A method for thermal bonding of YAG crystal in ultra-high vacuum environment
By using a thermal bonding method under ultra-vacuum conditions, the problem of poor bonding quality in large-size YAG crystals was solved, and a bonding interface with high thermal stability and mechanical strength was achieved, thereby improving the performance of the laser.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- QILU ZHONGKE INST OF OPTICAL PHYSICS & ENG TECH
- Filing Date
- 2026-04-28
- Publication Date
- 2026-07-17
AI Technical Summary
Existing technologies for bonding YAG crystals with large size and high performance requirements suffer from poor bonding quality, high process difficulty, and challenges in scaling up, especially in high-power lasers where thermal effects severely affect laser performance.
A thermal bonding method under ultra-vacuum conditions is adopted, including directional cutting, multi-pass grinding and polishing, ultrasonic cleaning and vacuum tungsten filament furnace thermal bonding, combined with annealing treatment, to form an excellent bonding interface, avoiding repeated heating and pressurization and wet etching processes.
It achieves excellent bonding interfaces for large-size YAG crystals, improves thermal stability and mechanical strength, mitigates thermal lensing effect, and enhances laser output efficiency, making it suitable for high-power lasers.
Smart Images
Figure CN122401665A_ABST