BMS low-temperature function test equipment

Abstract

The utility model relates to the technical field of low-temperature testing devices, and discloses BMS low-temperature function testing equipment which comprises a shell, a temperature changing piece and a temperature control assembly. The size of the shell is smaller than 150 cm < 3 >, a through hole is formed in the shell, the temperature changing piece is arranged in the shell, a temperature conduction containing part used for containing a BMS is arranged on the temperature changing piece, at least part of the temperature conduction containing part protrudes out of the through hole, and the temperature control assembly is connected with the shell and electrically connected with the temperature changing piece so that the temperature conduction containing part can be adjusted to reach the temperature needed by the BMS low-temperature test. According to the BMS low-temperature function testing equipment, the BMS can be subjected to low-temperature testing, compared with existing BMS low-temperature testing equipment, the overall size of the BMS low-temperature function testing equipment is smaller, the BMS low-temperature function testing equipment can be moved by moving the shell when a user needs to go out, carrying is more convenient, the BMS low-temperature function testing equipment can be used indoors or outdoors, application scenes are wider, and the BMS low-temperature function testing equipment is suitable for popularization and application. And the tool can be carried and used at any time as a portable tool, so that the practicability is better.

Description

Technical Field

[0001] The utility model belongs to the technical field of low-temperature testing devices, and in particular relates to a BMS low-temperature functional testing device. Background Art

[0002] The primary purpose of BMS (Battery Management System) low-temperature testing is to verify the BMS's ability to function properly in low-temperature conditions, including its charge and discharge performance, temperature control capabilities, fault response, and battery protection. This testing ensures that the BMS can maintain battery pack safety and performance in extremely low-temperature environments.

[0003] However, existing BMS low-temperature testing equipment is usually a large cabinet with a large overall volume and is difficult to move. As a result, BMS low-temperature testing can usually only be performed indoors, which has poor practicality. Utility Model Content

[0004] In order to solve the deficiencies of the prior art, the utility model provides a BMS low-temperature function test device.

[0005] The technical effects to be achieved by the present invention are achieved through the following technical aspects:

[0006] A BMS low-temperature functional test device, comprising: a housing, a temperature variable component and a temperature control component;

[0007] The volume of the shell is less than 150 cm3, and a perforation is provided on the shell. The temperature-changing component is arranged in the shell, and a heat-conducting accommodating portion for accommodating the BMS is provided on the temperature-changing component. The heat-conducting accommodating portion at least partially protrudes from the perforation. The temperature control component is connected to the shell and electrically connected to the temperature-changing component to adjust the heat-conducting accommodating portion to reach the temperature required for the BMS low-temperature test.

[0008] In some embodiments, the heat conduction accommodating portion has a heat conduction groove, and the depth of the heat conduction groove is greater than the height of the BMS.

[0009] In some embodiments, the temperature control component includes a temperature setting module and a control module, the control end of the temperature setting module is located outside the shell, and the temperature setting module is electrically connected to the control module, and the control module is electrically connected to the temperature variable component.

[0010] In some embodiments, the temperature setting module includes a temperature setting button, an electronic display, and a temperature setting circuit board. The temperature setting button and the electronic display are electrically connected to the temperature setting circuit board and exposed to the outside of the housing. The temperature setting circuit board is electrically connected to the control module.

[0011] In some embodiments, the temperature control assembly further includes a temperature setting switch for controlling the start or stop of the temperature setting module, and the temperature setting switch is electrically connected to the temperature setting module.

[0012] In some embodiments, the temperature control component further includes a power supply and a power socket, the power supply is electrically connected to the temperature setting module, the power socket is embedded in the shell, and the power socket is electrically connected to the power supply.

[0013] In some embodiments, the housing is provided with a heat dissipation channel communicating with the outside, and a heat dissipation component is disposed in the heat dissipation channel.

[0014] In some embodiments, the heat dissipation assembly includes a plurality of heat sinks, each of which is connected to the temperature variable component to dissipate heat from the temperature variable component to the outside.

[0015] In some embodiments, the heat dissipation assembly further includes a heat dissipation fan, which is disposed in the heat dissipation channel to blow heat in the housing to the outside.

[0016] In some embodiments, the temperature-changing component and the temperature-conducting accommodating portion are made of a temperature-conducting metal.

[0017] In summary, the present invention has at least the following advantages:

[0018] The BMS low-temperature functional test equipment provided by the present invention adjusts the temperature of the heat conducting container to the temperature required for the BMS low-temperature test through the temperature control component, and then places the BMS in the heat conducting container, so that the BMS can work at a specified temperature to perform a low-temperature test. Among them, by controlling the volume of the shell in the BMS low-temperature functional test equipment to be below 150cm3, and the shell contains the temperature variable component, and the temperature control component is connected to the shell, so that while ensuring that the BMS can perform a low-temperature test, compared with the existing BMS low-temperature test equipment, the BMS low-temperature functional test equipment of the present application has a smaller overall volume. When it is necessary to go out, the BMS low-temperature functional test equipment can be moved by moving the shell, which is more convenient to carry, so that it can be used indoors or outdoors, with a wider range of application scenarios, and can be carried and used at any time as a portable tool, with better practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic structural diagram of one direction of a BMS low-temperature functional test device according to an embodiment of the present application;

[0020] Figure 2 This is a schematic diagram of the exploded structure of the BMS low-temperature functional test equipment according to an embodiment of the present application;

[0021] Figure 3 This is a structural schematic diagram of another direction of the BMS low-temperature functional testing equipment of an embodiment of the present application.

[0022] Markings in the figure:

[0023] 10. BMS low temperature function test equipment;

[0024] 100, housing; 110, upper housing; 111, perforation; 120, lower housing; 130, heat dissipation channel;

[0025] 200, temperature changing element; 210, temperature conducting accommodating portion; 211, temperature conducting groove;

[0026] 300, temperature control component; 310, temperature setting module; 320, control module; 330, temperature setting switch; 340, power supply; 341, power socket; 350, main power switch; 360, voltage stabilizing module; 370, voltage stabilizing switch;

[0027] 400, heat dissipation component; 410, heat dissipation fan; 420, heat sink. DETAILED DESCRIPTION

[0028] To make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. The described embodiments are only part of the embodiments of the present invention, not all of the embodiments.

[0029] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0030] In the following embodiments and drawings, reference is made to Figure 1 The coordinate system is such that the direction indicated by the X-axis arrow is right, the direction indicated by the Y-axis arrow is forward, and the direction indicated by the Z-axis arrow is up.

[0031] Example 1:

[0032] like Figures 1 to 3As shown, this embodiment provides a BMS low-temperature functional test equipment 10, including: a shell 100, a temperature variable element 200 and a temperature control assembly 300; the volume of the shell 100 is less than 150cm3, and a through-hole 111 is opened on the shell 100. The temperature variable element 200 is arranged in the shell 100, and the temperature variable element 200 is provided with a temperature conducting accommodating portion 210 for accommodating the BMS. The temperature conducting accommodating portion 210 is at least partially protruded from the through-hole 111. The temperature control assembly 300 is connected to the shell 100 and is electrically connected to the temperature variable element 200 to adjust the temperature conducting accommodating portion 210 to reach the temperature required for the BMS low-temperature test.

[0033] Specifically, the shell 100 is used to accommodate components. Since the volume of the shell 100 is small, the overall volume of the BMS low-temperature functional testing equipment 10 can be ensured to be small. The material of the shell 100 is optional but not limited to plastic. A through hole 111 is opened on the upper end surface of the shell 100. The material of the temperature-changing component 200 may be selected but not limited to thermal conductive metal, and the thermal conductive metal may be selected but not limited to copper, that is, the temperature-changing component 200 may be set as a copper seat, and a thermal conductive accommodating portion 210 is provided on the top of the temperature-changing component 200, and the material of the thermal conductive accommodating portion 210 may be selected but not limited to thermal conductive metal, and the thermal conductive metal may be selected but not limited to copper, that is, the thermal conductive accommodating portion 210 may be set as a copper tube, and the shape of the thermal conductive accommodating portion 210 is adapted to the shape of the through-hole 111; one end of the temperature control component 300 is installed in the shell 100, and the other end is exposed. The temperature control component 300 can control and adjust the temperature of the temperature-changing component 200 and the thermal conductive accommodating portion 210, so that the temperature of the thermal conductive accommodating portion 210 reaches the temperature required for the BMS low-temperature test.

[0034] It is worth noting that the temperature of the heat conducting container 210 is adjusted to the temperature required for the BMS low temperature test by the temperature control component 300, and then the BMS is placed in the heat conducting container 210, so that the BMS can work at the specified temperature for low temperature testing. 3 Below, the shell 100 accommodates the temperature variable component 200, and the temperature control component 300 is connected to the shell 100. In this way, while ensuring that the BMS can perform low-temperature testing, compared with the existing BMS low-temperature testing equipment, the BMS low-temperature functional testing equipment 10 of the present application is smaller in overall size. When you need to go out, you can move the shell 100 to move the BMS low-temperature functional testing equipment 10, which is more convenient to carry, so that it can be used indoors or outdoors, and the application scenarios are wider. It can also be carried and used at any time as a portable tool, and is more practical.

[0035] In this embodiment, the volume of the housing 100 is about the size of a palm, that is, about 80 cm 3In another embodiment, the volume of the housing 100 is 120 cm 3 In another embodiment, the volume of the housing 100 is 65 cm 3 The specific size of the housing 100 is set according to actual production requirements and is not limited here. It only needs to ensure that the BMS low-temperature functional test equipment 10 can be portable.

[0036] Example 2

[0037] This embodiment is a further implementation of embodiment 1. Figure 1 As shown, in this embodiment, the heat conduction accommodating portion 210 has a heat conduction groove 211 , and the depth of the heat conduction groove 211 is greater than the height of the BMS.

[0038] Specifically, the upper end surface of the thermal conduction accommodating portion 210 has a thermal conduction groove 211 that is adapted to the shape of the BMS. By providing the thermal conduction groove 211 and the depth of the thermal conduction groove 211 being greater than the height of the BMS, the BMS can be entirely incorporated into the thermal conduction groove 211. This is more conducive to forming an environment with the temperature required for BMS low-temperature testing, thereby ensuring that the BMS is tested at the required temperature.

[0039] It is understood that the thermal bath 211 can accommodate a single or multiple BMSs, and the specific size and shape of the thermal bath 211 are not limited herein; they only need to ensure that a low-temperature testing environment is created for the BMS to be tested while maintaining the overall size of the BMS low-temperature functional testing apparatus 10. For example, the thermal bath 211 can accommodate a single BMS and can be configured as a rectangular bath. The dimensions of the thermal bath 211 match those of a single BMS, but are slightly larger than the dimensions of the single BMS to facilitate removal of the single BMS. For another example, the thermal bath 211 can accommodate three BMSs.

[0040] In order to facilitate the use of the temperature control component 300, as Figure 1 and Figure 2 As shown, in some embodiments, the temperature control component 300 includes a temperature setting module 310 and a control module 320, the control end of the temperature setting module 310 is arranged on the outside of the shell 100, and the temperature setting module 310 is electrically connected to the control module 320, and the control module 320 is electrically connected to the temperature variable component 200.

[0041] Specifically, an opening is provided on the upper surface of the housing 100, and the electronic display may be, but is not limited to, a digital tube. Thus, the temperature setting module 310 includes a temperature setting button, a digital tube, and a temperature setting circuit board. The temperature setting button and the digital tube are embedded in the opening and exposed to the outside world to display the temperature through the digital tube, so that the operator can observe the set temperature value. The temperature setting button and the digital tube are connected to the temperature setting circuit board, which is installed in the housing 100, and the control module 320 is arranged in the housing 100. Thus, the temperature setting button can be manually adjusted, the digital tube displays the temperature, and the temperature setting circuit board sends a corresponding electrical signal to the temperature variable element 200, causing the temperature of the temperature variable element 200 to change accordingly. In this way, when the BMS needs to be tested, the ambient temperature can be adjusted by simply pressing the temperature setting button. Compared with the cumbersome steps in testing the existing BMS low-temperature test equipment, the testing steps of the present application are simpler and more convenient.

[0042] It can be understood that the temperature setting module 310, the control module 320 and the temperature variable component 200 are connected by wires, the way in which the temperature setting button, the digital tube and the temperature setting circuit board work together, the way in which the temperature setting circuit board sends electrical signals to the control module 320, and the way in which the control module 320 regulates the temperature change of the temperature variable component 200 are known to those skilled in the art and are achievable, and are not described in detail in this embodiment.

[0043] To prevent accidental touch, Figure 1 and Figure 2 As shown, in some embodiments, the temperature control assembly 300 further includes a temperature setting switch 330 for controlling the start or stop of the temperature setting module 310 , and the temperature setting switch 330 is electrically connected to the temperature setting module 310 .

[0044] Specifically, a temperature setting switch 330 is connected to the circuit. It controls whether the input current is transmitted to the temperature setting circuit board. This additional switch prevents accidental activation of the temperature setting module 310, thereby effectively increasing practicality. The manner in which the temperature setting switch 330 controls the activation or deactivation of the temperature setting module 310 within the circuit is well known to those skilled in the art and is achievable, so a detailed description is omitted in this embodiment.

[0045] To facilitate the use of the BMS low-temperature functional testing equipment 10, in some embodiments, the temperature control component 300 also includes a power supply 340 and a power socket 341. The power supply 340 is electrically connected to the temperature setting module 310. The power socket 341 is embedded in the shell 100, and the power socket 341 is electrically connected to the power supply 340.

[0046] Specifically, the shell 100 is provided with a through slot, and the power supply 340 is assembled on the inner lower surface of the shell 100. The power supply 340 is used to power the temperature setting module 310 and other components, that is, to transmit current to the temperature setting switch 330; the power socket 341 is embedded in the through slot and is connected to the power supply 340 through a wire, and the power supply 340 can be charged through the power socket 341, which is more convenient to use, thereby increasing the practicality of the BMS low-temperature functional test equipment 10.

[0047] In order to ensure the stable use of the BMS low temperature function test equipment 10, as Figure 2 As shown, in some embodiments, the temperature control assembly 300 further includes a voltage stabilizing module 360 ​​, which is disposed between the power supply 340 and the circuit of the temperature setting module 310 .

[0048] Specifically, the voltage stabilization module 360 ​​stabilizes the input voltage and outputs a stable voltage for use by connected electronic devices, providing voltage stabilization, overload protection, short-circuit protection, overheat protection, and other functional features. This allows the voltage input from the power supply 340 to be stably output to the temperature setting module 310, further stabilizing the circuit and enhancing the practicality of the BMS low-temperature functional test device 10.

[0049] Furthermore, the temperature control component 300 also includes a voltage stabilizing switch 370 for controlling the start or stop of the voltage stabilizing module 360 ​​, and the voltage stabilizing switch 370 is electrically connected to the voltage stabilizing module 360 ​​.

[0050] Specifically, the voltage stabilizing switch 370 is connected to the circuit. By regulating the voltage stabilizing switch 370, the start or stop of the voltage stabilizing module 360 ​​can be controlled. The manner in which the voltage stabilizing switch 370 controls the start or stop of the voltage stabilizing module 360 ​​in the circuit is known to those skilled in the art and is achievable, and is not described in detail in this embodiment.

[0051] Furthermore, the temperature control component 300 also includes a main power switch 350 for turning on or off the power supply 340 , and the main power switch 350 is electrically connected to the power supply 340 .

[0052] Specifically, the main power switch 350 can power on and off the BMS low-temperature functional test device 10 by turning the power supply 340 on or off. The manner in which the main power switch 350 controls the power supply of the power supply 340 is known to those skilled in the art and is achievable, and is not described in detail in this embodiment.

[0053] It is understood that the main power switch 350, temperature setting switch 330, and voltage regulator switch 370 can be embedded in the housing 100 through openings and connected to corresponding electronic components via wires. The specific layout of the main power switch 350, temperature setting switch 330, and voltage regulator switch 370 is based on actual production requirements and is not limited here. It only needs to ensure that the corresponding control components are turned on or off. For example, the main power switch 350, temperature setting switch 330, and voltage regulator switch 370 can be arranged side by side on the upper surface of the housing 100, and the main power switch 350 is used to control the power supply of the power supply 340, so that current can be output to the temperature setting switch 330 and voltage regulator switch 370; the voltage regulator switch 370 is used to control whether the voltage output by the power supply 340 is output to the temperature setting module 310 through the voltage regulator module 360; and the temperature setting switch 330 is used to control whether the input current is output to the temperature setting module 310.

[0054] Example 3

[0055] This embodiment is a further implementation of embodiment 1 or 2. In this embodiment, the housing 100 is provided with a heat dissipation channel 130 communicating with the outside, and a heat dissipation component 400 is disposed in the heat dissipation channel 130 .

[0056] Specifically, a heat dissipation channel 130 is opened in the middle of the shell 100, and the heat dissipation channel 130 is set through the left and right sides of the shell 100 to connect the internal components of the shell 100 with the outside world. A heat dissipation component 400 is provided inside to prevent the temperature variable component 200 and other electronic components from being affected by heat during operation and affecting normal operation. It can also be combined with the temperature control component 300 to enable the temperature variable component 200 to quickly reach the required temperature.

[0057] To facilitate the use of the heat dissipation assembly 400, in some embodiments, the heat dissipation assembly 400 includes a plurality of heat sinks 420, each heat sink 420 being connected to the temperature changing element 200 to dissipate the heat of the temperature changing element 200 to the outside.

[0058] Specifically, the heat sinks 420 are mounted in parallel on the lower end of the temperature-changing element 200, and the power supply 340 is disposed below the heat sinks 420. This allows the power supply 340, the heat sinks 420, and the temperature-changing element 200 to be disposed on the left side of the heat dissipation channel 130. The heat sinks 420 are connected to the outside world through the heat dissipation channel 130, thereby allowing heat to be dissipated to the outside world in a timely manner. The heat sinks 420 may be made of, but not limited to, aluminum.

[0059] In order to facilitate the use of the heat dissipation assembly 400, as Figure 1 and Figure 2 As shown, in some embodiments, the heat dissipation assembly 400 further includes a heat dissipation fan 410 , which is disposed in the heat dissipation channel 130 to blow the heat in the housing 100 to the outside.

[0060] Specifically, the heat dissipation fan 410 is installed on the right side of the heat dissipation channel 130 and is located close to the outside. The heat dissipation fan 410 is spaced apart from the temperature-changing element 200, and the air flow is directed toward the heat dissipation fins 420 and the temperature-changing element 200 located on the left side, thereby promptly blowing the heat inside the housing 100 to the outside. The heat dissipation fan 410 can be, but is not limited to, a fan.

[0061] In order to facilitate assembly and repair, Figure 2 and Figure 3 As shown, in some embodiments, the housing 100 includes an upper shell 110 and a lower shell 120 , and the upper shell 110 and the lower shell 120 are detachably connected.

[0062] Specifically, the upper shell 110 is provided with perforations 111, openings, and holes for mounting the heat conduction housing 210, the temperature setting module 310, and the three switches. The lower shell 120 has a through slot on its front side for mounting the power socket 341. Air ducts are defined along the X-axis on both the upper shell 110 and the lower shell 120. When the upper shell 110 and the lower shell 120 are closed, the two air ducts form a heat dissipation channel 130. When internal components require maintenance, the upper shell 110 and the lower shell 120 can be disassembled, making it easier to repair the internal components.

[0063] Example 4

[0064] This embodiment is a further implementation of embodiment 1, 2 or 3, in which a heat-insulating layer is provided in the heat-conducting groove 211 .

[0065] Specifically, the insulation layer may be selected from but not limited to insulation cotton, so as to facilitate maintaining the test temperature of the BMS.

[0066] In this way, the low-temperature functional test equipment 10 of the present application uses components such as a plastic housing 100, a power supply 340, a voltage stabilizing module 360, a variable temperature heat dissipation fan 410, a variable temperature aluminum heat sink 420, and a heat-conducting copper heat-conducting container 210. Each component is connected according to a preset circuit through a wire and fixed to the inside of the portable plastic housing 100, thereby greatly reducing the size of the tooling and allowing it to be carried out anytime, anywhere. It can be used both indoors and outdoors, and is especially convenient for business travelers to carry. The test temperature is displayed using a digital tube, making the test results clearer.

[0067] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0068] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is typically placed when in use. These terms are intended solely to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0069] Furthermore, terms such as "horizontal," "vertical," and "overhanging" do not necessarily imply that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0070] In the present invention, unless otherwise expressly specified or limited, a first feature being above or below a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being above, above, and above the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being below, below, and below the second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0071] Although the present invention has been described with reference to the above specific embodiments, it is obvious that those skilled in the art can make many substitutions, modifications and variations based on the above content. Therefore, all such substitutions, modifications and variations are included within the spirit and scope of the appended claims.

Claims

1. A BMS low temperature functional test equipment, characterized in that, include: A housing (100), a temperature-changing element (200), and a temperature-control assembly (300); The volume of the housing (100) is less than 150 cm 3 The shell (100) is provided with a through hole (111), the temperature-changing element (200) is arranged in the shell (100), and the temperature-changing element (200) is provided with a heat-conducting accommodating portion (210) for accommodating a BMS, and the heat-conducting accommodating portion (210) is at least partially protruded from the through hole (111), and the temperature control component (300) is connected to the shell (100) and electrically connected to the temperature-changing element (200) to adjust the temperature of the heat-conducting accommodating portion (210) to reach the temperature required for the BMS low-temperature test.

2. The BMS low temperature functional test equipment according to claim 1, characterized in that: The heat conduction accommodating portion (210) has a heat conduction groove (211), and the depth of the heat conduction groove (211) is greater than the height of the BMS.

3. The BMS low temperature functional test equipment according to claim 1, characterized in that: The temperature control assembly (300) comprises a temperature setting module (310) and a control module (320), wherein the control end of the temperature setting module (310) is arranged outside the housing (100), and the temperature setting module (310) is electrically connected to the control module (320), and the control module (320) is electrically connected to the temperature variable component (200).

4. The BMS low temperature functional test equipment according to claim 3, characterized in that: The temperature setting module (310) comprises a temperature setting button, an electronic display, and a temperature setting circuit board. The temperature setting button and the electronic display are electrically connected to the temperature setting circuit board and exposed outside the housing (100). The temperature setting circuit board is electrically connected to the control module (320).

5. The BMS low temperature functional test equipment according to claim 3, characterized in that: The temperature control component (300) further comprises a temperature setting switch (330) for controlling the start or stop of the temperature setting module (310), and the temperature setting switch (330) is electrically connected to the temperature setting module (310).

6. The BMS low temperature functional test equipment according to claim 3, characterized in that: The temperature control component (300) further includes a power supply (340) and a power socket (341), wherein the power supply (340) is electrically connected to the temperature setting module (310), and the power socket (341) is embedded in the housing (100), and the power socket (341) is electrically connected to the power supply (340).

7. The BMS low temperature functional test equipment according to claim 1, characterized in that: The housing (100) is provided with a heat dissipation channel (130) communicating with the outside, and a heat dissipation component (400) is arranged in the heat dissipation channel (130).

8. The BMS low temperature functional test equipment according to claim 7, characterized in that: The heat dissipation assembly (400) comprises a plurality of heat dissipation fins (420), each of the heat dissipation fins (420) being connected to the temperature-changing component (200) to dissipate heat from the temperature-changing component (200) to the outside.

9. The BMS low temperature functional test equipment according to claim 7, characterized in that: The heat dissipation assembly (400) further includes a heat dissipation fan (410), and the heat dissipation fan (410) is arranged in the heat dissipation channel (130) to blow the heat in the housing (100) to the outside.

10. The BMS low temperature functional test equipment according to any one of claims 1 to 9, characterized in that: The temperature-changing component (200) and the temperature-conducting accommodating portion (210) are made of a temperature-conducting metal.

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