Horizontal electroplating equipment for photovoltaic crystalline silicon solar cell

Abstract

The embodiment of the utility model discloses horizontal electroplating equipment for a photovoltaic crystalline silicon solar cell, which is used for electroplating an electroplated part and comprises an upper electroplating tank, the upper electroplating tank consists of a plurality of tank body units, each tank body unit comprises an electroplating tank, a plurality of cathode units and a plurality of anode units, electroplating liquid is arranged in the electroplating tank, and the cathode units are arranged in the electroplating tank. The plated part is in contact with the cathode units and the electroplating liquid, the cathode units are connected in parallel, and the anode units are connected in parallel. Compared with a soaking type tank body structure of traditional electroplating equipment, the floating type tank body structure is adopted and combined with a cathode and anode parallel connection mode, the problem that the quality of a plating layer is affected due to uneven current distribution in the tank body can be solved, and therefore the quality and performance of the plating layer are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to photovoltaic equipment technical field especially relates to a horizontal plating equipment for photovoltaic crystalline silicon solar cell. BACKGROUND

[0002] The horizontal plating equipment is mainly used for uniformly depositing metal layer on the electrode of photovoltaic crystalline silicon solar cell to improve the photoelectric conversion efficiency and stability of the cell. The equipment forms one or more metal plating layers such as nickel, copper, tin or silver on the surface of the cell through electrochemical method, thereby improving the conductivity and corrosion resistance of the cell.

[0003] The slot body of the conventional horizontal plating equipment usually immerses the cell or other plated parts in the solution, but this mode causes uneven current distribution due to different plating liquid depths, which affects the plating layer quality, i.e. there is the problem of reverse etching phenomenon. SUMMARY

[0004] The utility model aims at providing a horizontal plating equipment for photovoltaic crystalline silicon solar cell, which aims to solve the technical problem of reverse etching phenomenon of the existing plating equipment.

[0005] To solve the above technical problem, the utility model aims at realizing the following technical scheme:

[0006] The utility model provides a horizontal plating equipment for photovoltaic crystalline silicon solar cell for plating plated parts, which comprises an upper plating slot, the upper plating slot is composed of a plurality of slot body units, the slot body unit comprises a plating slot, a plurality of cathode units and a plurality of anode units, the plating slot is provided with plating solution, the plated part contacts the cathode unit and the plating solution, the cathode units are connected in parallel, and the anode units are connected in parallel.

[0007] Further, the cathode unit is a plating roller, and the plating roller is located outside the plating slot.

[0008] Further, the two sides of each plating slot are respectively provided with a plating roller, and the plating roller is installed on the top of the slot body unit.

[0009] Further, the anode unit is a conductive metal plate, and the conductive metal plate is located in the plating slot.

[0010] Further, the slot body unit is further provided with a power supply unit outside, and the power supply unit is electrically connected with the cathode unit and the anode unit.

[0011] Further, the power supply unit comprises a plurality of power supply channels, the positive pole of the power supply channel is connected with the anode unit, and the negative pole of the power supply channel is connected with the cathode unit.

[0012] Further, the horizontal electroplating device further comprises a driving assembly, the electroplating roller is connected with the driving assembly, and the driving assembly drives the electroplating roller to roll to move the plated piece along the length direction of the electroplating upper groove.

[0013] Further, the groove body of the electroplating groove is externally provided with a plurality of conductive slip rings, the conductive slip rings are connected with the electroplating roller, and the conductive slip rings are connected through wires.

[0014] Further, the horizontal electroplating device further comprises an electroplating lower groove, the electroplating lower groove is connected with the electroplating upper groove, and the electroplating lower groove and the electroplating upper groove are arranged in an L shape.

[0015] Further, both sides of the electroplating groove are provided with plating solution backflow ports, the plating solution backflow ports are connected with the electroplating lower groove, and the electroplating solution is recycled into the electroplating lower groove through the plating solution backflow ports.

[0016] Further, the groove body of the electroplating upper groove and the electroplating lower groove is composed of steel and PP materials.

[0017] Compared with the prior art, the utility model discloses a battery piece or other plated piece is placed on the electroplating groove and contacts the electroplating solution in the electroplating groove, and the battery piece or the plated piece is electroplated metal ions by the anode unit and the cathode unit to form a metal plating layer, wherein the plurality of anode units and the plurality of cathode units are in parallel, thereby realizing the uniform distribution of the current in the electroplating groove. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the drawings needed in the embodiment description will be briefly introduced, and obviously, the drawings in the following description are some embodiments of the utility model, and for ordinary skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0019] Fig. 1 The structural schematic diagram of the horizontal electroplating device for photovoltaic crystalline silicon solar cell provided by the utility model embodiment is provided.

[0020] Fig. 2 The partial structural schematic diagram of a certain groove unit of the horizontal electroplating device for photovoltaic crystalline silicon solar cell provided by the utility model embodiment is provided.

[0021] Reference signs:

[0022] 1. electroplating tank; 11. tank unit; 111. electroplating tank; 1111. electroplating solution; 112. cathode unit; 113. anode unit; 114. plating solution return port; 2. plated part. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of the present application.

[0024] It should be understood that the terms "comprising" and "including" as used in the specification and the appended claims indicate the presence of the recited features, integers, steps, operations, elements, and / or components but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0025] It should also be understood that the terms used in the present application specification are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the present application specification and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0026] It should be further understood that the term "and / or" as used in the present application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations thereof, and includes these combinations.

[0027] Please refer to Figs. 1-2 The horizontal electroplating equipment for photovoltaic crystalline silicon solar cells disclosed in the embodiments of the present application is used for electroplating a plated part 2 and comprises an electroplating tank 1. The electroplating tank 1 is composed of a plurality of tank units 11. Each tank unit 11 comprises an electroplating tank 111, a plurality of cathode units 112 and a plurality of anode units 113. The electroplating tank 111 is provided with an electroplating solution 1111. The plated part 2 is in contact with the cathode units 112 and the electroplating solution 1111. The cathode units 112 are connected in parallel with each other, and the anode units 113 are connected in parallel with each other.

[0028] Specifically, the electroplating upper tank 1 is composed of multiple tank body units 11, and such a modular design facilitates the maintenance, upgrading and flexible adjustment of the equipment according to production requirements. Each tank body unit 11 is provided with an electroplating tank 111, and the electroplating tank 111 is filled with an appropriate amount of electroplating solution 1111, and the selection of the electroplating solution 1111 is determined according to the specific electroplating process and the required properties of the plated layer. The cathode unit 112 and the anode unit 113 are connected in parallel, respectively, the cathode unit 112 abuts against the plated piece 2, ensuring that the current can be smoothly conducted to the surface of the plated piece 2 during the electroplating process, and the anode unit 113 is located in the electroplating tank 111 and directly contacts the electroplating solution 1111, and releases metal ions into the electroplating solution 1111 through electrolysis. The uniformity of current distribution of the equipment makes the plated layer thickness more uniform and consistent, reducing the generation of plated layer defects and defective products; the modular design makes the maintenance and upgrading of the equipment more convenient and lower in cost. Therefore, through the modular design and parallel connection mode, the production capacity and efficiency of the electroplating equipment can be significantly improved.

[0029] Further, during the electroplating process, the electroplating solution 1111 undergoes electrolysis under the action of an electric field, metal ions are released from the anode unit 113 and deposited on the surface of the plated piece 2 to form a plated layer, and by controlling parameters such as the composition, temperature and current density of the electroplating solution 1111, the thickness, uniformity and other physical and chemical properties of the plated layer can be accurately controlled.

[0030] It can be understood that the plated piece 2 in the embodiment is a battery piece, and in other embodiments, the plated piece 2 can also be a semiconductor device, an electronic component, a metal part, etc., and the specific type can be selected according to actual conditions.

[0031] As shown in Fig. 1-2 , the cathode unit 112 is an electroplating roller, and the electroplating roller is located outside the electroplating tank 111.

[0032] Specifically, the electroplating roller serves as the cathode unit 112, and in order to meet the requirements of the electroplating process, the surface of the electroplating roller has good electrical conductivity and corrosion resistance to ensure stable transmission of current and uniform deposition of the plated layer during the electroplating process. The shape and size of the roller are customized according to the shape and size of the plated piece 2 to ensure close contact between the roller and the plated piece 2 during electroplating, thereby improving the electroplating efficiency and quality.

[0033] As shown in Fig. 1-2 , each electroplating tank 111 is provided with an electroplating roller on each side, and the electroplating roller is installed on the top of the tank body unit 11.

[0034] Specifically, the electroplating rollers in the embodiment are respectively located at two sides of the electroplating tank 111 and are fixed and installed through a support or a guide rail or the like. When installed, the relative positions between the rollers and the electroplating tank 111 need to be ensured to be accurate to avoid errors in the electroplating process. In the rotating process of the electroplating rollers, the electroplating rollers can drive the electroplating liquid 1111 to form a uniform and stable flow on the surface of the plated part 2, thereby further improving the uniformity and quality of the plated layer.

[0035] As shown in FIG. 1, the electroplating device comprises a plurality of tank body units 11, a plurality of cathode units 112, a plurality of anode units 113 and a plurality of power supply units. Fig. 1-2 As shown in FIG. 1, the anode unit 113 is a conductive metal plate, which is located in the electroplating tank 111.

[0036] Specifically, in the embodiment, the conductive metal plate is a conductive titanium plate. Titanium is known as "space metal" because it has super strong resistance to various harsh environments (such as high temperature, low temperature, humidity, dryness, etc.). The conductive titanium plate can maintain its stability and integrity in the electroplating liquid 1111 for a long time and is not easy to be corroded or worn, thereby prolonging the service life of the device. In addition, common anode materials also include lead, tin, stainless steel, etc. The specific selection can be determined according to the electroplating process and the required properties of the plated layer. In the electroplating process, the conductive metal plate as the anode forms an electric field with the cathode (such as the electroplating roller) in the electroplating tank 111. The electroplating liquid 1111 undergoes electrolytic reaction under the action of the electric field, and metal ions are released from the anode metal plate and deposited on the surface of the plated part 2 to form a plated layer.

[0037] In an optional embodiment, the tank body unit 11 is further provided with a power supply unit (not shown in the figure) outside. The power supply unit is electrically connected with the cathode unit 112 and the anode unit 113 respectively.

[0038] Specifically, the power supply unit is a key component in the electroplating device, which is responsible for providing direct current or alternating current required in the electroplating process.

[0039] In an optional embodiment, the power supply unit comprises a plurality of power supply channels. The positive pole of the power supply channel is connected with the anode unit 113, and the negative pole of the power supply channel is connected with the cathode unit 112.

[0040] Specifically, in the embodiment, the number of the cathode units 112 in each tank body unit 11 is four, and the number of the anode units 113 is three. Among them, two adjacent cathode units 112 and the anode unit 113 therebetween form an electroplating unit, and the number of the power supply channels is four, which corresponds to the electroplating units one by one to achieve the effect of power supply.

[0041] It can be understood that in other embodiments, the cathode unit 112, the anode unit 113 and the power supply channel can also be other numbers, which can be set according to actual work requirements.

[0042] In an optional embodiment, the horizontal electroplating device further comprises a driving assembly (not shown in the figure), and the electroplating roller is connected with the driving assembly, and the driving assembly drives the electroplating roller to roll to move the plated workpiece 2 along the length direction of the electroplating upper tank 1.

[0043] Specifically, the driving assembly is a key component in the horizontal electroplating device, which is responsible for providing power for the rolling of the electroplating roller. According to the scale of the electroplating device, the weight of the electroplating roller, and the moving speed of the plated workpiece 2 and other requirements, a suitable driving assembly is selected, such as a driving motor, a speed reducer, a transmission device, etc. The electroplating roller is driven to roll by the driving assembly, so that the plated workpiece 2 can continuously and smoothly move in the electroplating upper tank 1 (as shown by the arrow direction), thereby greatly improving the electroplating efficiency. Secondly, the rolling of the electroplating roller helps to form uniform flow and distribution of the electroplating liquid 1111 on the surface of the plated workpiece 2, thereby improving the uniformity and quality of the plated layer. Fig. 1

[0044] In an optional embodiment, the tank body of the electroplating tank 111 is provided with a plurality of conductive slip rings (not shown in the figure), and the conductive slip rings are connected with the electroplating roller, and the conductive slip rings are connected through wires.

[0045] Specifically, the conductive slip ring is a device that can transmit current or signals while rotating or sliding. In the electroplating device, the conductive slip ring is used to connect the electroplating roller and the power supply or signal source outside the electroplating tank 111. The number and position of the conductive slip rings should be reasonably configured according to the design of the electroplating roller and the layout of the electroplating tank 111, to ensure that the current can be uniformly transmitted to the electroplating roller, and to avoid the occurrence of current concentration or short circuit phenomenon.

[0046] In an optional embodiment, the horizontal electroplating device further comprises an electroplating lower tank (not shown in the figure), and the electroplating lower tank is connected with the electroplating upper tank 1, and the electroplating lower tank and the electroplating upper tank 1 are arranged in an L-shaped manner.

[0047] Specifically, the electroplating upper tank 1 in this embodiment is a working tank, and the electroplating lower tank is a secondary tank. The electroplating upper tank 1 can be used for depositing the plated layer of the battery piece and cleaning; and the electroplating lower tank is used for storing and circulating the electroplating liquid 1111. The L-shaped tank body design is helpful for the recycling and recycling of the electroplating liquid 1111. The electroplating lower tank can collect the electroplating liquid 1111 flowing down from the electroplating upper tank 1, and filter, purify and reuse through the management system.

[0048] As shown in Fig. 1-2 The two sides of the electroplating tank 111 are provided with plating liquid return ports 114, and the plating liquid return ports 114 are connected with the electroplating lower tank. The electroplating liquid 1111 is recycled into the electroplating lower tank through the plating liquid return ports 114.

[0049] ​Specifically, the main function of the plating solution backflow port 114 is to collect the excess electroplating solution 1111 in the electroplating tank 111, including the electroplating solution 1111 dripping from the surface of the plated part 2 and the electroplating solution 1111 overflowing due to improper operation or equipment leakage. The electroplating solution 1111 collected through the backflow port can be recycled after being treated and returned to the electroplating lower tank, which helps to reduce production costs and improve resource utilization.

[0050] In an optional embodiment, the tank body of the electroplating upper tank 1 and the electroplating lower tank is composed of steel and PP materials.

[0051] Specifically, the steel material used in this embodiment is less than the PP material, and the overall structure of the device is more compact. In addition, the combination of steel and PP materials makes the tank body have both the strength and rigidity of steel and the corrosion resistance and impact resistance of PP material. This design can prolong the service life of the tank body and reduce the maintenance and replacement costs caused by corrosion and impact.

[0052] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any skilled person in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A horizontal electroplating apparatus for a photovoltaic crystalline silicon solar cell for electroplating a plating target, characterized by, The application relates to an electroplating upper groove which comprises a plurality of groove body units, each of which comprises an electroplating groove, a plurality of cathode units and a plurality of anode units, and the electroplating groove is provided with electroplating liquid, the plated workpiece is in contact with the cathode units and the electroplating liquid, the cathode units are connected in parallel, and the anode units are connected in parallel.

2. The horizontal electroplating apparatus for photovoltaic crystalline silicon solar cells according to claim 1, characterized in that, The cathode units are electroplating rollers which are located outside the electroplating groove.

3. The horizontal electroplating apparatus for photovoltaic crystalline silicon solar cells according to claim 2, characterized in that, Each of the electroplating grooves is provided with an electroplating roller on each side, and the electroplating roller is installed on the top of the groove body unit.

4. The horizontal electroplating apparatus for photovoltaic crystalline silicon solar cells according to claim 1, characterized in that, The anode units are conductive metal plates which are located in the electroplating groove.

5. The horizontal electroplating apparatus for photovoltaic crystalline silicon solar cells according to claim 1, characterized in that, The groove body unit is further provided with a power supply unit outside, and the power supply unit is electrically connected with the cathode units and the anode units.

6. The horizontal electroplating apparatus for photovoltaic crystalline silicon solar cells according to claim 5, characterized in that, The power supply unit comprises a plurality of power supply channels, the positive pole of the power supply channel is connected with the anode units, and the negative pole of the power supply channel is connected with the cathode units.

7. The horizontal electroplating apparatus for photovoltaic crystalline silicon solar cells according to claim 2, characterized in that, The electroplating roller is connected with a driving assembly, and the driving assembly drives the electroplating roller to roll so as to move the plated workpiece along the length direction of the electroplating upper groove.

8. The horizontal electroplating apparatus for photovoltaic crystalline silicon solar cells according to claim 2, characterized in that, The groove body of the electroplating groove is provided with a plurality of conductive slip rings outside, the conductive slip rings are connected with the electroplating rollers, and the conductive slip rings are connected through wires.

9. The horizontal electroplating apparatus for photovoltaic crystalline silicon solar cells according to claim 1, characterized in that, The application further relates to an electroplating lower groove which is connected with the electroplating upper groove and is arranged in an L shape with the electroplating upper groove.

10. The horizontal electroplating apparatus for photovoltaic crystalline silicon solar cells according to claim 9, characterized in that, The electroplating groove is provided with a plating liquid return port on each side, the plating liquid return port is connected with the electroplating lower groove, and the electroplating liquid is recycled into the electroplating lower groove through the plating liquid return port.

Images