Sound output device

By designing a sound output device including a housing, a first bracket, a microphone and a first speaker, the problem that existing noise-reducing headphones are difficult to take into account both noise reduction effect and sound quality, and a compact design and high-precision assembly are achieved, which improves the reliability and consistency of the headphones.

CN222928481UActive Publication Date: 2025-05-30HUAWEI TECH CO LTD
View PDF 0 Cites 2 Cited by

Patent Information

Application Number
CN202421478721.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-25
Publication Date
2025-05-30
Estimated Expiration
2034-06-25

AI Technical Summary

Technical Problem

Due to the large number of internal components and limited space, existing noise reduction headphones are difficult to take into account both the noise reduction effect and sound quality, and the assembly and connection methods are complex, making it difficult to ensure reliability and consistency.

Method used

A sound output device is designed, including a housing, a first bracket, a microphone and a first speaker, and the microphone and the first speaker are respectively fixed through the first bracket, reducing the size of the audio component and improving structural compactness, while facilitating assembly and improving installation accuracy and consistency.

Benefits of technology

The compact design of noise-reducing headphones is realized, which improves the structural compactness and assembly accuracy of audio components, simplifies the assembly process, and enhances the reliability and consistency of the headphones.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN222928481U_ABST
    Figure CN222928481U_ABST
Patent Text Reader

Abstract

The utility model relates to the technical field of audio equipment, in particular to a sound output device. The sound output device comprises a shell, a first support microphone and a first loudspeaker. The shell is provided with an accommodating space; the first bracket is fixed in the accommodating space of the shell and comprises a first surface and a second surface which are arranged back to back; the microphone is fixed on the first surface; the first loudspeaker is fixed on the second face, and the microphone, the first support and the first loudspeaker are stacked in the first direction. The microphone and the first loudspeaker are respectively fixed through the first support, the influence of the first support on the earphone in the first direction is small, the size of the earphone in the first direction is reduced, the structural compactness of the earphone is improved, assembly is convenient, and the accuracy and consistency during earphone assembly are improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application relates to the technical field of audio devices, and particularly to a sound output device. Background Art

[0002] With the development of True Wireless Stereo (TWS) headphones, users' demands for the noise reduction effect and sound quality of headphones have gradually increased.

[0003] In existing noise-canceling headphones, due to the large number of internal components and the limitation of the internal space size of the headphones, it is difficult to balance the noise reduction effect and sound quality of the headphones. There are existing solutions in the prior art to set multiple sound-emitting units to improve sound quality, but this also makes the assembly and connection method of the headphones complex, and it is difficult to guarantee reliability and consistency. Summary of the Utility Model

[0004] An object of an embodiment of this application is to provide a sound output device.

[0005] In a first aspect, this application provides a sound output device, including a housing, a first bracket, a microphone, and a first speaker. The housing has a receiving space; the first bracket is fixed in the receiving space of the housing. The first bracket includes a first surface and a second surface arranged back to back; the microphone is fixed to the first surface; the first speaker is fixed to the second surface.

[0006] Wherein, the second surface and the first surface are arranged back to back, that is, the included angle between the positive direction of the normal line of the first surface (for a solid surface, the direction from the inside of the solid to the outside is the positive direction of the normal line) and the positive direction of the normal line of the second surface is greater than °.

[0007] On the one hand, the microphone and the first speaker are located on different surfaces of the first bracket, so that the first bracket fixes the microphone and the first speaker. By fixing the microphone and the first speaker respectively through the first bracket, the first bracket has less influence on the size of the audio component in the first direction, which is beneficial to reducing the size of the audio component in the first direction, thereby improving the structural compactness of the audio component. On the other hand, the microphone and the first speaker are located on different sides of the first bracket, and the installation of the microphone and the first speaker does not affect each other, which is convenient for the assembly of the microphone and the first speaker. On the further hand, the microphone, the first bracket, and the first speaker can be first assembled to form an independent module (audio component). When assembling, it is basically not necessary to consider the influence of other components (such as the housing) of the sound output device (headphone) on the microphone, the first bracket, and the first speaker. The space during assembly is relatively large, which is beneficial to improving the accuracy and consistency when the module (audio component) is installed in the housing.

[0008] In this embodiment, since components such as the microphone, the first bracket, and the first speaker can be assembled first to form an independent module (audio component), when the module is assembled into the housing, it is basically not necessary to consider the influence of other components (such as the housing) of the sound output device (earphone) on the microphone, the first bracket, and the first speaker, which is conducive to improving the accuracy and consistency of the installation of the module (audio component) in the housing.

[0009] In some embodiments, the first bracket has a first mounting groove, at least part of the first surface is formed on the bottom surface of the first mounting groove, and at least part of the structure of the microphone is located in the first mounting groove;

[0010] The first bracket has a second mounting groove, at least part of the second surface is formed on the bottom surface of the second mounting groove, and at least part of the structure of the first speaker is located in the second mounting groove.

[0011] Among them, the size of the first mounting groove can be set corresponding to the size of the microphone. The size of the second mounting groove can be set corresponding to the size of the first speaker.

[0012] In this embodiment, by providing the first mounting groove, the first mounting groove can both position and install the microphone; the microphone is generally small, and the first mounting groove is equivalent to wrapping at least part of the structure of the microphone. The groove structure of the first mounting groove can have more contact surfaces and a larger contact area with the microphone, so as to fix the microphone more reliably. By providing the second mounting groove, the second mounting groove can both position and fixedly install the first speaker.

[0013] In some embodiments, the first bracket has a positioning groove, the first speaker has a positioning portion, the positioning portion protrudes, the positioning portion is located in the positioning groove, and is fixedly connected to the groove wall of the positioning groove of the first bracket.

[0014] In this embodiment, the positioning groove is used to position the position of the first speaker in the first bracket and is also used to connect the first speaker and the first bracket. The positioning portion of the first speaker is installed in the positioning groove. The positioning portion is a partial structure of the first speaker, and the volumes of both the positioning portion and the positioning groove can be set to be small, so as to facilitate opening the positioning groove at a suitable position on the first bracket and forming the positioning portion at a suitable position on the first speaker, thereby further simplifying the structural design of the first bracket and the first speaker.

[0015] In some embodiments, the first bracket is a cover structure, the first bracket includes a top and a side, the side surrounds the top, the first surface is formed on one side of the top, and the second surface is formed on the other side of the top; the first surface is parallel to the second surface, and the side extends in a direction away from the first surface.

[0016] Exemplarily, the first surface may be a flat surface; the second surface may be a flat surface.

[0017] In this embodiment, since the first surface is formed on one side of the top, and the second surface is formed on the other side of the top; the first surface is parallel to the second surface. Thus, the microphone and the first speaker are respectively connected to the two side surfaces of the top, and there is substantially no gap among the microphone, the top, and the first speaker in the first direction, so that the audio component has a high compactness and a small size in the first direction.

[0018] In some embodiments, the first bracket includes a main body portion and a fixing portion. The fixing portion is located between the first speaker and the microphone, and the first surface is formed on one side surface of the fixing portion, and the second surface is formed on the other side surface of the fixing portion. The fixing portion is embedded in the main body portion; the material of the main body portion is plastic, and the fixing portion is a metal sheet.

[0019] In this embodiment, the fixing portion is made of a metal material, which can make the fixing portion have a high strength and a thin thickness, thus being beneficial to the thinning design of the audio component. The main body portion is made of a plastic material, which is beneficial to reducing the weight of the main body portion, thereby reducing the weight of the first bracket; and it is also convenient for the molding of the main body portion; in addition, it can also reduce the manufacturing cost of the main body portion.

[0020] In some embodiments, the housing has a sound outlet, and the first bracket and the housing enclose a sound outlet channel. The sound outlet communicates the sound outlet channel with the outside of the housing, and the first speaker emits sound through the sound outlet channel; the microphone is located on the side of the first bracket facing the sound outlet, and the microphone is located in the sound outlet channel.

[0021] In this embodiment, since the sound outlet channel is enclosed by the first bracket and the housing, the microphone is located in the sound outlet channel, and the microphone is relatively close to the sound outlet. The sound from the sound outlet will directly enter the human ear, and the sound picked up by the microphone is closer to the sound actually heard by the human ear. Therefore, it is beneficial to the noise reduction of the sound output device (headphone); and, since the microphone is fixed to the first bracket, that is, the microphone does not need to be fixed to the housing at the sound outlet, thus it will not block the sound outlet channel at the sound outlet, which is beneficial to making the sound outlet channel have a larger sound outlet area, thereby improving the sound output effect.

[0022] In some embodiments, the first surface faces the sound outlet, the first bracket has a first through hole, and the first speaker has a sound emitting port. The first through hole communicates the sound emitting port with the sound outlet channel.

[0023] Wherein, when the first speaker is bonded to the first bracket, the colloid can avoid the first through hole, so that the first through hole and the sound emitting port are communicated and the connection part is sealed. The colloid not only has the function of bonding the first speaker and the first bracket, but also has the function of sealing.

[0024] In this embodiment, on the one hand, the microphone can face the sound outlet, and the sound emitted by the sound output device (earphone) can be picked up by the microphone. The sound at the sound outlet can be directly transmitted to the microphone, and the transmission path is simpler, which is beneficial to the microphone to pick up sound. On the other hand, since the first through hole connects the sound emitting port and the sound outlet channel, the path between the sound emitting port of the first speaker and the sound outlet is basically a straight line. That is, the sound outlet channel structure for the first speaker to emit sound through the sound outlet is relatively simple, has little influence on the sound, is beneficial to improving the sound quality of the sound output device (earphone), and the simple sound outlet path is beneficial to simplifying the structure of the sound output device (earphone).

[0025] In some embodiments, the first bracket has a fixing surface, and the fixing surface is fixedly connected to the housing; the fixing surface is a plane, and the fixing surface is perpendicular to the center line of the sound outlet.

[0026] In this embodiment, the fixing surface being a plane is beneficial to the forming of the fixing surface, thereby simplifying the manufacture of the first bracket. The fixing surface contacts the mounting surface of the housing, which is beneficial to increasing the bonding area, thereby improving the reliability of the fixed connection. Since the fixing surface is connected to the housing, the force direction of the fixing surface is parallel to the first direction. When assembling the audio component, it can be installed along the first direction, which is the same as the assembling direction of the components in the audio component, thereby reducing the assembly direction and being beneficial to simplifying the assembly process.

[0027] In some embodiments, the sound output device further includes a second speaker, and the second speaker is fixedly connected to the first bracket, and the first bracket, the first speaker and the second speaker are stacked in sequence.

[0028] In this embodiment, the first speaker can be used for playing high-frequency sounds, and the second speaker can be used for playing mid-low-frequency sounds. Sounds of different frequencies are respectively played by the first speaker and the second speaker, which is beneficial to giving full play to the respective characteristics of the first speaker and the second speaker, thereby being beneficial to improving the sound quality of the audio component. Moreover, the second speaker is also stacked along the first direction, which is the same as the arrangement direction of the microphone, the first bracket and the first speaker. Therefore, it is convenient to install the second speaker on the first bracket.

[0029] In some embodiments, the first bracket is a cover structure, the second speaker is installed at the end of the first bracket, and the first bracket and the second speaker enclose an installation space, and the first speaker is located in the installation space.

[0030] Among them, the cross section of the second speaker can be larger than that of the first speaker, and the end face size of the second speaker can be close to the size of the end of the first bracket for docking. The end face of the second speaker closes the covered space of the first bracket and forms an installation space, and the first speaker is located in the installation space.

[0031] In this embodiment, the first bracket is fixedly connected to the first speaker and the second speaker, and the first speaker is wrapped by the first bracket and the second speaker. On the one hand, it can make the structures of the first bracket, the first speaker and the second speaker more compact, with higher space utilization rate, which is beneficial to improving the miniaturization of the audio component; on the other hand, it is also convenient for the first speaker and the second speaker to be fixedly connected to the first bracket.

[0032] In some embodiments, the first bracket includes a positioning post and a fixing post. The end of the second speaker facing the first bracket is provided with a positioning hole and a fixing hole. The positioning post and the positioning hole are in clearance fit, the fixing post is located in the fixing hole, and the fixing post and the fixing hole are adhesively bonded by glue.

[0033] Among them, the shapes of the positioning post and the positioning hole can be adapted. For example, the positioning post can be a cylindrical post structure, the positioning hole can be a circular cylindrical hole structure, and the diameter of the positioning post can be less than or equal to the diameter of the positioning hole. Among them, the size of the fixing post can be smaller than the size of the fixing hole, and there can be a gap between the outer wall of the fixing post and the inner wall of the fixing hole.

[0034] In this embodiment, by providing the positioning hole and the positioning post, it is convenient to position the second speaker on the first bracket when installing the second speaker. By providing the fixing hole and the fixing post and adhesively bonding them with glue, the connection between the second speaker and the first bracket is simpler and more reliable.

[0035] In some embodiments, the housing has a sound outlet. The first bracket and the housing enclose a sound outlet channel, and the sound outlet is communicated with the outside of the housing through the sound outlet channel; the first bracket has a second through hole. The first speaker and the second speaker are arranged at intervals. The space between the first speaker and the second speaker forms the rear cavity of the first speaker and forms the front cavity of the second speaker. The second through hole communicates the front cavity of the second speaker with the sound outlet channel.

[0036] In this embodiment, the front cavity of the second speaker is communicated with the second through hole. The second speaker is equivalent to emitting sound through the second through hole. The sound of the second speaker is transmitted to the second through hole through the front cavity, enters the sound outlet channel through the second through hole and is transmitted to the outside of the housing. Among them, the second through hole is opened on the first bracket, and the area of the second through hole is easy to be opened larger, which is beneficial to enabling the second speaker to have a larger sound-emitting area. In addition, the sounds of the first speaker and the second speaker are both fixed to the first bracket, and the sounds of the first speaker and the second speaker both enter the sound outlet channel through the first bracket, which is beneficial to simplifying the design of the sound channels of the first speaker and the second speaker in the sound output device (earphone).

[0037] In some embodiments, the second speaker includes a first sub-speaker and a second sub-speaker. The first sub-speaker and the second sub-speaker are fixedly connected, and the first sub-speaker and the second sub-speaker can emit sounds respectively.

[0038] Exemplarily, the first sub-speaker is mainly used to emit mid-frequency sounds, and the second sub-speaker is mainly used to emit low-frequency sounds.

[0039] In this embodiment, both the first speaker and the second speaker can produce sound, which is beneficial to improving the sound quality of the sound output device (headphones); the first sub-speaker and the second sub-speaker are integrated with the second speaker, which can improve the integration of the first sub-speaker and the second sub-speaker, reduce the occupied space, and can also be assembled together into the sound output device (headphones) to improve assembly efficiency.

[0040] In some embodiments, the sound output device further includes a flexible circuit board, the flexible circuit board and the microphone are integrally formed structural components, and the flexible circuit board is electrically connected to the first speaker and the second speaker.

[0041] In this embodiment, since the flexible circuit board and the microphone are integrally formed structural components, when the microphone is fixed to the first bracket, the steps of electrically connecting the flexible circuit board to the first speaker and the second speaker can be performed simultaneously, thereby simplifying the assembly steps of the audio component.

[0042] In some embodiments, the flexible circuit board is located outside the microphone, the first bracket and the second speaker, the first speaker has a first wiring portion, the first bracket has a third through hole, the first wiring portion passes through the third through hole, and the first wiring portion is electrically connected to the flexible circuit board.

[0043] In this embodiment, the electrical connection method between the flexible circuit board and the microphone, the first speaker and the second speaker is relatively simple. The flexible circuit board can cover the outside of the microphone, the first bracket, the first speaker and the second speaker. There is no need to arrange the flexible circuit board separately, so the installation of the flexible circuit board is relatively simple and convenient.

[0044] In some embodiments, the sound output device also includes a second bracket and a battery, the second bracket is fixedly connected to the battery, the second bracket and the battery are located in the accommodating space, and the second bracket is fixedly connected to the shell; the first bracket, the second bracket and the battery are arranged along a first direction, the second bracket is located on the side of the first bracket away from the microphone, and the first direction is the arrangement direction of the microphone, the first bracket and the first speaker.

[0045] In this embodiment, the second bracket and the battery can be assembled into the accommodating space of the shell along the first direction, so that it is easy to align with the assembly direction of the audio component, reduce the complexity of assembly, and simplify the assembly steps of the sound output device (earphones), thereby improving the assembly efficiency and assembly quality of the sound output device (earphones). BRIEF DESCRIPTION OF THE DRAWINGS

[0046] To illustrate the technical solutions in the embodiments of the present application or the background art, the drawings required for the embodiments of the present application or the background art will be described below.

[0047] Figure 1 is a schematic structural diagram of the earphone provided by the embodiment of the present application;

[0048] Figure 2 is Figure 1 a schematic structural diagram of the earphone shown in another perspective;

[0049] Figure 3 is Figure 1 a schematic exploded view of the earphone shown in some embodiments;

[0050] Figure 4 is Figure 1 a schematic exploded view of the housing shown;

[0051] Figure 5 is Figure 1 a schematic sectional view of the housing shown;

[0052] Figure 6 is Figure 3 a schematic exploded view of the audio component shown in some embodiments;

[0053] Figure 7 is Figure 6 a schematic structural diagram of the first bracket shown in some embodiments;

[0054] Figure 8 is Figure 7 a schematic structural diagram of the first bracket shown in another perspective;

[0055] Figure 9 is Figure 7 a schematic exploded view of the first bracket shown in some embodiments;

[0056] Figure 10 is Figure 6 a schematic structural diagram of the first speaker shown in some embodiments;

[0057] Figure 11 is Figure 3 a schematic sectional view of a part of the audio component shown in some embodiments;

[0058] Figure 12 is Figure 6 a schematic structural diagram of the second speaker shown in some embodiments;

[0059] Figure 13 is Figure 3 a schematic sectional view of a part of the audio component shown in some embodiments;

[0060] Figure 14 is Figure 3 A cross-sectional view of a partial structure of the audio component shown in some other embodiments;

[0061] Figure 15 is Figure 6 A schematic structural view of the flexible circuit board and the microphone shown;

[0062] Figure 16 is Figure 3 A cross-sectional view of a partial structure of the audio component shown in still some other embodiments;

[0063] Figure 17 is Figure 1 A cross-sectional view of a partial structure of the earphone shown in some embodiments;

[0064] Figure 18 is Figure 1 A cross-sectional view of a partial structure of the earphone shown in some other embodiments;

[0065] Figure 19 is Figure 1 A cross-sectional view of the earphone shown in some embodiments;

[0066] Figure 20 is Figure 1 A cross-sectional view of the earphone shown from another perspective;

[0067] Figure 21 is Figure 3 A schematic exploded view of a partial structure of the audio component shown in some other embodiments. Detailed implementation manners

[0068] The embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

[0069] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Multiple" means at least two.

[0070] The orientation terms mentioned in the embodiments of the present application, such as "upper", "lower", "inner", "outer", "top", "bottom", "side", etc., are only with reference to the direction of the accompanying drawings. Therefore, the orientation terms used are for better and clearer description and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the embodiments of the present application.

[0071] In the embodiments of the present application, the limitations on the relative position relationships, such as parallel, perpendicular, alignment, etc., are all in view of the current technological level and are not absolute strict limitations. A small deviation is allowed, and being approximately parallel, approximately perpendicular, approximately aligned, etc. are all acceptable. For example, when it is stated that A is parallel to B, it means that A is parallel to B or approximately parallel to B, and the included angle between A and B can be between 0 degrees and 10 degrees. For example, when it is stated that A is perpendicular to B, it means that A is perpendicular to B or approximately perpendicular to B, and the included angle between A and B can be between 80 degrees and 100 degrees.

[0072] In the embodiments of the present application, the terms "first", "second", "third", and "fourth" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", "third", and "fourth" may explicitly or implicitly include one or more of such features.

[0073] The sound output device provided in the embodiments of the present application is used for sound output. For example, playing music, playing voice information, or making a call, etc. The sound output device may be a device such as a headphone, a player, etc. Figure 1 The sound output device 100 in the illustrated embodiment is described by taking a headphone as an example. Among them, the reference numerals of the headphone hereinafter all adopt the reference numerals of the sound output device 100.

[0074] Please refer to Figure 1 , Figure 1 which is a schematic structural diagram of the headphone 100 provided in the embodiments of the present application.

[0075] In some embodiments, the headphone 100 may be a wireless headphone or a wired headphone. When the headphone 100 is a wireless headphone, the headphone 100 can be communicatively connected to other electronic devices. The other electronic devices may be devices with communication functions such as headphones 100, mobile phones, watches, tablet personal computers, laptop computers, in-vehicle devices, wearable devices, augmented reality (AR) glasses, AR helmets, virtual reality (VR) glasses, VR helmets, etc. Figure 1 The headphone 100 in the illustrated embodiment is a wireless headphone, such as a Bluetooth headphone. In one embodiment, the headphone 100 is a TWS (true wireless stereo) headphone. It should be noted that Figure 1Only an earphone 100 is schematically shown (i.e., the earphone 100 includes at least one earplug). In other embodiments, the earphone 100 may also include two earplugs, or more than two earplugs, where the two earplugs provide sound for the left ear or the right ear respectively.

[0076] In addition, the earphone 100 can be a semi-in-ear earphone, an in-ear earphone, or a headphone.

[0077] For the convenience of the following description, it is defined that the earphone 100 has opposite orientations "top" and "bottom", corresponding to the height direction of the earphone 100; the earphone 100 has opposite orientations "left" and "right", corresponding to the width direction of the earphone 100; the earphone 100 has opposite orientations "front" and "back", corresponding to the thickness direction of the earphone 100. In the description of some embodiments, the orientation "up" corresponds to the orientation "top", and the orientation "down" corresponds to the orientation "bottom".

[0078] Please refer to Figure 1 and Figure 2 , Figure 2 which Figure 1 is a schematic structural view of the earphone 100 shown in another perspective.

[0079] In some embodiments, the earphone 100 includes an earcup 1001 and an earstem 1002, and the top of the earstem 1002 is connected to the rear side of the earcup 1001. The outer surface of the earphone 100 is a geometric curved surface with a smooth transition. The earstem 1002 can also be called a handle, and the earstem 1002 is used to be held by the user to operate the earphone 100; the earstem 1002 is generally in a straight rod-like structure. When the earphone 100 is an in-ear earphone, the earcup 1001 can be used to be inserted into the user's ear to fix the earphone 100.

[0080] Exemplarily, the earphone 100 can have a central plane 1003, and the central axis 1004 of the earcup 1001 can be inclined relative to the central plane 1003. Among them, when the earphone 100 is used as a left earphone, the bottom end of the central axis 1004 of the earcup 1001 can be deflected to the left relative to the central plane 1003, and the top end of the central axis 1004 of the earcup 1001 can be deflected to the right relative to the central plane 1003; when the earphone 100 is used as a right earphone, the bottom end of the central axis 1004 of the earcup 1001 can be deflected to the right relative to the central plane 1003, and the top end of the central axis 1004 of the earcup 1001 can be deflected to the left relative to the central plane 1003. Exemplarily, the outer contour of the earstem 1002 can be symmetrically arranged relative to the central plane 1003.

[0081] Exemplarily, the earphone 100 may have a sound output portion 1005, and the sound output portion 1005 may be formed on the earcup 1001. A sound outlet 1006 may be formed on the sound output portion 1005, and the sound outlet 1006 is used for sound output. The central axis 1004 of the earcup 1001 may pass through the sound output portion 1005, and the central axis 1004 may coincide with the center line of the sound outlet 1006. For example, a plurality of sound holes 1007 are provided at the sound outlet 1006, and the sound emitted inside the earphone 100 can be emitted through the sound holes 1007 and propagated to the outside. Among them, the plurality of sound holes 1007 may be arranged in an array, but it is not strictly limited thereto.

[0082] In some embodiments, the earphone 100 may further include a wearing detection module 1008. The wearing detection module 1008 may be installed on the earcup 1001 and exposed on the earcup 1001.

[0083] Exemplarily, in some usage scenarios, the earphone 100 can determine whether the user wears / removes the earphone 100 through the wearing detection function to automatically play / pause music. In some other usage scenarios, if the user removes the earphone 100 and does not wear it for a long time and does not put it back into the charging case, the earphone 100 will automatically go into sleep / shut down to save power. In some other usage scenarios, to improve the single / double-ear usage experience of the earphone 100, when both earphones 100 are worn, both earphones 100 play music. When one earphone 100 is removed and the other earphone 100 is worn, the earphone 100 in the non-wearing state stops playing music, and the earphone 100 in the wearing state continues to play, realizing seamless switching.

[0084] In some embodiments, the earphone 100 may have a control area 1009. The control area 1009 may be located on the earstem 1002. The user can operate the earphone 100 by touching the control area 1009.

[0085] Exemplarily, in some usage scenarios, the earphone 100 can realize functions such as playing / pausing of the music of the earphone 100, switching between previous and next songs, adjusting the volume size, and waking up the intelligent voice by detecting different touch actions or operation actions of the user on the control area 1009, so that the earphone 100 can be to a certain extent separated from the connected terminal (such as a mobile phone, a tablet, etc.) during use, and the operation is more convenient and fast, which is beneficial to improving the user experience.

[0086] In some other embodiments, the earphone 100 may further include a circuit component (not shown in the figure), and the circuit component may be located in the ear rod 1002. Exemplarily, the circuit component may include a circuit board. A plurality of devices may be fixed on the circuit board. For example, a main control chip may be arranged on the main circuit board, and the main control chip may be a System on Chip (SOC). The main control chip may integrate multiple circuits. The circuit component is electrically connected to other functional devices, modules, etc. of the earphone 100. For example, the circuit component may be electrically connected to the audio component described later to control the working state of the audio component.

[0087] In some other embodiments, the earphone 100 may further include an antenna (not shown in the figure). The antenna may be located in the ear rod 1002. Exemplarily, the antenna is used to implement wireless communication between the earphone 100 and other terminals (such as mobile phones, tablets, etc.).

[0088] In some other embodiments of the present application, the earphone 100 may include more or fewer components than those in the above embodiments, or combine certain components, or split certain components, or have different component arrangements. Each component of the earphone 100 may be implemented in hardware, software, or a combination of software and hardware.

[0089] Please refer to Figure 1 and Figure 3 , Figure 3 is Figure 1 the exploded structural schematic diagram of the earphone 100 shown in some embodiments.

[0090] In some embodiments, the earphone 100 may include a housing 10, an audio component 20, and a battery component 30.

[0091] Exemplarily, the housing 10 may serve as a fixing structure and a supporting structure of the earphone 100. The inner side of the housing 10 may be a hollow structure, and an accommodation space 104 is formed inside the housing 10. Components such as the audio component 20 and the battery component 30 may be fixedly installed in the accommodation space 104 of the housing 10. When the earphone 100 includes other components, the other components may be installed in the accommodation space 104 of the housing 10.

[0092] Among them, the housing 10 may include a first housing 101 and a second housing 102. The first housing 101 and the second housing 102 can be spliced to form the housing 10. The first housing 101 and the second housing 102 can be fixedly connected to facilitate the manufacturing and forming of the housing 10 and also facilitate the installation of other components of the earphone 100 on the housing 10. For example, the first housing 101 is fixed to the front side of the second housing 102, and the internal space of the first housing 101 communicates with the internal space of the second housing 102. When the earphone 100 is in a worn state, the first housing 101 is used to face the user's ear, and the second housing 102 is connected to a part of the structure of the first housing 101 and the first housing 101 together form the outer shell of the ear cup 1001, and another part of the structure of the second housing 102 forms the outer shell of the ear rod 1002 of the earphone 100.

[0093] For example, an air vent hole 103 may be provided on the housing 10, and the air vent hole 103 can communicate the outside and the inside of the housing 10.

[0094] For example, the sound output part 1005 may be formed on the housing 10.

[0095] Exemplarily, the audio component 20 can be used for sound emission and also for sound collection. The audio component 20 may include a speaker and a microphone. Among them, the speaker can also be called a "horn", which is used to convert an audio electrical signal into a sound signal to realize sound playback. Among them, the microphone is used to convert a sound signal into an electrical signal to realize sound pickup. The microphone can be mainly used to collect the sound output by the earphone 100 and convert it into an electrical signal for transmission to the main control chip for processing to realize functions such as active noise reduction, voice call, call noise reduction, ambient sound mode, and voice assistant wake-up of the earphone 100.

[0096] Exemplarily, the battery component 30 is used to supply power to the power-consuming components (such as the audio component 20) of the earphone 100. The battery component 30 can be electrically connected to the audio component 20 to supply power to the audio component 20. For example, the battery component 30 can use a lithium battery, but is not limited thereto.

[0097] In this embodiment, when assembling the earphone 100, the audio component 20 can be first installed on the first housing 101, then the battery component 30 can be installed on the second housing 102, and then the first housing 101 and the second housing 102 are spliced. At this time, when assembling the earphone 100, the number of modules to be assembled is small and the steps during assembly are also few, thereby improving the assembly efficiency, and the consistency of the obtained earphone 100 is also better.

[0098] It can be understood that the microphone in the earphone 100 may further include a feedforward microphone (not shown in the figure) for picking up the external noise of the earphone 100, and may also include a sound collection microphone (not shown in the figure) for picking up the user's voice.

[0099] Please refer to Figure 4 and Figure 5 , Figure 4 which Figure 1 is a schematic exploded view of the housing 10 shown in Figure 5 and Figure 1 is a schematic cross-sectional view of the housing 10 shown in

[0100] In some embodiments, the first housing 101 may be a cover structure, and a first space may be formed inside the first housing 101.

[0101] Exemplarily, one end of the first housing 101 forms a sound outlet portion 1005, and the other end forms a first docking port 1011. Among them, the sound outlet portion 1005 may form a first channel 1012 inside the first housing 101, and the first channel 1012 may communicate the first space and the sound outlet hole 1007. The first docking port 1011 may be generally circular in structure. From the direction of the sound outlet portion 1005 towards the first docking port 1011, the cross-sectional area of the first housing 101 may increase first and then decrease. Among them, the first docking port 1011 may be provided with a first clamping portion 1013, and the first clamping portion 1013 may protrude towards the inside of the first housing 101. In some other embodiments, from the direction of the sound outlet portion 1005 towards the first docking port 1011, the cross-sectional area of the first housing 101 may also increase first, and this embodiment does not make strict limitations on this.

[0102] Among them, at one end of the first housing 101 close to the sound outlet portion 1005, a part of the inner wall of the first housing 101 may form a mounting surface 1014. The mounting surface 1014 may be arranged around the first channel 1012. In some examples, the mounting surface 1014 may be a plane, and the mounting surface 1014 may be perpendicular to the central axis 1004. In some other embodiments, the mounting surface 1014 may be a non-plane.

[0103] In some embodiments, the second housing 102 may be a cover structure, and a second space may be formed inside the second housing 102.

[0104] Exemplarily, the second housing 102 may include a main housing 1021 and a rear cover 1022, and the main cover body and the rear cover 1022 are fixedly connected. Among them, one end of the main housing 1021 forms a second docking port 1023, and the other end forms a third docking port 1024. The second docking port 1023 may be generally circular in structure, and the third docking port 1024 may be generally rectangular in structure. Among them, the rear cover 1022 may be generally rectangular plate-shaped, and the shape of the rear cover 1022 may be correspondingly set with the shape of the third docking port 1024. For example, the rear cover 1022 may be fixed to the third docking port 1024 and close the third docking port 1024. Among them, the second docking port 1023 may be provided with a second clamping portion 1025.

[0105] In some embodiments, the first housing 101 and the second housing 102 are fixedly connected. At this time, the first space and the second space are communicated to form the accommodation space 104 of the housing 10, so as to facilitate the installation of other components (such as the audio component 20, the battery component 30, etc.) inside the housing 10. Exemplarily, the first mating interface 1011 of the first housing 101 is docked with the second mating interface 1023 of the second housing 102, and the first engaging portion 1013 and the second engaging portion 1025 are engaged, so that the first housing 101 and the second housing 102 are fixedly connected, thereby facilitating the disassembly and assembly of the first housing 101 and the second housing 102. In some other embodiments, the first housing 101 and the second housing 102 can also be fixedly connected by bonding.

[0106] Please refer to Figure 6 , Figure 6 is Figure 3 the exploded structural schematic diagram of the audio component 20 in some embodiments.

[0107] In some embodiments, the audio component 20 may include a first bracket 1, a first speaker 2, a microphone 3, and a flexible circuit board 4.

[0108] Among them, the first bracket 1 is used to fixedly mount the first speaker 2 and the microphone 3. Among them, the first speaker 2 is used to play sound, and the second speaker 5 is used to pick up sound. Among them, the flexible circuit board 4 is used to electrically connect the first speaker 2 and the microphone 3, and the flexible circuit board 4 is also used to communicate with the circuit board, so that the circuit board communicates with the first speaker 2 and the microphone 3, so that the first speaker 2 realizes the sound playback function and the microphone 3 realizes the sound pickup function.

[0109] In some embodiments, the audio component 20 may further include a second speaker 5. The first bracket 1 is also used to fixedly mount the second speaker 5. The first bracket 1, the first speaker 2, and the second speaker 5 are stacked in sequence along the first direction. Among them, the first direction may be parallel to the central axis 1004. The second speaker 5 may be electrically connected to the flexible circuit board 4. The second speaker 5 is used for sound playback. Among them, both the first speaker 2 and the second speaker 5 are used for sound playback. At this time, the first speaker 2 may be used for playing high-pitched sounds, and the second speaker 5 may be used for playing medium and low-pitched sounds. Different frequencies of sounds are respectively played by the first speaker 2 and the second speaker 5, which is beneficial to giving full play to the respective characteristics of the first speaker 2 and the second speaker 5, and thus is beneficial to improving the sound quality of the audio component 20. And, the second speaker 5 is also stacked along the first direction, in the same arrangement direction as the microphone 3, the first bracket 1, and the first speaker 2, so it is convenient to mount the second speaker 5 on the first bracket 1.

[0110] It can be understood that when the audio component 20 includes the first speaker 2 but does not include the second speaker 5, the first speaker 2 can be a full-range speaker for playing sounds of all frequencies.

[0111] Please refer to Figure 7 and Figure 8 , Figure 7 which is Figure 6 a schematic structural view of the first bracket 1 shown in some embodiments, Figure 8 and Figure 7 a schematic structural view of the first bracket 1 shown in another perspective. Among them, Figure 8 the perspective shown is Figure 7 the perspective after being flipped.

[0112] In some embodiments, the first bracket 1 can be generally in the shape of a cover structure.

[0113] Exemplarily, the first bracket 1 can include a top 1a and a side 1b, and the top 1a and the side 1b are fixedly connected. Among them, the side 1b can be generally in a ring shape, the side 1b can surround the top 1a, the top 1a is fixed to one end of the side 1b, and the other end of the side 1b forms an open port, and the top 1a and the side 1b can enclose a covering space.

[0114] Exemplarily, the first bracket 1 can have a first mounting groove 11. Among them, the first mounting groove 11 can be formed on the outer side of the first bracket 1 and exposed on the outer surface of the first bracket 1. For example, the first mounting groove 11 can be formed on the side of the top 1a facing away from the covering space of the first bracket 1, so the opening direction of the first mounting groove 11 also faces away from the covering space. Among them, the first mounting groove 11 can be generally in the shape of a rectangular groove, but is not strictly limited thereto.

[0115] Exemplarily, the first bracket 1 can have a second mounting groove 12. Among them, the second mounting groove 12 can be formed on the inner side of the first bracket 1. For example, the second mounting groove 12 can be formed on the side of the top 1a located in the covering space, so the opening direction of the second mounting groove 12 also faces away from the first mounting groove 11. Among them, the second mounting groove 12 can be generally in the shape of a rectangular groove, but is not strictly limited thereto.

[0116] Exemplarily, the first bracket 1 can have a positioning groove 13. Among them, the positioning groove 13 can be formed on the inner side of the first bracket 1. For example, the positioning groove 13 can be formed on the side 1b. The number of the positioning grooves 13 can be multiple, and the multiple positioning grooves 13 can be arranged at intervals along the circumferential direction of the side 1b. For example, the number of the positioning grooves 13 can be 3.

[0117] Exemplarily, the first bracket 1 may have a first surface 1c. Among them, the first surface 1c is formed on one side of the top 1a. For example, the first surface 1c is at least partially formed on the bottom surface of the first mounting groove 11. The first surface 1c may be a flat surface, but is not strictly limited thereto. Among them, the first surface 1c can be used for fixedly connecting the first speaker 2. Among them, the side portion 1b extends in a direction away from the first surface 1c.

[0118] Exemplarily, the first bracket 1 may have a second surface 1d. Among them, the second surface 1d and the first surface 1c are arranged back to back, that is, the included angle between the positive direction of the normal line of the first surface 1c (for a solid surface, the direction from the inside of the entity to the outside is the positive direction of the normal line) and the positive direction of the normal line of the second surface 1d is greater than 90°. Among them, the second surface 1d is formed on the other side of the top 1a. For example, the second surface 1d is formed on the bottom wall surface of the second mounting groove 12 of the top 1a, and the second surface 1d may be parallel to the first surface 1c. The second surface 1d may be a flat surface, but is not strictly limited thereto. Among them, the second surface 1d can be used to fix the first bracket 1 to the housing 10. In some other embodiments, the second surface 1d may also be formed on the side portion 1b, and no specific limitation is made here.

[0119] Exemplarily, the first bracket 1 may have a fixing surface 14. For example, the fixing surface 14 may be formed by a partial surface of the top 1a. The fixing surface 14 can be connected to the side portion 1b. For example, the fixing surface 14 and the first surface 1c may be coplanar, so that the first surface 1c and the fixing surface 14 can be formed synchronously. In some other embodiments, the fixing surface 14 and the first surface 1c may also not be coplanar. Among them, the fixing surface 14 can be used to fix the first bracket 1 to the housing 10.

[0120] Exemplarily, the first bracket 1 may have a first through hole 15. For example, the first through hole 15 may penetrate the top 1a of the first bracket 1. In some examples, the first through hole 15 may be a circular hole.

[0121] Exemplarily, the first bracket 1 may have a second through hole 16. Among them, the second through hole 16 may be opened at the connection of the top 1a and the side portion 1b. For example, the area of the second through hole 16 may be larger than the area of the first through hole 15. For example, the number of the second through holes 16 may be two, and the two second through holes 16 may be distributed on both sides of the first through hole 15.

[0122] Exemplarily, the first bracket 1 may have a third through hole 17. The third through hole 17 may penetrate the first bracket 1. The third through hole 17 may be opened at the connection of the top 1a and the side portion 1b. Among them, the covering space inside the first bracket 1 can be communicated with the space outside the first bracket 1 through the first through hole 15, the second through hole 16 and / or the third through hole 17 respectively.

[0123] Exemplarily, the first bracket 1 may have positioning posts 18. For example, the positioning posts 18 may be formed at one end of the side portion 1b away from the top portion 1a. The positioning posts 18 may protrude. The positioning posts 18 may be generally cylindrical in structure. The number of the positioning posts 18 may be multiple, and the multiple positioning posts 18 may be arranged at intervals. Among them, the positioning posts 18 may be used to position the relative position of the first bracket 1 and other components.

[0124] Exemplarily, the first bracket 1 may have fixing posts 19. For example, the fixing posts 19 may be formed at one end of the side portion 1b away from the top portion 1a. The fixing posts 19 may protrude. The fixing posts 19 may be generally rectangular columnar in structure. In this example, the positioning posts 18 and the fixing posts 19 may be used in cooperation. Among them, the fixing posts 19 may be used to fix the relative position of the first bracket 1 and other components.

[0125] In some examples, two fixing posts 19 may be respectively located on both sides of a positioning post 18, and the two fixing posts 19 and a positioning post 18 may form a set of positioning and fixing structures. In some examples, the first bracket 1 may have multiple sets of positioning and fixing structures.

[0126] In this example, the first bracket 1 forms a cover structure, and the cover structure can form a covering space, so as to facilitate the installation of other components thereon and enable the first bracket 1 to have a lighter mass.

[0127] Please refer to Figure 7 and Figure 9 , Figure 9 which Figure 7 is a schematic exploded view of the first bracket 1 in some embodiments as shown.

[0128] In some embodiments, the first bracket 1 may include a fixing portion 110 and a main body portion 111. Among them, the fixing portion 110 and the main body portion 111 may be fixedly connected. Among them, a part of the structure of the fixing portion 110 is used to form the bottom wall of the first mounting groove 11. That is, the fixing portion 110 may form a part of the structure of the top portion 1a, and the main body portion 111 may form the side portion 1b and another part of the structure of the top portion 1a.

[0129] Exemplarily, the first through hole 15 may be opened in the fixing portion 110. Among them, the surface of the fixing portion 110 exposed on the surface of the first bracket 1 may be smoothly connected to the surface of the main body portion 111 and may be coplanar, that is, the first surface 1c of the first bracket 1 may be formed by the surface of the fixing portion 110; the fixing surface 14 of the first bracket 1 is formed by a part of the surface of the main body portion 111 and a part of the surface of the fixing portion 110.

[0130] Exemplarily, the second through-hole 16, the third through-hole 17, and the positioning groove 13 may be formed in the main body portion 111. The fixing post 19 and the positioning post 18 may be formed on the main body portion 111.

[0131] Exemplarily, the bottom wall of the first mounting groove 11 may be formed by the fixing portion 110, and the side wall of the first mounting groove 11 may be formed by the main body portion 111. The second mounting groove 12 may also be formed by the fixing portion 110 and the main body portion. It can be understood that the second surface 1d may be formed by a partial surface of the fixing portion 110.

[0132] Exemplarily, the main body portion 111 may have an embedding hole 1111 that penetrates the main body portion 111. The embedding hole 1111 may be an irregularly shaped hole, and the shape of the embedding hole 1111 may be correspondingly set with the shape of the fixing portion 110.

[0133] Exemplarily, the fixing portion 110 may have an embedding portion 1101 for embedding in the main body portion 111. When the fixing portion 110 is fixedly connected to the main body portion 111, the fixing portion 110 covers the embedding hole 1111.

[0134] Exemplarily, the fixing portion 110 may be provided with a fourth through-hole 1102 for positioning the fixing portion 110 when the fixing portion 110 and the main body portion 111 are integrally formed.

[0135] In some embodiments, the fixing portion 110 and the main body portion 111 may be an integrally formed structural member.

[0136] Exemplarily, the fixing portion 110 may be made of metal, and the main body portion 111 may be made of plastic. The fixing portion 110 may be embedded in the main body portion 111. For example, the fixing portion 110 may be a plate-like structure for easy molding. For example, the fixing portion 110 may be made of a metal sheet such as a steel sheet. The main body portion 111 may be formed by injection molding. The fixing portion 110 may be embedded in the injection mold, and when the main body portion 111 is formed, the fixing portion 110 and the main body portion 111 can be integrally formed. In this example, the fixing portion 110 is made of a metal material, which can make the fixing portion 110 have a higher strength and a thinner thickness, thus facilitating the thinning design of the audio component 20. The main body portion 111 is made of a plastic material, which is beneficial to reducing the weight of the main body portion 111, thereby reducing the weight of the first bracket 1; and it is also convenient for the molding of the main body portion 111; in addition, it can also reduce the manufacturing cost of the main body portion 111.

[0137] In some other examples, the fixing portion 110 and the main body portion 111 may be integrally formed of the same material. For example, the first bracket 1 may be formed by injection molding, thereby synchronously forming the fixing portion 110 and the main body portion 111.

[0138] In some other embodiments, the fixing part 110 and the main body part 111 can also be split structural members, and the fixing part 110 and the main body part 111 form the first bracket 1 through assembly.

[0139] Please refer to Figure 10 , Figure 10 which Figure 6 is a schematic structural diagram of the first loudspeaker 2 in some embodiments.

[0140] In some embodiments, the first loudspeaker 2 can include a first main body 21 and a first wiring part 22. Among them, the first wiring part 22 is fixedly connected to the first main body 21.

[0141] Exemplarily, the first main body 21 is the sound generating structure of the first loudspeaker 2. For example, the first main body 21 can generate sound by the vibration of the diaphragm. In this embodiment, the sound generating structure and the sound generating principle of the first loudspeaker 2 are not strictly limited.

[0142] Exemplarily, the first wiring part 22 can be flexible, so that the first wiring part 22 can deform and bend relative to the first main body 21, thereby facilitating the adjustment of the relative position between the first wiring part 22 and the first main body 21.

[0143] Exemplarily, the first wiring part 22 can be electrically connected to the first main body 21. Among them, the first wiring part 22 can have a first solder joint 221. The first solder joint 221 is used for electrical connection with other components, so that other components are electrically connected to the first main body 21. For example, the first solder joint 221 can be exposed on the first wiring part 22. The number of the first solder joints 221 can be two.

[0144] Exemplarily, the first loudspeaker 2 can have a positioning part 23, and the positioning part 23 can be formed on the first main body 21. For example, the first main body 21 can be generally in a cylindrical structure. The positioning part 23 can be located on the cylindrical side surface of the first main body 21. For example, the number of the positioning parts 23 can be multiple. For example, the number of the positioning parts 23 is three, and the three positioning parts 23 are arranged along the circumferential direction of the first main body 21. The three positioning parts 23 can make the connection between the first loudspeaker 2 and the first bracket 1 more, which is beneficial to improving the connection stability between the first loudspeaker 2 and the first bracket 1.

[0145] Exemplarily, the first loudspeaker 2 can have a sound outlet 24, and the sound outlet 24 can be opened on the first main body 21. The sound emitted by the first main body 21 can be transmitted to the outside of the first loudspeaker 2 through the sound outlet 24. For example, the sound outlet 24 can be opened on the surface of the first main body 21, and the sound outlet 24 can be communicated with the inside of the first main body 21.

[0146] Please refer to Figure 11 , Figure 11 which Figure 3Partial structure of the audio component 20 shown in a cross-sectional view of some embodiments.

[0147] In some embodiments, the first speaker 2 can be fixedly mounted on the first bracket 1. Exemplarily, the first speaker 2 can be bonded to the first bracket 1.

[0148] Exemplarily, the first main body 21 of the first speaker 2 can be located in the covering space of the first bracket 1.

[0149] Wherein, the size of the second installation groove 12 can be correspondingly set with the size of the first speaker 2. At least part of the structure of the first speaker 2 is located in the second installation groove 12 and is fixedly connected to the second installation groove 12, so as to be fixedly connected to the second surface 1d (please refer to Figure 8 ). Wherein, the sound outlet 24 can be correspondingly set with the first through hole 15, and the sound outlet 24 can communicate with the first through hole 15. In this embodiment, by providing the second installation groove 12, the second installation groove 12 can not only position the first speaker 2, but also fixedly install the first speaker 2.

[0150] Wherein, the positioning portion 23 of the first main body 21 can be located in the positioning groove 13 of the first bracket 1, and the positioning groove 13 and the positioning portion 23 can be connected in a one-to-one correspondence. The positioning portion 23 can be bonded to the wall surface of the positioning groove 13 to make the fixation between the first bracket 1 and the first speaker 2 more reliable. At this time, the positioning groove 13 is used to position the position of the first speaker 2 in the first bracket 1 and is also used to connect the first speaker 2 and the first bracket 1. The positioning portion 23 of the first speaker 2 is installed in the positioning groove 13. The positioning portion 23 is a partial structure of the first speaker 2, and the volumes of both the positioning portion 23 and the positioning groove 13 can be set to be smaller, so as to facilitate opening the positioning groove 13 at a suitable position on the first bracket 1 and forming the positioning portion 23 at a suitable position on the first speaker 2, thereby further simplifying the structural design of the first bracket 1 and the first speaker 2.

[0151] Exemplarily, the first wiring portion 22 of the first speaker 2 can pass through the third through hole 17 and extend to the outside of the first bracket 1. Thus, when the first speaker 2 is installed on the first bracket 1, it is convenient for the first wiring portion 22 to be welded to other components.

[0152] In some other embodiments, the first speaker 2 can also be fixed to the first bracket 1 by means of snap connection or threaded connection with fasteners, etc.

[0153] Please refer to Figure 12 , Figure 12 is Figure 6 Schematic structural diagram of the second speaker 5 shown in some embodiments.

[0154] In some embodiments, the second speaker 5 may include a second body 51 and a second wiring portion 52. Among them, the second wiring portion 52 is fixedly connected to the second body 51.

[0155] Exemplarily, the second body 51 is the sound - generating structure of the second speaker 5. For example, the second body 51 can generate sound by the vibration of the diaphragm.

[0156] In some examples, the second speaker 5 may include a first sub - speaker 53 and a second sub - speaker 54. The first sub - speaker 53 and the second sub - speaker 54 are fixedly connected and can generate sound separately. Among them, the first sub - speaker 53 and the second sub - speaker 54 can be arranged back - to - back. Both the first sub - speaker 53 and the second sub - speaker 54 can generate sound, and the first sub - speaker 53 and the second sub - speaker 54 can emit sound in the same direction through the internal channel design.

[0157] Among them, the first sub - speaker 53 and the second sub - speaker 54 can generate sound simultaneously or independently. For example, the first sub - speaker 53 and the second sub - speaker 54 each have a diaphragm and generate sound through their respective diaphragms. For example, the first sub - speaker 53 and the second sub - speaker 54 can be formed separately and then connected into one body to form the second speaker 5. For example, the first sub - speaker 53 and the second sub - speaker 54 can also reuse the structures such as magnets and coils for driving the diaphragms. The structure of the first sub - speaker 53 and the second sub - speaker 54 is not strictly limited in this example. For example, the first sub - speaker 53 is mainly used to emit medium - frequency sounds, and the second sub - speaker 54 is mainly used to emit low - frequency sounds, but it is not limited thereto.

[0158] At this time, both the first speaker 2 and the second speaker 5 can generate sound, which is beneficial to improving the sound quality of the earphone 100; the first sub - speaker 53 and the second sub - speaker 54 are integrated into the second speaker 5, which can improve the integration degree of the first sub - speaker 53 and the second sub - speaker 54, reduce the occupied space, and can also be assembled into the earphone 100 together, improving the assembly efficiency.

[0159] In some examples, the second speaker 5 can be mainly used to emit medium - low - frequency sounds for use in cooperation with the first speaker 2. In some other examples, the second speaker 5 can also be used to emit high - frequency sounds or full - frequency sounds. This example is not strictly limited thereto.

[0160] Exemplarily, the second wiring portion 52 can be flexible, so the second wiring portion 52 can deform and bend relative to the second body 51, thus facilitating the adjustment of the relative position between the second wiring portion 52 and the second body 51.

[0161] Exemplarily, the second wiring portion 52 can be electrically connected to the second main body 51. Among them, the second wiring portion 52 can have a second solder joint 521. The second solder joint 521 is used for electrical connection with other components, so that other components are electrically connected to the second main body 51. For example, the second solder joint 521 can be exposed on the second wiring portion 52. The number of the second solder joints 521 can be four; two of the second solder joints 521 are used for electrical connection with the first sub-speaker 53, and the other two second solder joints 521 are used for electrical connection with the second sub-speaker 54. Of course, in some other embodiments, the number of the second solder joints 521 can be set according to the structure of the second speaker 5.

[0162] Exemplarily, the second main body 51 can be generally in a cylindrical structure. The second wiring portion 52 can be connected to the end face of the second main body 51 and partially fixed to the side surface of the second main body 51. The second solder joint 521 can be exposed on the outer surface of the second wiring portion 52.

[0163] In some embodiments, the second speaker 5 can have a positioning hole 55. Exemplarily, the positioning hole 55 can be opened on the end face of the second main body 51. Exemplarily, the number of the positioning holes 55 can be multiple, and the multiple positioning holes 55 are arranged at intervals on the end face of the second main body 51. For example, the number of the positioning holes 55 can be two.

[0164] In some embodiments, the second speaker 5 can have a fixing hole 56. Exemplarily, the fixing hole 56 can be opened on the end face of the second main body 51. Exemplarily, the number of the fixing holes 56 can be multiple, and the multiple fixing holes 56 are arranged at intervals on the end face of the second main body 51. Among them, some of the fixing holes 56 can be arranged adjacent to the positioning holes 55. For example, the number of the fixing holes 56 can be six. Two of the fixing holes 56 are located on both sides of a positioning hole 55. The fixing holes 56 and the positioning holes 55 can also be arranged in other ways, and this embodiment does not make strict limitations.

[0165] Please refer to Figure 13 and Figure 14 , Figure 13 is Figure 3 a cross-sectional view of a partial structure of the audio component 20 shown in some embodiments, Figure 14 is Figure 3 a cross-sectional view of a partial structure of the audio component 20 shown in some other embodiments. Among them, Figure 13 the cutting plane of Figure 14 is parallel to the central axis 1004,

[0166] In some embodiments, the second speaker 5 may be fixedly mounted on the first bracket 1. For example, the second speaker 5 may be adhered to the first bracket 1. Herein, the first bracket 1, the first speaker 2, and the second speaker 5 are stacked in sequence along a first direction. The first direction may be parallel to the central axis 1004. At this time, both the first speaker 2 and the second speaker 5 belong to the audio component 20, both the first speaker 2 and the second speaker 5 can emit sound, and the first speaker 2 and the second speaker 5 may be responsible for sounds of different frequencies, thereby facilitating improving the sound quality of the first speaker 2 and the second speaker 5 respectively, and thus improving the sound quality of the earphone 100.

[0167] Exemplarily, the second speaker 5 is mounted at an end of the first bracket 1. The first bracket 1 and the second speaker 5 enclose an installation space, the first speaker 2 is located in the installation space, and the first speaker 2 and the second speaker 5 are spaced apart. The cross-section of the second speaker 5 may be larger than that of the first speaker 2, and the end face size of the second speaker 5 may be close to the size of the end portion of the first bracket 1 for docking. The end face of the second speaker 5 closes the covering space of the first bracket 1 and forms an installation space, and the first speaker 2 is located in the installation space. The first sub-speaker 53 of the second speaker 5 may be located on a side facing the first speaker 2. Since the installation space may communicate with the outside through the second through hole 16 (please refer to Figure 7 ) or the third through hole 17 of the first bracket 1, the sound of the first sub-speaker 53 may be transmitted to the outside of the first bracket 1 through the installation space and the second through hole 16 or the third through hole 17.

[0168] In this example, the first bracket 1 is fixedly connected to the first speaker 2 and the second speaker 5, and the first speaker 2 is wrapped by the first bracket 1 and the second speaker 5. On the one hand, it can make the structures of the first bracket 1, the first speaker 2, and the second speaker 5 more compact, with higher space utilization rate, thereby facilitating the miniaturization of the audio component 20; on the other hand, it can also facilitate the fixed connection of the first speaker 2 and the second speaker 5 to the first bracket 1.

[0169] Exemplarily, the positioning post 18 of the first bracket 1 and the positioning hole 55 of the second speaker 5 are in clearance fit. The fixing post 19 of the first bracket 1 is located in the fixing hole 56 of the second speaker 5, and the fixing post 19 and the fixing hole 56 are adhesively bonded by glue. Among them, the shapes of the positioning post 18 and the positioning hole 55 can be adapted. For example, the positioning post 18 can be a cylindrical post structure, and the positioning hole 55 can be a circular column hole structure. The diameter of the positioning post 18 can be less than or equal to the diameter of the positioning hole 55. Among them, the size of the fixing post 19 can be less than the size of the fixing hole 56, and there can be a gap between the outer wall of the fixing post 19 and the inner wall of the fixing hole 56. The shape of the fixing post 19 and the shape of the fixing hole 56 can be different or the same. For example, both the fixing post 19 and the fixing hole 56 can be substantially rectangular columnar structures. The gap between the fixing post 19 and the fixing hole 56 can be filled with glue, so that the fixing post 19 and the fixing hole 56 are fixedly connected, and the second speaker 5 and the first bracket 1 are fixedly connected. The gap between the fixing hole 56 and the fixing post 19 is beneficial to increasing the adhesive area of the glue between the two, thereby improving the reliability of the adhesion.

[0170] In this example, by providing the positioning hole 55 and the positioning post 18, when installing the second speaker 5, it is convenient to position the second speaker 5 on the first bracket 1. By providing the fixing hole 56 and the fixing post 19 and adhesively bonding them with glue, the connection between the second speaker 5 and the first bracket 1 is simpler and more reliable.

[0171] Exemplarily, as described above, when the second speaker 5 includes the first sub - speaker 53 and the second sub - speaker 54, the first sub - speaker 53 and the second sub - speaker 54 can be arranged along the first direction. The first sub - speaker 53 can face the first speaker 2, and the second sub - speaker 54 can be opposite to the first sub - speaker 53 and deviate from the first speaker 2.

[0172] In some other embodiments, the first bracket 1 and the second speaker 5 can also be fixedly connected by connection methods such as welding and snap - fitting.

[0173] Please refer to Figure 15 , Figure 15 which Figure 6 is a schematic structural diagram of the flexible circuit board 4 and the microphone 3 shown.

[0174] In some embodiments, the flexible circuit board 4 can include a main board portion 41, a first electrical connection portion 42, a second electrical connection portion 43, and a third electrical connection portion 44. Among them, the first electrical connection portion 42, the second electrical connection portion 43, and the third electrical connection portion 44 are all fixedly connected to the main board portion 41.

[0175] Exemplarily, the first electrical connection portion 42 is fixedly connected to the main board portion 41, the second electrical connection portion 43 is fixedly connected to the main board portion 41, and the third electrical connection portion 44 is fixedly connected to the second electrical connection portion 43; the third electrical connection portion 44 is fixedly connected to the main board portion 41 through the second electrical connection portion 43. Among them, the first electrical connection portion 42, the second electrical connection portion 43, and the third electrical connection portion 44 can extend from the main board portion 41.

[0176] It can be understood that the flexible circuit board 4 can have a circuit to transmit electrical signals.

[0177] In some embodiments, the microphone 3 can convert a sound signal into an electrical signal for output to pick up sound. For example, the microphone 3 can be a feedback microphone 3, and the microphone 3 can be used to pick up the sound output by the earphone 100.

[0178] In some embodiments, the flexible circuit board 4 and the microphone 3 can be an integrally formed structural member. The microphone 3 can be formed by semiconductor processes. When the microphone 3 is formed, it can be directly formed on the first electrical connection portion 42 of the flexible circuit board 4. After the microphone 3 is manufactured, it can be fixedly connected to the first electrical connection portion 42. This makes the electrical connection between the microphone 3 and the flexible circuit board 4 more reliable, and when assembling the audio component 20, the fixing steps of the microphone 3 and the flexible circuit board 4 are reduced, facilitating the assembly of the audio component.

[0179] Please refer to Figure 16 , Figure 16 is Figure 3 a cross-sectional view of a partial structure of the audio component 20 shown in yet some other embodiments.

[0180] In some embodiments, both the microphone 3 and the first speaker 2 can be fixed to the first bracket 1. Exemplarily, with reference to Figure 7 , the microphone 3 can be fixed in the first mounting groove 11 so that the microphone 3 is fixed to the first surface 1c.

[0181] Among them, the size of the first mounting groove 11 can be correspondingly set according to the size of the microphone 3. At least a part of the structure of the microphone 3 is located within the first mounting groove 11. In this embodiment, by providing the first mounting groove 11, the first mounting groove 11 can both position and install the microphone 3; the microphone 3 is generally small, and the first mounting groove 11 is equivalent to wrapping at least a part of the structure of the microphone 3, and the groove structure of the first mounting groove 11 can have more contact surfaces and a larger contact area with the microphone 3, thus fixing the microphone 3 more reliably.

[0182] Among them, in the direction perpendicular to the central axis 1004, the microphone 3 avoids the first through hole 15 to prevent blocking the first through hole 15, so that the first through hole 15 can communicate with the outside of the first bracket 1.

[0183] In some embodiments, the flexible circuit board 4 can be electrically connected to the first speaker 2 and the second speaker 5. Among them, the second electrical connection portion 43 can be welded to the two first solder joints 221, and two solder joints can be formed after welding. The third electrical connection portion 44 can be welded to the four second solder joints 521 of the second wiring portion 52. At this time, since the flexible circuit board 4 and the microphone 3 are integrally formed structural members, when the microphone 3 is fixed to the first bracket 1, the step of electrically connecting the flexible circuit board 4 to the first speaker 2 and the second speaker 5 can be synchronously performed, thereby simplifying the assembly steps of the audio component 20.

[0184] In some embodiments, as described above, with reference to Figure 11 , since the first wiring portion 22 can pass through the third through hole 17 and extend to the outside of the first bracket 1, it is convenient to weld the flexible circuit board 4 to the first wiring portion 22 outside the first bracket 1. Since the second speaker 5 is installed at the end of the first bracket 1 and the second wiring portion 52 is located on the side of the second speaker 5, the second wiring portion 52 is also located outside the first bracket 1, so that it is convenient to weld the flexible circuit board 4 to the second wiring portion 52 outside the first bracket 1. At this time, the electrical connection manner of the flexible circuit board 4 to the microphone 3, the first speaker 2 and the second speaker 5 is relatively simple. The flexible circuit board 4 can cover the outside of the microphone 3, the first bracket 1, the first speaker 2, and the second speaker 5, and there is no need to perform additional arrangement on the flexible circuit board 4. Therefore, the installation of the flexible circuit board 4 is relatively simple and convenient.

[0185] In the embodiments of the present application, the microphone 3, the first bracket 1, and the first speaker 2 of the audio component 20 are stacked along the first direction.

[0186] At this time, on the one hand, the microphone 3 and the first speaker 2 are located on different surfaces of the first bracket 1, so that the first bracket 1 fixes the microphone 3 and the first speaker 2. By fixing the microphone 3 and the first speaker 2 respectively through the first bracket 1, the first bracket 1 has a small influence on the size of the audio component 20 in the first direction, which is beneficial to reducing the size of the audio component 20 in the first direction and thus improving the structural compactness of the audio component 20. On the other hand, the microphone 3 and the first speaker 2 are located on different sides of the first bracket 1, and the installation of the microphone 3 and the first speaker 2 does not affect each other, which is convenient for the assembly of the microphone 3 and the first speaker 2. On the other hand, the microphone 3, the first bracket 1, and the first speaker 2 can be first assembled to form an independent module (audio component 20). When assembling, it is basically not necessary to consider the influence of other components of the earphone 100 (such as the housing 10) on the microphone 3, the first bracket 1, and the first speaker 2. The space during assembly is large, which is beneficial to improving the accuracy and consistency when the module (audio component 20) is installed in the housing 10.

[0187] With reference toFigure 5 , Figure 16 and Figure 17 , Figure 17 is Figure 1 a cross-sectional view of a partial structure of the earphone 100 shown in some embodiments.

[0188] In some embodiments, the audio component 20 can be installed in the accommodation space 104 of the housing 10. Among them, the first bracket 1 and the housing 10 enclose a sound output channel 105, and the sound output channel 105 communicates with the accommodation space 104 and the outside of the housing 10. At this time, the first speaker 2 can transmit sound to the outside of the earphone 100 through the sound output channel 105, so that the earphone 100 can emit sound normally; and the microphone 3 can be located in the sound output channel 105 for easy sound pickup.

[0189] Exemplarily, the sound output channel 105 can communicate with the outside through the sound output port 1006, that is, the sound output port 1006 communicates with the space outside the sound output channel 105 and the housing 10; and the microphone 3 can be located on the side of the first bracket 1 facing the sound output port 1006. At this time, since the sound output channel 105 is enclosed by the first bracket 1 and the housing 10, the microphone 3 is located in the sound output channel 105, and the microphone 3 is relatively close to the sound output port 1006, and the sound at the sound output port 1006 will directly enter the human ear. The sound picked up by the microphone 3 is closer to the sound actually heard by the human ear, so it is beneficial to the noise reduction of the earphone 100; and because the microphone 3 is fixed to the first bracket 1, that is, the microphone 3 does not need to be fixed to the housing 10 at the sound output port 1006, so as not to block the sound output channel 105 at the sound output port 1006, which is beneficial to make the sound output channel 105 have a larger sound output area, thereby improving the sound output effect.

[0190] Among them, the first surface 1c can face the sound output port 1006. The first through hole 15 can communicate the sound emitting port 24 with the sound output channel. Among them, when the first speaker 2 is bonded to the first bracket 1, the colloid can avoid the first through hole 15, so that the first through hole 15 and the sound emitting port 24 are communicated and the connection is sealed. The colloid not only has the function of bonding the first speaker 2 and the first bracket 1, but also has the function of sealing. At this time, on the one hand, the microphone 3 can face the sound output port 1006, the sound emitted by the earphone 100 can be picked up by the microphone 3, and the sound at the sound output port 1006 can be directly transmitted to the microphone 3, and the transmission path is simpler, which is beneficial to the microphone 3 to pick up sound. On the other hand, since the first through hole 15 communicates the sound emitting port 24 with the sound output channel 105, the path between the sound emitting port 24 of the first speaker 2 and the sound output port 1006 is basically a straight line, that is, the sound output channel 105 structure of the first speaker 2 emitting sound through the sound output port 1006 is relatively simple, has little influence on the sound, is beneficial to improving the sound quality of the earphone 100, and the simple sound output path is beneficial to simplifying the structure of the earphone 100.

[0191] Exemplarily, the fixing surface 14 of the first bracket 1 (please refer to Figure 7 ) is fixedly connected to the mounting surface 1014 of the first housing 101 (please refer to Figure 5 ). For example, the first surface 1c can be bonded to the mounting surface 1014 through a colloid.

[0192] Among them, as described above, since the fixing surface 14 can be a plane, and the fixing surface 14 can be perpendicular to the first direction, that is, the fixing surface 14 can be perpendicular to the central axis 1004. At this time, the fixing surface 14 being a plane is beneficial to the forming of the fixing surface 14, thereby simplifying the manufacturing of the first bracket 1. The contact between the fixing surface 14 and the mounting surface 1014 of the housing 10 is beneficial to increasing the bonding area, thereby improving the reliability of the fixed connection. Since the fixing surface 14 is bonded to the housing 10, the force application direction of the fixing surface 14 is parallel to the first direction. When assembling the audio component 20, it can be installed along the first direction, which is the same as the assembly direction of the components in the audio component 20, thereby reducing the assembly direction and being beneficial to simplifying the assembly process.

[0193] In this embodiment, since the microphone 3, the first bracket 1, the first speaker 2, etc. can be first assembled to form an independent module (audio component 20), when assembling the module into the housing 10, it is basically not necessary to consider the influence of other components of the earphone 100 (such as the housing 10) on the microphone 3, the first bracket 1, and the first speaker 2, which is beneficial to improving the accuracy and consistency of the installation of the module (audio component 20) in the housing 10.

[0194] In some embodiments, as described above, since the first surface 1c is formed on one side of the top 1a, and the second surface 1d is formed on the other side of the top 1a; the first surface 1c is parallel to the second surface 1d. At this time, the microphone 3 and the first speaker 2 are respectively connected to the two side surfaces of the top 1a, and there is basically no gap among the microphone 3, the top 1a, and the first speaker 2 in the first direction, so that the audio component 20 has a high compactness and a small size in the first direction.

[0195] In some embodiments, when the audio component 20 further includes a second speaker 5, the second speaker 5 can also transmit sound to the outside of the earphone 100 through the sound output channel 105. Since the second speaker 5 is fixed to the first bracket 1, and the first bracket 1 is fixed to the housing 10, the second speaker 5 can be fixed to the housing 10 through the first bracket 1. The first bracket 1, the first speaker 2, and the second speaker 5 are stacked in sequence along the first direction.

[0196] At this time, the second speaker 5 can also be stacked in the first direction without adding additional fixed components or the space occupied by additional fixed components, which is beneficial to improving the compactness of the audio component 20. Additionally, since the second speaker 5 is also stacked in the first direction, when installing the second speaker 5, it can be positioned and fixed in the first direction, which is the same as the positioning and fixing direction of the first speaker 2, thereby reducing the complexity of installing the second speaker 5 and further reducing the assembly complexity of the audio component 20.

[0197] In some embodiments, as described above, the second speaker 5 is installed at the end of the first bracket 1. The first bracket 1 and the second speaker 5 enclose an installation space, and the first speaker 2 is located in the installation space. At this time, the first bracket 1 covers the first speaker 2. The first speaker 2 and the first bracket 1 multiplex the space in the first direction and enable the first bracket 1 to be directly connected to the second speaker 5. On the one hand, it can make the structures of the first bracket 1, the first speaker 2, and the second speaker 5 more compact and have a higher space utilization rate, which is beneficial to improving the miniaturization of the audio component 20; on the other hand, it can also facilitate the fixed connection of the first speaker 2 and the second speaker 5 to the first bracket 1.

[0198] Please refer to Figure 3 and Figure 18 , Figure 18 is Figure 1 a cross-sectional view of a partial structure of the headphone 100 shown in another embodiment.

[0199] In some embodiments, the battery assembly 30 includes a second bracket 301 and a battery 302. Among them, the second bracket 301 is fixedly connected to the battery 302.

[0200] Exemplarily, the second bracket 301 can be an integrally formed structural member. Among them, the second bracket 301 can have a fixing groove 3011.

[0201] Exemplarily, the battery 302 can store electricity. The battery 302 is used to supply power to the energy-consuming components in the headphone 100, and the energy-consuming components in the headphone 100 are not listed one by one here. The battery 302 can be generally cylindrical in structure to adapt to the shape of the headphone 100. Among them, the battery 302 can be fixedly installed in the fixing groove 3011.

[0202] In some embodiments, the second bracket 301 and the battery 302 of the battery assembly 30 can be located in the accommodation space 104 of the housing 10.

[0203] Exemplarily, the first bracket 1, the second bracket 301, and the battery 302 are arranged along the first direction, and the second bracket 301 is located on the side of the first bracket 1 away from the microphone 3. For example, when the earphone 100 includes the second speaker 5, the second speaker 5, the second bracket 301, and the battery 302 can be arranged in sequence. In some examples, the second bracket 301 and the battery 302 can be sequentially assembled into the housing 10. In some other examples, the second bracket 301 and the battery 302 can also be assembled to form a battery assembly 30 and then assembled into the housing 10. This example does not strictly limit the assembly of the second bracket 301 and the battery 302.

[0204] In this embodiment, the second bracket 301 and the battery 302 can be assembled into the accommodation space 104 of the housing 10 along the first direction, so as to be easily aligned with the assembly direction of the audio component 20, reduce the complexity of assembly, and simplify the assembly steps of the earphone 100, thereby improving the assembly efficiency and assembly quality of the earphone 100.

[0205] In this embodiment, after the first housing 101 and the second housing 102 are butted and fixedly connected to form the housing 10, the microphone 3, the first bracket 1, the first speaker 2, and the second speaker 5 of the audio component 20 are all located in the installation space of the housing 10, and the housing 10 supports and protects the above components.

[0206] Please refer to Figure 19 and Figure 20 , Figure 19 which Figure 1 are cross-sectional views of the earphone 100 shown in some embodiments, Figure 20 and Figure 1 are cross-sectional views of the earphone 100 shown in another perspective. Among them, Figure 19 the cross-sectional plane of Figure 20 and Figure 19 the cross-sectional plane of Figure 20 are both parallel to the central axis 1004, and

[0207] In some embodiments, in the earphone 100, for the first speaker 2, the sound outlet 24 of the first speaker 2 is connected to the first through hole 15 (please refer to Figure 7 ). Therefore, as shown by the dotted arrow in Figure 19 , the sound emitted by the first speaker 2 can enter the sound outlet channel 105 through the first through hole 15 from the sound outlet 24, and be transmitted to the outside of the housing 10 through the sound outlet 1006 by the sound outlet channel 105.

[0208] In some embodiments, for the second speaker 5, the first speaker 2 and the second speaker 5 are spaced apart, and the spaced space between the first speaker 2 and the second speaker 5 forms the rear cavity 26 of the first speaker 2 and forms the front cavity 57 of the second speaker 5. The second through hole 16 (please refer to Figure 7 ) communicates the front cavity 57 of the second speaker 5 with the sound output channel 105. At this time, as shown by the dashed arrow in Figure 19 , the front cavity 57 of the second speaker 5 is communicated with the second through hole 16. The second speaker 5 is equivalent to outputting sound through the second through hole 16. The sound of the second speaker 5 is transmitted to the second through hole 16 through the front cavity 57, enters the sound output channel 105 through the second through hole 16 and is transmitted to the outside of the housing 10. Among them, the second through hole 16 is opened on the first bracket 1, and the area of the second through hole 16 is relatively large and easy to open, which is beneficial to enabling the second speaker 5 to have a relatively large sound output area. In addition, the sounds of both the first speaker 2 and the second speaker 5 are fixed to the first bracket 1, and the sounds of both the first speaker 2 and the second speaker 5 enter the sound output channel 105 through the first bracket 1, which is beneficial to simplifying the design of the sound channels of the first speaker 2 and the second speaker 5 in the earphone 100.

[0209] It can be understood that the rear cavity of the second speaker 5 can be communicated with the air vent hole 103 on the housing 10, and the specific communication structure is not strictly limited in this embodiment.

[0210] Please refer to Figure 21 , Figure 21 which is Figure 3 a schematic exploded view of a partial structure of the audio component 20 shown in another embodiment.

[0211] In some embodiments, Figure 21 the main difference between the audio component 20 shown in Figure 6 and the audio component 20 shown in

[0212] is mainly the different structures of the first bracket 1, the first speaker 2 and the second speaker 5. Exemplarily, the first bracket 1 may include a top portion 1a and a side portion 1b, and the side portion 1b surrounds the top portion 1a. Among them, the top portion 1a may be generally in a rectangular structure, and the main body portion 111 is generally in an annular structure. Among them, the specific structural setting of the first bracket 1 can refer to the relevant description in Figures 7 to 9 the embodiments, and will not be repeated in this embodiment again.

[0213] Exemplarily, the first speaker 2 can be generally in a rectangular block structure. The first speaker 2 can be a MEMS (Micro Electro Mechanical Systems) speaker. The projection of the first speaker 2 in the first direction can be smaller than the projection of the top 1a in the first direction. Among them, the specific structural setting of the first speaker 2 can refer to Figure 10 the relevant description in the embodiment. This embodiment will not be elaborated again. The volume of the first speaker 2 is small, which is beneficial to the miniaturized design of the audio component 20.

[0214] Exemplarily, the second speaker 5 can be a moving coil single diaphragm speaker. Among them, the second speaker 5 can be not provided with structures such as positioning holes and fixing holes.

[0215] In this embodiment, the assembly method of the first bracket 1, the first speaker 2 and the second speaker 5 can refer to Figure 13 the relevant solution in the embodiment. This embodiment will not be elaborated.

[0216] It should be noted that, without conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The arbitrary combination of features in different embodiments is also within the protection scope of the present application. That is to say, the above-described multiple embodiments can also be arbitrarily combined according to actual needs.

[0217] It should be noted that all the above drawings are exemplary illustrations of the present application and do not represent the actual size of the product. And the dimensional proportional relationship between components in the drawings is not used as a limitation to the actual product of the present application.

[0218] The above are only partial embodiments and implementation manners of the present application. The protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present application, and all should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A sound output device (100), characterized in that: include: A housing (10) having a receiving space (104); A first bracket (1) fixed to the accommodating space (104) of the housing (10), the first bracket (1) comprising a first surface (1c) and a second surface (1d) arranged in back-to-back relation; A microphone (3) fixed to the first surface (1c); and A first loudspeaker (2) is fixed to the second surface (1d).

2. The sound output device (100) according to claim 1, characterized in that: The first bracket (1) has a first mounting groove (11), the first surface (1c) is at least partially formed on the bottom surface of the first mounting groove (11), and at least a part of the structure of the microphone (3) is located in the first mounting groove (11); The first bracket (1) has a second mounting groove (12), the second surface (1d) is at least partially formed on the bottom surface of the second mounting groove (12), and at least part of the structure of the first speaker (2) is located in the second mounting groove (12).

3. The sound output device (100) according to claim 2, characterized in that: The first bracket (1) has a positioning groove (13), and the first speaker (2) has a positioning portion (23). The positioning portion (23) is protrudingly arranged, and the positioning portion (23) is located in the positioning groove (13) and is fixedly connected to the groove wall of the positioning groove (13).

4. The sound output device (100) according to any one of claims 1 to 3, wherein the first bracket (1) is a cover structure, the first bracket (1) comprises a top (1a) and a side (1b), the side (1b) surrounds the top (1a), the first surface (1c) is formed on one side of the top (1a), and the second surface (1d) is formed on the other side of the top (1a); the first surface (1c) is parallel to the second surface (1d), and the side (1b) extends in a direction away from the first surface (1c).

5. The sound output device (100) according to any one of claims 1 to 3, characterized in that: The first bracket (1) comprises a main body (111) and a fixing part (110), the fixing part (110) being located between the first speaker (2) and the microphone (3), the first surface (1c) being formed on one side surface of the fixing part (110), the second surface (1d) being formed on the other side surface of the fixing part (110), and the fixing part (110) being embedded in the main body (111); The main body (111) is made of plastic, and the fixing portion (110) is a metal sheet.

6. The sound output device (100) according to any one of claims 1 to 3, characterized in that: The shell (10) has a sound outlet (1006), the first bracket (1) and the shell (10) enclose a sound outlet channel (105), the sound outlet (1006) connects the sound outlet channel (105) with the outside of the shell (10), and the first speaker (2) emits sound through the sound outlet channel (105); The microphone (3) is located on a side of the first bracket (1) facing the sound outlet (1006), and the microphone (3) is located in the sound outlet channel (105).

7. The sound output device (100) according to claim 6, characterized in that: The first surface (1c) faces the sound outlet (1006), the first bracket (1) has a first through hole (15), the first speaker (2) has a sound outlet (24), and the first through hole (15) connects the sound outlet (24) and the sound outlet channel (105).

8. The sound output device (100) according to claim 6, characterized in that: The first bracket (1) has a fixing surface (14), and the fixing surface (14) is fixedly connected to the shell (10); the fixing surface (14) is a plane, and the fixing surface (14) is perpendicular to the center line of the sound outlet (1006).

9. The sound output device (100) according to any one of claims 1 to 3, characterized in that: The sound output device (100) further comprises a second speaker (5), wherein the second speaker (5) is fixedly connected to the first bracket (1), and the first bracket (1), the first speaker (2) and the second speaker (5) are stacked in sequence.

10. The sound output device (100) according to claim 9, characterized in that: The first bracket (1) is a cover structure, the second speaker (5) is installed at the end of the first bracket (1), the first bracket (1) and the second speaker (5) enclose an installation space, and the first speaker (2) is located in the installation space.

11. The sound output device (100) according to claim 9, characterized in that: The first bracket (1) comprises a positioning column (18) and a fixing column (19); the second speaker (5) is provided with a positioning hole (55) and a fixing hole (56) at the end facing the first bracket (1); the positioning column (18) and the positioning hole (55) are loosely matched; the fixing column (19) is located in the fixing hole (56); and the fixing column (19) and the fixing hole (56) are bonded by colloid.

12. The sound output device (100) according to claim 9, characterized in that: The shell (10) has a sound outlet (1006), the first bracket (1) and the shell (10) form a sound outlet channel (105), and the sound outlet (1006) communicates with the sound outlet channel (105) and the outside of the shell (10); The first bracket (1) has a second through hole (16); the first speaker (2) and the second speaker (5) are arranged at a distance from each other; the space between the first speaker (2) and the second speaker (5) forms a rear cavity of the first speaker (2) and a front cavity of the second speaker (5); the second through hole (16) connects the front cavity of the second speaker (5) and the sound output channel (105).

13. The sound output device (100) according to claim 9, characterized in that: The second loudspeaker (5) comprises a first sub-speaker (53) and a second sub-speaker (54); the first sub-speaker (53) and the second sub-speaker (54) are fixedly connected; the first sub-speaker (53) and the second sub-speaker (54) are capable of producing sound respectively.

14. The sound output device (100) according to claim 9, characterized in that: The sound output device (100) further comprises a flexible circuit board (4), wherein the flexible circuit board (4) and the microphone (3) are integrally formed structural components, and the flexible circuit board (4) is electrically connected to the first loudspeaker (2) and the second loudspeaker (5).

15. The sound output device (100) according to claim 14, characterized in that: The flexible circuit board (4) is located on the outside of the microphone (3), the first bracket (1) and the second speaker (5); the first speaker (2) has a first wiring portion (22); the first bracket (1) has a third through hole (17); the first wiring portion (22) passes through the third through hole (17); and the first wiring portion (22) is electrically connected to the flexible circuit board (4).

16. The sound output device (100) according to any one of claims 1 to 3, characterized in that: The sound output device (100) further comprises a second bracket (301) and a battery (302), the second bracket (301) being fixedly connected to the battery (302), the second bracket (301) and the battery (302) being located in the accommodating space (104), and the second bracket (301) being fixedly connected to the housing (10); The first bracket (1), the second bracket (301) and the battery (302) are arranged along a first direction, the second bracket (301) is located on a side of the first bracket (1) away from the microphone (3), and the first direction is the arrangement direction of the microphone (3), the first bracket (1) and the first speaker (2).

Citation Information

Cited By

  • Sound output device

    EP4765866A1

  • Sound output device

    WO2026001178A1