A built-in instant action generation script integrated intelligent control chip

Abstract

The application discloses a stacked integrated intelligent control chip with instant action generation script, and belongs to the technical field of intelligent control hardware and heterogeneous packaging technology.The chip adopts a 3D vertical stacked packaging structure, integrates a SIM identity communication chip on the top of a main chip, and realizes high-speed direct connection through a TSV (Through Silicon Via).An instant action generation script is stored in a nonvolatile storage unit inside the main chip, and the script is used for real-time calculation and dynamic generation of continuous action instructions according to external sensing signals, instead of executing a fixed sequence.An action logic operation core and an on-chip cache are built in the chip, and the whole action generation process is completed on the chip without the participation of external memory, CPU or cloud.The application realizes an end-side intelligent hardware architecture with self-determination, instant action generation and identity security after power-on, solves the problems of traditional controllers, such as dependence on external programs, high response delay, weak security and large memory occupation, and is suitable for scenes such as intelligent terminals and robots.

Description

Technical Field

[0001] This invention relates to the field of intelligent control hardware and heterogeneous packaging, and in particular to a stacked integrated intelligent control chip with built-in real-time action generation script. Background Technology

[0002] With the rapid development of intelligent control technology, the requirements for response speed, autonomous decision-making capabilities, and data security of control chips in intelligent terminals, industrial robots, and intelligent interactive devices are continuously increasing. Currently, mainstream intelligent controllers generally adopt a distributed architecture of "main control chip + independent communication module + external storage / processor + cloud collaboration," which has many technical shortcomings. High response latency: Traditional controllers rely on external CPU for computation, external memory for program storage, or cloud for command delivery. The transmission of sensor signals, data interaction, and command feedback links are long, making it difficult to meet the real-time action generation requirements at the millisecond or even microsecond level. In dynamic scenarios, action lag and control inaccuracy are prone to occur. Dependence on external resources: The control logic and action generation program are stored on external storage devices. The action instructions are preset fixed sequences, which can only execute programmed actions and cannot be dynamically adjusted in real time according to external sensor signals, resulting in poor adaptability. Furthermore, the entire process relies on external processor scheduling, resulting in low hardware integration and high system resource consumption. Weak security: The communication module is separated from the main control chip, making data transmission vulnerable to theft and tampering; the control program is stored on an external device, posing a risk of program copying, cracking, and malicious implantation; lacking hardware-level anti-tampering and identity authentication mechanisms, it is difficult to guarantee the security of control commands and interactive data. Low integration and high power consumption: Multi-chip discrete design requires a lot of PCB board space, complex wiring and high production and assembly costs; frequent data interaction between multiple modules will increase additional power consumption, which does not conform to the development trend of miniaturized and low-power intelligent devices.

[0003] In summary, existing intelligent control chip architectures cannot simultaneously meet the core requirements of edge-side autonomous decision-making, real-time action generation, high-security communication, and low-latency response. A highly integrated, fast-response, and secure all-in-one intelligent control chip solution that does not rely on external resources is needed. Summary of the Invention

[0004] Purpose of the invention: This invention provides a stacked integrated intelligent control chip with built-in real-time action generation scripts, which solves the defects of traditional controllers in the prior art, such as high response latency, dependence on external resources, weak security, and low integration. It provides a stacked integrated intelligent control chip with built-in real-time action generation scripts, which realizes an edge-side intelligent hardware architecture that can make autonomous decisions upon power-on, generate actions in real time, and has built-in identity security, without the need for external memory, CPU, or cloud participation, thereby improving control response speed, data security, and hardware integration.

[0005] Technical Solution: To solve the above-mentioned technical problems, according to one aspect of the present invention, more specifically, a stacked integrated intelligent control chip with built-in real-time action generation script, including a main control chip and a SIM identity communication chip, the specific structure and functional design of which are as follows: 3D stacked packaging architecture: The entire structure adopts a 3D vertical stacked packaging process, in which the SIM identity communication chip is stacked on top of the main control chip. The two are electrically directly connected through TSV silicon vias, replacing traditional gold wire bonding or PCB wiring connections, shortening the signal transmission path, improving the data interaction rate, and significantly reducing the overall size of the chip while improving integration.

[0006] Main control chip core design Internally integrated on-chip non-volatile memory units (such as Flash and EEPROM) are used to store real-time action generation scripts. These scripts contain preset dynamic decision-making logic and cannot be read, tampered with, or copied. It has a built-in motion logic operation core and an on-chip SRAM cache unit. The motion logic operation core is responsible for loading the fixed script, receiving external sensor signals (such as temperature, distance, attitude, image and other sensor data), and dynamically generating continuously changing motion instructions based on the real-time operation of the script, rather than executing a preset fixed motion sequence. The entire process of action generation and instruction output only calls on-chip SRAM cache resources, without relying on external memory or external processors, to achieve independent operation and control on the edge.

[0007] SIM identity communication chip function integration It is directly connected to the main control chip via TSV through-silicon vias, providing hardware-level identity recognition, data encryption, and anti-tampering security mechanisms. It is responsible for chip identity authentication, encrypted transmission of communication data, and hardware anti-tampering protection. It works with the main control chip to form an integrated trusted execution environment to prevent data leakage, instruction tampering, and illegal chip disassembly.

[0008] Power-on autonomous operation mechanism: After the chip is powered on, it automatically loads the fixed real-time action generation script from the on-chip non-volatile memory unit. The action logic operation core independently completes the reception of sensor signals, real-time calculation, action command generation and output, without the need for external program download, cloud computing, or edge scheduling, thus achieving autonomous control upon power-on.

[0009] Hardware-level security protection: The chip adopts a sealed packaging structure, and the on-chip embedded real-time action generation script has the characteristics of being unreadable, untamperable, and uncopyable, realizing algorithm protection at the hardware level and eliminating the risk of program cracking and malicious tampering. Beneficial effects

[0010] This invention employs 3D stacking + TSV through-silicon via direct connection, resulting in a short signal transmission path; the entire motion generation process is completed on-chip, requiring no external CPU, memory, or cloud involvement, thus improving the response speed to the microsecond level and adapting to the real-time control requirements in dynamic scenarios. This invention has a built-in solidified real-time action generation script, which can calculate and dynamically generate action instructions in real time based on external sensor signals, breaking away from the limitations of preset fixed sequences. It does not require external program download and scheduling, and can run independently upon power-up, adapting to complex and ever-changing control scenarios. This invention integrates a SIM identity communication chip, providing hardware-level identity authentication, encrypted communication, and anti-tampering capabilities; sealed encapsulation and immutable scripts construct end-to-end security protection from algorithm to communication, solving the problem of weak security in traditional architectures; This invention reduces chip size through 3D stacking packaging, thereby reducing PCB space and wiring complexity; it eliminates the need for external auxiliary chips, reducing hardware costs and system power consumption, and is suitable for miniaturized, low-power smart devices. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of the present invention. Detailed Implementation

[0012] To make the technical solution of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Example

[0013] A stacked integrated intelligent control chip with built-in real-time action generation scripts is disclosed. The chip has an overall size of 8mm×8mm×1.2mm and adopts a 3D vertical stacked packaging structure. The bottom layer is the main control chip and the top layer is the SIM identity communication chip. The two are electrically directly connected through 20 sets of TSV through-silicon vias. The TSV through-silicon vias have a diameter of 10μm and a spacing of 50μm to ensure high-speed data transmission.

[0014] The main control chip is manufactured using a 40nm process and integrates 128MB of non-volatile Flash memory, a dual-core motion logic operation core, and 64KB of on-chip SRAM cache. The Flash memory stores the robot's obstacle avoidance action generation script, which is a dynamic decision-making logic that includes sensor signal parsing, distance threshold judgment, path planning algorithm, and action command mapping.

[0015] SIM identity communication chip: It adopts a heterogeneous packaging process compatible with the main chip, supports 5G low power communication, and has built-in hardware encryption module (national cryptographic SM4 algorithm), identity authentication module, and anti-tampering detection module. It can monitor the chip packaging status in real time, and once illegal disassembly is detected, it immediately triggers the data self-destruction mechanism.

[0016] Workflow: After the chip is powered on, the dual-core motion logic operation core automatically loads the obstacle avoidance script from Flash and initializes the on-chip SRAM cache unit; external infrared and ultrasonic sensors collect obstacle distance and position signals in real time and transmit them to the motion logic operation core through the chip's peripheral interface; the operation core performs real-time calculations based on the script and dynamically generates continuous action commands such as "forward, decelerate, turn, stop" and outputs them directly to the robot drive module; the SIM chip simultaneously completes chip identity authentication and encrypts the transmission of sensor data and action commands to prevent data leakage and tampering.

[0017] In this embodiment, the chip does not require an external CPU or memory, nor does it require cloud assistance. Its response latency is ≤1μs, enabling real-time autonomous control of the robot's dynamic obstacle avoidance and providing hardware-level security protection capabilities. Example

[0018] In this embodiment, the above-mentioned chip is applied to a smart interactive terminal (such as a smart voice remote control). The main control chip Flash has a script for generating voice interaction actions embedded in it, which integrates voice signal parsing, command recognition, and device control logic. The SIM chip provides device authentication and encrypted communication functions to ensure the security of control command transmission.

[0019] After the chip powers on, it receives voice signals from the microphone in real time, analyzes and recognizes them through an action logic processing core, and dynamically generates action commands such as "power on," "adjust volume," and "switch channels" to directly control the terminal device. This requires no external processor or cloud support, offering rapid response and high security. The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A stacked integrated intelligent control chip with built-in real-time action generation script, comprising a main control chip and a SIM identity communication chip, characterized in that: The SIM identity communication chip is stacked on top of the main control chip using a 3D vertical stacking packaging process. The two are electrically directly connected through a TSV through-silicon via array, forming a heterogeneous integrated chip structure. The main control chip integrates an on-chip non-volatile memory unit, an action logic operation core, and an on-chip cache unit. The on-chip non-volatile memory unit stores a real-time action generation script, which is a preset dynamic decision logic program that is unreadable, unalterable, and uncopyable.

2. The stacked integrated intelligent control chip with built-in real-time action generation script as described in claim 1, characterized in that, The real-time action generation script is compatible with various types of external sensor signal inputs, including but not limited to temperature, distance, posture, image, voice, and pressure sensor data. It is used to receive sensor signals, perform real-time calculations, and dynamically generate continuously changing action commands. Unlike traditional execution programs that preset fixed action sequences, it can adaptively adjust the command output according to changes in the external environment.

3. The stacked integrated intelligent control chip with built-in real-time action generation script as described in claim 1, characterized in that, The action logic operation core is a single-core or dual-core architecture and adopts a dedicated control operation logic design; the on-chip high-speed cache unit is an SRAM cache unit. The entire process of action generation, logic operation, instruction temporary storage and output only calls the resources of the on-chip SRAM cache unit, and does not rely on external memory, external processor and external operation unit to participate in data processing and instruction generation.

4. The stacked integrated intelligent control chip with built-in real-time action generation script as described in claim 1, characterized in that, The SIM identity communication chip is a hardware-level secure communication module that supports low-power communication standards. It has a built-in hardware encryption module, identity authentication module, and anti-tampering detection module. The hardware encryption module uses national cryptographic algorithms to achieve encrypted data transmission. The identity authentication module is used for unique chip identification and trusted device authentication. The anti-tampering detection module monitors the chip packaging status in real time and triggers a data self-destruction mechanism when the chip is illegally disassembled. Together with the main control chip, it builds an integrated trusted execution environment.

5. A stacked integrated intelligent control chip with built-in real-time action generation script as described in claim 1, characterized in that, The TSV through-silicon via array contains 10-30 groups of through-silicon vias, with a diameter of 8-12 μm for each group and a spacing of 40-60 μm between adjacent through-silicon vias. The high-density through-silicon via layout enables high-speed, low-latency data interaction between the main control chip and the SIM identity communication chip.

6. The stacked integrated intelligent control chip with built-in real-time action generation script as described in claim 1, characterized in that, The on-chip non-volatile storage unit is a Flash storage unit or an EEPROM storage unit, with a storage capacity configured from 64MB to 256MB. It can stably store real-time action generation scripts of varying complexity. Once the script is stored, it is permanently locked and has no external read or modify interface.

7. A stacked integrated intelligent control chip with built-in real-time action generation script as described in claim 1, characterized in that, After power-on, the chip requires no external program download, cloud computing power support, or edge device scheduling. It automatically loads the fixed real-time action generation script from the on-chip non-volatile memory unit. The action logic operation core immediately starts receiving sensor signals, performing real-time logic operations, and outputting action commands, achieving microsecond-level autonomous decision-making and control response upon power-on.

8. A stacked integrated intelligent control chip with built-in real-time action generation script as described in claim 1, characterized in that, The main control chip is manufactured using a mature 28nm-40nm process technology and integrates peripheral interfaces including I2C, SPI, UART and general IO interfaces. It can directly connect to various sensors and drive modules and complete signal acquisition and command output without the need for additional adapter chips.

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