Latticed chip protective film

Abstract

The utility model relates to a latticed chip protective film, which is formed by laminating and compounding a conductive film, an antistatic protective film and a conductive adhesive film, the antistatic protective film is a latticed antistatic protective film, one surface of the latticed antistatic protective film is compounded on the conductive film, and the other surface of the latticed antistatic protective film is compounded on the conductive adhesive film. The other surface of the latticed antistatic protective film is bonded with one surface of the conductive bonding film, and the other surface of the conductive bonding film is provided with strip-shaped convex bonding strips which are parallel to each other. The anti-static packaging film has the advantages that firstly, the anti-static protection film is of a latticed structure, so that a conductive layer is formed on the surface of a packaged chip, the surface resistivity of the chip is reduced, static electricity generated when the chip is packaged, transported and torn off is quickly led in and leaked, and the internal structure of the chip is prevented from being damaged by the static electricity; and 2, the strip-shaped convex bonding strips on the surface of the conductive bonding film are bonded in parallel at intervals, so that the bonding surface between the conductive bonding film and the chip is greatly reduced, and when the antistatic protective film bonded on the surface of the chip needs to be torn off from the chip, the antistatic protective film can be naturally and smoothly torn off without generating static electricity, and the service life of the antistatic protective film is prolonged. And the internal structure of the chip is ensured not to be damaged by the generated static electricity during assembly.

Description

TECHNICAL FIELD

[0001] The utility model relates to a grid chip protection film which has reliable anti-static function, reliably protects the internal structure of the chip from static damage, and does not cause static damage to the chip when the grid chip protection film is torn. BACKGROUND

[0002] CN210706393U, entitled "High-cleanliness anti-static chip packaging film", includes a protective film and an anti-sticking anti-static layer. The protective film includes a base film and an adhesive layer coated on the base film. The anti-sticking anti-static layer is bonded to the protective film, and the anti-sticking anti-static layer has a plurality of conductive particles therein. The anti-sticking anti-static layer includes a polymer film, and the conductive particles are dispersed in the polymer film. The polymer film includes a first surface and a second surface, and the first surface is bonded to the protective film. The first surface has a plurality of spaced protrusions, and recesses are formed between adjacent protrusions. The second surface of the polymer film is also provided with a support layer made of plastic. The conductive particles are in contact with each other to form a path. The path is arranged in a chain-like manner. The disadvantages are: first, although the conductive particles are added in the polymer film of the packaging film, the conductive particles cannot ensure that the static electricity is released 100%, and only the static electricity is relatively reduced, so that the chip is inevitably damaged; second, after the anti-sticking anti-static layer and the protective film are bonded, only the protrusions are bonded to the adhesive layer, and the recesses are not bonded to the adhesive layer of the protective film, thereby reducing the bonding area between the anti-sticking anti-static layer and the protective film, achieving easy tearing between the anti-sticking anti-static layer and the protective film, and not achieving easy tearing between the chip surfaces; third, bubbles are generated during the bonding process of the anti-sticking anti-static layer and the protective film, the bubbles can be transferred from the protrusions to the recesses and discharged, although the effect of reducing bubbles is achieved, but the protection of the chip does not play any role. SUMMARY

[0003] Design purpose: to avoid the disadvantages of the background art, and to design a grid chip protection film which has reliable anti-static function, reliably protects the internal structure of the chip from static damage, and does not cause static damage to the chip when the grid chip protection film is torn.

[0004] Design scheme: in order to realize the above design purpose, the utility model discloses on scheme design: 1, the design of the anti-static protective film is the grid structure, and it is one of the technical features of the utility model. The purpose of such design is: static electricity is generated due to the unbalance of the surface charge of the object, and the common generation methods include contact, friction and peeling, etc. In the design and production process of the chip, electrostatic discharge (ESD) is a problem that cannot be ignored, which may cause damage to the internal structure of the chip and cause it to malfunction. The film for protecting the chip is designed into a grid structure in the utility model, and the surface of the chip forms a conductive layer through the contact of the grid film and the chip surface, which reduces the surface resistivity, makes the static electricity generated during packaging, transportation and film tearing of the chip leak quickly, avoids the accumulation of static electricity on the chip surface, and further achieves the purpose of protecting the internal structure of the chip from being damaged by static electricity. Because the conductive path is constructed on the surface of the material, the charged particles can quickly contact and conduct, thereby inhibiting and reducing the generation of static charge. 2, the design of the grid-shaped anti-static protective film high molecular resin powder and nanometer graphene powder mixed uniformly, which is the second technical feature of the utility model. The purpose of such design is: the conductivity of graphene is very excellent, because its stable lattice structure makes the carbon atoms have excellent conductivity, and the electrons in the graphene move in the orbit without scattering due to lattice defects or introduction of foreign atoms, so the interference of the electrons during movement is very small. Therefore, the nanometer graphene powder and nanometer high molecular resin powder are mixed uniformly in the utility model, and the high molecular resin conductive ball prepared therefrom not only has good conductivity, but also has good elasticity. When it contacts the chip surface, the good elasticity greatly reduces the impact of gravity and external force on the chip, ensuring the safety of the chip during storage and transportation. 3, the design of the strip-shaped convex adhesive strip on the surface of the conductive adhesive film, which is the third technical feature of the utility model. The purpose of such design is: the surface of the strip-shaped convex adhesive strip is a sticky adhesive surface, and the adhesive surface of the chip is also a spaced strip adhesive, so the adhesive surface between the chip is less and parallel to each other. Therefore, when the anti-static protective film adhered to the chip surface needs to be torn off from the chip, the anti-static protective film can be naturally, smoothly and effortlessly torn off from the chip surface without generating static electricity, ensuring that the internal structure of the chip is not damaged by the generated static electricity during assembly. 4, the design of the conductive film, which is the fourth technical feature of the utility model. The purpose of such design is: the conductive film has very good conductivity, so it can quickly discharge the static electricity generated in the grid-shaped anti-static protective film, ensuring the safety of the protected chip.

[0005] Technical solution: A grid-shaped chip protection film is composed of a conductive film, an antistatic protection film and a conductive adhesive film, the antistatic protection film is a grid-shaped antistatic protection film, one side of the grid-shaped antistatic protection film is combined with the conductive film, the other side of the grid-shaped antistatic protection film is bonded with one side of the conductive adhesive film, and the other side of the conductive adhesive film is a strip-shaped protruding bonding strip parallel to each other.

[0006] ‌ Compared with the background art, the antistatic protection film is in a grid-shaped structure, so that a conductive layer is formed on the surface of the packaged chip, thereby reducing the surface resistivity of the chip, allowing the static electricity generated during packaging, transportation and film tearing of the chip to be rapidly discharged and leaked, and ensuring that the internal structure of the chip is not damaged by static electricity; and the strip-shaped protruding bonding strip on the surface of the conductive adhesive film is a parallel strip-shaped bonding strip, which not only greatly reduces the bonding surface between the chip and the strip-shaped protruding bonding strip, but also allows the antistatic protection film bonded on the surface of the chip to be naturally, smoothly and effortlessly torn off from the surface of the chip without generating static electricity, thereby ensuring that the internal structure of the chip is not damaged by the generated static electricity during assembly. BRIEF DESCRIPTION OF DRAWINGS

[0007] Figure 1 is a structural schematic diagram of the grid-shaped chip protection film.

[0008] Figure 2 is Figure 1 is a partial top view structural schematic diagram of the antistatic protection film.

[0009] Figure 3 is a top view structural schematic diagram of the conductive adhesive film. DETAILED DESCRIPTION

[0010] Referring to the drawings Figures 1-3 A grid-shaped chip protection film is characterized by being composed of a conductive film 1, an antistatic protection film 2 and a conductive adhesive film 3, the antistatic protection film 2 is a grid-shaped antistatic protection film, one side of the grid-shaped antistatic protection film 2 is combined with the conductive film 1, the other side of the grid-shaped antistatic protection film 2 is bonded with a conductive conductive film 4 in the conductive adhesive film 3, and the other side of the conductive conductive film 4 is a strip-shaped protruding bonding strip 5 parallel to each other. The conductive adhesive film 3 is composed of the conductive conductive film 4 and the strip-shaped protruding bonding strip 5 on the surface of the conductive conductive film. The width of the strip-shaped protruding bonding strip 5 is less than 3mm, and the protruding height is less than 0.5mm.

[0011] In example 2, on the basis of example 1, the conductive film 1, the antistatic protection film 2 and the conductive adhesive film 3 are made of a mixture of nano-level high molecular resin powder, nano-level graphene powder and nano-level aluminum powder, the manufacturing process is the prior art, which is not described here.

[0012] It needs to be understood that: the above examples, although the design idea of the utility model has been described in more detail, these text descriptions are only simple text descriptions of the design idea of the utility model, and are not limitations of the design idea of the utility model, and any combination, addition or modification beyond the design idea of the utility model falls within the protection scope of the utility model.

Claims

1. A grid-shaped chip protection film, characterized in that The conductive adhesive film (3) is composed of a conductive film (1), an antistatic protective film (2) and a conductive adhesive film (3) stacked and compounded. The antistatic protective film (2) is a grid-shaped antistatic protective film. One side of the grid-shaped antistatic protective film (2) is compounded on the conductive film (1). The other side of the grid-shaped antistatic protective film (2) is bonded to one side of the conductive adhesive film (3). The other side of the conductive adhesive film (3) is a strip-shaped raised adhesive strip (5) parallel to each other.

2. The grid-shaped chip protection film according to claim 1, wherein: The conductive adhesive film (3) is composed of a conductive conductive film (4) and a strip-shaped raised adhesive strip (5) located on the surface of the conductive conductive film.

3. The grid-shaped chip protection film according to claim 1, wherein: The width of the strip-shaped raised adhesive strip (5) is less than 3 mm, and the raised height is less than 0.5 mm.

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