Glass-based high-performance magnetic inductor structure and manufacturing method thereof
By filling the space between two glass substrates with a three-dimensional inductor structure, the problems of substrate eddy current loss and low magnetic permeability of traditional inductors are solved, realizing a high-performance, high-frequency stable inductor suitable for 5G communication and high-performance computing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- XIAMEN SKY SEMICON TECH CO LTD
- Filing Date
- 2026-04-23
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional planar spiral inductors suffer from problems such as high substrate eddy current losses, low permeability of hollow glass-based inductors, and poor process compatibility with silicon-based magnetic cores, making it difficult to meet the requirements of modern radio frequency systems for high efficiency, low noise, and high bandwidth.
By employing a double-layer glass substrate structure and filling the space between it with a magnetic thin film to form a three-dimensional inductor, the magnetic thin film guides and concentrates the magnetic flux. Combined with the existing TGV-RDL manufacturing process, a high-performance, high-frequency stable and compact inductor is achieved.
It significantly improves inductance and quality factor within the same volume, avoids parasitic effects on silicon substrates, saves chip area, is suitable for high-density integration, and meets the needs of 5G communication and high-performance computing.
Smart Images
Figure CN122421771A_ABST