An embedded RFID tag packaging apparatus and a packaging process thereof

By combining dual-mode pressure control, thermal coupling compensation, and environmental sensing sensors, the problem of unstable packaging in multi-material mixed-flow production of existing equipment has been solved, realizing efficient and stable packaging of RFID tags and improving the versatility of the equipment and production quality.

CN122373727APending Publication Date: 2026-07-10JIANGSU SML&CF CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
JIANGSU SML&CF CO LTD
Filing Date
2026-04-10
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Existing embedded RFID tag packaging equipment is difficult to adapt to mixed-material production, lacks a dynamic compensation mechanism for the thermal expansion differences of heterogeneous materials, and lacks environmental closed-loop control capabilities, resulting in brittle matrix damage, weak adhesion, electrostatic damage, and unstable curing quality.

Method used

The system employs a dual-mode pressure control unit, a thermal coupling compensation mechanism, and an environmental sensing sensor group to achieve real-time sensing and dynamic adjustment of the substrate material. Combined with a modular tool head group and a main control terminal, it performs packaging mode switching, temperature control, and environmental monitoring to ensure the consistency and stability of packaging quality.

Benefits of technology

It improves the equipment's compatibility with multiple materials, prevents damage to brittle substrates, ensures packaging accuracy and stability, reduces the risk of electrostatic damage, and achieves stable production quality in different environments.

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Abstract

This application relates to an embedded RFID tag packaging device and its packaging process, belonging to the field of radio frequency identification tag manufacturing technology. It includes: a base fixing support for supporting the main body of the device; a turntable sorting module disposed on the main body of the device for conveying and positioning the substrate to be packaged; a dual-mode pressure control unit for acquiring the material characteristics of the substrate and controlling the device to switch between contact pressing and non-contact suspension modes to apply packaging pressure; and a thermal coupling compensation mechanism disposed at the packaging station for temperature regulation of the packaging interface and precise displacement compensation combined with piezoelectric drive. This application utilizes the cooperation of the dual-mode pressure control unit and data acquisition sensors to obtain the substrate hardness in real time using piezoelectric detection technology and switches the execution mode accordingly. For hard substrates such as metals, the device adopts a contact pressing mode to output sufficient mechanical pressure to ensure uniform adhesive layer spreading and bonding strength.
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