchart of a three-phase drive circuit thermal equalization adjustment method provided in an embodiment of the present invention; Figure 3 This is a third flowchart of a three-phase drive circuit thermal equalization adjustment method provided in an embodiment of the present invention; Figure 4 This is a fourth flowchart of a three-phase drive circuit thermal equalization adjustment method provided in an embodiment of the present invention; Figure 5 A fifth flowchart of a three-phase drive circuit thermal equalization adjustment method provided in an embodiment of the present invention; Figure 6 The sixth flowchart of the thermal equalization adjustment method for a three-phase drive circuit provided in the embodiments of the present invention; Figure 7 The seventh flowchart of the thermal equalization adjustment method for a three-phase drive circuit provided in the embodiments of the present invention; Figure 8 This is a schematic diagram of the structure of the three-phase drive circuit thermal equalization adjustment device provided in an embodiment of the present invention; Figure 9 This is a schematic diagram of the structure of a three-phase drive circuit thermal equalization adjustment device provided in an embodiment of the present invention. Detailed Implementation

[0016] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" or "having" and any variations thereof are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0017] For ease of understanding, the specific process of the embodiments of the present invention is described below. Please refer to [link / reference]. Figure 1 One embodiment of the thermal equalization adjustment method for a three-phase drive circuit in this invention includes: 101. Collect the first phase sampling voltage, the second phase sampling voltage, and the third phase sampling voltage of the three-phase drive circuit; In this embodiment, the first phase sampling voltage, the second phase sampling voltage, and the third phase sampling voltage are all characteristic voltages (such as tube voltage drops) of the three-phase IGBT devices in the three-phase drive circuit, which are collected in real time. The acquisition process is carried out synchronously to ensure the timeliness and consistency of the three-phase voltage data, laying the foundation for subsequent synchronous conversion, comparison and analysis. 102. Analyze the sampling voltage of the first phase, the sampling voltage of the second phase, and the sampling voltage of the third phase according to the preset linear mapping formula to obtain the maximum junction temperature difference; In this embodiment, by pre-setting a linear mapping formula that matches the IGBT device parameters and the characteristics of the three-phase drive circuit, the three-phase sampling voltage is analyzed to accurately obtain the real-time junction temperature of the three phases. Then, by comparing and analyzing the three-phase sampling voltage, the maximum junction temperature difference is obtained, clearly quantifying the degree of thermal imbalance of the three-phase IGBT, providing a clear basis for the thermal balance requirement analysis, ensuring device safety, extending lifespan, and improving circuit operation stability and engineering practicality. 103. Determine whether the maximum junction temperature difference is less than the preset hysteresis threshold; 104. If the maximum junction temperature difference is less than the hysteresis threshold, the reference duty cycle of the first phase, the reference duty cycle of the second phase, and the reference duty cycle of the third phase of the three-phase drive circuit are collected. In this embodiment, the hysteresis threshold is a preset critical junction temperature difference value used to determine whether the three-phase IGBT needs thermal equalization adjustment. Its core function is to define the trigger boundary of thermal equalization adjustment. If the maximum junction temperature difference is less than the hysteresis threshold, it indicates that the thermal imbalance of the three-phase IGBT is relatively mild, and the subsequent reference duty cycle acquisition and adjustment command generation stage is entered. If it is greater than or equal to the hysteresis threshold, the original adjustment state is maintained or a higher level of adjustment is triggered to ensure the targeting and rationality of the adjustment. The acquired first-phase reference duty cycle, second-phase reference duty cycle, and third-phase reference duty cycle are the initial duty cycles adapted to the normal operation of the three-phase drive circuit. The three phases are matched and conform to the circuit phase relationship, providing reliable basic parameters for subsequent analysis based on the current operating conditions and amplitude coefficients to generate thermal equalization adjustment commands. 105. Obtain the current operating conditions, and analyze the first phase reference duty cycle, the second phase reference duty cycle, and the third phase reference duty cycle based on the current operating conditions and the preset amplitude coefficient to obtain the thermal equilibrium adjustment command. In this embodiment, the current operating condition ensures that the thermal equalization adjustment command matches the actual operating state of the circuit, avoiding the thermal equalization adjustment command from deviating from reality and causing adjustment failure; the amplitude coefficient can quantify the intensity of thermal equalization adjustment, ensuring that the adjustment range is accurately matched with the demand. This can achieve precise implementation of thermal equalization adjustment, effectively optimize the junction temperature distribution of IGBT, reduce the three-phase junction temperature difference, ensure the safety of IGBT devices and the output stability of the three-phase drive circuit, and improve the reliability, stability and engineering practicality of the circuit operation. In this embodiment, the characteristic voltages of the IGBT devices in the three-phase drive circuit are first collected to ensure the timeliness and consistency of the data, laying a solid foundation for subsequent analysis. By pre-setting a linear mapping formula that matches the characteristics of the devices and the circuit, the sampled voltage is converted into the maximum junction temperature difference, clearly quantifying the degree of IGBT thermal imbalance and providing a clear basis for thermal equalization adjustment. The adjustment trigger boundary is defined by using the hysteresis threshold, and the adjustment strategy is flexibly switched according to the junction temperature difference to ensure the targeting and rationality of the adjustment and avoid blind adjustment. The three-phase reference duty cycle of the adaptive circuit is collected and analyzed in combination with the current operating conditions and amplitude coefficients to generate thermal equalization adjustment commands. This ensures that the commands match the actual operating state and quantifies the adjustment intensity, achieving precise implementation of thermal equalization, effectively optimizing the IGBT junction temperature distribution, reducing the junction temperature difference, ensuring device safety, extending service life, and improving the reliability, stability, and engineering practicality of the three-phase drive circuit.

[0018] Please see Figure 2 The second embodiment of the three-phase drive circuit thermal equalization adjustment method in this invention specifically includes: 201. Based on the linear mapping formula, the sampling voltages of the first phase, the second phase, and the third phase are converted to obtain the first real-time junction temperature, the second real-time junction temperature, and the third real-time junction temperature. In this embodiment, the linear mapping formula is preset based on IGBT device parameters and three-phase drive circuit characteristics. The core basis is the linear correlation between IGBT sampling voltage and junction temperature. The formula can be expressed as: T=k×U+b (where T is the real-time junction temperature, U is the sampling voltage, k is the linear coefficient, and b is the correction coefficient). k and b are predetermined through device calibration to ensure conversion accuracy. The controller substitutes the collected three-phase sampling voltages into the preset linear mapping formula for synchronous calculation to obtain the first, second, and third real-time junction temperatures one by one. During the calculation process, the voltage data is preprocessed to avoid junction temperature conversion errors caused by acquisition noise, ensuring the accuracy of the three-phase real-time junction temperatures. 202. Compare and analyze the first, second, and third real-time junction temperatures to obtain the highest and lowest junction temperatures; In this embodiment, the controller synchronously reads the first real-time junction temperature, the second real-time junction temperature, and the third real-time junction temperature. It adopts a step-by-step comparison method, first comparing the junction temperatures of any two phases, filtering out the highest and lowest values ​​in a certain stage, and then comparing the stage results with the junction temperature of the third phase to finally determine the highest and lowest junction temperatures among the three phases. The comparison process is fast and efficient, and adapts to real-time computing requirements. 203. Calculate the difference between the highest and lowest junction temperatures to obtain the maximum junction temperature difference; In this embodiment, the highest junction temperature corresponds to the device with the most severe heat generation, and the lowest junction temperature corresponds to the device with the least heat generation. The difference between the two is the core basis for subsequent calculation of the maximum junction temperature difference, providing a clear quantitative basis for thermal equilibrium demand analysis. In this embodiment, the three-phase sampling voltages are acquired synchronously to ensure data timeliness and consistency. A linear mapping formula is preset based on IGBT device parameters and circuit characteristics. The conversion accuracy is ensured by determining the coefficients through device calibration. The controller synchronously calculates and preprocesses the voltage data, effectively avoiding noise interference and accurately obtaining the real-time junction temperature of the three phases. The highest and lowest junction temperatures are quickly screened out by comparison, and the comparison is efficiently adapted to the real-time calculation requirements. The maximum junction temperature difference is then obtained by subtraction calculation, which clearly quantifies the degree of thermal imbalance of the three-phase IGBTs, providing a clear basis for thermal balance requirement analysis. At the same time, it ensures device safety, extends service life, and improves the stability and engineering practicality of the three-phase drive circuit.

[0019] Please see Figure 3 The third embodiment of the thermal equalization adjustment method for the three-phase drive circuit in this invention specifically includes: 301. Correct the first phase reference duty cycle, the second phase reference duty cycle, and the third phase reference duty cycle based on the maximum junction temperature difference to obtain the target duty cycle; In this embodiment, the maximum junction temperature difference is used as the core correction basis to make targeted corrections to the first phase reference duty cycle, the second phase reference duty cycle and the third phase reference duty cycle, and finally obtain the target duty cycle that meets the thermal balance requirements. The correction process is in line with the characteristics of the three-phase drive circuit and the requirements of IGBT devices, and can effectively optimize the conduction loss of each phase IGBT. 302. Calculate the target duty cycle according to the preset phase angle calculation formula to obtain the current phase angle; In this embodiment, the target duty cycle for adapting to the thermal equalization requirement is accurately calculated using a preset phase angle calculation formula to obtain the current phase angle. This formula fits the characteristics of the target duty cycle and the requirements of the three-phase drive circuit. It is accurate in calculation and clear in logic, providing a reliable timing reference for the subsequent generation of thermal equalization adjustment commands, ensuring that the adjustment commands are synchronized with the circuit operation sequence, helping the thermal equalization adjustment to be accurately implemented, and improving the stability and engineering applicability of the three-phase drive circuit. 303. Generate thermal equilibrium adjustment commands based on amplitude coefficient, current operating conditions, and current phase angle; In this embodiment, the amplitude coefficient quantifies the adjustment intensity, the current operating condition ensures that the thermal balance adjustment command fits the actual operating state, and the current phase angle provides a precise timing reference, which can realize the precise implementation of thermal balance adjustment, optimize the junction temperature distribution of IGBT, ensure device safety and circuit output stability, and improve the reliability and engineering practicality of the three-phase drive circuit. In this embodiment, the scheme uses the maximum junction temperature difference as the core correction basis to correct the reference duty cycles of the first phase, the second phase, and the third phase, obtaining a target duty cycle that meets the thermal equalization requirements. The correction process aligns with the characteristics of the three-phase drive circuit and the requirements of the IGBT devices, effectively optimizing the conduction losses of each IGBT. Subsequently, the target duty cycle is accurately calculated using a preset phase angle calculation formula to obtain the current phase angle. This formula aligns with the target duty cycle and circuit characteristics, is accurate in calculation, and has clear logic, providing a reliable timing reference for the subsequent generation of thermal equalization adjustment commands. Finally, the thermal equalization adjustment command is generated by combining the amplitude coefficient, the current operating conditions, and the current phase angle, achieving precise implementation of thermal equalization adjustment, optimizing the IGBT junction temperature distribution, ensuring device safety and stable circuit output, and improving the reliability, stability, and engineering practicality of the three-phase drive circuit.

[0020] Please see Figure 4 The fourth embodiment of the thermal equalization adjustment method for the three-phase drive circuit in this invention specifically includes: 401. Determine the adjustment amount based on the maximum junction temperature difference; In this embodiment, the determination of the adjustment amount is based on the maximum junction temperature difference calculated above. The maximum junction temperature difference directly reflects the degree of thermal imbalance of the three-phase IGBT. The larger the maximum junction temperature difference, the more serious the thermal imbalance, and the larger the adjustment amount. It is necessary to quickly optimize the junction temperature by correcting the duty cycle by a larger margin. The smaller the maximum junction temperature difference, the less severe the thermal imbalance, and the smaller the adjustment amount, so as to avoid excessive correction affecting the stability of the circuit output. 402. Calculate the reference duty cycle of the first phase, the reference duty cycle of the second phase, and the reference duty cycle of the third phase based on the adjustment amount to obtain the target duty cycle; In this embodiment, the formula for calculating the target duty cycle is as follows: In the formula, This is the final target duty cycle. The first phase reference duty cycle, For the second phase reference duty cycle, The duty cycle is the reference for the third phase. To adjust the amount, the formula is adapted to the three-phase reference duty cycle characteristics and adjustment requirements. The calculation is accurate and the logic is clear. It optimizes the IGBT conduction loss, reduces the three-phase junction temperature difference, avoids over-adjustment, ensures device safety and circuit output stability, and improves the reliability and engineering practicality of the three-phase drive circuit. In this embodiment, the adjustment amount is determined based on the maximum junction temperature difference. The magnitude of the adjustment amount is precisely matched with the degree of thermal imbalance of the three-phase IGBTs. The larger the maximum junction temperature difference, the larger the adjustment amount, ensuring the targeting and rationality of the adjustment. The first-phase reference duty cycle, the second-phase reference duty cycle, and the third-phase reference duty cycle are accurately calculated based on the adjustment amount to obtain the target duty cycle, which is adapted to the characteristics of the three-phase reference duty cycle and the adjustment amount requirements. The calculation logic is clear and the accuracy is reliable. It effectively optimizes the IGBT conduction loss, reduces the three-phase junction temperature difference, and ensures the safety of IGBT devices. Real-time calculation can be achieved using existing controllers, adapting to the dynamic operating conditions of the circuit. It not only ensures the stable output of the three-phase drive circuit, but also achieves precise implementation of thermal balance adjustment, improving the reliability, stability, and engineering practicality of the three-phase drive circuit.

[0021] Please see Figure 5 The fifth embodiment of the three-phase drive circuit thermal equalization adjustment method in this invention specifically includes: 501. Obtain the thermal equilibrium requirement and the current timestamp; 502. Analyze the thermal equilibrium requirements based on the maximum junction temperature difference and the preset equilibrium level library to obtain the target output frequency; In this embodiment, the current output frequency is determined based on the thermal equalization requirement. The equalization level library stores multiple adjustment levels based on the characteristics of the three-phase drive circuit and IGBT device parameters, divided according to the maximum junction temperature difference range. Each adjustment level corresponds to a clear output frequency adjustment direction and magnitude (e.g., the smaller the junction temperature difference, the lower the equalization level and the smaller the output frequency adjustment magnitude; the larger the junction temperature difference, the higher the equalization level and the larger the output frequency adjustment magnitude). The level division is clear and traceable, ensuring the standardization of the adjustment. The equalization level corresponding to the thermal equalization requirement is matched from the equalization level library based on the current maximum junction temperature difference. The adjustment direction and magnitude of the output frequency are determined according to the equalization level, and the output frequency is adjusted to the specific target output frequency, indirectly optimizing the IGBT conduction loss and junction temperature distribution. 503. Calculate the current phase angle based on the current timestamp, target output frequency, and target duty cycle using the phase angle calculation formula; In this embodiment, the controller substitutes the three main parameters into a preset phase angle calculation formula (such as θ(t)=2πft+φ(d), where θ(t) is the current phase angle, f is the target output frequency, t is the current timestamp, and φ(d) is the phase offset corresponding to the target duty cycle) and performs real-time calculations. During the calculation process, the data is filtered to avoid phase angle fluctuations caused by calculation errors or parameter mutations, ensuring a smooth transition of the phase angle and adapting to the dynamic operating conditions of the circuit. In this embodiment, the scheme obtains the thermal equalization requirement and the current timestamp to provide a clear adjustment guide and stable timing reference for the current phase angle calculation, ensuring the continuity and reliability of the calculation. Relying on the preset equalization level library, it divides the adjustment levels into multiple levels based on the characteristics of the three-phase drive circuit and the parameters of the IGBT device. The levels are clear and traceable. The corresponding equalization level is matched with the current maximum junction temperature difference. By clearly defining the direction and magnitude of the output frequency adjustment, the thermal equalization requirement is transformed into a specific target output frequency, which indirectly optimizes the IGBT conduction loss and junction temperature distribution. The controller substitutes the timestamp, target output frequency, and target duty cycle into the preset phase angle calculation formula for real-time calculation. At the same time, filtering is performed to avoid phase angle fluctuations, ensuring a smooth transition and adapting to the dynamic operating conditions of the circuit. This ensures the stable operation of the three-phase drive circuit, reduces the IGBT junction temperature difference, extends the device life, and balances the effectiveness of thermal equalization adjustment, engineering practicality, and adjustment standardization, adapting to various three-phase drive scenarios.

[0022] Please see Figure 6 The sixth embodiment of the thermal equalization adjustment method for the three-phase drive circuit in this invention specifically includes: 601. Analyze the current phase angle based on the amplitude coefficient to obtain the three-phase modulation signal; In this embodiment, the current phase angle is analyzed based on the amplitude coefficient to generate a three-phase modulation signal. The intention of thermal equalization adjustment can be accurately integrated into the modulation signal, adapting to the circuit operation phase, indirectly optimizing IGBT heating, ensuring stable three-phase output, and accurately adjusting device losses to reduce junction temperature difference and extend IGBT life. 602. Analyze the current operating conditions based on the preset drive circuit conduction conditions to obtain the analysis results; In this embodiment, the drive circuit conduction conditions are preset conditions that combine the three-phase drive circuit topology and IGBT device characteristics. These mainly include: no IGBT device faults (no over-temperature or over-current alarms), bus voltage within the normal range, no abnormal fluctuations in three-phase current, and drive unit readiness. The controller collects current operating parameters (such as bus voltage, three-phase current, IGBT status, drive unit status, etc.) in real time and compares them one by one with the preset drive circuit conduction conditions to determine whether all conditions are met. The controller outputs an analysis result of "conduction conditions met" or "conduction conditions not met". If the analysis result indicates that the conduction conditions are not met, the generation of thermal equalization adjustment commands is immediately paused, the original drive state is maintained, and an abnormality prompt is triggered to ensure circuit safety. If the conditions are met, the next command generation stage is initiated. 603. If the analysis result shows that the current operating conditions meet the conditions for the drive circuit to conduct, then generate a thermal equilibrium adjustment command based on the three-phase modulation signal and the preset loading parameters. In this embodiment, under the premise of ensuring the safe operation of the circuit, the three-phase modulation signal carrying the intention of thermal equalization is combined with preset loading parameters (parameters adapted to the IGBT driving characteristics, such as dead time, driving voltage, etc.) and converted into a thermal equalization adjustment command that can directly drive the IGBT, so as to realize the final implementation of thermal equalization adjustment. In this embodiment, a three-phase modulation signal is generated by analyzing the current phase angle using the amplitude coefficient. This signal can precisely integrate the intention of thermal equalization adjustment, adapting to the real-time operating phase of the circuit to ensure stable three-phase output. It can also indirectly optimize IGBT heating, precisely adjust device losses to reduce junction temperature difference, and effectively extend IGBT lifespan. By pre-setting the drive circuit conduction conditions that match the circuit topology and IGBT characteristics, a comprehensive comparison and analysis of the current operating conditions can be performed. Abnormal operating conditions can be identified in a timely manner, and adjustment can be paused and prompts can be triggered to ensure circuit operation safety. When the current operating conditions meet the drive circuit conduction conditions, an adjustment command is generated by combining the pre-set IGBT-adapted loading parameters and the three-phase modulation signal to achieve safe implementation of thermal equalization adjustment. This approach balances the effectiveness of thermal equalization adjustment with circuit operation safety and is suitable for various three-phase drive scenarios.

[0023] Please see Figure 7 The seventh embodiment of the thermal equalization adjustment method for the three-phase drive circuit in this invention specifically includes: 701. Determine the reference carrier amplitude based on the current phase angle; In this embodiment, the current phase angle is a core parameter reflecting the output phase state of the three-phase drive circuit. The reference carrier amplitude is determined by the phase angle to ensure that the reference carrier amplitude can match the current operating phase of the circuit, laying the foundation for the subsequent generation of a modulation signal that meets the output requirements. At the same time, it implies the initial adaptation of thermal equalization adjustment (the phase angle change is related to the IGBT conduction state and loss, and amplitude adaptation can indirectly optimize device heating). The controller (DSP / MCU+FPGA) has a pre-stored phase angle-reference carrier amplitude mapping table, reads the current phase angle data in real time, and quickly obtains the reference carrier amplitude by looking up the table. For dynamic phase change scenarios; 702. Calculate the current phase angle, reference carrier amplitude, and amplitude coefficient to obtain the reference sine wave; In this embodiment, the reference carrier amplitude is the basic amplitude determined based on the phase angle, and the amplitude coefficient is the core coefficient for thermal equilibrium adjustment (0 < K_amp ≤ 1, which can be dynamically adjusted according to the maximum junction temperature difference. The larger the temperature difference, the smaller the high-temperature phase coefficient); the reference sine wave amplitude (U_sin_ref) = the reference carrier amplitude (U_ref) × the amplitude coefficient (K_amp); taking the current phase angle as the reference, a sine wave with an amplitude of U_sin_ref and a frequency consistent with the target output frequency is generated, that is, the reference sine wave (u_sin_ref(t) = U_sin_ref × sin(θ(t)), where θ(t) is the current phase angle), providing a basis for the thermal equilibrium adaptation of the subsequent modulation signal; 703. Determine the three-phase carrier amplitudes according to the reference sine wave; In this embodiment, the three-phase carrier amplitudes (U_carrier) can be determined according to the maximum amplitude of the reference sine wave, usually taking 1.05 to 1.1 times the maximum amplitude of the reference sine wave, which not only avoids the distortion of the modulation signal caused by insufficient carrier amplitude but also avoids waste of resources caused by excessive carrier amplitude; 704. Calculate the ratio of the reference carrier amplitude and the three-phase carrier amplitudes to obtain the modulation coefficient; 705. Calculate the product of the preset basic sine wave form and the modulation coefficient to obtain the three-phase modulation signal; In this embodiment, through the ratio of the reference carrier amplitude and the three-phase carrier amplitudes, the characteristics of the reference waveform (including the intention of thermal equilibrium adjustment) are transformed into the modulation coefficient, thereby realizing the optimization of the basic sine wave form and finally generating the three-phase modulation signal adapted to the thermal equilibrium requirements; In this embodiment, through the precise linkage of core parameters such as the current phase angle, the reference carrier amplitude, and the amplitude coefficient, the deep adaptation of thermal equilibrium adjustment and the generation of the three-phase modulation signal is achieved. It can not only ensure that the reference carrier amplitude matches the circuit operation phase, laying a stable foundation for the generation of the modulation signal, but also integrate the thermal equilibrium intention into the reference sine wave through the amplitude coefficient to indirectly optimize the heating of the IGBT device; at the same time, the three-phase carrier amplitudes are reasonably set to avoid the distortion of the finally generated modulation signal and waste of resources, and the standardized modulation coefficient is obtained through ratio calculation, and finally the three-phase modulation signal adapted to the thermal equilibrium requirements is generated; the scheme does not require additional hardware investment and can achieve real-time operation based on the controller look-up table method, adapting to various three-phase drive scenarios.

[0024] The method for thermal equilibrium adjustment of the three-phase drive circuit in the embodiment of the present invention is described above. Next, the device for thermal equilibrium adjustment of the three-phase drive circuit in the embodiment of the present invention will be described. Please refer to Figure 8 , an embodiment of the device for thermal equilibrium adjustment of the three-phase drive circuit in the embodiment of the present invention includes: The first data acquisition module 1 is used to acquire the first phase sampling voltage, the second phase sampling voltage and the third phase sampling voltage of the three-phase drive circuit; The first analysis module 2 is used to analyze the first phase sampling voltage, the second phase sampling voltage and the third phase sampling voltage according to the preset linear mapping formula, so as to obtain the maximum junction temperature difference; Module 3 is used to determine whether the maximum junction temperature difference is less than the preset hysteresis threshold. The second data acquisition module 4 is used to acquire the first phase reference duty cycle, the second phase reference duty cycle, and the third phase reference duty cycle of the three-phase drive circuit if the maximum junction temperature difference is less than the hysteresis threshold. The second analysis module 5 is used to obtain the current operating conditions and analyze the first phase reference duty cycle, the second phase reference duty cycle and the third phase reference duty cycle according to the current operating conditions and the preset amplitude coefficient, so as to obtain the thermal equilibrium adjustment command. In this embodiment, the characteristic voltages of the IGBT devices in the three-phase drive circuit are first collected to ensure the timeliness and consistency of the data, laying a solid foundation for subsequent analysis. By pre-setting a linear mapping formula that matches the characteristics of the devices and the circuit, the sampled voltage is converted into the maximum junction temperature difference, clearly quantifying the degree of IGBT thermal imbalance and providing a clear basis for thermal equalization adjustment. The adjustment trigger boundary is defined by using the hysteresis threshold, and the adjustment strategy is flexibly switched according to the junction temperature difference to ensure the targeting and rationality of the adjustment and avoid blind adjustment. The three-phase reference duty cycle of the adaptive circuit is collected and analyzed in combination with the current operating conditions and amplitude coefficients to generate thermal equalization adjustment commands. This ensures that the commands match the actual operating state and quantifies the adjustment intensity, achieving precise implementation of thermal equalization, effectively optimizing the IGBT junction temperature distribution, reducing the junction temperature difference, ensuring device safety, extending service life, and improving the reliability, stability, and engineering practicality of the three-phase drive circuit.

[0025] Figure 9This is a schematic diagram of the structure of a three-phase drive circuit thermal equalization adjustment device 900 provided in an embodiment of the present invention. The three-phase drive circuit thermal equalization adjustment device 900 can vary significantly due to different configurations or performance. It may include one or more central processing units (CPUs) 910 (e.g., one or more processors) and a memory 920, and one or more storage media 930 (e.g., one or more mass storage devices) storing application programs 933 or data 932. The memory 920 and storage media 930 can be temporary or persistent storage. The program stored in the storage media 930 may include one or more modules (not shown in the diagram), each module may include a series of instruction operations on the three-phase drive circuit thermal equalization adjustment device 900. Furthermore, the processor 910 may be configured to communicate with the storage media 930 and execute a series of instruction operations in the storage media 930 on the three-phase drive circuit thermal equalization adjustment device 900 to implement the steps of the three-phase drive circuit thermal equalization adjustment method provided in the above-described method embodiments.

[0026] The three-phase drive circuit thermal equalization adjustment device 900 may also include one or more power supplies 940, one or more wired or wireless network interfaces 950, one or more input / output interfaces 960, and / or one or more operating systems 931, such as Windows Server, MacOSX, Unix, Linux, FreeBSD, etc. Those skilled in the art will understand that... Figure 9 The structure of the three-phase drive circuit thermal equalization adjustment device shown does not constitute a limitation on the three-phase drive circuit thermal equalization adjustment device. It may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0027] The present invention also provides a computer-readable storage medium, which can be a non-volatile computer-readable storage medium or a volatile computer-readable storage medium, wherein the computer-readable storage medium stores instructions that, when executed on a computer, cause the computer to perform the steps of a three-phase drive circuit thermal equalization adjustment method.

[0028] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working process of the system, device, or unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0029] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0030] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for thermal equalization adjustment of a three-phase drive circuit, characterized in that, include: The sampling voltages of the first, second, and third phases of the three-phase drive circuit are collected. The sampling voltages of the first phase, the second phase, and the third phase are analyzed according to the preset linear mapping formula to obtain the maximum junction temperature difference. Determine whether the maximum junction temperature difference is less than the preset hysteresis threshold; If the maximum junction temperature difference is less than the hysteresis threshold, the first phase reference duty cycle, the second phase reference duty cycle, and the third phase reference duty cycle of the three-phase drive circuit are collected. The current operating conditions are obtained, and the reference duty cycles of the first phase, the second phase, and the third phase are analyzed based on the current operating conditions and the preset amplitude coefficients to obtain the thermal equilibrium adjustment command.

2. The three-phase drive circuit thermal equalization adjustment method as described in claim 1, characterized in that, The step of analyzing the first-phase sampling voltage, the second-phase sampling voltage, and the third-phase sampling voltage according to a preset linear mapping formula to obtain the maximum junction temperature difference includes: The first phase sampling voltage, the second phase sampling voltage, and the third phase sampling voltage are converted according to the linear mapping formula to obtain the first real-time junction temperature, the second real-time junction temperature, and the third real-time junction temperature. The first, second, and third real-time junction temperatures were compared and analyzed to obtain the highest and lowest junction temperatures. The difference between the highest and lowest junction temperatures is calculated to obtain the maximum junction temperature difference.

3. The three-phase drive circuit thermal equalization adjustment method as described in claim 1, characterized in that, The process of analyzing the first-phase reference duty cycle, the second-phase reference duty cycle, and the third-phase reference duty cycle based on the current operating conditions and preset amplitude coefficients to obtain thermal equilibrium adjustment commands includes: The first-phase reference duty cycle, the second-phase reference duty cycle, and the third-phase reference duty cycle are corrected based on the maximum junction temperature difference to obtain the target duty cycle. The target duty cycle is calculated according to the preset phase angle calculation formula to obtain the current phase angle; A thermal equilibrium adjustment command is generated based on the amplitude coefficient, current operating conditions, and current phase angle.

4. The three-phase drive circuit thermal equalization adjustment method as described in claim 3, characterized in that, The step of correcting the first-phase reference duty cycle, the second-phase reference duty cycle, and the third-phase reference duty cycle based on the maximum junction temperature difference to obtain the target duty cycle includes: The adjustment amount is determined based on the maximum junction temperature difference; The target duty cycle is obtained by calculating the reference duty cycle of the first phase, the reference duty cycle of the second phase, and the reference duty cycle of the third phase based on the adjustment amount.

5. The three-phase drive circuit thermal equalization adjustment method as described in claim 3, characterized in that, The step of calculating the target duty cycle according to a preset phase angle calculation formula to obtain the current phase angle includes: Get the thermal equilibrium requirement and the current timestamp; The thermal equilibrium requirement is analyzed based on the maximum junction temperature difference and the preset equilibrium level library to obtain the target output frequency. The current phase angle is calculated based on the current timestamp, target output frequency, and target duty cycle using the phase angle calculation formula.

6. The three-phase drive circuit thermal equalization adjustment method as described in claim 3, characterized in that, The process of generating a thermal equilibrium adjustment command based on the amplitude coefficient, current operating conditions, and current phase angle includes: The current phase angle is analyzed based on the amplitude coefficient to obtain the three-phase modulation signal; The current operating conditions are analyzed based on the preset drive circuit conduction conditions to obtain the analysis results; If the analysis results indicate that the current operating conditions meet the conditions for the drive circuit to conduct, then a thermal equilibrium adjustment command is generated based on the three-phase modulation signal and the preset loading parameters.

7. The three-phase drive circuit thermal equalization adjustment method as described in claim 6, characterized in that, The step of analyzing the current phase angle based on the amplitude coefficient to obtain the three-phase modulation signal includes: Determine the reference carrier amplitude based on the current phase angle; The current phase angle, reference carrier amplitude, and amplitude coefficient are calculated to obtain the reference sine wave; The three-phase carrier amplitude values ​​are determined based on a reference sine wave. The ratio of the reference carrier amplitude to the three-phase carrier amplitude is calculated to obtain the modulation coefficient; The three-phase modulated signal is obtained by multiplying the preset basic sine waveform and the modulation coefficient.

8. A three-phase drive circuit thermal equalization adjustment device, characterized in that, include: The first data acquisition module is used to acquire the first phase sampling voltage, the second phase sampling voltage and the third phase sampling voltage of the three-phase drive circuit. The first analysis module is used to analyze the first phase sampling voltage, the second phase sampling voltage and the third phase sampling voltage according to the preset linear mapping formula, so as to obtain the maximum junction temperature difference. The judgment module is used to determine whether the maximum junction temperature difference is less than the preset hysteresis threshold. The second data acquisition module is used to acquire the first phase reference duty cycle, the second phase reference duty cycle, and the third phase reference duty cycle of the three-phase drive circuit if the maximum junction temperature difference is less than the hysteresis threshold. The second analysis module is used to obtain the current operating conditions and analyze the first phase reference duty cycle, the second phase reference duty cycle and the third phase reference duty cycle according to the current operating conditions and the preset amplitude coefficient, so as to obtain the thermal equilibrium adjustment command.

9. A three-phase drive circuit thermal equalization adjustment device, characterized in that, include: A memory and at least one processor, wherein the memory stores instructions; At least one of the processors invokes the instructions in the memory to cause the three-phase drive circuit thermal equalization adjustment device to perform the steps of the three-phase drive circuit thermal equalization adjustment method as described in any one of claims 1-7.

10. A computer-readable storage medium storing instructions thereon, characterized in that, When the instructions are executed by the processor, they implement the various steps of the three-phase drive circuit thermal equalization adjustment method as described in any one of claims 1-7.

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