Display module and display device

Abstract

The utility model provides a display module and a display device, and belongs to the technical field of display. The display module is divided into a middle area and an edge area surrounding the middle area; the display module comprises: a display substrate; the cover plate is positioned on the light-emitting surface side of the display substrate; the first box dam and the second box dam are both located in the edge area and arranged around the middle area; the first box dam is located on the periphery of the display substrate, and a certain distance is formed between the first box dam and the display substrate; the second box dam is closer to the middle area than the first box dam, and the second box dam is located on the backlight face side of the display substrate; the first box dam, the second box dam, the display substrate and the cover plate define a containing space located in the edge area. The containing space is filled with the edge sealing glue, and the edge sealing glue is used for sealing the edge of the display substrate.

Description

Technical Field

[0001] The present disclosure belongs to the field of display technology, and particularly relates to a display module and a display device. Background Art

[0002] With the development of active matrix organic light-emitting diode (AMOLED) display technology, the borders of flexible AMOLED products are gradually reduced, the screen-to-body ratio is gradually increased, and the product thickness is gradually reduced. In order to further improve the user experience, a display product with a narrower border is a technical problem that needs to be solved urgently. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art and provides a display module and a display device.

[0004] An embodiment of the present disclosure provides a display module, which is divided into a middle area and an edge area surrounding the middle area; the display module includes:

[0005] Display substrate;

[0006] A cover plate, located on the light emitting surface side of the display substrate;

[0007] The first dam and the second dam are both located in the edge region and are arranged around the middle region; the first dam is located at the periphery of the display substrate and has a certain distance from the display substrate; the second dam is closer to the middle region than the first dam, and the second dam is located on the backlight side of the display substrate; the first dam, the second dam, the display substrate and the cover plate define an accommodation space located in the edge region;

[0008] The edge sealing glue fills the accommodating space and is used to seal the edge of the display substrate.

[0009] Wherein, a first buffer portion is provided on the end surface of the first dam close to the cover plate, and the material hardness of the first buffer portion is less than the material hardness of the first dam; and / or a second buffer portion is provided on the end surface of the second dam close to the display substrate, and the material hardness of the second buffer portion is less than the material hardness of the second dam. Wherein, the display module further includes at least one connecting portion, which is located on a side of the first dam and the second dam away from the cover plate and connected to the first dam and the second dam.

[0010] Wherein, the materials of the first buffer part and the second buffer part both include silicone.

[0011] The first enclosure dam and the second enclosure dam are both made of steel sheets.

[0012] Among them, the display substrate includes a display part, a bending part and a pad part; the display part is opposite to the cover plate, the pad part is located on the side of the display part away from the cover plate, and the bending part is connected to one side of the display part to connect the display part and the pad part.

[0013] The second dam includes a first sub-dam arranged on a side of the pad portion away from the display portion, and a second sub-dam arranged on a side of the display portion away from the cover plate; the distance between the first sub-dam and the pad portion is not less than the distance between the second sub-dam and the display portion.

[0014] The second dam includes a first sub-dam arranged on a side of the pad portion away from the display portion, and a second sub-dam arranged on a side of the display portion away from the cover plate; the display module also includes a first connecting portion arranged on a side of the first sub-dam away from the pad portion, and the first connecting portion connects the first dam and the first sub-dam.

[0015] The display module further includes a second connecting portion disposed on a side of the second sub-dam away from the display portion, and the second connecting portion connects the first dam and the second sub-dam.

[0016] Wherein, the arrangement density of the first connection parts is greater than the arrangement density of the second connection parts; and / or, the size of the first connection parts is greater than the size of the second connection parts.

[0017] Among them, the display module also includes a frame; the frame includes a retaining wall portion and a bearing portion, the bearing portion is located on the side of the first dam away from the cover plate, and is fixed to the first dam; the retaining wall portion surrounds the first dam and the cover plate, and is fixed to the first dam and the cover plate.

[0018] Wherein, the distance between the retaining wall portion and the bending portion is 0.4 mm.

[0019] The retaining wall portion includes a first sub-retaining wall opposite to the bending portion, and a second sub-retaining wall connected to the first sub-retaining wall, and the maximum width of the first sub-retaining wall is 0.1 mm greater than the maximum width of the second sub-retaining wall.

[0020] The first dam is closer to the middle area than the edge of the cover plate, and the distance from the first dam to the edge of the cover plate is 0.05-0.15 mm.

[0021] An embodiment of the present disclosure provides a display device, which includes any of the display modules described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1A partial cross-sectional schematic diagram of an exemplary display module.

[0023] Figure 2 is a schematic diagram of an exemplary display substrate.

[0024] Figure 3 A pixel circuit diagram in a pixel area of ​​a display substrate.

[0025] Figure 4 It is a partial cross-sectional schematic diagram of a display module according to an embodiment of the present disclosure.

[0026] Figure 5 It is a top view of the backlight side of the display module of the embodiment of the present disclosure.

[0027] Figure 6 It is a top view of the first dam, the second enclosure plate and the connecting portion of the display module of the disclosed embodiment.

[0028] Figure 7 for Figure 6 AA cross-section diagram in.

[0029] Figure 8 for Figure 6 BB cross-section diagram in.

[0030] Fig. 9 for Figure 6 CC cross-section diagram in .

[0031] Fig.10 for Figure 5 Cross-sectional view of the unfilled edge banding adhesive at position A in the middle.

[0032] Fig.11 for Figure 5 Cross-sectional view of the unfilled edge banding adhesive at position B in the middle.

[0033] Fig.12 for Figure 5 Cross-sectional view of the edge-sealing adhesive at position A in the middle.

[0034] Fig.13 for Figure 5 Cross-sectional view of the edge-sealing adhesive at position B in the middle.

[0035] Fig.14 It is a partial cross-sectional view of another display module according to an embodiment of the present disclosure.

[0036] Fig.15 Schematic diagram of each film layer of the display part of an embodiment of the present disclosure. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0038] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0039] In the following description, when an element or layer is referred to as being "on" or "connected to" another element or layer, the element or layer may be directly on or directly connected to the other element or layer, or there may be intervening elements or layers. However, when an element or layer is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or layers. The term "and / or" includes any and all combinations of one or more of the associated listed items.

[0040] Although the terms first, second, etc. can be used here to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish an element, component, region, layer and / or part from another element, component, region, layer and / or part. Therefore, without departing from the teaching of the present disclosure, the first element, first component, first region, first layer and / or first part discussed below can be referred to as the second element, second component, second region, second layer and / or second part.

[0041] For descriptive purposes, spatially relative terms such as "under," "beneath," "below," "above," "on," and the like may be used herein to describe the relationship of one element or feature to another (other) element or feature as shown in the figures. In addition to the orientations depicted in the drawings, the spatially relative terms are intended to include different orientations of the device in use, operation, and / or manufacture. For example, if the device in the drawings is turned over, an element described as "under" or "beneath" other elements or features will subsequently be positioned as "above" the other elements or features. Thus, the exemplary term "under" may include both above and below orientations.

[0042] Figure 1 is a partial cross-sectional schematic diagram of an exemplary display module; Figure 1 As shown, the display module is divided into a middle area Q1 and an edge area Q2. The display module includes a display substrate 1, a cover plate 2 located on the light emitting surface side of the display substrate 1, and a frame 3 located in the edge area Q2 and surrounding the middle area Q1.

[0043] Figure 2 is a schematic diagram of an exemplary display substrate; Figure 2 As shown, the display substrate is a flexible display substrate, which is divided into a display area AA, a peripheral area PA surrounding the display area AA, a pad area WA located on the side of the peripheral area PA away from the display area AA, and a bending area BA located between the peripheral area PA and the pad area WA and configured to be bent along a bending axis BX. For edge description, the portion of the peripheral area PA located between the bending area BA and the display area AA is referred to as a connection area TPA. Figure 1 , in Figure 2 When the display substrate shown is applied to a display module, the bending area of ​​the display substrate 1 needs to be bent along the bending axis BX so that the pad area WA is placed on the backlight side of the display substrate 1. For ease of understanding, the portion of the display substrate 1 facing the cover plate, that is, the position of the display area DA and the peripheral area PA is referred to as the display portion 101, the display substrate 1 and its display portion 101 are opposite, that is, the position corresponding to the pad area WA is referred to as the pad portion 102, and the position of the display substrate 1 connecting the display portion 101 and the pad portion 102, that is, the position corresponding to the bending area BA is referred to as the bending portion 103.

[0044] The display substrate 1 includes a base substrate, and a signal line 11 is arranged on the base substrate. For example, the signal line 11 includes a plurality of gate lines GL (Gate Line) extending along the x direction and a plurality of data lines DL (Data Line) extending along the y direction. The plurality of gate lines GL and the plurality of data lines DL cross to define a plurality of pixel areas, each of which is provided with a pixel P (Pixel), and each pixel P has an organic light-emitting element, such as an organic light-emitting diode OLED (Organic Light-Emitting Diode). Since the light emitted by the organic light-emitting diode can be used to display an image, the area where the plurality of pixel areas P are located is defined as a display area AA. The peripheral area PA is arranged outside the display area AA, and the peripheral area PA cannot display an image and is a non-display area.

[0045] Figure 3 is a pixel circuit diagram in a pixel area of ​​a display substrate; Figure 3 As shown, each pixel P includes a pixel circuit PC (Pixel Circuit) connected to the gate line GL and the data line DL of the pixel P and an organic light emitting diode OLED connected to the pixel circuit PC. The pixel circuit PC includes a driving thin film transistor (Thin-film Transistor, TFT) Td, a switching TFT Ts and a storage capacitor Cst. The switching TFT Ts is connected to the gate line GL and the data line DL, and is configured to transmit the data signal received through the data line DL to the driving TFT Td according to the scan signal received through the gate line GL. The storage capacitor Cst is connected to the switching TFT Ts and the driving voltage line PL, and is configured to store a voltage corresponding to the difference between the voltage received from the switching TFT Ts and the driving voltage ELVDD supplied to the driving voltage line PL. The driving TFT Td is connected to the driving voltage line PL and the storage capacitor Cst, and can be used to control the driving current flowing from the driving voltage line PL to the organic light emitting diode OLED according to the voltage value stored in the storage capacitor Cst. The organic light emitting diode OLED can emit light with a desired brightness by the driving current. The organic light emitting diode OLED can emit, for example, red light, green light, blue light or white light. Although Figure 2 , the pixel P includes two TFTs and one storage capacitor Cst, but the exemplary embodiments of the present disclosure may adopt different arrangements of transistors and memories. In other embodiments, the pixel circuit PC of the pixel P may include three or more TFTs or two or more storage capacitors.

[0046] Continue to refer to Figure 2, the display substrate 1 also includes a plurality of connecting pads 4 located in the pad area WA, each connecting pad 4 being configured to electrically connect a signal line 11 extending from the display area AA or the peripheral area PA. The connecting pad 4 may be exposed on the surface of the pad area WA, that is, not covered by any layer, so as to facilitate electrical connection to the flexible printed circuit board FPCB (Flexible Print Circuit Board). The flexible printed circuit board FPCB is electrically connected to an external controller and is configured to transmit signals or power from the external controller. For example, the connecting pad 4 is electrically connected to a common signal line, the connecting pad 4 is electrically connected to a touch signal line, the connecting pad 4 is electrically connected to a drive signal line, and the connecting pad 4 is electrically connected to a data connection line (the data connection line is electrically connected to a data line DL in the display area AA). The connecting pad 4 is electrically connected to each signal line, so that mutual communication between the signal line 11 and the flexible printed circuit board FPCB can be achieved. There is no specific restriction on the number and arrangement of the connecting pads 4, and they can be set according to actual needs.

[0047] Among them, the display module also includes a functional film layer (in the embodiment of the present disclosure, the functional film layer is a polarizer 11 as an example for explanation) and a cover plate 2, and a support structure 12 located on the backlight side of the display substrate 1 (the side away from the polarizer 11). Among them, the polarizer 11 extends from the display area AA to the peripheral area PA. The polarizer 11 is a circular polarizer, which consists of a polarizer and a 1 / 4 wave plate. The setting of the polarizer 11 can improve the contrast of the display module and reduce reflected light. A transparent optical adhesive layer is provided between the cover plate 2 and the polarizer 11 to bond the two together. The support structure 12 is used to provide a certain support force for the display substrate 1 as the name implies. The support structure 12 may include a back film 121 and a support layer 122 arranged in sequence in a direction away from the display substrate 1. It can be understood that the support layer 122 has a certain strength, and therefore also defines the position of the bending area BA in the display substrate 1, that is, the edge of the support layer 122 is also the starting position of the bending area BA. The support layer 122 may be made of metal material and extends from the display area AA to the connection area TPA of the display substrate 1. In order to facilitate bending, the back film 121 is provided with a groove at a position corresponding to the bending area BA.

[0048] Continue to refer to Figure 2 After the bending area BA of the display substrate 1 is bent along the bending axis BX, the pad area WA of the display substrate 1 is located on the side of the support layer 122 away from the polarizer 11. Since the connection pads on the pad area WA will be connected to the flexible printed circuit board (or the driving chip), in order to avoid signal interference, a heat conducting layer, an electromagnetic shielding layer, etc. are provided on the side of the support layer 122 away from the back film 121.

[0049] Continue to refer to Figure 1The bending portion 103 of the display substrate 1 is covered with a protective layer 5. The protective layer 5 is made of MCL glue, namely Micro Coating Layer glue, which is used to protect the bending area BA and the exposed connection area TPA to prevent environmental factors such as moisture, oxygen and temperature changes from damaging the OLED device.

[0050] The display module also includes an ink layer 41 located in the peripheral area PA, and the ink layer 41 is arranged on the side of the cover plate 2 close to the polarizer 11, and the ink layer 41 and the polarizer 11 have a certain overlap, that is, the orthographic projections of the ink layer 41 and the polarizer 11 on the plane where the cover plate 2 is located overlap. The ink layer 41 can improve the screen appearance and dustproof and waterproof effects.

[0051] Reference Figure 1 , the frame 3 includes a bearing portion 31 and a retaining wall portion 32; wherein the bearing portion 31 and the retaining wall portion 32 form a step structure for supporting the cover plate 2. The inventor found that when assembling the display module, due to a certain assembly tolerance, in order to avoid the frame damaging the bending portion 103 of the display substrate 1, the spacing between the frame 3 and the bending portion 103 will be reserved in advance according to the bending radius of the bending portion 103. Generally, the spacing between the retaining wall portion 32 and the bending portion 103 of the frame 3 is MIN, the width of the step structure formed by the retaining wall portion 32 and the bearing portion 31 is a, and the installation distance between the bearing portion 31 and the bending portion 103, that is, the tolerance reserved range value is Gap, MIN = a + Gap, MIN is about 0.91mm, that is, the frame 3 of the display module in the existing product is wider.

[0052] In view of the above problems, the following technical solutions are provided in the embodiments of the present disclosure.

[0053] Figure 4 FIG. 1 is a partial cross-sectional schematic diagram of a display module according to an embodiment of the present disclosure; Figure 4 As shown, the embodiment of the present disclosure provides a display module, which is divided into a middle area Q1 and an edge area Q2 surrounding the middle area Q1. The display module includes a display substrate 1, a cover plate 2, a first dam 61, a second dam 62 and an edge sealant 8. The cover plate 2 is located on the light-emitting side of the display substrate 1, and both the cover plate 2 and the display substrate 1 cover the middle area Q1 and extend to the edge area Q2. The first dam 61 and the second dam 62 are both located in the edge area Q2 and are arranged around the middle area Q1. The first dam 61 is located at the periphery of the display substrate 1 and has a certain distance from the display substrate 1; the second dam 62 is closer to the middle area Q1 than the first dam 61, and the second dam 62 is located on the backlight side of the display substrate 1; the first dam 61, the second dam 62, the display substrate 1 and the cover plate 2 define a receiving space located in the edge area. The edge sealant 8 fills the receiving space and is used to seal the edge of the display substrate 1.

[0054] In the embodiment of the present disclosure, an edge sealing glue 8 that wraps the edge of the display substrate 1 is provided in the edge area Q2 of the display module, and the edge sealing glue 8 is confined therein by the first dam 61 and the second dam 62. The edge sealing glue 8 can protect the edge of the display substrate 1. The first dam 61 and the second dam 62 can not only fix and limit the edge sealing glue 8, but also protect the edge sealing glue 8. Therefore, when the frame 3 is assembled with the display substrate 1, the cover plate 2, etc., the frame 3 can contact the first dam 61, so the distance between the frame 3 and the edge of the display substrate 1 can be shortened, thereby realizing a narrow frame design.

[0055] In some examples, the display substrate 1 in the embodiment of the present disclosure may adopt a flexible display substrate, that is, the display substrate 1 includes a display portion 101, a bending portion 103 and a pad portion 102. Of course, the display substrate 1 in the embodiment of the present disclosure may also adopt a hard display substrate, for example, the base substrate of the display substrate 1 adopts a glass base, in which case the display substrate 1 needs to be bound and connected with a separate printed circuit board. Regardless of whether the display substrate 1 in the embodiment of the present disclosure is a flexible display substrate or a hard display substrate, the edge of the display substrate 1 can be wrapped with the edge sealing glue 8 mentioned above, and the edge sealing glue 8 is limited, fixed and protected by the first dam 61 and the second dam 62. In the embodiment of the present disclosure, only the flexible display substrate is used as an example for explanation. For the bending portion 103 of the flexible display substrate sealed and protected by the edge sealing glue 8, the first dam 61 can contact the assembled frame 3, so the distance between the bending portion 103 and the frame 3 can be greatly reduced, thereby achieving narrow edge.

[0056] In some examples, continue to refer to Figure 4 , the first dam 61 and the second dam 62 can be made of a material with higher hardness, such as a steel sheet, so as to provide more stable support and solid protection for the edge sealant 8. At the same time, in order to prevent the first dam 61 and the second dam 62 from being too hard and scratching the circuits on the cover plate 2 and the pad portion 102 under the action of external impact force, in the embodiment of the present disclosure, a first buffer portion 71 is provided on the end surface of the first dam 61 close to the cover plate 2, and a second buffer portion 72 is provided on the end surface of the second dam 62 close to the display substrate 1. Therefore, even if the first dam 61 and the second dam 62 are subjected to external impact force, the circuits on the cover plate 2 and the pad portion 102 will not be scratched by the buffering effect of the first buffer portion 71 and the second buffer portion 72. Moreover, the first buffer portion 71 and the second buffer portion 72 can be deformed under the action of external force, so they can absorb the uneven contact surface between the first dam 61 and the cover plate 2, and the uneven contact surface between the second dam 62 and the display substrate 1, and prevent the edge sealant 8 from overflowing.

[0057] Furthermore, the first buffer portion 71 and the second buffer portion 72 may be made of silicone, and the hardness thereof is 40A. Of course, the first buffer portion 71 and the second buffer portion 72 may also be made of other elastic materials, which are not listed here one by one.

[0058] In some examples, the display module also includes at least one connecting portion 63 arranged on the side of the first dam 61 and the second dam 62 facing away from the cover plate 2, and the connecting portion 63 is connected to the first dam 61 and the second dam 62, so as to prevent the impact force in the thickness direction of the display substrate 1 from damaging the edge area of ​​the display module.

[0059] In one example, Figure 5 is a top view of the backlight side of the display module of the embodiment of the present disclosure; Figure 6 FIG. 4 is a top view of a first dam 61, a second dam 62 and a connecting portion 63 of a display module of a disclosed embodiment; Figure 5 and 6 As shown, since a connection line is provided on the bending portion 103 of the display substrate 1, a connection portion 63 is preferably provided at the end of the first dam 61 and the second dam 62 at this position away from the cover plate 2. Specifically, the second dam 62 includes a first sub-dam 621 provided on the side of the pad portion 102 away from the display portion 101, and a second sub-dam 622 provided on the side of the display portion 101 away from the cover plate 2. Taking the display substrate 1 as a quadrilateral as an example, that is, the side of the second dam 62 corresponding to the bending portion 103 is the first sub-dam 621, and the structure formed at the remaining position is the second sub-dam 622. The first sub-dam 621 and the first dam 61 are connected by the connection portion 63. For ease of understanding, the connection portion 63 connecting the first sub-dam 621 and the first dam 61 is referred to as the first connection portion 631. Of course, the second sub-dam 622 and the first dam 61 may also be connected via a connecting portion 63 . For ease of understanding, the connecting portion 63 connecting the second sub-dam 622 and the first dam 61 is referred to as a second connecting portion 632 .

[0060] Furthermore, since the connection lines are arranged on the bending portion 103, the arrangement density of the first connection portion 631 is greater than that of the second connection portion 632, or the size of the first connection portion 631 is greater than that of the second connection portion 632, or, while the arrangement density of the first connection portion 631 is greater than that of the second connection portion 632, the size of the first connection portion 631 is greater than that of the second connection portion 632. It should be noted that the size of the arrangement density in the embodiment of the present disclosure depends on the spacing between two adjacently arranged multiple identical components. Specifically, the smaller the spacing between two adjacent components, the greater the arrangement density, and the larger the spacing between two adjacent components, the smaller the arrangement density. Figure 6Only an exemplary distribution of the first connection part 631 and the second connection part 632 is shown in the figure. The arrangement of the first connection part 631 and the second connection part 632 can be specifically set according to the size of the display module. In one example, when the widths of the first connection part 631 and the second connection part 632 are the same, the length of the first connection part 631 is greater than the length of the second connection part 632. For example, the length of the first connection part 631 is about 15 mm-25 mm, and the length of the second connection part 632 is about 2 mm-3 mm.

[0061] In one example, Figure 7 for Figure 6 AA cross section in; Figure 8 for Figure 6 BB cross-section diagram in; Fig. 9 for Figure 6 The CC cross-section diagram in Figure 7-Figure 9 As shown, since a connection circuit is provided on the bending portion 103 of the display substrate 1, the spacing s2 between the first sub-dam 621 and the pad portion 102 is not less than the spacing s1 between the second sub-dam 622 and the display portion 101, thereby preventing the first sub-dam 621 from damaging the connection circuit when subjected to impact force. Among them, the spacing between the first sub-dam 621 and the pad portion 102 may be about 0.7mm-0.8mm, and the spacing between the second sub-dam 622 and the display portion 101 may be about 0.6mm-0.7mm. If a first buffer portion 71 and a second buffer portion 72 are provided, the thickness d4 of both is about 0.2mm. At this time, the spacing S2 between the second buffer portion 72 on the first sub-dam 621 and the pad portion 102 may be about 0.5mm-0.6mm, and the spacing S1 between the second buffer portion 72 on the second sub-dam 622 and the display portion 101 may be about 0.4mm-0.5mm. In some examples, continue to refer to Figure 7-9 The thickness d1 of the first dam 61 and the thickness d2 of the second dam 62 are both about 0.2 mm, and the spacing between the first dam 61 and the second dam 62 is about 2 mm-3.2 mm, that is, the width of the edge sealing glue 8 area is about 2 mm-3.2 mm. The thickness d3 of the connecting portion 63 is about 0.1 mm-0.2 mm.

[0062] In some examples, Fig.10 for Figure 5 A cross-sectional view of the unfilled edge sealant 8 at position A; Fig.11 for Figure 5 A cross-sectional view of the unfilled edge sealant 8 at position B; Fig.10 and 11As shown, the first dam 61 is retracted inwards toward the middle area Q1 relative to the cover plate 2, and the retracted size is about 0.05-0.15 mm, for example, 0.1 mm. That is to say, the first dam 61 is spaced apart from the edge of the cover plate 2 by about 0.05-0.15 mm, for example, 0.1 mm. In this way, the buckling accuracy of the first dam 61 and the cover plate 2 is reserved. At the same time, there is a spacing of, for example, about 0.05-0.15 mm between the cover plate 2 and the first dam 61, which facilitates the overlap of the cover plate 2 and the frame 3 during assembly to ensure the overlap strength.

[0063] In some examples, Fig.12 for Figure 5 A cross-sectional view of the edge-sealing adhesive 8 at position A; Fig.13 for Figure 5 A cross-sectional view of the edge sealing glue 8 at position B in FIG. Fig.12 and 13 As shown, the edge-sealing glue 8 specifically uses UV glue combined with heat-curing glue. During preparation, UV glue is filled in the accommodation space. The glue specifically uses UV glue combined with heat-curing glue, low-viscosity glue with a viscosity of <200cps, and the diameter of the UV glue printing valve is 0.1mm. The printing speed is 50mm / s, and the Macro piezoelectric valve is used for printing (voltage 220V, frequency 200Hz). After the UV glue is printed, a 370nm LED cold light source is used to cure the UV glue. After the UV glue is cured, thermal curing is used at a curing temperature of 60°C for 30 minutes to fully cure the glue, ensure the extrusion strength of the product, improve the impact resistance and drop resistance, and increase the waterproof performance of the product.

[0064] In some examples, continue to refer to Fig.12 and 13 , Fig.12 Compared to Fig.13 The pad portion 103 is not provided on the side of the display portion 101 facing away from the cover plate 2, and the support structure 12 is not provided at this position, so the distance between the second sub-dam 622 and the display portion 101 is smaller than the distance between the first sub-dam 621 and the display portion 101. In other words, the lengths of the first sub-dam 621 and the second sub-dam 622 in the second dam 62 along the thickness direction of the display module are different. The lengths of the first sub-dam 621 and the second sub-dam 622 along the thickness direction of the display module need to be specifically set according to the thickness of different positions of the product.

[0065] In some examples, Fig.14 is a partial cross-sectional view of another display module according to an embodiment of the present disclosure; Fig.14As shown, the display module of the embodiment of the present disclosure includes not only the above structure, but also a frame 3. The frame 3 includes a bearing portion 31 and a retaining wall portion 32, the bearing portion 31 is located on the side of the first dam 61 away from the cover plate 2, and is fixed to the first dam 61; the retaining wall portion 32 surrounds the first dam 61 and the cover plate 2, and is fixed to the first dam 61 and the cover plate 2.

[0066] Among them, a step structure can be formed at one end of the retaining wall portion 32 close to the cover plate 2, so as to facilitate the overlap and fixation of the cover plate 2 and the retaining wall portion 32. If the interval between the first dam 61 and the edge of the cover plate 2 is about 0.1 mm, then the width of the step structure formed on the retaining wall portion 32 is adapted to the interval, that is, about 0.1 mm, thereby ensuring the overlap strength between the cover plate 2 and the retaining wall portion 32. When the first dam 61 and the second enclosure are connected by the connecting portion 63, the connecting portion 63 is overlapped on the bearing portion 31, thereby ensuring the stability of the display module edge area Q2 and the frame 3. In the embodiment of the present disclosure, since the bending portion 103 is wrapped by the edge sealing glue 8, and the edge sealing glue 8 is fixed by the first dam 61 and the second dam 62, the distance between the frame 3 and the connecting portion 63 is shortened. Specifically, refer to Fig.14 , the spacing between the retaining wall portion 32 and the bending portion 103 is MIN, MIN=b+c, ​​b is the overlap amount between the frame 3 and the cover plate 2, because the frame 3 also has an overlap amount e with the first dam 61 and the connecting portion 63, the strength of the middle frame can be guaranteed, so the overlap amount between the frame 3 and the cover plate 2 can be reduced, because the buckling accuracy of the first dam 61 and the cover plate 2 is 0.1mm, so the b value Max is 0.1mm, that is, b≥0.1mm, c=thickness of the first dam 61+d, d is the minimum gap between the first dam 61 and the bending portion 103, to ensure that the edge sealing glue 8 in the slit area between the cover plate 2 and the display substrate 1 can be completely filled, so d≥0.1mm, to ensure the impact strength of the product, the thickness of the first dam 61 is 0.2mm, so the spacing MIN between the retaining wall portion 32 and the bending portion 103 in the disclosed embodiment is 0.4mm, compared with the width of 0.91 in the existing structure, the gain of the frame 3 can reach about 0.5mm.

[0067] In some examples, due to the existence of the bending portion 103 of the display substrate 1, the width of the retaining wall portion 32 at the frame position corresponding to the display module and the bending portion 103 is slightly larger than the width of the retaining wall portion 32 at the rest of the frame. For example: the retaining wall portion 32 includes a first sub-retaining wall portion (i.e., corresponding to the lower frame position of the display module) opposite to the bending portion, and a second sub-retaining wall portion (i.e., corresponding to the rest of the frame positions outside the lower frame of the display module) connected to the first sub-retaining wall portion, and the maximum width of the first sub-retaining wall portion is about 0.1 mm larger than the maximum width of the second sub-retaining wall portion. By designing this setting method, the problem of external impact force acting on the bending portion 103 and causing damage to the circuit can be effectively solved.

[0068] In some examples, the retaining wall portion 32 is recessed toward one side of the display substrate 1 to form a first step portion for supporting the cover plate 2. The first step portion includes a first supporting surface and a second supporting surface, the first supporting surface is opposite to the supporting portion 31 and connected to the second supporting surface; the cover plate 2 is overlapped on the first supporting surface and abuts against the second supporting surface, in this case, a stable support can be provided for the cover plate 2.

[0069] In some examples, the bearing portion 31 and the retaining wall portion 32 are connected to form a second step portion, and the second step portion is used to provide support for the first dam 61 and the connecting portion 63. The second step includes a third bearing surface for bearing the first dam 61 and the connecting portion 63, and the third bearing surface is the surface of the bearing portion 31 protruding from the retaining wall portion 32 and facing the cover plate. By setting the second step portion, stable support can be provided for the first dam 61 and the connecting portion 63. In some examples, the display module of the embodiment of the present disclosure includes not only the above structure, but also includes a polarizer 11 arranged between the light-emitting surface side of the display substrate 11 and the cover plate 2. The polarizer 11 is a circular polarizer, which is composed of a polarizer and a 1 / 4 wave plate. The setting of the polarizer 11 can improve the contrast of the display panel and reduce reflected light. A transparent optical adhesive layer is arranged between the cover plate 2 and the polarizer 11 to bond the two together. An ink layer 41 may also be disposed on the edge of the cover plate 2 close to the display substrate 1 . The ink layer 41 is disposed on the side of the cover plate 2 close to the polarizer 11 , and the ink layer 41 and the polarizer 11 have a certain overlap.

[0070] In some examples, a support structure 12 is further provided on the backlight side of the display substrate 1, and the support structure 12 includes a back film 121 and a support layer 122 sequentially provided in a direction away from the display substrate 1. A protective layer 5 (MCL glue) may also be provided on the bending portion 103 to protect the wiring on the bending portion 103. The display module also includes a heat conducting layer 13 and an electromagnetic shielding layer located on the side of the display portion 101 away from the cover plate 2, wherein the heat conducting layer 13 is made of metal and may also be reused as an electromagnetic shielding layer.

[0071] In some examples, reference Fig.12 The edge of the thermal conductive layer 13 is retracted compared to the edge of the display substrate 1 to form a step structure. In this way, when the edge of the display substrate 1 and the thermal conductive layer 13 are sealed by the edge sealing glue 8, the step structure formed by the edge of the thermal conductive layer 13 and the edge of the display substrate 1 can provide a larger contact area with the edge sealing glue 8, thereby ensuring sufficient adhesion and improving sealing stability.

[0072] In some examples, the edge of the thermal conductive layer 13 may also be flush with the edge of the display portion 101 of the display substrate 1. In this case, the surface of the thermal conductive layer 13 close to the edge sealing glue 8 may be processed to make the surface of the thermal conductive layer 13 in contact with the edge sealing glue 8 rough, thereby increasing the adhesion between the thermal conductive layer 13 and the edge sealing glue 8. Of course, a concave-convex structure may also be formed on the surface of the thermal conductive layer 13 close to the edge sealing glue 8, which may also increase the adhesion between the thermal conductive layer 13 and the edge sealing glue 8.

[0073] In some examples, reference Fig.13 and 14 After being bent, the bending portion 103 forms a receiving space with the display portion 101, the pad portion 102, the support structure 12 and the heat conducting layer 13. The receiving space can be filled with air, or a filler can be formed by filling, printing or injection molding. When a filler is arranged in the receiving space, a certain supporting force can be provided to the bending portion 103, thereby preventing the bending portion 103 from collapsing and causing circuit damage.

[0074] In some examples, the base substrate of the display substrate 1 of the embodiment of the present disclosure may be a flexible substrate, or may be a rigid substrate. The flexible substrate may include a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked together. The materials of the first flexible material layer and the second flexible material layer may be polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film, etc. The materials of the first inorganic material layer and the second inorganic material layer may be silicon nitride (SiNx) or silicon oxide (SiOx), etc., to improve the water and oxygen resistance of the substrate, and the material of the semiconductor layer may be amorphous silicon (a-Si).

[0075] In some examples, the display unit 101 includes a substrate, and signal lines, pixel circuits, and light-emitting devices located on the substrate; the pixel circuits may be Figure 3 The pixel circuit shown in FIG. 1 , wherein the transistor includes an active layer, a gate electrode, a source electrode and a drain electrode.

[0076] Furthermore, Fig.15 Schematic diagram of each film layer of the display part of the embodiment of the present disclosure; Fig.15As shown, the film layers of the display unit 101 may include: a buffer layer BFL disposed on the substrate base 10, an active layer 142 of the transistor 14 disposed on the buffer layer BFL, a first gate insulating layer GI1 covering the active layer 142, a gate electrode 141 and a first capacitor electrode 145 of the transistor 14 disposed on the first gate insulating layer GI1, a second gate insulating layer GI2 covering the gate electrode 141 and the first capacitor electrode 145, a second capacitor electrode 146 disposed on the second gate insulating layer GI2, an interlayer insulating layer ILD covering the second capacitor electrode 146, a via hole being provided on the interlayer insulating layer ILD, and the via hole exposing the active layer 142. The source electrode 143 and the drain electrode 144 of the transistor 14 are disposed on the interlayer insulating layer ILD, and the source electrode 143 and the drain electrode 144 are connected to the active layer 142 through the via hole, respectively. The planar layer PLN is located on the side of the source electrode 143 and the drain electrode 144 away from the substrate 11. The first capacitor electrode 145 and the second capacitor electrode 146 constitute a storage capacitor. In some possible implementations, the buffer layer BFL, the first gate insulating layer GI1, the second gate insulating layer GI2 and the interlayer insulating layer ILD may be made of any one or more of silicon oxide (SiOx), silicon nitride (SiNx) and silicon oxynitride (SiON), and may be a single layer, a multilayer or a composite layer. The gate electrode 141, the source electrode 143, the drain electrode 144, the first capacitor electrode 145 and the second capacitor electrode 146 may be made of metal materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or alloy materials of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), and may be a single layer structure, or a multilayer composite structure, such as Ti / Al / Ti, etc. The active layer 142 may be made of amorphous indium gallium zinc oxide material (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), sexithiophene or polythiophene, and the like, that is, the present disclosure is applicable to transistors manufactured based on oxide technology, silicon technology or organic technology. The active layer 142 based on oxide technology may be made of oxides containing indium and tin, oxides containing tungsten and indium, oxides containing tungsten, indium and zinc, oxides containing titanium and indium, oxides containing titanium, indium and tin, oxides containing indium and zinc, oxides containing silicon, indium and tin, oxides containing indium, gallium and zinc, and the like.

[0077] Continue to refer to Fig.15In some examples, the light emitting structure layer 15 may include an anode 151, a pixel definition layer PDL, an organic light emitting layer 153 and a cathode 152. The anode 151 is disposed on the flat layer PLN and is connected to the drain electrode 144 through a via hole opened on the flat layer PLN. The pixel definition layer PDL is disposed on the anode 151 and the flat layer PLN, and a pixel opening is disposed thereon. The pixel opening exposes the anode 151. The organic light emitting layer 153 is disposed in the pixel opening. The cathode 152 is disposed on the organic light emitting layer 153. The organic light emitting layer 153 emits light of corresponding color under the action of voltage applied by the anode 151 and the cathode 152.

[0078] In some examples, the organic light emitting layer 153 may include at least a stacked hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL), the hole injection layer and the hole transport layer may be collectively referred to as a hole layer, and the electron transport layer and the electron injection layer may be collectively referred to as an electron layer.

[0079] Continue to refer to Fig.15 In some examples, the encapsulation layer 16 may include a first encapsulation layer 161, a second encapsulation layer 162, and a third encapsulation layer 163 stacked together. The first encapsulation layer 161 and the third encapsulation layer 163 may be made of inorganic materials, and the second encapsulation layer 162 may be made of organic materials. The second encapsulation layer 162 is arranged between the first encapsulation layer 161 and the third encapsulation layer 163, which can ensure that external water vapor cannot enter the light-emitting structure layer 13.

[0080] To further illustrate the display module in the embodiment of the present disclosure, a 192.5 g swing ball is used to hit the bending portion 103 of the existing display module and the bending portion 103 of the embodiment of the present disclosure, and the minimum swing ball angle and energy when the X-Line appears are recorded, as shown in the table below.

[0081]

[0082] Conclusion: The impact resistance of the bending portion 103 of the display module of the embodiment of the present disclosure is greatly improved.

[0083] The present disclosure also provides a method for preparing a display module, which can be used to prepare the above-mentioned display module. Figure 4 , the display module is divided into a middle area Q1 and an edge area Q2; the preparation method of the embodiment of the present disclosure may specifically include the following steps:

[0084] S1, the display substrate 1 and the cover plate 2 are arranged opposite to each other.

[0085] In some examples, if the display substrate 1 is a flexible display substrate, it includes a display portion 101, a pad portion 102, and a connecting portion 63 connecting the display portion 101 and the bending portion 103. The bending portion 103 is bent around the bending axis, and the pad portion 102 is folded to the backlight side of the display portion 101, and the cover plate 2 is placed on the light emitting side of the display portion 101.

[0086] S2. A first dam 61 and a second dam 62 are formed in the edge area Q2 and are arranged around the middle area Q1. The first dam 61 is located at the periphery of the display substrate 1 and has a certain distance from the display substrate 1. The second dam 62 is closer to the middle area Q1 than the first dam 61, and the second dam 62 is located on the backlight side of the display substrate 1. The first dam 61, the second dam 62, the display substrate 1 and the cover plate 2 define a containing space located in the edge area Q2.

[0087] S3 , filling the accommodating space with edge sealing glue 8 to seal the edge of the display substrate 1 .

[0088] In some examples, the edge-sealing glue 8 is specifically made of UV glue, and step S3 may include: filling the accommodation space with UV glue, using UV glue in combination with heat-curing glue, low-viscosity glue with a viscosity of less than 200cps, a UV glue printing valve with a diameter of 0.1mm, a printing speed of 50mm / s, and using a Macro piezoelectric valve for printing (voltage 220V, frequency 200Hz). After the UV glue is printed, a 370nm LED cold light source is used to cure the UV glue. After the UV glue is cured, heat curing is used at a curing temperature of 60°C for 30 minutes to fully cure the glue, ensure the extrusion strength of the product, improve the impact resistance and drop resistance, and increase the waterproof performance of the product.

[0089] In some examples, before forming the first dam 61 and the second dam 62, the steps of forming a first buffer portion 71 and a second buffer portion 72 may also be included, where the first buffer portion 71 is on the end surface of the first dam 61 close to the cover plate 2, and the second buffer portion 72 is on the end surface of the second dam 62 close to the display substrate 1.

[0090] In some examples, before UV glue filling is performed, that is, before the edge sealing glue 8 is formed, at least one connecting portion 63 is formed, and the connecting portion 63 is connected to the first dam 61 and the second dam 62 .

[0091] In some examples, reference Fig.14 The method for preparing the display module of the embodiment of the present disclosure further includes: providing a frame 3, the frame 3 including a retaining wall portion 32 and a bearing portion 31. The bearing portion 31 is arranged on a side of the first dam 61 away from the cover plate 2, and is fixed to the first dam 61; the retaining wall portion 32 is arranged around the first dam 61 and the cover plate 2, and is fixed to the first dam 61 and the cover plate 2.

[0092] Of course, the method for preparing the display module in the present embodiment may also include steps of forming the above-mentioned polarizer, support structure, thermal conductive layer and electromagnetic shielding layer, etc., which are not listed one by one here.

[0093] The present disclosure also provides a display device, including the display module in the above embodiment. The display device may include any device or product with a display function. For example, the display device may be a smart phone, a mobile phone, an e-book reader, a desktop computer (PC), a laptop PC, a netbook PC, a personal digital assistant (PDA), a portable multimedia player (PMP), a digital audio player, a mobile medical device, a camera, a wearable device (such as a head-mounted device, an electronic clothing, an electronic bracelet, an electronic necklace, an electronic accessory, an electronic tattoo, or a smart watch), etc.

[0094] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A display module, divided into a middle area and an edge area surrounding the middle area; characterized in that: The display module comprises: Display substrate; A cover plate, located on the light emitting surface side of the display substrate; The first dam and the second dam are both located in the edge region and are arranged around the middle region; the first dam is located at the periphery of the display substrate and has a distance from the display substrate; the second dam is closer to the middle region than the first dam, and is located on the backlight side of the display substrate; the first dam, the second dam, the display substrate and the cover plate define an accommodation space located in the edge region; The edge sealing glue fills the accommodation space and is used to seal the edge of the display substrate.

2. The display module according to claim 1, characterized in that: A first buffer portion is provided on the end surface of the first dam close to the cover plate, and the material hardness of the first buffer portion is less than the material hardness of the first dam; and / or a second buffer portion is provided on the end surface of the second dam close to the display substrate, and the material hardness of the second buffer portion is less than the material hardness of the second dam.

3. The display module according to claim 2, characterized in that: The first buffer portion and the second buffer portion are both made of silicone.

4. The display module according to claim 1, characterized in that: The first enclosure dam and the second enclosure dam are both made of steel sheets.

5. The display module according to claim 1, characterized in that: It also includes at least one connecting portion, which is located on a side of the first dam and the second dam away from the cover plate and is connected to the first dam and the second dam.

6. The display module according to claim 1, characterized in that: The display substrate includes a display portion, a bending portion and a pad portion; the display portion is opposite to the cover plate, the pad portion is located on the side of the display portion away from the cover plate, and the bending portion is connected to one side of the display portion to connect the display portion and the pad portion.

7. The display module according to claim 6, characterized in that: The second dam includes a first sub-dam arranged on a side of the pad portion away from the display portion, and a second sub-dam arranged on a side of the display portion away from the cover plate; the distance between the first sub-dam and the pad portion is not less than the distance between the second sub-dam and the display portion.

8. The display module according to claim 6, characterized in that: The second dam includes a first sub-dam arranged on a side of the pad portion away from the display portion, and a second sub-dam arranged on a side of the display portion away from the cover plate; the display module also includes a first connecting portion arranged on a side of the first sub-dam away from the pad portion, the first connecting portion connecting the first dam and the first sub-dam.

9. The display module according to claim 8, characterized in that: The invention also includes a second connecting portion disposed on a side of the second sub-dam away from the display portion, wherein the second connecting portion connects the first dam and the second sub-dam.

10. The display module according to claim 9, characterized in that: The arrangement density of the first connection parts is greater than the arrangement density of the second connection parts; and / or the size of the first connection parts is greater than the size of the second connection parts.

11. The display module according to claim 6, characterized in that: It also includes a frame; the frame includes a retaining wall portion and a bearing portion, the bearing portion is located on the side of the first dam away from the cover plate and is fixed to the first dam; the retaining wall portion surrounds the first dam and the cover plate and is fixed to the first dam and the cover plate.

12. The display module according to claim 11, characterized in that: The distance between the retaining wall portion and the bending portion is 0.4 mm.

13. The display module according to claim 11, characterized in that: The retaining wall portion includes a first sub-retaining wall opposite to the bending portion, and a second sub-retaining wall connected to the first sub-retaining wall, and the maximum width of the first sub-retaining wall is 0.1 mm greater than the maximum width of the second sub-retaining wall.

14. The display module according to any one of claims 1 to 13, characterized in that: The first dam is closer to the middle area than the edge of the cover plate, and the distance from the first dam to the edge of the cover plate is 0.05-0.15 mm.

15. A display device, characterized in that: It comprises the display module described in any one of claims 1-14.

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