Circuit interface assembly and electronic device

Abstract

The utility model belongs to the technical field of electronic circuits, and particularly discloses a circuit interface assembly and an electronic device.The circuit interface assembly comprises an elastic probe contact pad with conductivity and a hard gold piece with conductivity; the elastic probe contact pad can be fixed in an electronic device in an embedded manner, and the hard gold sheet can be fixed on the surface of the electronic device; the first contact surface of the hard gold sheet is used for contacting the elastic probe connector, the second contact surface of the hard gold sheet is used for contacting the first contact surface of the elastic probe contact pad, and the second contact surface of the elastic probe contact pad is used for connecting a circuit in an electronic device. According to the invention, the hard gold piece is in compression joint with the elastic probe connector, the wear resistance of the hard gold piece can be fully utilized, the elastic probe contact pad can be prevented from being worn, and compared with a mode that the elastic probe contact pad is in direct compression joint with the elastic probe connector, the service life of the circuit interface can be effectively prolonged.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of electronic circuits, and more particularly relates to a circuit interface assembly and an electronic device. BACKGROUND

[0002] POGO PIN (spring pin connector) is a spring probe formed by three basic components of needle shaft, spring and needle tube through precise instrument riveting and pre-pressing, and has a precise spring structure inside.

[0003] The circuit interface matched with the POGO PIN is a POGO PAD (spring pin contact pad). In use, the POGO PIN of one electronic device is directly crimped on the POGO PAD of another electronic device to realize the electrical connection between the two electronic devices.

[0004] However, after multiple crimping, the surface plating of the POGO PAD will be worn, affecting the service life of the POGO PAD. For the circuit interface matched with the POGO PIN, how to prolong the service life of the circuit interface is a technical problem to be solved in the field. CONTENT OF THE INVENTION

[0005] In view of the defects of the prior art, the purpose of the present application is to prolong the service life of the circuit interface matched with the POGO PIN.

[0006] To achieve the above purpose, in a first aspect, the present application provides a circuit interface assembly, comprising: an elastic probe contact pad having electrical conductivity and a hard gold sheet having electrical conductivity; the elastic probe contact pad can be fixed in an electronic device in an embedded manner, and the hard gold sheet can be fixed on the surface of the electronic device; the first contact surface of the hard gold sheet is used to contact the elastic probe connector, the second contact surface of the hard gold sheet is used to contact the first contact surface of the elastic probe contact pad, and the second contact surface of the elastic probe contact pad is used to connect the circuit in the electronic device.

[0007] The elastic probe connector can be a spring pin connector (POGO PIN), or a connector composed of other elastic probes.

[0008] The circuit interface matched with the elastic probe connector is an elastic probe contact pad. The elastic probe contact pad can be a spring pin contact pad (POGO PAD), or a circuit interface matched with a connector composed of other elastic probes.

[0009] In a possible implementation, the circuit interface assembly further comprises a fixing plate, and the fixing plate is provided with a through hole, the area of the through hole of the fixing plate is smaller than the area of the hard gold sheet, and opposite sides of the fixing plate are provided with fixing members.

[0010] In a possible implementation, an extension is arranged around the through hole of the compression surface, the extension has an extension length less than the thickness of the hard gold sheet, and the projection area of the hard gold sheet on the compression surface can fall into the projection area of the extension on the compression surface. The compression surface is a surface of the fixing plate that is in contact with the hard gold sheet.

[0011] In a possible implementation, the second contact surface of the hard gold sheet is provided with a columnar pin, and the elastic probe contact pad is provided with a through hole, and the columnar pin can pass through the through hole of the elastic probe contact pad.

[0012] In a possible implementation, the length of the columnar pin can penetrate a circuit board in the electronic device that is in contact with the hard gold sheet, and the columnar pin has weldability.

[0013] In a possible implementation, the elastic probe contact pad and the hard gold sheet are connected by welding.

[0014] In a possible implementation, the elastic probe contact pad and the hard gold sheet are connected by conductive glue.

[0015] In a second aspect, the present application provides an electronic device, comprising: a circuit interface assembly and a circuit board, the circuit interface assembly comprising an elastic probe contact pad and a hard gold sheet; the elastic probe contact pad is fixed in the circuit board in an embedded manner, and the hard gold sheet is fixed on the surface of the circuit board; the first contact surface of the hard gold sheet is used to contact an elastic probe connector, the second contact surface of the hard gold sheet contacts the first contact surface of the elastic probe contact pad, and the second contact surface of the elastic probe contact pad is connected to a circuit in the circuit board.

[0016] In a possible implementation, the circuit interface assembly further comprises: a fixing plate, the fixing plate is provided with a through hole, the area of the through hole of the fixing plate is less than the area of the hard gold sheet, and opposite sides of the fixing plate are provided with fixing members; the circuit board is provided with fixing positions matched with the fixing members.

[0017] In a possible implementation, the second contact surface of the hard gold sheet is provided with a columnar pin, the elastic probe contact pad is provided with a through hole, the columnar pin can pass through the through hole of the elastic probe contact pad, the length of the columnar pin can penetrate the circuit board, and the columnar pin has weldability; the circuit board is provided with a through hole through which the columnar pin can pass, the through hole on the back surface of the circuit board is provided with a solder pad, the columnar pin is connected to the solder pad by welding, and the back surface of the circuit board is opposite to the surface of the circuit board on which the hard gold sheet is located.

[0018] Overall, compared with the prior art, the above technical solutions conceived by the present application have the following beneficial effects:

[0019] (1) The hard gold plating layer of the hard gold sheet is obtained by surface treatment using a hard gold process. Compared with the elastic probe contact pad, the hard gold sheet has stronger wear resistance. During use, the hard gold sheet is connected with the elastic probe connector by crimping, which can fully utilize the wear resistance of the hard gold sheet and prevent the elastic probe contact pad from being worn. Compared with the direct crimping of the elastic probe contact pad and the elastic probe connector, the service life of the circuit interface can be effectively prolonged.

[0020] (2) The hard gold sheet is fixed on the surface of the electronic device. In the case that the hard gold plating layer of the hard gold sheet is seriously worn, the hard gold sheet can be replaced, which is convenient for maintenance. After the old hard gold sheet is replaced by a new one, the service life of the circuit interface can be further prolonged. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is one of the schematic diagrams of the circuit interface assembly provided by the embodiment of the present application applied to an electronic device;

[0022] Figure 2 is a schematic diagram of the hard gold sheet provided with pins at both ends;

[0023] Figure 3 is another schematic diagram of the circuit interface assembly provided by the embodiment of the present application applied to an electronic device;

[0024] Figure 4 is a structural schematic diagram of the fixing plate;

[0025] Figure 5 is a structural schematic diagram of the matrix type insulating structural member;

[0026] Figure 6 is a schematic diagram of the matrix type insulating structural member applied to fix the hard gold sheet;

[0027] Figure 7 is a structural schematic diagram of the fixing member provided with an extension part matched with the hard gold sheet;

[0028] Figure 8 is a schematic diagram of the hard gold sheet provided with a columnar pin applied to an electronic device;

[0029] Figure 9 is a schematic diagram of the spring needle contact pad connected with the hard gold sheet by conductive glue;

[0030] Figure 10 is one of the schematic diagrams of the crimping life test experiment provided by the embodiment of the present application;

[0031] Figure 11Fig. 2 is a schematic diagram of a second crimping life test experiment provided by an embodiment of the present application. DETAILED DESCRIPTION

[0032] In order to more clearly understand the embodiments of the present application, first some related background knowledge is introduced as follows.

[0033] In the prior art, a spring needle contact pad (POGO PAD) is directly crimped with a spring needle connector (POGO PIN).

[0034] The POGO PAD is usually a small metal plate (for example, a circular metal plate), which generally includes an inner layer metal (for example, nickel) and a surface plating layer, and the surface plating layer is used to prevent the inner layer metal from being oxidized. The metal plate is generally fixed in an embedded manner in an electronic device, one side of the metal plate is used to contact the POGO PIN, and the other side is used to connect a circuit in the electronic device. In use, the POGO PIN of one electronic device is directly crimped on the POGO PAD of another electronic device to establish an electrical connection between the two electronic devices.

[0035] The surface plating layer of the POGO PAD is relatively thin, and after multiple crimping, the surface plating layer of the POGO PAD will be worn. In the case of severe wear of the surface plating layer, the inner layer metal (for example, nickel) in the POGO PAD will be exposed to the air, and the oxidation of the inner layer metal will cause the POGO PAD to lose conductivity or even be unable to conduct, affecting the service life of the POGO PAD.

[0036] In order to overcome the above-mentioned defects, the present application provides a circuit interface assembly and an electronic device, which are crimped with a hard gold sheet and a spring needle connector. The hard gold sheet can be fully utilized to resist wear, and the spring needle contact pad can be prevented from being worn. Compared with the direct crimping of the spring needle contact pad and the spring needle connector, the service life of the circuit interface can be effectively prolonged.

[0037] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application is further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.

[0038] The term "and / or" in this paper is a description of the association relationship of the associated object, which means that there can be three relationships, for example, A and / or B, which can represent the existence of A alone, the existence of A and B together, and the existence of B alone. The symbol " / " in this paper represents the relationship of or, for example, A / B represents A or B.

[0039] The terms “first” and “second” and the like in the description and claims of this application are used for distinguishing between similar objects and are not necessarily used to describe a particular sequential or chronological order. For example, a first contact surface and a second contact surface are used for distinguishing between two different contact surfaces, and are not necessarily used to describe a particular sequential or chronological order.

[0040] In the embodiments of the present application, the words “exemplary” and “for example” are used to mean serving as an example, instance, or illustration, at 99 2 / 18 / 2021 3:45 PM example. The embodiments or designs described as “exemplary” or “for example” in the embodiments of the present application are not to be construed as preferred or advantageous over other embodiments or designs. In fact, any embodiment or design described as “exemplary” or “for example” is intended to be one of various possible embodiments or designs in which the application can be carried out. The words “exemplary” and “for example” are used to introduce examples that further clarify specific embodiments or designs of the application but are not intended to, nor should they be interpreted to, exclude other embodiments or designs.

[0041] In the description of the embodiments of the present application, unless otherwise specified, “a plurality of” means two or more, for example, a plurality of processing units means two or more processing units, and the like; a plurality of elements means two or more elements, and the like.

[0042] The embodiments of the present application will be described below in conjunction with the accompanying drawings in the embodiments of the present application.

[0043] Figure 1 is one of the schematic diagrams in which the circuit interface assembly provided by the embodiments of the present application is applied to an electronic device, as shown in Figure 1 The circuit interface assembly includes a spring pin contact pad (POGO PAD) with electrical conductivity and a hard gold sheet with electrical conductivity; the spring pin contact pad can be fixed in the electronic device in an embedded manner, and the hard gold sheet can be fixed on the surface of the electronic device; a first contact surface of the hard gold sheet is used to contact a spring pin connector (POGO PIN), a second contact surface of the hard gold sheet is used to contact a first contact surface of the spring pin contact pad, and a second contact surface of the spring pin contact pad is used to connect a circuit in the electronic device.

[0044] Specifically, the hard gold sheet is a sheet-shaped metal connector component that is surface-treated by a hard gold process. The hard gold process is an electroplating technology mainly used to plate a hard gold plating layer on the surface of a metal substrate. This process usually uses a gold alloy as the hard gold plating layer, such as a gold-cobalt alloy or a gold-nickel alloy, rather than pure gold. Other metal elements (such as cobalt or nickel) in the alloy increase the hardness of the plating layer, making it more wear-resistant. The thicker the hard gold plating layer of the hard gold sheet, the more times of crimping (crimping refers to the operation of contacting the hard gold sheet and the spring pin connector by extrusion) the hard gold plating layer can withstand, and the longer the service life of the hard gold sheet. The thickness of the hard gold plating layer of the hard gold sheet can be determined according to the target service life (for example, a service life that meets 100,000 times of crimping).

[0045] Optionally, the thickness of the hard gold plating layer is greater than the thickness of the surface plating layer of the POGO PAD, for example, the thickness of the hard gold plating layer is one order of magnitude greater than the thickness of the surface plating layer of the POGO PAD, so as to ensure that the hard gold plating layer can withstand more times of crimping than the surface plating layer of the POGO PAD.

[0046] Optionally, the shape of the hard gold sheet is the same as the shape of the POGO PAD. For example, if the shape of the POGO PAD is circular, the shape of the hard gold sheet is also circular.

[0047] As shown in Figure 1 , during the installation of the circuit interface assembly, the POGO PAD can be fixed in the electronic device in an embedded manner so that the second contact surface of the POGO PAD is electrically connected to the corresponding circuit in the electronic device, then the hard gold sheet can be placed on the surface of the electronic device and the second contact surface of the hard gold sheet is in contact with the POGO PAD, and the hard gold sheet is fixed on the surface of the electronic device, and the hard gold sheet can be fixed by welding or bonding.

[0048] Exemplarily, Figure 1 , the electronic device includes a circuit board, and the circuit board is provided with a solder resist coating (for example, a green oil coating).

[0049] Exemplarily, Figure 2 is a schematic diagram of a hard gold sheet provided by an embodiment of the present application, as shown in Figure 2 , the hard gold sheet is provided with a pin for fixation at both ends, and the pin of the hard gold sheet can be welded or bonded to the surface of the electronic device to fix the hard gold sheet and make the second contact surface of the hard gold sheet in contact with the POGO PAD.

[0050] Exemplarily, Figure 3 is a schematic diagram of a circuit interface assembly applied to an electronic device provided by an embodiment of the present application, as shown in Figure 3 , the circuit interface assembly includes a plurality of POGO PADs and a plurality of hard gold sheets, the number of POGO PADs and the number of hard gold sheets are the same, and the electronic device can be configured with the circuit interface assembly, wherein the plurality of POGO PADs are fixed in the electronic device in an embedded manner, the plurality of hard gold sheets are fixed on the surface of the electronic device, and one hard gold sheet is in contact with a corresponding POGO PAD.

[0051] As shown in Figure 1As shown, in the process of using the circuit interface assembly, the pogo pin connector can be crimped on the first contact surface of the hard gold sheet, the pogo pin contact pad and the hard gold sheet are conductive, thereby forming a conductive path between the pogo pin connector, the hard gold sheet, the pogo pin contact pad and the corresponding circuit of the electronic device, and thereby being capable of transmitting electrical signals between the pogo pin connector and the corresponding circuit of the electronic device.

[0052] It can be understood that the hard gold plating layer of the hard gold sheet is obtained by surface treatment using a hard gold process, and the hard gold sheet has stronger wear resistance than the pogo pin contact pad. In use, by crimping the hard gold sheet and the pogo pin connector, the wear resistance of the hard gold sheet can be fully utilized, and the pogo pin contact pad can be prevented from being worn. Compared with the direct crimping of the pogo pin contact pad and the pogo pin connector, the service life of the circuit interface can be effectively prolonged.

[0053] It is worth noting that in the prior art, the pogo pin contact pad is directly crimped with the pogo pin connector, and the pogo pin contact pad is fixed in the electronic device in an embedded manner. When the pogo pin contact pad is severely worn, it is not easy to replace the pogo pin contact pad, and the maintenance is difficult. For the circuit interface assembly provided by the embodiments of the present application, the hard gold sheet is fixed on the surface of the electronic device. In the case that the hard gold plating layer of the hard gold sheet is severely worn, the hard gold sheet can be replaced, which is convenient for maintenance. After the old hard gold sheet is replaced with a new one, the service life of the circuit interface can be further prolonged.

[0054] In a possible implementation, the circuit interface assembly further comprises a (insulating) fixing plate. Figure 4 FIG. 1 is a structural schematic diagram of the fixing plate provided by the embodiments of the present application, as shown, Figure 4 The fixing plate is provided with a through hole, the area of the through hole of the fixing plate is smaller than the area of the hard gold sheet, and opposite sides of the fixing plate are provided with fixing members.

[0055] In the process of installing the circuit interface assembly with the fixing plate, the pogo pin contact pad can be first fixed in the electronic device in an embedded manner so that the second contact surface of the pogo pin contact pad is electrically connected with the corresponding circuit in the electronic device. Then, the hard gold sheet can be placed on the surface of the electronic device and the second contact surface of the hard gold sheet is in contact with the pogo pin contact pad. Next, the through hole of the fixing plate is aligned with the hard gold sheet and the fixing plate is placed on the hard gold sheet. Finally, the fixing plate is locked by the fixing members on the fixing plate. The area of the through hole of the fixing plate is smaller than the area of the hard gold sheet, which can prevent the hard gold sheet from passing through the through hole. When the fixing plate is locked, the fixing plate will exert a force on the hard gold sheet, which is directed to the surface of the electronic device, so as to fix the hard gold sheet on the surface of the electronic device.

[0056] Exemplarily, the electronic device (for example, the circuit board of the electronic device) is provided with fixing positions matched with the fixing members on the fixing plate. The fixing members on the fixing plate can be fixing holes and screws. The screws pass through the fixing holes and enter the fixing positions (for example, screw holes) of the electronic device to lock the fixing plate.

[0057] Exemplarily, the circuit interface assembly can include a plurality of POGO pads and a plurality of hard gold sheets. Correspondingly, the fixing plate can be designed as a matrix type insulating structure, Figure 5 is a structural diagram of the matrix type insulating structure provided by the embodiment of the present application, as shown in Figure 5 The matrix type insulating structure is provided with a plurality of through holes arranged in a matrix manner. The number of the through holes, the number of the POGO pads and the number of the hard gold sheets are kept the same.

[0058] Figure 6 is a schematic diagram of the matrix type insulating structure provided by the embodiment of the present application applied to fixing the hard gold sheets, as shown in Figure 6 The fixing members on the matrix type insulating structure (that is, the fixing plate) can be fixing holes and screws. The screws pass through the fixing holes and enter the fixing positions of the electronic device to lock the matrix type insulating structure, so that one fixing plate can fix a plurality of hard gold sheets on the surface of the circuit board, improving the installation efficiency.

[0059] In the process of using the above-mentioned circuit interface assembly with the fixing plate, the pin shaft of the pogo pin connector can be crimped on the first contact surface of the hard gold sheet after passing through the through hole of the fixing plate. The POGO pad and the hard gold sheet have conductivity, thereby forming a conductive path between the pogo pin connector, the hard gold sheet, the POGO pad and the corresponding circuit of the electronic device, thereby being capable of transmitting electrical signals between the pogo pin connector and the corresponding circuit of the electronic device.

[0060] In a possible implementation manner, Figure 7 is a structural diagram of the fixing member provided with an extension matched with the hard gold sheet, as shown in Figure 7 The extension is provided around the through hole of the crimping surface. The extension length of the extension is less than the thickness of the hard gold sheet. The projection area of the hard gold sheet on the crimping surface can fall into the projection area of the extension on the crimping surface. The crimping surface is the surface of the fixing plate matched with the hard gold sheet.

[0061] In the process of installing the circuit interface assembly with the fixed plate (the fixed plate is provided with the extension), first, the pogo pin contact pad can be fixed in the electronic device in an embedded manner to electrically connect the second contact surface of the pogo pin contact pad with the corresponding circuit in the electronic device, then the hard gold sheet can be placed on the surface of the electronic device and the second contact surface of the hard gold sheet is in contact with the pogo pin contact pad, the through hole of the fixed plate is aligned with the hard gold sheet and the fixed plate is placed on the hard gold sheet, the projection area of the crimping surface of the hard gold sheet can fall into the projection area of the extension, the extension of the fixed plate can enclose the hard gold sheet on the crimping surface to prevent the hard gold sheet from sliding laterally, improve the convenience of installation, finally, the fixed plate is locked by the fixing part on the fixed plate, the area of the through hole of the fixed plate is smaller than the area of the hard gold sheet, which can prevent the hard gold sheet from passing through the through hole, and when the fixed plate is locked, the extension length of the extension is smaller than the thickness of the hard gold sheet, so the extension will not contact the surface of the electronic device, and the fixed plate will exert a force on the hard gold sheet to fix the hard gold sheet on the surface of the electronic device.

[0062] In the process of using the circuit interface assembly with the fixed plate (the fixed plate is provided with the extension), since the extension of the fixed plate can enclose the hard gold sheet on the crimping surface, the hard gold sheet can be effectively prevented from sliding laterally, the reliable contact between the pogo pin contact pad and the hard gold sheet is ensured, and the stability of the electrical connection of the circuit interface is improved.

[0063] In a possible implementation, Figure 8 is a schematic diagram of the hard gold sheet provided with the columnar pin applied to an electronic device, as Figure 8 shown, the second contact surface of the hard gold sheet is provided with a columnar pin, and the pogo pin contact pad is provided with a through hole, and the columnar pin can pass through the through hole of the pogo pin contact pad.

[0064] In the process of installing the circuit interface assembly with the columnar pin, first, the pogo pin contact pad can be fixed in the electronic device in an embedded manner to electrically connect the second contact surface of the pogo pin contact pad with the corresponding circuit in the electronic device, then the columnar pin can pass through the through hole of the pogo pin contact pad and be inserted into the inside of the electronic device, to place the hard gold sheet on the surface of the electronic device and make the second contact surface of the hard gold sheet in contact with the pogo pin contact pad, the columnar pin can prevent the hard gold sheet from sliding laterally, improve the convenience of installation, and then fix the hard gold sheet on the surface of the electronic device, and the fixing method of the hard gold sheet can be welding or bonding.

[0065] In the process of using the circuit interface assembly with the columnar pin, since the columnar pin is inserted into the inside of the electronic device, the hard gold sheet can be effectively prevented from sliding laterally, the reliable contact between the pogo pin contact pad and the hard gold sheet is ensured, and the stability of the electrical connection of the circuit interface is improved.

[0066] In a possible implementation, as shown in Figure 8 The length of the columnar pin can penetrate the circuit board connected with the hard gold sheet in the electronic device, and the columnar pin has solderability.

[0067] Solderability: refers to the pins of the components and the pad surface on the PCB can be well combined with the solder. This usually requires that these parts are made of materials with good solderability (such as copper, nickel), and the surface is clean and non-oxidized.

[0068] Specifically, as shown in Figure 8 The hard gold sheet can be placed on the surface of the circuit board, and the circuit board is provided with a through hole through which the columnar pin can penetrate, the length of the columnar pin can penetrate the circuit board connected with the hard gold sheet in the electronic device, the through hole on the back surface (the surface opposite to the surface on which the hard gold sheet is located) of the circuit board is provided with a pad, the columnar pin has solderability, and the columnar pin is connected with the pad by welding to fix the hard gold sheet on the surface of the electronic device.

[0069] In a possible implementation, the pogo pin contact pad is connected with the hard gold sheet by welding to fix the hard gold sheet on the surface of the electronic device.

[0070] Optionally, in the case that the pogo pin contact pad is connected with the hard gold sheet by welding, the fixing method using the fixing plate and / or the fixing method using the hard gold sheet with the columnar pin described above can also be combined, and the columnar pin of the hard gold sheet is welded with the corresponding pad to fix the hard gold sheet more firmly on the surface of the electronic device.

[0071] In a possible implementation, Figure 9 is a schematic diagram provided by the embodiment of the present application for connecting the pogo pin contact pad and the hard gold sheet through conductive glue, as shown in Figure 9 The pogo pin contact pad is connected with the hard gold sheet through conductive glue to fix the hard gold sheet on the surface of the electronic device.

[0072] Specifically, the conductive glue can be ACF conductive glue, which is the full name of Anisotropic Conductive Film (Anisotropic Conductive Film), a conductive material used in the connection of electronic components. It is mainly composed of a polymer substrate and metal particles, and is widely used in the manufacturing process of flat panel displays, touch screens, LEDs and other equipment. The characteristics of ACF include excellent conductivity, good bonding performance, thinness and lightness.

[0073] The working principle of the ACF conductive adhesive is based on the special structure inside the material. Metal particles are mixed in the polymer base, which are usually coated with a metal coating such as Ni / Au on the surface. When the ACF is applied to the connection of electronic components, its conductive properties in the vertical direction and the horizontal direction are different, that is, it shows anisotropy. When not under pressure, the ACF film itself is not conductive, but after pressure is applied, the metal particles come into contact with each other to form a conductive path, thereby realizing conduction.

[0074] The POGO PAD and the hard gold sheet are bonded together by using the ACF conductive adhesive. During use, the POGO PIN crimps the hard gold sheet, indirectly applying pressure to the ACF conductive adhesive, causing the insulating film of the conductive particles in the ACF conductive adhesive to break and reach the conductive mode, thereby realizing the electrical connection between the hard gold sheet and the POGO PAD.

[0075] Alternatively, in the case of connecting the spring needle contact pad and the hard gold sheet by conductive adhesive, the above-mentioned fixing method using a fixing plate and / or the hard gold sheet with a columnar pin can also be combined, and the columnar pin of the hard gold sheet is welded to the corresponding pad, so that the hard gold sheet is more firmly fixed on the surface of the electronic device.

[0076] The application also provides an electronic device, comprising: a circuit interface assembly and a circuit board, the circuit interface assembly comprising a spring needle contact pad (POGO PAD) and a hard gold sheet; the spring needle contact pad is fixed in the circuit board in an embedded manner, and the hard gold sheet is fixed (welded or bonded) on the surface of the circuit board; the first contact surface of the hard gold sheet is used to contact a spring needle connector (POGO PIN), the second contact surface of the hard gold sheet contacts the first contact surface of the spring needle contact pad, and the second contact surface of the spring needle contact pad is connected to a circuit in the circuit board.

[0077] In a possible implementation, the circuit interface assembly further comprises: a fixing plate, the fixing plate is provided with a through hole, the area of the through hole of the fixing plate is smaller than the area of the hard gold sheet, and opposite sides of the fixing plate are provided with fixing members; the circuit board is provided with fixing positions matched with the fixing members.

[0078] In a possible implementation, the second contact surface of the hard gold sheet is provided with a columnar pin, the spring needle contact pad is provided with a through hole, and the columnar pin can pass through the through hole of the spring needle contact pad; the length of the columnar pin can penetrate the circuit board, the columnar pin is weldable; the circuit board is provided with a through hole through which the columnar pin can pass, the through hole on the back surface of the circuit board is provided with a pad, the columnar pin is connected to the pad by welding, and the back surface of the circuit board is opposite to the surface of the circuit board on which the hard gold sheet is located.

[0079] Figure 10 is one of the schematic diagrams of the crimping life test experiment provided by the embodiments of the application, Figure 10It is shown that in the case of using the prior art spring needle contact pad (POGO PAD) and spring needle connector (POGO PIN) direct crimping mode, the test results of crimping 20,000 times, after crimping 20,000 times, the surface of the POGO PAD (such as the circular structure in Figure 10 The black spots are caused by the serious wear of the surface plating of the POGO PAD, the inner metal (such as nickel) of the POGO PAD is exposed to the air and oxidized, the blackening of the POGO PAD will cause the POGO PAD to lose conductivity or even be unable to conduct, affecting the service life of the POGO PAD.

[0080] Figure 11 is a schematic diagram of the crimping life test experiment provided by the embodiment of the present application, Figure 11 It is shown that in the case of using the circuit interface assembly provided by the embodiment of the present application, the test results of crimping 100,000 times, after crimping 100,000 times, the surface of the hard gold sheet (such as the circular structure in Figure 11 It can be seen that the service life of the circuit interface assembly provided by the embodiment of the present application is more than 5 times the service life of the prior art direct crimping mode, compared with the direct crimping mode of the spring needle contact pad and the spring needle connector, the service life of the circuit interface can be effectively prolonged.

[0081] It should be understood that expressions such as "include" and "may include" used in the present application indicate the presence of the disclosed functions, operations or constituent elements, and do not limit one or more additional functions, operations and constituent elements. In the present application, terms such as "include" and / or "have" can be interpreted to mean that specific features, numbers, operations, constituent elements, components or combinations thereof are present, but cannot be interpreted to exclude the presence or addition of one or more other features, numbers, operations, constituent elements, components or combinations thereof.

[0082] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the term "connection" should be understood broadly, for example, "connection" can be detachable connection, or can be non-detachable connection; can be direct connection, or can be indirect connection through intermediate medium. Among them, "fixed connection" refers to the relative position relationship after connection is unchanged. "Rotary connection" refers to the relative rotation after connection. "Sliding connection" refers to the relative sliding after connection. The orientation language mentioned in the embodiments of the present application, such as "top", "bottom", "inner", "outer", "left", "right", etc., is only the direction of the drawing, therefore, the orientation language used is to better, more clearly illustrate and understand the embodiments of the present application, and is not indicative or implied that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, therefore, it cannot be understood as a limitation on the embodiments of the present application.

[0083] In addition, in the embodiments of the present application, the mathematical concepts mentioned, such as symmetry, equality, parallel, perpendicular, etc. These limitations are all for the current process level, and are not strictly defined in the mathematical sense, and a small amount of deviation is allowed, such as approximately symmetric, approximately equal, approximately parallel, approximately perpendicular, etc. For example, A is parallel to B, which means that A and B are parallel or approximately parallel, and the included angle between A and B can be between 0 degrees and 10 degrees. A is perpendicular to B, which means that A and B are perpendicular or approximately perpendicular, and the included angle between A and B can be between 80 degrees and 100 degrees.

[0084] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A circuit interface assembly, characterized by Comprising: a conductive elastic probe contact pad and a conductive hard gold sheet; the elastic probe contact pad is fixed in the electronic device in an embedded manner, and the hard gold sheet is fixed on the surface of the electronic device; a first contact surface of the hard gold sheet is used to contact an elastic probe connector, a second contact surface of the hard gold sheet is used to contact a first contact surface of the elastic probe contact pad, and a second contact surface of the elastic probe contact pad is used to connect a circuit in the electronic device.

2. The circuit interface assembly of claim 1, wherein, Further comprising: a fixing plate provided with a through hole, the area of the through hole of the fixing plate is smaller than the area of the hard gold sheet, and fixing members are arranged on opposite sides of the fixing plate.

3. The circuit interface assembly of claim 2, wherein, An extension is arranged around the through hole of the crimping surface, the extension length of the extension is smaller than the thickness of the hard gold sheet, the projection area of the hard gold sheet on the crimping surface can fall into the projection area of the extension on the crimping surface, and the crimping surface is a surface of the fixing plate that is in contact with the hard gold sheet.

4. The circuit interface assembly of any of claims 1-3, wherein, The second contact surface of the hard gold sheet is provided with a columnar pin, the elastic probe contact pad is provided with a through hole, and the columnar pin can pass through the through hole of the elastic probe contact pad.

5. The circuit interface assembly of claim 4, wherein, The length of the columnar pin can penetrate a circuit board in the electronic device that is in contact with the hard gold sheet, and the columnar pin has weldability.

6. The circuit interface assembly of any one of claims 1-3 or 5, wherein, The elastic probe contact pad and the hard gold sheet are connected by welding.

7. The circuit interface assembly of any one of claims 1-3 or 5, wherein, The elastic probe contact pad and the hard gold sheet are connected by conductive glue.

8. An electronic device, characterized by Comprising: a circuit interface assembly and a circuit board, the circuit interface assembly comprising an elastic probe contact pad and a hard gold sheet; the elastic probe contact pad is fixed in the circuit board in an embedded manner, and the hard gold sheet is fixed on the surface of the circuit board; a first contact surface of the hard gold sheet is used to contact an elastic probe connector, a second contact surface of the hard gold sheet is used to contact a first contact surface of the elastic probe contact pad, and a second contact surface of the elastic probe contact pad is used to connect a circuit in the circuit board.

9. The electronic device of claim 8, wherein, The circuit interface assembly further comprises a fixing plate provided with a through hole, the area of the through hole of the fixing plate is smaller than the area of the hard gold sheet, and fixing members are arranged on opposite sides of the fixing plate; the circuit board is provided with a fixing position matched with the fixing member.

10. The electronic device according to claim 8 or 9, characterized by The second contact surface of the hard gold sheet is provided with a columnar pin, the elastic probe contact pad is provided with a through hole, the columnar pin can pass through the through hole of the elastic probe contact pad, the length of the columnar pin can penetrate a circuit board, and the columnar pin has weldability; the circuit board is provided with a through hole through which the columnar pin can pass, a solder pad is arranged at the through hole on the back surface of the circuit board, the columnar pin is connected to the solder pad by welding, and the back surface of the circuit board is opposite to the surface of the circuit board on which the hard gold sheet is located.

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