Ceramic pulse forming line
By using rectangular ceramic chips and silver sheet structures in the ceramic pulse forming line, combined with copper terminals, the problems of large size, heavy weight and high cost in the existing technology are solved, and the efficient formation and low-cost application of ns-level pulses are achieved.
Patent Information
- Application Number
- CN202422703787.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-06
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2034-11-06
AI Technical Summary
The existing ceramic pulse forming wire has the problems of large size, heavy weight, high cost and difficulty in achieving ns-level artificial forming wire.
It adopts rectangular ceramic chip and rectangular silver sheet structure, and welds copper terminals on the rectangular silver sheet to achieve capacitance and inductance parameters while forming ns-level pulses. It has simple structure, small size and low cost.
It achieves efficient formation of nanosecond-level pulses, has a compact structure and low cost, and is suitable for equipment such as high-power microwave sources and particle accelerators.
Smart Images
Figure CN223334656U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of electronic components, and more particularly to a ceramic pulse forming wire. Background Art
[0002] Ceramic pulse forming line is a device component used to generate high-power pulses. It mainly uses the special electrical properties of ceramic materials to realize the formation and transmission of pulses. It plays a key role in the field of pulse power technology, such as high-power microwave sources, particle accelerators and other equipment. The basic working principle of the pulse forming line is to generate pulses by charging the transmission line and then discharging it quickly at a specific moment. In this process, the ceramic pulse forming line utilizes the high dielectric constant characteristics of the ceramic medium. When voltage is applied to its two ends for charging, the electric field energy is stored in the ceramic medium. Taking a simple parallel plate ceramic pulse forming line as an example, it is similar to a capacitor. The size of the capacitor is related to the dielectric constant of the ceramic, the plate area, and the plate spacing ( Where C is the capacitance, ∈ is the dielectric constant, S is the plate area, and d is the plate spacing. During the charging process, charge accumulates on the plates, and energy is stored in the ceramic dielectric as electric field energy. When a trigger switch (such as a spark gap switch) closes to discharge, the stored electric field energy is rapidly released, forming a pulse current, thereby generating a pulse signal.
[0003] The structure of a ceramic pulse forming line mainly consists of ceramic materials, electrodes and leads. Among them, the coaxial structure is a traditional pulse forming line structure, which consists of an inner conductor, a ceramic dielectric and an outer conductor. The ceramic dielectric is located between the inner and outer conductors and plays the role of insulation and energy storage. The electrodes are connected to the inner and outer conductors respectively for applying voltage and transmitting current. The flat plate structure of a ceramic pulse forming line consists of two parallel ceramic plates with electrodes sandwiched in between. The electrodes can be metal foil or metal mesh, which are prepared on the ceramic plates by printing or sputtering. The leads are connected to the electrodes for connection with the external circuit. The thin film structure of a ceramic pulse forming line is to make the ceramic material into a thin film, and then prepare the electrodes on the film. This structure has the advantages of small size, light weight and stable performance, and is suitable for miniaturized and integrated pulse power systems. The folded structure of a ceramic pulse forming line is to fold the coaxial structure or flat plate structure of the pulse forming line to reduce the volume and weight. This structure is suitable for applications with limited space.
[0004] The existing ceramic pulse forming line relies on multiple capacitors and inductors connected in series and in parallel, such as Figure 1 As shown, the above-mentioned ceramic pulse forming line has relatively high requirements on the internal resistance, inductive reactance and other performance of electronic components, and it is difficult to achieve ns-level artificial forming line. At the same time, there are also problems such as large size, heavy weight and high cost. Utility Model Content
[0005] The embodiment of the utility model provides a ceramic pulse forming line, which simultaneously achieves the capacitance and inductance parameter requirements through the geometric shape of the silver surface on the rectangular ceramic medium, realizes the ns-level pulse artificial forming line with good effect, simple structure, small size and low cost.
[0006] The present invention provides a ceramic pulse forming wire, comprising:
[0007] A rectangular ceramic chip, with a rectangular silver sheet disposed on its upper surface and a rectangular silver sheet disposed on its lower surface, wherein the length and width of the rectangular silver sheet are smaller than the length and width of the rectangular ceramic chip;
[0008] A rectangular silver sheet has copper terminals welded to both ends thereof, and the copper terminals extend to the outside of the ceramic chip, and the width of the copper terminals is smaller than the width of the rectangular silver sheet.
[0009] Preferably, the rectangular ceramic chip has a length of 250 mm, a width of 30 mm, and a thickness of 10 mm.
[0010] Preferably, the rectangular silver sheet has a length of 220 mm, a width of 10 mm, and a thickness of 20 μm.
[0011] Preferably, the length of the copper terminal located on the lower surface of the ceramic chip extending to the rectangular ceramic chip is equal to the length of the copper terminal located on the upper surface of the ceramic chip extending to the rectangular ceramic chip.
[0012] Preferably, the copper terminals at both ends of the upper surface of the ceramic chip have the same length, and the lengths extending outside the rectangular ceramic chip are equal;
[0013] The copper terminals at both ends of the lower surface of the ceramic chip have the same length, and the lengths of the copper terminals extending outside the rectangular ceramic chip are equal.
[0014] The ceramic pulse forming line provided by an embodiment of the present invention comprises: a rectangular ceramic chip, a rectangular silver sheet disposed on its upper surface, and a rectangular silver sheet disposed on its lower surface, wherein the length and width of the rectangular silver sheet are smaller than the length and width of the rectangular ceramic chip; and a rectangular silver sheet, copper terminals welded to its ends, the copper terminals extending to the outside of the ceramic chip, the width of the copper terminals being smaller than the width of the rectangular silver sheet. The ceramic pulse forming line provided by an embodiment of the present invention comprises rectangular silver sheets disposed on the upper and lower surfaces of the rectangular ceramic chip, and the rectangular silver sheets extending to the outside of the rectangular ceramic chip via the copper terminals. In practical applications, the desired pulse wave can be achieved by controlling the length, width, and thickness of the rectangular ceramic chip and the rectangular silver sheet, and the voltage requirements can be ensured to be met by designing the thickness of the rectangular ceramic chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0016] Figure 1 A schematic diagram of the structure of a ceramic pulse forming line provided by the prior art;
[0017] Figure 2 A schematic diagram of the structure of a ceramic pulse forming line provided by an example of the present utility model;
[0018] Figure 3 A schematic front view of a ceramic pulse forming line provided by an example of the present utility model;
[0019] Among them, 1 ~ rectangular ceramic chip, 2 ~ rectangular silver sheet, 3 ~ copper terminal. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0021] Figure 2 A schematic diagram of the structure of a ceramic pulse forming line provided by an example of the present utility model; Figure 3 A schematic diagram of a front view of a ceramic pulse forming line provided by an example of the present invention; Figures 2 and 3As an example, a ceramic pulse forming wire provided by the present utility model is described in detail. Figure 2 As shown, the ceramic pulse forming line mainly includes a rectangular ceramic chip 1, a rectangular silver sheet 2 and a copper terminal 3.
[0022] Specifically, the upper and lower surfaces of the rectangular ceramic chip are the same, and rectangular silver sheets are symmetrically arranged on the upper and lower surfaces thereof, and the length and width of the rectangular silver sheets are both smaller than the length and width of the rectangular ceramic chip.
[0023] It should be noted that, in actual application, the rectangular ceramic chip and the rectangular silver surface are sintered together at high temperature.
[0024] Furthermore, copper terminals are welded on both ends of the rectangular silver sheet. The width of the copper terminals is smaller than that of the rectangular silver sheet, and one end of the copper terminals away from the rectangular silver sheet extends to the outside of the ceramic chip.
[0025] The ceramic pulse forming wire provided in the embodiment of the present invention can realize the required pulse wave by controlling the length, width and thickness of the rectangular ceramic chip and the rectangular silver sheet, and ensure that the voltage requirement is met by designing the thickness of the rectangular ceramic chip.
[0026] For example, in the ceramic pulse forming line provided in an embodiment of the present invention, in order to set the rectangular silver sheet on the upper and lower surfaces of the rectangular ceramic chip, preferably, the length of the rectangular silver sheet is smaller than the length of the rectangular ceramic chip, and the width of the rectangular silver sheet is smaller than the width of the rectangular ceramic chip.
[0027] In one example, the rectangular ceramic chip has a length of 250 mm, a width of 30 mm, and a thickness of 10 mm.
[0028] In one example, the rectangular silver sheet has a length of 220 mm, a width of 10 mm, and a thickness of 20 μm.
[0029] For example, in the ceramic pulse forming line provided by an embodiment of the present invention, the length of the copper terminal located on the lower surface of the ceramic chip extending to the rectangular ceramic chip is equal to the length of the copper terminal located on the upper surface of the ceramic chip extending to the rectangular ceramic chip.
[0030] For example, the ceramic pulse forming line provided in an embodiment of the present invention has the same length of copper terminals at both ends of the upper surface of the ceramic chip, and the same length extending outside the rectangular ceramic chip; the same length of copper terminals at both ends of the lower surface of the ceramic chip, and the same length extending outside the rectangular ceramic chip.
[0031] It should be noted that, in the embodiment of the present invention, the width of the copper terminal is smaller than the width of the rectangular silver sheet. Since the copper terminal needs to extend to the outside of the rectangular ceramic chip, there is no limit on the length of the copper terminal.
[0032] The ceramic pulse forming line provided by an embodiment of the present invention comprises: a rectangular ceramic chip, a rectangular silver sheet disposed on its upper surface, and a rectangular silver sheet disposed on its lower surface, wherein the length and width of the rectangular silver sheet are smaller than the length and width of the rectangular ceramic chip; and a rectangular silver sheet, copper terminals welded to its ends, the copper terminals extending to the outside of the ceramic chip, the width of the copper terminals being smaller than the width of the rectangular silver sheet. The ceramic pulse forming line provided by an embodiment of the present invention comprises rectangular silver sheets disposed on the upper and lower surfaces of the rectangular ceramic chip, and the rectangular silver sheets extending to the outside of the rectangular ceramic chip via the copper terminals. In practical applications, the desired pulse wave can be achieved by controlling the length, width, and thickness of the rectangular ceramic chip and the rectangular silver sheet, and the voltage requirements can be ensured to be met by designing the thickness of the rectangular ceramic chip.
[0033] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.
[0034] Obviously, those skilled in the art may make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include such modifications and variations.
Claims
1. A ceramic pulse forming wire, characterized in that: include: A rectangular ceramic chip, with a rectangular silver sheet disposed on its upper surface and a rectangular silver sheet disposed on its lower surface, wherein the length and width of the rectangular silver sheet are smaller than the length and width of the rectangular ceramic chip; A rectangular silver sheet has copper terminals welded to both ends thereof, and the copper terminals extend to the outside of the ceramic chip, and the width of the copper terminals is smaller than the width of the rectangular silver sheet.
2. The ceramic pulse forming wire according to claim 1, wherein The rectangular ceramic chip has a length of 250 mm, a width of 30 mm, and a thickness of 10 mm.
3. The ceramic pulse forming wire according to claim 1, wherein The rectangular silver sheet has a length of 220 mm, a width of 10 mm, and a thickness of 20 μm.
4. The ceramic pulse forming wire according to claim 1, wherein The length of the copper terminal located on the lower surface of the ceramic chip extending to the rectangular ceramic chip is equal to the length of the copper terminal located on the upper surface of the ceramic chip extending to the rectangular ceramic chip.
5. The ceramic pulse forming wire according to claim 1, wherein: The copper terminals at both ends of the upper surface of the ceramic chip are of the same length and have the same length extending outside the rectangular ceramic chip; The copper terminals at both ends of the lower surface of the ceramic chip have the same length, and the lengths of the copper terminals extending outside the rectangular ceramic chip are equal.