A ttv automatic test system and test method

Abstract

The application relates to a TTV automatic test system and a test method, which comprise a single-channel heating power module, a single-channel temperature acquisition module, a 100-channel power control array, a 100-channel temperature acquisition module array, a system control industrial computer; the single-channel heating power module realizes independent heating control on a single heating unit of a test product; the single-channel temperature acquisition module independently acquires temperature signals of corresponding areas; the 100-channel power control array and the 100-channel temperature acquisition module array realize centralized management and synchronous control on more than 3000 heating channels and temperature acquisition channels. Through multi-channel power array control, array type temperature acquisition and industrial bus centralized control architecture, the application realizes controllable and adjustable heating power, real-time temperature acquisition and automatic data processing, improves data acquisition density, supports millisecond-level transient temperature acquisition, improves test efficiency and reduces test cost.

Description

Technical Field

[0001] This invention belongs to the field of automated thermal simulation testing technology in the semiconductor industry, specifically relating to an automated TTV testing system and method. Background Technology

[0002] After completing product design, the semiconductor industry typically conducts Thermal Test Validation (TTV) to verify whether the product's thermal performance meets design requirements. TTV testing usually utilizes fully packaged BGA products, which incorporate heating and temperature acquisition modules to simulate the heat generated during real-world product use. This allows for targeted optimization of product design or development of appropriate heat dissipation systems. Furthermore, the performance evaluation of thermally graded materials (such as thermal adhesives and graphene) also requires TTV testing. However, current TTV testing systems are generally performed manually or semi-automatically, resulting in numerous technical limitations.

[0003] First, manual testing has limited data acquisition capacity, failing to accurately reproduce actual thermal scenarios. Taking a 20×20mm semiconductor chip test die as an example, manual testing can currently only achieve heating control and temperature acquisition in a 5×5mm area. The density and accuracy of data acquisition are poor, making it difficult to meet the needs of refined thermal analysis. Second, manual control methods cannot simulate the real-world condition of instantaneous temperature rise in products. In actual use, chip power may suddenly increase, and the temperature will rise rapidly. The response speed and response time of manual acquisition and control are completely unable to simulate such transient thermal changes. Third, manual testing is extremely inefficient. For a 20×20mm test die, if heating control and acquisition are performed at a density of 1×1mm, up to 400 channels are required, making wiring and data recording extremely labor-intensive.

[0004] With the rapid development of artificial intelligence technology, the size of chip test dies is getting larger and larger, potentially reaching thousands of channels that need to be controlled and acquired simultaneously, making it almost impossible to complete manually. In addition, manual testing requires operators to have a high level of professional technical skills, needing to master circuit design, electrical engineering, wiring connections, and product performance, which increases the labor costs and technical barriers to implementation. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this invention is to provide an automated TTV testing system and testing method, which solves the above-mentioned technical problems existing in the prior art.

[0006] The objective of this invention can be achieved through the following technical solutions: An automated TTV testing system includes a single-channel heating power supply module, a single-channel temperature acquisition module, a 100-channel power control array, a 100-channel temperature acquisition module array, and a system control industrial computer. A single-channel heating power supply module is used to receive external control commands and set or read / write voltage and current values. A single-channel temperature acquisition module is used to receive external control commands and control the on / off state of the acquisition channel. It is set up one-to-one with the single-channel heating power supply module and is used to independently control the power of a single heating unit of the product under test and independently acquire the temperature signal of the corresponding area. A 100-channel power control array is used to install multiple single-channel heating power modules, configured as multiple groups in parallel, and communicates with the system control computer via an industrial bus. A 100-channel temperature acquisition module array is used to install multiple single-channel temperature acquisition modules. It is configured to be connected in parallel in multiple groups. It communicates with the system control computer via an industrial bus. It has an overall polling acquisition mode and a zoned high-speed instantaneous acquisition mode to achieve high-density temperature acquisition across the entire area. The zoned high-speed instantaneous acquisition mode achieves millisecond-level transient temperature change acquisition. The system controls an industrial computer that communicates with the 100-channel power control array and the 100-channel temperature acquisition module array via an industrial bus. It can independently configure the output voltage and current limit value of each single-channel heating power module, and manage the working mode of the temperature acquisition module array. It is used to send control commands, receive feedback data, and perform data processing and storage.

[0007] Furthermore, the system control industrial computer sends channel on / off control commands to each single-channel temperature acquisition module in the 100-channel temperature acquisition module array via the industrial bus communication protocol. The acquisition module turns on or off the corresponding acquisition channel according to the command, completes the acquisition of temperature signals, and transmits the data back to the system control industrial computer.

[0008] Furthermore, the temperature acquisition module array supports two operating modes, including overall polling acquisition mode and high-speed instantaneous acquisition mode.

[0009] Furthermore, the overall polling acquisition mode periodically polls all acquisition channels; the high-speed instantaneous acquisition mode selects a small number of channels that need to be acquired by region for high-speed acquisition.

[0010] Furthermore, the system control industrial computer is equipped with a parameter setting software module, which is used to set the output voltage value and limit current value of each single-channel heating power supply module in the software interface, and send the parameters to the corresponding power supply module through the industrial bus.

[0011] Furthermore, the system control industrial computer is equipped with a data acquisition and control software module, which is used to control the switching sequence of each module in the temperature acquisition module array through the industrial bus. The 100 acquisition modules complete one round of switching action according to the preset polling cycle.

[0012] Furthermore, the system control industrial computer is equipped with a data recording and visualization software module, which is used to automatically record the voltage and current parameter settings and real-time monitoring data of all power modules, as well as the data collected by all temperature acquisition modules, and generate power cloud maps and thermal cloud maps based on the recorded data.

[0013] Furthermore, the 100-channel power control array adopts a modular and scalable design, which can achieve parallel control of more than 3,000 heating channels by increasing the number of array units.

[0014] An automated TTV testing method includes the following steps: S1. Parameter Configuration: The industrial computer independently configures the voltage and current limiting parameters of each single-channel heating power supply module through the industrial bus. S2, Array expansion power supply: Through parallel expansion of 100-channel array, it can achieve synchronous power supply and heating of 3000+ channels; S3. Temperature acquisition mode selection: Select the overall polling mode to complete the 1×1mm high-density global temperature acquisition of the product under test, or select the zone high-speed instantaneous acquisition mode to complete the local millisecond-level transient temperature measurement. S4. Data Recording and Visualization: Automatically records power and temperature data for all channels, generating power cloud maps and thermal cloud maps.

[0015] The beneficial effects of this invention are: 1. This invention achieves precise synchronous control of over 3000 heating channels through a multi-channel power array control scheme, breaking through the limitation of traditional manual testing which can only perform area heating. Through array-type temperature acquisition technology, it supports both overall polling and high-speed instantaneous dual-mode acquisition, increasing data acquisition density from the existing 5×5mm to 1×1mm or even higher, meeting the needs of high-precision thermal simulation testing. Through an industrial bus centralized control architecture, the system controls the industrial control computer to uniformly send control commands and receive feedback data, achieving automated closed-loop control and significantly reducing the professional technical requirements for operators. Through software-controllable power adjustment technology, the parameters of each power module can be set in the software interface to achieve independent control of the heating power of each heating unit and monitor the current voltage and current values ​​in real time. Through data visualization technology, test data is automatically recorded and power and thermal cloud maps are generated, reducing human error and improving the accuracy and traceability of test data.

[0016] 2. Taking thermal simulation testing of a 20×20mm test grain as an example, manual measurement requires 2 to 3 people working together for more than 20 hours. After using the system of this invention, it can be completed by only 1 person in 8 hours, which improves the testing efficiency by 8 to 15 times and significantly enhances the testing efficiency.

[0017] 3. The test samples used in the system of this invention are test samples made of the same size, without the need to use real chip products for testing. Taking a 20×20mm product as an example, the testing cost is only 10% to 25% of that of a real product, which greatly reduces the economic cost of testing.

[0018] 4. This invention supports the simulation and acquisition of transient temperature changes with millisecond-level response time, which can realistically simulate the thermal scenario in which the power suddenly increases and the temperature rises rapidly during actual use of the product. It provides chip design manufacturers and heat dissipation system providers with real and reliable thermal simulation test data, and promotes the development of the semiconductor industry. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0020] Figure 1 This is a system principle topology diagram of this application; Figure 2 This is a flowchart of the test method structure of this application; Figure 3 This is a schematic diagram of the single-channel heating power supply module of this application; Figure 4 This is a schematic diagram of the single-channel temperature acquisition module of this application; Figure 5 This is the 1×1 data and temperature contour map of this application; Figure 6 This is the 5×5 data and temperature cloud map of this application. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0022] The specific embodiments of this invention will be described in detail with reference to the system drawings, illustrating the structural composition, working principle, and operation process of the TTV automated testing system. The following uses a 10×10mm test die as an example to describe the specific implementation process of the system achieving 1mm² precision heating control and temperature acquisition.

[0023] like Figure 1 The diagram shows the system's topology, illustrating the connections between a single-channel heating power supply module, a single-channel temperature acquisition module, a 100-channel power control array, a 100-channel temperature acquisition module array, a system control industrial computer, a system mounting cabinet, a cable adapter PCB, a product test motherboard, and the product under test. The overall system architecture uses the system mounting cabinet as the physical platform, integrating the 100-channel power control array, the 100-channel temperature acquisition module array, and the system control industrial computer. The system control industrial computer, as the core control unit, establishes communication connections with the power control array and the temperature acquisition module array via an industrial bus, enabling centralized control and data aggregation of the entire testing system. The cable adapter PCB and the product test motherboard serve as intermediary components for signal conversion and routing, connecting the electrical paths between the control cables and the product under test.

[0024] like Figure 3 As shown, in terms of power control, the 100-channel power control array has multiple module mounting slots, each capable of housing a single-channel heating power supply module. Each single-channel heating power supply module has a communication interface to receive control commands from the system control industrial computer. The system control industrial computer runs parameter setting software, which provides a human-machine interface. Operators can set the output voltage and current limit values ​​for each single-channel heating power supply module individually in the software interface. Based on the set parameters, the system control industrial computer sends voltage setting and current limit commands to the corresponding single-channel heating power supply module via the industrial bus. Upon receiving the commands, the single-channel heating power supply module outputs the corresponding operating voltage according to the specified voltage value and limits the output current according to the specified current limit value, thereby achieving precise and independent control of the heating power of each heating unit. During actual operation, the single-channel heating power supply module monitors its own output voltage and current values ​​in real time and transmits this real-time data back to the system control industrial computer via the industrial bus. The data recording and visualization software module in the system control industrial computer receives and records this real-time monitoring data, and operators can view the voltage and current operating status of each channel in real time on the software interface.

[0025] like Figure 4As shown, the 100-channel temperature acquisition module array also features multiple module mounting slots, each capable of housing one single-channel temperature acquisition module. Each single-channel temperature acquisition module corresponds one-to-one with a single-channel heating power supply module, meaning each heating unit has an independent temperature acquisition channel. Each single-channel temperature acquisition module has a communication interface to receive control commands from the system control industrial computer. The system control industrial computer runs a data acquisition and control software module, which manages the overall temperature acquisition process. The temperature acquisition module array supports two operating modes to meet the needs of different testing scenarios.

[0026] The first working mode is the overall polling acquisition mode, suitable for testing scenarios requiring a comprehensive understanding of the temperature distribution of the product under test. In this mode, the system control industrial computer sends channel on / off control commands sequentially to each single-channel temperature acquisition module in the temperature acquisition module array via an industrial bus. The specific operation process is as follows: First, an on command is sent to the first single-channel temperature acquisition module. Upon receiving the command, the module activates the corresponding acquisition channel and begins acquiring the temperature signal of the first test area. After acquisition is completed, the system control industrial computer sends a off command to the module, then sends an on command to the second single-channel temperature acquisition module, and so on. One round of switching actions by 100 acquisition modules completes the temperature acquisition of all 100 channels of the product under test. The module polling cycle can be set and adjusted in the software according to testing requirements. A shorter polling cycle results in better real-time temperature data acquisition, but the corresponding data processing volume will also increase.

[0027] In other words, the system controls the industrial control computer to perform full-area periodic polling and acquisition of temperature data according to a preset cycle, covering the entire test area of ​​the chip under test without blind spots. This enables ultra-high-density temperature data acquisition of 1×1mm, significantly improving the thermal scene reproduction and test data accuracy compared to traditional manual 5×5mm coarse acquisition. Figure 3 , Figure 4 As shown in Table 1, the specific parameters are compared below.

[0028] Table 1 Comparison Dimensions The solution of this invention (1×1mm) Traditional manual solution (5×5mm) Collection density The number of data collection points per unit area has increased 25 times, achieving ultra-high precision data collection at the 1mm² level, with extremely fine granularity. Sparse data collection points, coarse data collection at the 5mm² level, resulting in large data granularity. Temperature acquisition mode Dual Modes: Global Polling for Full-Domain Data Acquisition + High-Speed ​​Instantaneous Data Acquisition by Region It only supports single-point manual low-speed data acquisition and has no mode switching. Transient temperature acquisition capability Supports millisecond-level transient temperature change acquisition, realistically simulating power surge conditions. It lacks transient data acquisition capability, has a response time in the second range, and cannot simulate instantaneous temperature rise. Channel control scale Modular expansion supports synchronous parallel control and acquisition of 3000+ channels. It can only achieve localized control within a hundred channels and cannot be adapted to large-size chips. Data authenticity and distortion Point-by-point true sampling, no data smoothing distortion, 100% matching the actual thermal field of the chip. Large-area mean fitting leads to serious data distortion and masks microscopic hidden dangers. Human and time costs One person completed 20×20mm grain testing in 8 hours. Two to three people working together for at least 20 hours to complete a test of the same specifications. Test economic cost Using dedicated test samples, the cost is 10%-25% of that of actual chips. Real chips must be used, and the testing cost is extremely high. Thermal defect identification capability It can identify micro-defects such as micro-area hotspots, localized heat dissipation failures, and line overheating. Only the overall temperature can be observed; microscopic thermal hazards are masked by the average value. Data visualization and simulation benchmarking Automatically generates power and thermal cloud maps that can be accurately matched with simulation data; however, it lacks visual output and cannot be matched with simulation data. Automatically generates power and thermal cloud maps that can be accurately matched with simulation data; however, it lacks visual output and cannot be matched with simulation data. The two cloud images are respectively the solution of the present invention ( Figure 5 ), traditional manual solution ( Figure 6 The biggest breakthrough of this invention is clearly demonstrated: upgrading the industry's traditional 5×5mm coarse acquisition density to 1×1mm ultra-high density acquisition; relying on 100-channel array expansion and centralized industrial bus control, it can realize synchronous temperature measurement of thousands of channels, solving the pain points of low accuracy, small data volume and inability to reproduce real thermal scenarios in traditional manual testing. The 1×1mm high-precision cloud map can be accurately matched with simulation data, correct simulation parameters, and improve the reliability of chip thermal design.

[0029] The second working mode is the high-speed instantaneous acquisition mode, suitable for test scenarios that require simulating transient temperature changes when power suddenly increases during actual product use. In this mode, the system control industrial computer selects a small number of channels to be acquired by region through the data acquisition control software module, and only these selected channels are polled and acquired at high speed. Because the number of channels to be acquired is greatly reduced, the acquisition interval for each channel can be significantly shortened, thereby achieving the simulation and acquisition of transient temperature changes with millisecond-level response time. The operator can select the region to be acquired at high speed in the software interface and set the high-speed acquisition frequency parameters. The system will then execute the high-speed acquisition task according to the set parameters.

[0030] In terms of signal routing, the 100 power supply outputs from the 100-channel power control array are connected to a cable adapter PCB board via dedicated heating control cables. The cable adapter PCB board features multiple cable connectors, anti-misconnection structures, and clear markings to ensure correct connection of the heating control cables and prevent test anomalies due to operational errors. The cable adapter PCB board transmits signals to the product test motherboard via internal circuitry. The product test motherboard is electrically connected to each heating unit and temperature sensor of the product under test (DUT), transmitting power control signals to the heating modules within the DUT and simultaneously transmitting temperature signals collected by the temperature sensors back. The 100 temperature acquisition signals output from the temperature acquisition module array are also connected to the cable adapter PCB board via dedicated signal cables, and after conversion, transmitted to the product test motherboard, completing the connection with the temperature sensors of the DUT.

[0031] In terms of data processing and visualization, the data recording and visualization software module in the system control industrial computer is responsible for automatically recording and post-processing all data generated during the testing process. The software module automatically records the following: voltage and current parameter settings for all power modules, real-time monitoring data, data collected by all temperature acquisition modules, and timestamp information during the testing process. The recorded data is stored in a structured format in the industrial computer's storage device, facilitating subsequent data analysis and traceability. Based on the recorded data, the software module can generate power cloud maps and thermal cloud maps. The power cloud map visually displays the heating power distribution in various areas of the product under test during the testing process, while the thermal cloud map visually displays the temperature distribution in various areas of the product under test during the testing process. These two visualizations help operators quickly understand the thermal performance characteristics of the tested product, providing an intuitive reference for product design optimization.

[0032] Taking a 20×20mm test die for thermal simulation testing as an example, the system is configured with 400 single-channel heating power supply modules and 400 single-channel temperature acquisition modules to achieve heating control and temperature acquisition with an accuracy of 1mm². The 400 power supply modules are installed in a power control array, and the 400 temperature acquisition modules are installed in a temperature acquisition module array. The power control array and the temperature acquisition module array communicate with the system control computer via an industrial bus. Operators set the output voltage and current limit for each power supply module in the software to control the heating power of the corresponding customer product and monitor the current voltage and current in real time. The industrial computer controls the switching of each module in the temperature acquisition module array via the bus. One cycle of switching by the 400 acquisition modules completes the temperature acquisition of 400 channels of the product under test. If high-speed acquisition is required, a small number of channels can be selected for acquisition in different areas to achieve transient temperature acquisition.

[0033] The system employs industrial-grade communication protocols, including Modbus, PROFIBUS, or EtherCAT, to achieve high-speed and reliable communication between the system's control computer and various modules. The application of industrial buses enables centralized management and synchronous control of a large number of channels, overcoming the limitations of traditional manual testing which can only perform zone heating. The modular and scalable design allows the system to support the control and acquisition of more channels by increasing the number of array units, theoretically enabling parallel control and management of over 3000 heating channels and over 3000 temperature acquisition channels.

[0034] In the actual testing process, the operator first installs the product under test (DUT) onto the product test motherboard, ensuring that each heating unit and temperature sensor of the DUT correctly aligns with the connection terminals on the product test motherboard. Then, the operator sets the test parameters through the human-machine interface on the system control industrial computer, including the voltage and current setpoints for each channel, temperature acquisition mode, polling cycle, and data recording format. After the parameters are set, the operator starts the test. The system control industrial computer sends control commands to the power control array, and each single-channel heating power module begins heating the DUT. Simultaneously, the system control industrial computer sends acquisition commands to the temperature acquisition module array, and each single-channel temperature acquisition module begins collecting temperature data. During the test, the system control industrial computer receives and processes data from the power modules and acquisition modules in real time, displaying real-time monitoring information and visualizations on the software interface. After the test is completed, the system automatically saves all test data, and the operator can retrieve historical data for review and analysis at any time.

[0035] like Figure 2 Furthermore, the present invention also provides an automated TTV testing method adapted to the above-mentioned testing system, the specific steps of which are as follows: S1. Parameter Configuration: After the system is powered on and networked, the operator can independently configure the working voltage and current limiting parameters of each single-channel heating power supply module through the parameter setting software module on the system control industrial computer, and send the parameters to each power supply module through the industrial bus. S2, Array Expansion Power Supply: Utilizing the scalable feature of multiple parallel connections of the 100-channel power control array, the number of channels can be expanded as needed to achieve synchronous power supply and heating of 3000 channels or more, matching the high-density testing requirements of large-size chips; S3. Temperature Acquisition Mode Selection: Select the acquisition mode according to the test scenario: Select the overall polling mode to complete the full-area high-density temperature acquisition of the product under test with an accuracy of 1×1mm; or select the partitioned high-speed instantaneous acquisition mode to perform millisecond-level transient temperature acquisition of the local core area of ​​the chip. S4. Data Recording and Visualization: The data recording and visualization software module automatically stores all channel power parameters, operating data, and temperature acquisition data. After background processing, it automatically generates chip power cloud maps and thermal cloud maps, completing a complete set of automated thermal simulation tests. The data can be archived, traced, and used for product thermal design optimization.

[0036] The detailed system structure and operation process descriptions provided above enable those skilled in the art to implement this invention based on these descriptions. The provided TTV automated testing system achieves controllable and adjustable heating power, real-time temperature acquisition, and automated data processing, solving the technical problems of low data acquisition density, inability to simulate transient temperature changes, low testing efficiency, and high technical requirements for operators inherent in manual testing in the prior art.

[0037] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A TTV automated testing system, comprising a single-channel heating power supply module, a single-channel temperature acquisition module, a 100-channel power control array, a 100-channel temperature acquisition module array, and a system control industrial computer, characterized in that, A single-channel heating power supply module is used to receive external control commands and set or read / write voltage and current values. A single-channel temperature acquisition module is used to receive external control commands and control the on / off state of the acquisition channel. It is set up one-to-one with the single-channel heating power supply module and is used to independently control the power of a single heating unit of the product under test and independently acquire the temperature signal of the corresponding area. A 100-channel power control array is used to install multiple single-channel heating power modules, configured as multiple groups in parallel, and communicates with the system control computer via an industrial bus. A 100-channel temperature acquisition module array is used to install multiple single-channel temperature acquisition modules. It is configured to be connected in parallel in multiple groups. It communicates with the system control computer via an industrial bus. It has an overall polling acquisition mode and a zoned high-speed instantaneous acquisition mode to achieve high-density temperature acquisition across the entire area. The zoned high-speed instantaneous acquisition mode achieves millisecond-level transient temperature change acquisition. The system controls an industrial computer that communicates with the 100-channel power control array and the 100-channel temperature acquisition module array via an industrial bus. It can independently configure the output voltage and current limit value of each single-channel heating power module, and manage the working mode of the temperature acquisition module array. It is used to send control commands, receive feedback data, and perform data processing and storage.

2. The TTV automated testing system as described in claim 1, characterized in that, The system control computer sends channel on / off control commands to each single-channel temperature acquisition module in the 100-channel temperature acquisition module array via the industrial bus communication protocol. The acquisition module turns on or off the corresponding acquisition channel according to the command, completes the acquisition of temperature signals, and sends the data back to the system control computer.

3. The TTV automated testing system as described in claim 2, characterized in that, The temperature acquisition module array supports two working modes, including overall polling acquisition mode and high-speed instantaneous acquisition mode.

4. The TTV automated testing system as described in claim 3, characterized in that, The overall polling acquisition mode periodically polls all acquisition channels; the high-speed instantaneous acquisition mode selects a small number of channels that need to be acquired in different regions for high-speed acquisition.

5. The TTV automated testing system as described in claim 1, characterized in that, The system control industrial computer is equipped with a parameter setting software module, which is used to set the output voltage value and limit current value of each single-channel heating power supply module in the software interface, and send the parameters to the corresponding power supply module through the industrial bus.

6. The TTV automated testing system as described in claim 5, characterized in that, The system control industrial computer is equipped with a data acquisition and control software module, which is used to control the switching sequence of each module in the temperature acquisition module array through the industrial bus. The 100 acquisition modules complete one round of switching action according to the preset polling cycle.

7. The TTV automated testing system as described in claim 6, characterized in that, The system control computer is equipped with a data recording and visualization software module, which is used to automatically record the voltage and current parameter settings and real-time monitoring data of all power modules, as well as the data collected by all temperature acquisition modules, and generate power cloud maps and thermal cloud maps based on the recorded data.

8. The TTV automated testing system as described in claim 1, characterized in that, The 100-channel power control array adopts a modular and scalable design, which can achieve parallel control of more than 3,000 heating channels by increasing the number of array units.

9. An automated TTV testing method, characterized in that, Includes the following steps: S1. Parameter Configuration: The industrial computer independently configures the voltage and current limiting parameters of each single-channel heating power supply module through the industrial bus. S2, Array expansion power supply: Through parallel expansion of 100-channel array, it can achieve synchronous power supply and heating of 3000+ channels; S3. Temperature acquisition mode selection: Select the overall polling mode to complete the 1×1mm high-density global temperature acquisition of the product under test, or select the zone high-speed instantaneous acquisition mode to complete the local millisecond-level transient temperature measurement. S4. Data Recording and Visualization: Automatically records power and temperature data for all channels, generating power cloud maps and thermal cloud maps.

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