A mirror module, a synchrotron radiation device and a free electron laser device
By combining heating and cooling components in the reflector module, the problem of mirror thermal gradient caused by light spot movement, which traditional cooling solutions cannot handle, is solved. This enables precise temperature control of the reflective surface and meets the mirror shape requirements of fourth-generation light sources.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- INST OF ADVANCED SCI FACILITIES SHENZHEN
- Filing Date
- 2026-04-09
- Publication Date
- 2026-07-10
AI Technical Summary
Traditional side-contact uniform cooling solutions cannot effectively cope with the local high thermal gradient and non-uniform thermal expansion deformation of the mirror surface caused by the movement of high-energy light spots, affecting the atomic-level flatness of the mirror.
The design employs a combination of heating and cooling components. The heat-conducting block is connected to the cooling component and protrudes from the reflective surface. The heating element provides localized temperature compensation, and the cooling component provides uniform cooling, thus precisely controlling the temperature gradient of the reflective surface.
It effectively reduces the local high thermal gradient and non-uniform thermal expansion deformation of the reflective surface caused by changes in the position of the light spot, and realizes precise control of the dynamic thermal surface shape of the reflective surface, meeting the mirror shape requirements of the fourth-generation light source.
Smart Images

Figure CN122370832A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of lasers, and more particularly to a mirror module, a synchrotron radiation device, and a free-electron laser device. Background Technology
[0002] In synchrotron radiation sources and free-electron laser devices, the front plane mirror of the grating monochromator is crucial for achieving high-resolution spectra. To scan beams of different energies, this plane mirror needs to rotate off-axis. During this process, the high-energy, Gaussian-distributed light spot continuously moves across the mirror's reflective area, causing the position and distribution of the heat load absorbed by the mirror to dynamically change. This results in complex, non-uniform thermal expansion deformation of the mirror surface, severely disrupting its ideal atomic-level flatness. Traditional side-contact uniform cooling schemes cannot cope with the localized high thermal gradients caused by the light spot movement, offering extremely limited control over the dynamic thermal surface shape. Summary of the Invention
[0003] In view of this, the purpose of this application is to overcome the shortcomings of the prior art and provide a reflector module, a synchrotron radiation device and a free electron laser device.
[0004] To achieve the above objectives, the technical solution adopted in this application is as follows: This application provides: A mirror module having three perpendicular directions: a first direction, a second direction, and a third direction, comprising: A mirror body, the mirror body extending along the first direction and having a reflective surface along the third direction, and the mirror body having first surfaces on both sides along the second direction; A cooling assembly is connected to the mirror body and disposed on the first surface, and the cooling assembly is used to reduce the temperature of the reflective surface; A heating assembly is connected to the cooling assembly and is disposed on one side of the cooling assembly along the third direction. The heating assembly is used to compensate for the temperature of the reflective surface. The heating assembly includes a heat-conducting block and a heating plate. The heat-conducting block is connected to the cooling assembly and protrudes from the reflective surface along the third direction. The heating plate is disposed on the surface of the heat-conducting block facing the mirror body along the second direction.
[0005] Furthermore, the cooling assembly includes a cooling block and a cooling pipe. The cooling block is connected to the mirror body and disposed on the first surface. The cooling block is used to reduce the temperature of the reflective surface. The cooling pipe is connected to the cooling block. The heat-conducting block is disposed on the cooling block along the third direction side.
[0006] Furthermore, the heating assembly also includes a controller, the heating element is electrically connected to the controller, and there are multiple heating elements that are evenly spaced along the first direction.
[0007] Furthermore, the heat-conducting block has a heat-insulating groove along the third direction, and the heat-insulating groove is located between two adjacent heating elements.
[0008] Furthermore, the cooling block has a protrusion on the side facing the first surface, and the protrusion is connected to the mirror body.
[0009] Furthermore, the reflector module also includes a connecting layer that connects the bump to the mirror body. The connecting layer includes a thermally conductive layer disposed on the surface of the bump facing the mirror body.
[0010] Furthermore, the connecting layer also includes a protective layer, which is disposed between the thermally conductive layer and the bump, and is connected to both the bump and the thermally conductive layer.
[0011] Furthermore, the mirror body also has a second surface, and the reflecting surface is disposed opposite to the second surface; The bump has a fourth surface on the side facing the reflective surface along the third direction. Along the third direction, the fourth surface is located between the reflective surface and the second surface. The distance between the fourth surface and the reflective surface satisfies: 1mm≤H≤3mm.
[0012] This application provides a synchrotron radiation device, including the mirror module described in any one of the above-mentioned methods.
[0013] This application provides a free-electron laser device, including the mirror module described in any one of the above-mentioned methods.
[0014] This application provides a heating component located on one side of the cooling component along the third direction. It is connected to the cooling component by a heat-conducting block and protrudes from the reflective surface along the third direction. The heating element is placed on the surface of the heat-conducting block facing the mirror body along the second direction. It can compensate for the local temperature of the reflective surface by the heating component in response to the dynamic heat load caused by the movement of the light spot. Combined with the uniform cooling of the cooling component, it can effectively reduce the local high thermal gradient and non-uniform thermal expansion deformation of the reflective surface caused by the change of the light spot position. This enables precise control of the dynamic thermal surface shape of the reflective surface and overcomes the shortcomings of existing uniform cooling schemes that are difficult to cope with the local high thermal gradient caused by the movement of the light spot and have limited control effect on the dynamic thermal surface shape.
[0015] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This paper shows a schematic diagram of the reflector module structure without the heat insulation groove in this application. Figure 2 A cross-sectional schematic diagram of the reflector module of this application is shown; Figure 3 This paper shows a structural schematic diagram of the cooling and heating components in their assembled state. Figure 4 This paper shows a schematic diagram of the reflector module structure with the heat insulation groove provided in this application. Figure 5 This shows a top view of the reflector module with the heat insulation groove provided in this application; Figure 6 A schematic diagram of the light spot when ray with a wavelength of 2.3 nm is irradiated on a reflective surface is shown; Figure 7 A schematic diagram of the light spot when 4.35 nm wavelength rays of this application are irradiated onto a reflective surface is shown; Figure 8 The diagram shows the power trapezoidal diagrams of each heating element under conditions where the heat insulation groove is not provided and under irradiation with 2.3 nm wavelength rays. Figure 9 The diagram shows the height error distribution curve of the mirror body in the normal direction of the meridian under the condition that the heat insulation groove is not provided and under the irradiation of 2.3nm wavelength rays. Figure 10 The diagram shows the power trapezoidal diagrams of each heating element under conditions where the heat insulation groove is not provided and under irradiation with 4.35nm wavelength rays. Figure 11 The diagram shows the height error distribution curve of the mirror body in the normal direction of the meridian under the condition that the heat insulation groove is not provided and under the irradiation of 4.35nm wavelength rays. Figure 12 The diagram shows the power trapezoidal diagrams of each heating element under the condition of having a heat insulation groove and under irradiation with 2.3 nm wavelength rays. Figure 13 The diagram shows the height error distribution curve of the mirror body in the normal direction of the meridian under the condition that the heat insulation groove is provided and under the irradiation of 2.3nm wavelength rays. Figure 14The diagram shows the power trapezoidal diagrams of each heating element under the condition of having a heat insulation groove and under irradiation with 4.35nm wavelength rays. Figure 15 The diagram shows the height error distribution curve of the mirror body in the meridional normal direction under the condition of having a heat insulation groove and under irradiation with 4.35nm wavelength.
[0018] Explanation of key component symbols: 100-Mirror body; 101-Reflecting surface; 102-First surface; 103-Second surface; 200-Cooling assembly; 210-Cooling block; 211-Protrusion; 2110-Fourth surface; 220-Cooling pipe; 300-Heating assembly; 310-Heat-conducting block; 311-Heat insulation groove; 320-Heating plate; 400-Connecting layer; 410-Heat-conducting layer; 420-Protective layer; X-First direction; Y-Second direction; Z-Third direction; u-Meridian; v-Sagitta; a-Light spot. Detailed Implementation
[0019] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0020] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0022] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0023] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0024] See Figure 6 and Figure 7 As shown, in synchrotron radiation source devices and free-electron laser devices, the variable-pitch grating monochromator achieves energy scanning through the linkage of a mirror and a planar variable-pitch grating. As the wavelength changes, the front mirror (mirror body 100) needs to rotate off-axis to ensure the beam center hits the grating center, or more precisely, the landing point is within a small range near the grating center. Off-axis rotation of the mirror means that the beam spot will move on its surface during energy scanning. When the beam incident angle is very small, the beam spot moves significantly on the mirror, causing a change in the distribution of the heat load absorbed by the mirror. This introduces extremely high complexity to the surface shape control of the front mirror. For some free-electron laser beamlines, a tapered (variable parameter) undulator is required to enhance the pulse energy, operating at a high repetition frequency above 100 kHz. This results in very high laser power absorbed by the mirror, further increasing the difficulty of controlling the thermal surface shape of the front mirror. For fourth-generation light sources, the surface shape of the reflector is required to be extremely high. The height error (RMS) must be controlled below 1 nm and the slope error (RMS) must be controlled below 100 nrad (nanoradians). This undoubtedly poses a huge challenge to the design of the cooling scheme for the hot surface shape of the front reflector.
[0025] The heat absorbed by a reflector is usually distributed in a Gaussian pattern, with the power mainly concentrated at the center of the spot. Therefore, the temperature gradient from the center to the sides of the optical surface spot area of the reflector is large. Traditional cooling block structures provide uniform heat dissipation, and the cooling block has the same heat dissipation efficiency for the central area of the spot and the sides of the spot. This has a limited effect on improving the temperature gradient, thus limiting the control of mirror deformation.
[0026] To address the above issues, this application provides a reflector module. Specifically, the reflector module has two perpendicular directions: a first direction X, a second direction Y, and a third direction Z. The reflector module includes a mirror body 100, a cooling assembly 200, and a heating assembly 300. The mirror body 100 extends along the first direction X and has a reflective surface 101 along the third direction Z. The mirror body 100 has first surfaces 102 on both sides along the second direction Y. The cooling assembly 200 is connected to the mirror body 100 and disposed on the first surfaces 102. The cooling component 200 is used to reduce the temperature of the reflective surface 101. The heating component 300 is connected to the cooling component 200 and is disposed on the side of the cooling component 200 along the third direction Z. The heating component 300 is used to compensate for the temperature of the reflective surface 101. The heating component 300 includes a heat-conducting block 310 and a heating plate 320. The heat-conducting block 310 is connected to the cooling component 200 and protrudes from the reflective surface 101 along the third direction Z. The heating plate 320 is disposed on the surface of the heat-conducting block 310 facing the mirror body 100 along the second direction Y.
[0027] In the above, the first direction X is the left-right length direction of the mirror body 100, the second direction Y is the front-back width direction of the mirror body 100, and the third direction Z is the vertical height direction of the mirror body 100. The reflecting surface 101 is located on the upper surface of the mirror body 100 and is also the reflecting surface of the light beam. The first surface 102 is the side surface on both sides of the width of the mirror body 100. The first surface 102 is mainly used to install the cooling assembly 200 to cool the reflecting surface of the mirror body 100.
[0028] See Figures 1 to 3As shown, in this embodiment, each first surface 102 is provided with a cooling component 200. That is, the two cooling components 200 cool and dissipate heat on both sides of the reflective surface 101 of the mirror body 100. Correspondingly, in order to better compensate for the temperature of the reflective surface 101, each cooling component 200 is also fixedly provided with a heating component 300 to compensate for heat from both sides. Specifically, the heat-conducting block 310 is fixedly provided on the top of the cooling component 200, and the heating plate 320 is fixedly provided on the inner side of the heat-conducting block 310. The heat generated by the heating plate 320 is used to compensate for the temperature of the reflective surface 101 through the temperature transfer path formed by the heat-conducting block 310 and the cooling component 200. This prevents the reflective surface 101 from deforming due to a large temperature difference between the center of the light spot and the two sides of the light spot. The temperature gradient of the reflective surface 101 is reduced by the temperature compensation of the heating plate 320, thereby reducing the excessive deformation of the reflective surface 101 caused by the large temperature gradient.
[0029] It is understandable that the heat generated at different positions along the first direction X by the heating element 320 can compensate for the temperature of different areas of the reflective surface 101, thereby reducing the temperature gradient. For example, since the cooling component 200 has the same cooling effect on each area of the reflective surface 101 along the first direction X, the heat generated by the heating element 320 in the center area of the light spot can be reduced, while the heat generated on both sides of the center of the light spot can be increased to compensate for the temperature of the areas on both sides of the center of the light spot, thereby reducing the temperature gradient between the areas on both sides of the center of the light spot and the center of the light spot, and thus reducing the thermal deformation of the reflective surface 101 caused by the temperature gradient.
[0030] The uneven thermal deformation caused by the change in the position of the light spot is reduced by the thermal compensation of the reflective surface 101 by the heating element 320, and the heat load generated by the heating element 320 and the light spot is removed by the cooling component 200. Finally, the height error RMS value of the reflective surface 101 is less than 1 nm and the slope error RMS value is less than 100 nrad, which meets the requirements of the fourth generation light source.
[0031] In some embodiments, the cooling assembly 200 includes a cooling block 210 and a cooling pipe 220. The cooling block 210 is connected to the mirror body 100 and disposed on the first surface 102. The cooling block 210 is used to reduce the temperature of the reflective surface 101. The cooling pipe 220 is connected to the cooling block 210. A heat-conducting block 310 is disposed on the cooling block 210 along the third direction Z side.
[0032] Continue reading Figure 1 , Figure 2 as well as Figure 3As shown, the cooling assembly 200 used to cool the reflective surface 101 in this application adopts liquid cooling. The cooling block 210 of the substrate is connected to the first surface 102 of the mirror body 100. A cooling pipe 220 is fixedly connected to the cooling block 210. A flowing cooling medium is introduced into the cooling pipe 220. It can be understood that the heat from the light spot will be transferred to the cooling block 210 through the mirror body 100, and finally transferred to the cooling medium inside through the cooling pipe 220, thereby cooling the reflective surface 101 to control the surface shape of the reflective surface 101.
[0033] like Figure 3 As shown, an arc-shaped groove adapted to the outer circumference of the cooling pipe 220 is opened on the outer surface of the cooling block 210. The cooling pipe 220 is located in the arc-shaped groove and is fixedly connected to the cooling block 210 by welding.
[0034] In another embodiment, holes can be directly made in the cooling block 210 along the first direction X, and the holes contain a cooling medium. This method can also transfer the heat of the light spot absorbed by the reflective surface 101 to the cooling medium to achieve cooling and temperature reduction.
[0035] For example, the cooling block 210 and the cooling pipe 220 can be made of pure copper, copper alloy or aluminum alloy. In order to ensure thermal conductivity, in this embodiment, both the cooling block 210 and the cooling pipe 220 are made of pure copper.
[0036] In this embodiment, the cooling medium is water. In practice, the cooling medium can also be other liquids, which are not limited here.
[0037] In some embodiments, the heating assembly 300 further includes a controller, the heating element 320 is electrically connected to the controller, and there are multiple heating elements 320 that are evenly spaced along the first direction X.
[0038] See Figure 1 and Figure 4 As shown, in order to accurately control the temperature of thermal compensation in different areas of the reflective surface 101 along the first direction X, multiple heating elements 320 are connected to the inner wall of the heat-conducting block 310, and the heating elements 320 are evenly spaced along the first direction X of the heat-conducting block 310.
[0039] It is understandable that by controlling the heating power of the heating element 320 at different positions, the temperature of the reflective surface 101 at that position can be controlled, thereby reducing the temperature gradient on the reflective surface 101 and controlling the surface shape of the reflective surface 101.
[0040] In this embodiment, in order to ensure the heat transfer efficiency between the heat-conducting block 310 and the cooling block 210, the heat-conducting block 310 and the cooling block 210 are integrally formed.
[0041] In this embodiment, in order to further explain the effects of the solution of this application, the following examples are provided.
[0042] In this embodiment, the cooling pipe 220 is externally connected to a cooling water circulation system to provide cooling water at a constant temperature to the cooling block 210. For example, in this embodiment, the circulating cooling water is 22°C. In practice, other temperatures of cooling water can be selected, and this is not limited here. The mirror body 100 is made of single-crystal silicon and mainly receives X-rays in the range of 2.3nm to 4.35nm. The dimensions of the mirror body 100 are 500mm × 40mm × 50mm. Figure 5 and Figure 6 As shown, X-rays irradiate the reflecting surface 101 in a grazing incidence manner, forming a long strip of light spot. The light spot is symmetrically distributed along the meridian u. When the X-rays vary from 2.3 nm to 4.35 nm, the light spot is not symmetrically distributed along the meridian u.
[0043] See Figure 5 and Figure 6 As shown, regarding the wavelength of the rays, we take 2.3nm and 4.35nm as examples. When the ray is 2.3nm, the light spot is located at the center of the reflecting surface 101 at a position of -108.5mm. Figure 5 The light spot is 206.8 mm long and 2.4 mm wide, with a total heat load of 9.9 W on the 101 reflective surface absorbing the light spot; at 4.35 nm, the light spot is located 5.3 mm from the physical center of the reflective surface. Figure 6 The light spot is 245.4 mm long and 3.9 mm wide. The total heat load of the light spot absorbed by the reflective surface 101 is 18.8 W.
[0044] In this embodiment, each heating element 320 is a rectangular ceramic sheet with a length of 28mm × 8mm, and the spacing between two adjacent heating elements 320 is 3mm, totaling 16 elements. A controller controls these 16 heating elements 320 to reduce the temperature gradient of the reflective surface 101, thereby compensating for the surface shape of the reflective surface 101. The maximum output power of the heating elements 320 is generally limited to within 30W; in this embodiment, a default power limit of 20W is used. The surface shape of the reflective surface 101 at different wavelengths is mainly examined based on the surface shape of the light spot region, i.e., the surface shape of the meridian of the light spot region is used as the evaluation criterion. The controller controls the power of each heating element 320 to ensure that the reflective surface 101 reaches the target value.
[0045] like Figure 6 As shown, when the mirror body 100 operates under 2.3nm X-ray irradiation, the light spot deviates significantly from the physical center of the reflecting surface 101. Therefore, the optimized power of each heating element 320 is not symmetrical along both sides of the meridian u, as... Figure 8 As shown, the total heat input required from heating element 320 is 224.02W. Figure 9As shown, at this time, the RMS value of the thermal surface shape height error along the sagittal line v direction of the spot area is 0.13 nm, and the RMS value of the slope error is 7 nrad.
[0046] like Figure 7 As shown, when using 4.35nm X-rays, the mirror body 100 rotates off-axis to move the spot position closer to the physical center of the reflecting surface 101; as Figure 10 As shown, the optimized power of each heating element at 320° decreases along both sides of meridian u, as... Figure 7 As shown, the total heat input required from heating element 320 is 215.53W; Figure 11 As shown, the RMS value of the thermal surface shape height error along the sagittal line v in the spot area is 0.18 nm, and the RMS value of the slope error is 14.74 nrad. The thermal surface shape at both different wavelengths can be effectively controlled, and both the height error and the slope error are significantly lower than the requirements, which is extremely beneficial for beam transmission in monochromator devices.
[0047] In this embodiment, in order to enable the controller to accurately control the power of each heating element 320 to meet the surface shape requirements of the reflective surface 101, the output power of each heating element 320 can be calculated and analyzed by simulation software. Specifically, firstly, all electric heating elements are turned off, and a fixed cooling water temperature and flow rate and a fixed ambient temperature are used as boundary conditions. A heat load capable of absorbing a preset wavelength light spot is applied to the reflective surface 101 as a heat source. The thermal surface shape of the light spot area along the sagittal line v is calculated and used as the original surface shape. The thermal surface shape of the light spot area along the sagittal line v is taken as the target. The power of each heating element 320 is calculated to minimize the surface shape of the entire light spot area, and the output power of each heating element 320 does not exceed the maximum limit. Control instructions are written based on the calculated output power of each heating element 320, and the actual surface shape of the plane mirror is controlled by the controller.
[0048] In some embodiments, the heat-conducting block 310 has a heat insulation groove 311 along the third direction Z, and the heat insulation groove 311 is located between two adjacent heating elements 320.
[0049] See Figure 1As shown, since the adjacent heating elements 320 are spaced apart, but the heat-conducting blocks 310 on which the heating elements 320 are installed are connected, part of the heat generated by the heating elements 320 will be transferred vertically through the heat-conducting blocks 310 to the cooling blocks 210, and then transferred to the mirror body 100 and the corresponding reflective surface 101. Excess heat will be carried away by the water in the cooling pipe 220. Another part of the heat will be transferred laterally to the mounting positions of other heating elements 320. Due to the lateral transfer of heat from the heating elements 320, the heat cannot be concentrated and transferred to the corresponding area of the mirror body 100, thus affecting the temperature compensation effect of the reflective surface 101.
[0050] See Figure 4 and Figure 5 As shown, in order to prevent the heat generated by the heating element 320 from being transferred to the area of the adjacent heating element 320, multiple heat insulation grooves 311 are opened on the heat-conducting block 310, and the heat insulation grooves 311 are located between two adjacent heating elements 320, thereby cutting off the heat transfer channel between two adjacent heating elements 320 to improve the temperature compensation effect of the reflective surface 101.
[0051] like Figure 12 As shown, compared to the design described above where the heat-conducting block 310 does not have a heat insulation groove 311, the heat-conducting block 310 with a heat insulation groove 311, when applied to a 2.3nm wavelength, yields an optimized total heat input of 137.58W from the heating element 320; Figure 13 As shown, it is significantly smaller than the solution without the heat insulation groove 311 in Example 1. At this time, the RMS value of the thermal surface shape height error along the arc sagitta v direction of the light spot area is 0.08nm, and the RMS value of the slope error is 9.43nrad.
[0052] like Figure 14 As shown, the heat-conducting block 310 with the design of having heat insulation grooves 311, when applied to a wavelength of 2.3nm, achieves an optimized total heat input of 203.88W for the heating element 320, which is less than that of the scheme without heat insulation grooves 311 in Example 1; Figure 15 As shown, the RMS value of the thermal surface shape height error along the sagittal line v in the spot area is 0.15 nm, and the RMS value of the slope error is 8.93 nrad. It can be seen that the combination of the heat-conducting block 310 with the heat insulation groove 311 and the cooling block 210 can further reduce the additional heat input required for temperature compensation, which is beneficial to reducing the overall temperature rise of the mirror body 100. In addition, the thermal surface shape error in the spot area is also slightly lower than in Embodiment 1, indicating that the combination of the heat-conducting block 310 with the heat insulation groove 311 and the cooling block 210 can further improve the surface shape compensation effect of the front planar mirror.
[0053] In some embodiments, the cooling block 210 is provided with a protrusion 211 on the side facing the first surface 102, and the protrusion 211 is connected to the mirror body 100.
[0054] like Figure 2 As shown, heat transfer is achieved by connecting the bump 211 to 110. In order to improve the heat dissipation and heat compensation effect of the reflective surface 101, the bump 211 is set as close as possible to the reflective surface 101. Generally, the bump 211 is set at the top of the first surface 102 to improve the cooling effect and heat compensation effect.
[0055] In this embodiment, the protrusion 211 and the cooling block 210 are integrally molded and connected to improve heat transfer efficiency.
[0056] In some embodiments, the reflector module further includes a connecting layer 400, which connects the protrusion 211 to the mirror body 100. The connecting layer 400 includes a thermally conductive layer 410 disposed on the surface of the protrusion 211 facing the mirror body 100. The connecting layer 400 also includes a protective layer 420 disposed between the thermally conductive layer 410 and the protrusion 211, and connected to both the protrusion 211 and the thermally conductive layer 410.
[0057] See Figure 3 As shown, in order to improve the heat conduction efficiency, a heat-conducting layer 410 is provided on the surface of the bump 211 facing the mirror body 100. For example, the cooling block 210 can be an indium gallium liquid alloy film. Heat transfer is achieved by using the indium gallium liquid alloy film as a heat transfer medium. In order to prevent the indium gallium liquid alloy film from corroding the bump 211, a protective layer 420 is provided on the surface of the bump 211 facing the mirror body 100 to protect the bump 211. For example, the protective layer 420 can be a nickel plating layer.
[0058] It is understandable that using liquid alloy as a heat transfer medium can not only achieve heat transfer, but also effectively prevent the vibration generated by the flow of cooling water in the cooling pipe 220 from being transmitted to the mirror body 100, thereby improving the stability of the mirror body 100.
[0059] It should be noted that solid metal cannot be used as the heat transfer medium between the bump 211 and the mirror body 100. This is mainly because the material of the bump 211 is generally different from that of the mirror body 100, and the two have different coefficients of thermal expansion. After absorbing X-ray heat load, their thermal expansion amounts will not be the same. Generally, the coefficient of thermal expansion of pure copper is higher than that of single-crystal silicon, meaning that the thermal expansion amount of the bump 211 is higher than that of the mirror body 100. If a solid heat transfer medium is used to connect the bump 211 and the mirror body 100, the thermal expansion of the solid heat transfer medium (specifically copper) will cause additional deformation of the top of the mirror body 100 at the connection surface through static friction, affecting the surface shape control effect of the mirror body 100.
[0060] In some embodiments, the mirror body 100 further has a second surface 103, and the reflecting surface 101 is disposed opposite to the second surface 103; the protrusion 211 has a fourth surface 2110 on the side facing the reflecting surface 101 along the third direction Z, and the fourth surface 2110 is located between the reflecting surface 101 and the second surface 103 along the third direction Z, and the distance between the fourth surface 2110 and the reflecting surface 101 is H, which satisfies: 1mm≤H≤3mm.
[0061] See Figure 1 , Figure 2 as well as Figure 3 As shown, the second surface 103 is located on the bottom surface of the mirror body 100 and is opposite to the reflective surface 101. In this embodiment, the fourth surface 2110 is a stepped surface. The fourth surface 2110 is located on the top surface of the protrusion 211. The fourth surface 2110 is not flush with the reflective surface 101, but is located below the reflective surface 101. This avoids contamination of the reflective surface 101 when the protrusion 211 is attached to the mirror body 100 with the heat-conducting layer 410, thereby achieving the purpose of protecting the reflective surface 101.
[0062] For example, the distance between the fourth surface 2110 and the reflective surface 101 can be 1mm, 2mm, 3mm, etc., to prevent contamination of the reflective surface 101 during mounting due to too small a distance, and to prevent heat dissipation and thermal compensation of the reflective surface 101 due to too large a distance. In practice, the distance can be selected according to the design requirements, and the specific value is not limited here.
[0063] This application also provides a synchrotron radiation device, including the mirror module described in any of the above embodiments. The synchrotron radiation device has all the beneficial effects of the mirror module in any of the above embodiments, which will not be described in detail here.
[0064] This application also provides a free-electron laser device, including the mirror module described in any of the above embodiments. The free-electron laser device has all the beneficial effects of the mirror module in any of the above embodiments, which will not be described in detail here.
[0065] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0066] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.
Claims
1. A reflector module having a first direction (X), a second direction (Y), and a third direction (Z) that are perpendicular to each other, characterized in that, include: The mirror body (100) extends along the first direction (X) and has a reflective surface (101) along the third direction (Z), and has first surfaces (102) on both sides along the second direction (Y). A cooling assembly (200) is connected to the mirror body (100) and disposed on the first surface (102), the cooling assembly (200) being used to reduce the temperature of the reflecting surface (101); A heating assembly (300) is connected to the cooling assembly (200) and is disposed on one side of the cooling assembly (200) along the third direction (Z). The heating assembly (300) is used for temperature compensation of the reflective surface (101). The heating assembly (300) includes a heat-conducting block (310) and a heating plate (320). The heat-conducting block (310) is connected to the cooling assembly (200) and protrudes from the reflective surface (101) along the third direction (Z). The heating plate (320) is disposed on the surface of the heat-conducting block (310) facing the mirror body (100) along the second direction (Y).
2. The reflector module according to claim 1, characterized in that, The cooling assembly (200) includes a cooling block (210) and a cooling pipe (220). The cooling block (210) is connected to the mirror body (100) and disposed on the first surface (102). The cooling block (210) is used to reduce the temperature of the reflective surface (101). The cooling pipe (220) is connected to the cooling block (210). The heat-conducting block (310) is disposed on the cooling block (210) along the third direction (Z) side.
3. The reflector module according to claim 1, characterized in that, The heating assembly (300) further includes a controller, and the heating element (320) is electrically connected to the controller. The heating element (320) is a plurality of elements and is evenly spaced along the first direction (X).
4. The reflector module according to claim 1, characterized in that, The heat-conducting block (310) has a heat-insulating groove (311) along the third direction (Z), and the heat-insulating groove (311) is located between two adjacent heating elements (320).
5. The reflector module according to claim 2, characterized in that, The cooling block (210) has a protrusion (211) on the side facing the first surface (102), and the protrusion (211) is connected to the mirror body (100).
6. The reflector module according to claim 5, characterized in that, The reflector module further includes a connecting layer (400) that connects the bump (211) to the mirror body (100). The connecting layer (400) includes a heat-conducting layer (410) that is disposed on the surface of the bump (211) facing the mirror body (100).
7. The reflector module according to claim 6, characterized in that, The connecting layer (400) further includes a protective layer (420), which is disposed between the heat-conducting layer (410) and the protrusion (211), and is connected to the protrusion (211) and the heat-conducting layer (410) respectively.
8. The reflector module according to claim 5, characterized in that, The mirror body (100) also has a second surface (103), and the reflecting surface (101) is disposed opposite to the second surface (103); The protrusion (211) has a fourth surface (2110) on the side facing the reflective surface (101) along the third direction (Z). Along the third direction (Z), the fourth surface (2110) is located between the reflective surface (101) and the second surface (103). The distance between the fourth surface (2110) and the reflective surface (101) is H, which satisfies: 1mm≤H≤3mm.
9. A synchrotron radiation device, characterized in that, Includes the mirror module as described in any one of claims 1 to 8.
10. A free-electron laser device, characterized in that, Includes the mirror module as described in any one of claims 1 to 8.