Ink screen display module, electronic equipment shell and electronic price tag

Abstract

The utility model provides an ink screen display module, an electronic equipment shell and an electronic price tag, the ink screen display module comprises a display substrate, the display substrate is provided with a display area and a peripheral area surrounding the display area, the display substrate comprises a base and an electronic ink display layer arranged on the base, and the electronic ink display layer is arranged in the peripheral area; the electronic ink display layer is at least partially located in the display area; the circuit substrate is adjacent to the display substrate and at least comprises a communication circuit of a near field communication module; an antenna circuit of the near field communication module is further integrated on the substrate, the antenna circuit is connected with the communication circuit, and the antenna circuit comprises a first antenna circuit located in the peripheral area and / or a second antenna circuit located in the display area. According to the ink screen display module, the electronic equipment shell and the electronic price tag, the thickness of the whole module can be reduced, and the ink screen display module is suitable for more application scenes.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to an e-ink display module, an electronic device housing, and an electronic price tag. Background Technology

[0002] E-ink displays represent a revolutionary new method and technology for information display. Like most traditional inks, e-ink and the circuitry that changes its color can be printed onto many surfaces, from flexible plastics and polyester films to paper and fabric. The difference from traditional paper is that e-ink changes color when electricity is applied, and it can display changing images like traditional screens. E-ink displays are being used in electronic device housings (such as phone cases), electronic price tags, and other products, becoming a new breakthrough in display applications. Utility Model Content

[0003] To address at least one technical problem in the prior art, embodiments of this disclosure provide an e-ink display module, an electronic device housing, and an electronic price tag.

[0004] The technical solutions provided in this disclosure are as follows:

[0005] In a first aspect, embodiments of this disclosure provide an e-ink display module, including:

[0006] A display substrate has a display area and a peripheral area surrounding the display area. The display substrate includes a substrate and an electronic ink display layer disposed on the substrate, wherein the electronic ink display layer is at least partially located in the display area.

[0007] A circuit board, adjacent to the display board, and including at least the communication circuit of the near-field communication module;

[0008] The near-field communication module antenna circuit is also integrated on the substrate. The antenna circuit is connected to the communication circuit and includes a first antenna circuit located in the peripheral area and / or a second antenna circuit located in the display area.

[0009] For example, the peripheral area includes a first border area and a bonding area disposed opposite to each other; wherein the circuit board is adjacent to the first border area of ​​the circuit board.

[0010] For example, the electronic ink display layer includes a pixel circuit and a plurality of display pixels; wherein the first antenna circuit does not overlap with the orthographic projection of the pixel circuit and the display pixels on the substrate.

[0011] For example, the display pixel includes a first electrode, an ink capsule, and a second electrode stacked together, and any one of the pixel circuit, the first electrode, the ink capsule, and the second electrode is disposed on a different layer from the first antenna circuit.

[0012] For example, the electronic ink display layer further includes a plurality of insulating layers, the plurality of insulating layers including a first insulating layer that is furthest from the substrate in the electronic ink display layer; wherein the first antenna circuit is located in the peripheral region and is stacked on the side of the first insulating layer away from the substrate.

[0013] For example, the pixel circuit includes multiple gate lines, multiple data lines, and a thin-film transistor, the thin-film transistor including a gate, a source, and a drain; the electronic ink display layer includes patterns of a gate metal layer and a source / drain metal layer, the gate metal layer including the gate and the gate lines; the source / drain metal layer includes patterns of the source, the drain, and the data lines; wherein, at least one of the gate metal layer and the source / drain metal layer further includes a pattern of the first antenna circuit.

[0014] For example, the peripheral area includes a first border area adjacent to the circuit board; the display pixel includes a first electrode, an ink capsule and a second electrode, at least one of the second electrode and the first electrode includes a connection point located in the first border area, the connection point being connected to the circuit board; the first antenna circuit is arranged in the first border area and does not overlap with the orthographic projection of the connection point on the substrate.

[0015] For example, the first border area has an extension length along a first direction, and the first border area is divided into a first region and a second region along the first direction; wherein, there is only one connection point, the connection point is located in the first region, the antenna circuit is located in the second region, and the orthographic projection area of ​​the second region on the substrate is greater than the orthographic projection area of ​​the first region on the substrate.

[0016] For example, the first antenna circuit includes a first coil-type antenna circuit formed by being surrounded by at least one conductive wire.

[0017] For example, in the first coil antenna circuit, the coil thickness is The coil width is 50±5μm, and the gap between adjacent coils is 10±1μm.

[0018] For example, the peripheral area includes a first frame area adjacent to the circuit board, and a pad area is further provided in the first frame area, wherein the pads of the circuit board are arranged in the pad area; wherein, the first antenna circuit includes a main body and a connecting part; the main body is located outside the pad area and does not overlap with the orthographic projection of the pad area on the substrate; the connecting part is electrically connected to the circuit board through the pad area.

[0019] For example, the display area includes a plurality of pixel opening areas distributed in an array, and the orthographic projection of the second antenna circuit on the substrate does not overlap with the orthographic projection of the pixel opening areas on the substrate.

[0020] For example, the electronic ink display layer includes a pixel circuit and a display pixel, and the display pixel includes a first electrode, an ink capsule, and a second electrode stacked together; any one of the pixel circuit, the first electrode, the ink capsule, and the second electrode is disposed in a different layer from the second antenna circuit.

[0021] For example, the electronic ink display layer further includes a plurality of insulating layers, the plurality of insulating layers including a first insulating layer that is furthest from the substrate in the electronic ink display layer; wherein the second antenna circuit is located in the display area and is stacked on the side of the first insulating layer away from the substrate.

[0022] For example, the pixel circuit includes multiple gate lines, multiple data lines, and a thin-film transistor, the thin-film transistor including a gate, a source, and a drain; the electronic ink display layer includes patterns of a gate metal layer and a source / drain metal layer, the gate metal layer including the gate and the gate lines; the source / drain metal layer includes patterns of the source, the drain, and the data lines; wherein, at least one of the gate metal layer and the source / drain metal layer further includes a pattern of the second antenna circuit.

[0023] For example, the gate metal layer includes a first portion of the second antenna circuit, the source-drain metal layer includes a second portion of the second antenna circuit, and the electronic ink display layer further includes a second insulating layer located between the gate metal layer and the source-drain metal layer, wherein the first portion and the second portion overlap through vias in the second insulating layer.

[0024] For example, the second antenna circuit includes a second coil-type antenna circuit formed by being surrounded by at least one conductive wire.

[0025] For example, in the second coil antenna circuit, the coil thickness is The coil width is 6±2μm, and the gap between adjacent coils is 20±1μm.

[0026] For example, the display substrate further includes test traces disposed in the peripheral area, wherein the test traces are at least disposed in the bonding area, and at least not disposed in the first border area.

[0027] Secondly, embodiments of this disclosure provide an electronic device housing, comprising:

[0028] A protective housing, wherein the protective housing has a transparent area; and

[0029] As described above, the e-ink display module is disposed on the protective housing, and the display area of ​​the display substrate is set corresponding to the transparent area.

[0030] Thirdly, embodiments of this disclosure provide an electronic price tag, including: an e-ink display module as described above. Attached Figure Description

[0031] Figure 1 This diagram illustrates the NFC coil of an external NFC module attached to the e-ink screen on the back of some mobile phones with small camera modules.

[0032] Figure 2 This diagram illustrates that some phones with large camera modules cannot have an e-ink screen on the back.

[0033] Figure 3 This is a schematic diagram showing the structure of the display substrate in the e-ink screen module with the first antenna circuit integrated in the peripheral area in some embodiments of this disclosure;

[0034] Figure 4 express Figure 3 Enlarged view of the local area structure shown in the dashed box E;

[0035] Figure 5 express Figure 4 One of the schematic diagrams of the cross-sectional structure along the A-A' direction;

[0036] Figure 6 express Figure 4 Schematic diagram of the cross-sectional structure along the A-A' direction (Part 2);

[0037] Figure 7 This diagram illustrates the connection between the display substrate and the circuit board of the e-ink screen module in some embodiments of this disclosure.

[0038] Figure 8 Indicate Figure 7 Enlarged view of the local area structure shown in the dashed box E;

[0039] Figure 9 One of the schematic diagrams showing the structure of the display substrate of the e-ink screen module in some embodiments of this disclosure, where the display area is integrated with a second antenna circuit;

[0040] Figure 10 express Figure 9 A schematic diagram of the cross-sectional structure of the display area in the diagram;

[0041] Figure 11 This is the second schematic diagram showing the structure of the display substrate of the e-ink screen module in some embodiments of the present disclosure, in which the display area is integrated with the second antenna circuit;

[0042] Figure 12 express Figure 11 A schematic diagram of the cross-sectional structure of the display area in the diagram;

[0043] Figure 13 A block diagram showing the circuit structure in a circuit board. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0045] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0046] The features such as "parallel," "perpendicular," and "identical" used in the embodiments of this disclosure include features in the strict sense of "parallel," "perpendicular," and "identical," as well as cases where "approximately parallel," "approximately perpendicular," and "approximately identical" include certain tolerances. Taking into account the measurement and the tolerances associated with the measurement of a specific quantity (e.g., limitations of the measurement system), they represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of said value.

[0047] Furthermore, throughout this document, unless otherwise defined, the terms “substantially,” “essentially,” “approximately,” and “about” are used to describe and explain small variations. When used with an event or situation, these terms can cover situations where the event or situation occurs precisely or approximately. For example, when used with a numerical value, these terms can include a range of variation of the numerical value less than or equal to 10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term “substantially coplanar” can refer to two surfaces arranged along the same plane within a micrometer range, for example, within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm.

[0048] It should be understood that, in the exemplary embodiments of this disclosure, when a layer or element is referred to as being on another layer or substrate, it may mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate. "A and B are set in the same layer" means that after A and B are formed using the same film deposition process to form a film layer for forming a specific pattern, the layer structure is formed in one patterning process using the same photomask.

[0049] Before providing a detailed description of the e-ink display module, electronic device housing, and electronic price tag provided in this disclosure, the following explanations are provided regarding the relevant technologies:

[0050] E-ink displays represent a revolutionary new method and technology for information display. Like most traditional inks, e-ink and the lines that change its color can be printed onto many surfaces, from curved plastics, polyester films, paper to cloth. The difference from traditional paper is that e-ink changes color when electricity is applied and can display changing images like traditional screens.

[0051] E-ink displays are lightweight, portable, and consume little power, maintaining their display even after power is off. Leveraging these advantages, E-ink technology is being applied to electronic device casings (such as phone cases) and electronic price tags, representing a new breakthrough in display applications.

[0052] Electronic shelf labels, as electronic display products that display product prices, names, and templates, are commonly used to replace traditional manually printed paper price tags. Electronic shelf labels can display information using e-ink screens.

[0053] Phone cases are decorative items used to protect or decorate the appearance of mobile phones. They can protect the phone from drops, scratches, water, and shocks. To make phone cases more beautiful and novel, many e-ink screen phone cases have emerged. Users can transfer their favorite pictures and texts to the e-ink screen for display, realizing the user's personal expression.

[0054] NFC (Near Field Communication) is developed based on contactless radio frequency identification (RFID) technology and combined with wireless interconnection technology. It provides a very secure and fast communication method for various electronic products that are becoming increasingly common in our daily lives. The "near field" in the Chinese name NFC refers to radio waves that are near an electromagnetic field.

[0055] Electronic shelf tags can communicate wirelessly with NFC-enabled devices (such as smartphones and tablets) in a short-range manner, transmitting data without contact. Users simply need to bring an NFC-enabled device close to the NFC tag to perform operations such as fast data transfer, information reading, and payment.

[0056] E-ink phone cases can be equipped with NFC modules, communicating with the phone's built-in NFC module to achieve data transfer. Images are refreshed via a mobile app, and the phone powers the e-ink phone case. The e-ink screen only draws a small amount of power from the phone during image transfer; once the transfer is complete, the screen does not require power to maintain its display, thus eliminating the need to charge the phone case separately. E-ink screens work by having ink capsule molecules propelled to different positions under the control of positive and negative charges, thus displaying corresponding patterns. E-ink screens can be used for a relatively long period without external damage.

[0057] The inventor of this utility model application has discovered through research that the modules in related technologies, such as e-ink screen phone cases and electronic price tags, are generally thick, affecting the user experience. Furthermore, their applicability is limited. For example, current e-ink screen phone cases can only be used in mobile phone products with smaller camera modules. However, with the development of the mobile phone industry, large camera modules have become a trend. Due to space limitations, e-ink screen phone cases cannot be used, thus affecting the market expansion of e-ink screen phone cases.

[0058] The inventor of this utility model application has discovered through research that one of the reasons for the above-mentioned problems is:

[0059] Taking e-ink screen phone cases as an example, the NFC module of e-ink screen phone cases adopts an external solution and is set on the e-ink screen. The NFC coil is located outside the e-ink screen. The external NFC coil makes the overall module of the phone case thicker, which affects the user experience and takes up a lot of space, making it impossible to apply to mobile phone products with larger camera modules.

[0060] by Figure 1 As shown in the example, for mobile phone products with a small camera module 1, the NFC coil 3 is located outside the e-ink screen 2. The camera module 1 can generally be located on the upper back of the phone, on one side of the back of the phone. There is enough space on the other side above the back of the camera module 1 to accommodate the NFC coil 3 of an external NFC module; Figure 2 As shown, for mobile phone products with a larger camera module 1, the camera module 1 can be located in the center or on one side of the back of the phone and occupies a large area. There is not enough space around the camera module 1 to set the NFC coil of the external NFC module, which makes it impossible to use an e-ink screen phone case.

[0061] To address the aforementioned issues, this disclosure provides an e-ink display module, an electronic device housing, and an electronic price tag.

[0062] The e-ink display module provided in this disclosure can be applied to products such as electronic device housings or electronic price tags.

[0063] An electronic device housing can be used as a casing for an electronic device, and may include a protective casing. An e-ink display module can be mounted on the protective casing. For example, the electronic device can be a mobile phone, tablet, laptop, or other device with an NFC module. Correspondingly, if the electronic device is a mobile phone, the housing can be a phone case, and the e-ink display module can be mounted on this phone case. This allows the user to operate the control application of the e-ink display module (such as an application installed on the phone) to select the content to be displayed and send it to the e-ink phone case for display, thus enabling screen scrolling on the e-ink phone case.

[0064] Electronic shelf labels can communicate wirelessly with NFC-enabled devices (such as smartphones and tablets) and transfer data without contact. Users simply need to bring an NFC-enabled device close to the electronic shelf label to perform operations such as fast data transfer, information reading, and payment.

[0065] like Figures 3 to 13 As shown, the e-ink display module provided in this embodiment includes a display substrate 100 and a circuit board 200.

[0066] The display substrate 100 has a display area AA and a peripheral area D surrounding the display area AA. The display substrate 100 includes a substrate 110 and an electronic ink display layer 120 disposed on the substrate 110. The electronic ink display layer 120 is at least partially located in the display area AA. The circuit board 200 is adjacent to the display substrate 100. The circuit board 200 includes at least a communication circuit 211 for a near field communication module (NFC module). The circuit board 200 may also include a microprocessor 212, etc.

[0067] An antenna circuit 213 with a near-field communication module is also integrated on the substrate 110. The antenna circuit 213 can wirelessly connect with external devices such as the near-field communication module 5 built into a mobile phone. The communication circuit 211 is connected to the antenna circuit 213, and the microprocessor 212 is connected to the communication circuit 211. The microprocessor 212 achieves wireless communication with external devices such as mobile phones through the communication circuit 211 and the antenna circuit 213.

[0068] The antenna circuit 213 may include a first antenna circuit 2131 located in the peripheral area D and / or a second antenna circuit 2132 located in the display area AA.

[0069] In other words, the antenna circuit 213 of the near-field communication module is integrated on the substrate 110 of the display substrate 100. Specifically, the antenna circuit 213 of the near-field communication module can be integrated in the display area AA of the display substrate 100, or it can be integrated in the peripheral area D of the display substrate 100. Alternatively, the antenna circuit 213 of the near-field communication module can be integrated in both the display area AA and the peripheral area D of the display substrate 100.

[0070] In this way, by integrating the antenna circuit 213 of the near-field communication module of the e-ink display module onto the display substrate 100, the overall thickness of the e-ink display module can be reduced compared to the related art where the antenna circuit of the near-field communication module of the e-ink display module is externally mounted. Furthermore, since the antenna circuit 213 of the near-field communication module is integrated onto the display substrate 100, there is no need to reserve space for an externally mounted antenna circuit 213, resulting in fewer space constraints and more flexible application scenarios for the e-ink display module. For example, when the e-ink display module is used in e-ink phone cases, it can be applied not only to mobile phone products with smaller camera modules but also to mobile phone products with larger camera modules.

[0071] When the e-ink display module is working, it wirelessly connects to electronic devices, such as the near-field communication module 5 built into a mobile phone, via the antenna circuit 213 of the near-field communication module. This allows the e-ink display module to draw power from the mobile phone through the near-field communication module, eliminating the need to integrate an internal power supply within the e-ink display module and reducing its weight and thickness. Simultaneously, the near-field communication module of the e-ink display module connects wirelessly with electronic devices, such as the near-field communication module 5 built into the mobile phone (e.g.,...). Figure 2 As shown, data transmitted from electronic devices is displayed on an e-ink display module via a wireless pairing connection.

[0072] Specifically, such as Figure 13 As shown, a power supply circuit 214 can be provided on the circuit board 200. The power supply circuit 214 can be connected to the antenna circuit 213 to convert environmental energy into electrical energy through the antenna circuit 213. The power supply circuit 214 enables passive driving of the e-ink display module. That is, the e-ink display module itself may not contain a power supply. The power supply circuit 214 obtains electrical energy through a wireless circuit to power the e-ink display module when displaying content. The power supply circuit 214 in the drive board directly obtains electrical energy from an external device, eliminating the need for a battery. This avoids the problem of the e-ink display module being unable to update the display content when the battery is depleted, making it more convenient to use.

[0073] For example, such as Figure 13 As shown, the power supply circuit 214 may include a matching circuit 2141, a rectifier circuit 2142, and an energy storage circuit 2143. The matching circuit 2141 is connected to the antenna circuit 213 and cooperates to output the first electrical energy. The rectifier circuit 2142 is connected to the matching circuit 2141 and rectifies the first electrical energy. The energy storage circuit 2143 is connected to the rectifier circuit 2142 and stores the rectified first electrical energy. The energy storage circuit 2143 is used to connect to the display substrate 100 and supply power to the display substrate 100 when the display substrate 100 updates the display content.

[0074] Furthermore, since the display substrate 100 is powered by the energy storage circuit 2143, a battery is not required, which reduces the thickness of the circuit board 200 and makes it easier to install in thinner products (such as mobile phone cases). The microprocessor 212 and the communication circuit 211 can wirelessly communicate with external devices, such as acquiring data signals, through the antenna circuit 213. The display substrate 100 can update the display content based on the data signals, making it easy to acquire data signals corresponding to new images and thus facilitating the updating of the display content.

[0075] The circuit board 200 may be a flexible printed circuit board (FPC), but is not limited thereto.

[0076] The above is merely an exemplary description of the circuit board 200, and the circuit structure on the circuit board 200 is not limited thereto.

[0077] In some embodiments, such as Figure 3 As shown, the peripheral area D may include a first border area DO and a binding area DP that are set relatively to each other. Wherein, as... Figure 7 and Figure 8 As shown, the circuit board 200 may be adjacent to the first border area DO of the circuit board 200.

[0078] by Figure 3 As shown in the example, the binding area DP can be the bottom border of the e-ink display module, and the first border area DO can be the top border of the e-ink display module.

[0079] When an e-ink display module is used in a mobile phone case, since the camera module of the mobile phone is generally located on the top, the display substrate 100 of the e-ink display module can be placed below the camera module, while the circuit board 200 can be placed above the display substrate 100 and located to one side of the camera module, resulting in a more reasonable spatial layout. It is understandable that in other embodiments, depending on the application scenario of the e-ink display module, the circuit board 200 may also be adjacent to other sides of the display substrate 100.

[0080] Furthermore, in some exemplary embodiments, the electronic ink display layer 120 includes pixel circuitry 121 and a plurality of display pixels 122. The display pixels 122 are used to display images. Each display pixel 122 may include a first electrode 1221, an ink capsule, and a second electrode stacked together.

[0081] For example, the first electrode 1221 can be an anode, and the second electrode can be a cathode. The ink capsule may contain electronic ink. The pixel circuit 121 can control the electrical signals applied to each display pixel 122, so that the electronic ink in each display pixel 122 can display an image.

[0082] like Figures 9 to 12 As shown, the pixel circuit 121 may include multiple gate lines 1211, multiple data lines 1212, and multiple thin-film transistors 1213. The multiple gate lines 1211 and multiple data lines 1212 may intersect each other to define multiple pixel opening regions P. Display pixels 122 may be disposed in corresponding pixel opening regions P. The thin-film transistors 1213 may include a gate 12131, a source 12132, and a drain 12133.

[0083] In addition, the electronic ink display layer 120 may also include a gate metal layer (Gate) and a source / drain metal layer (SD). The gate metal layer (Gate) may include patterns such as a gate electrode 12131 and gate lines 1211. The source / drain metal layer (SD) may include patterns such as a source electrode 12132, a drain electrode 12133, and data lines 1212.

[0084] For example, such as Figures 3 to 8 As shown, the orthographic projections of the first antenna circuit 2131 arranged in the peripheral area D, the pixel circuit 121, and the display pixel 122 on the substrate 110 do not overlap. In other words, an antenna clearance area is set in the first border area DO of the display substrate 100, and the pixel circuit 121 and the display pixel 122 do not exist in this antenna clearance area.

[0085] In this way, the first antenna circuit 2131 is far away from the display area AA of the e-ink display module, which will not increase the extra load on the display area AA and will not affect the display refresh. This can prevent the first antenna circuit 2131 from affecting the display.

[0086] In some exemplary embodiments, any one of the pixel circuit 121, the first electrode 1221, the ink capsule, and the second electrode is disposed on a different layer from the first antenna circuit 2131.

[0087] For example, such as Figure 5 As shown, the electronic ink display layer 120 also includes a plurality of insulating layers 123, including a first insulating layer 1231 in the electronic ink display layer 120 that is furthest from the substrate 110; wherein the first antenna circuit 2131 is located in the peripheral region D and is stacked on the side of the first insulating layer 1231 that is furthest from the substrate 110.

[0088] Specifically, with Figure 5 As shown in the example, the gate metal layer is located on the side of the source / drain metal layer SD that is close to the substrate 110, and the display pixel 122 is located on the side of the source / drain metal layer SD that is away from the substrate 110. The plurality of insulating layers 123 may include a second insulating layer 1232 located between the gate metal layer and the source / drain metal layer SD, and a first insulating layer 1231 located between the source / drain metal layer SD and the display pixel 122. The first antenna circuit 2131 is stacked on the side of the first insulating layer 1231 that is away from the substrate 110.

[0089] In this way, there is no need to add an additional insulating layer 123. The first antenna circuit 2131 can be directly fabricated on the first insulating layer 1231 in the original electronic ink display layer 120. Based on the existing fabrication process of the electronic ink display layer 120, only one additional fabrication process for the first antenna circuit 2131 needs to be added, which is simple. For example, the first antenna circuit 2131 can be fabricated using an etching process.

[0090] by Figure 5 As shown in the example, when fabricating the display substrate 100, firstly, a gate metal layer (Gate) can be formed on the substrate 110; then, a second insulating layer 1232 is formed; then, a semiconductor layer (Active) is formed on the second insulating layer 1232; then, a source / drain metal layer (SD) is formed; then, a first insulating layer 1231 is formed on the source / drain metal layer (SD); then, a first antenna circuit 2131 is formed on the first insulating layer 1231, and finally, a display pixel 122 including a first electrode 1221 is formed.

[0091] For example, the first antenna circuit 2131 can be made of a conductive material, such as copper or other metals.

[0092] Because of its extremely high electrical conductivity, copper coils can transmit more current under the same conditions, thus improving antenna efficiency. Copper forms a thin film of copper oxide in air, which protects the internal metal from further oxidation, extending the antenna's lifespan. Copper is easy to process, allowing it to be easily manufactured into coils of various shapes and sizes to meet the needs of different antenna designs. Copper's high thermal conductivity helps in effective heat dissipation in high-power applications, reducing performance degradation caused by overheating. Copper has good mechanical strength, capable of withstanding certain tensile and compressive forces, enabling the coil to maintain stable performance in various environments. Compared to other conductive materials (such as silver), copper is relatively inexpensive and cost-effective, making it suitable for mass production and application. Therefore, copper, as a material for antenna coils, not only provides excellent electrical performance but also possesses favorable physical properties.

[0093] In other embodiments, at least one of the gate metal layer (Gate) and the source / drain metal layer (SD) may further include a pattern of the first antenna circuit 2131.

[0094] For example, such as Figure 6 As shown, the first antenna circuit 2131 can also be fabricated using a source-drain metal layer SD. In this way, the first antenna circuit 2131 can be formed simultaneously with the pixel circuit 121. For example, an opening pattern 123a can be provided on the insulating layer (e.g., the first insulating layer 1231) above the first antenna circuit 2131 at a position directly opposite the first antenna circuit 2131 to expose the first antenna circuit 2131.

[0095] It is understood that in other embodiments, the first antenna circuit 2131 may also be made of a gate metal layer; or, the first antenna circuit 2131 may also be made of a gate metal layer and a source / drain metal layer SD, for example, the first antenna circuit 2131 on the gate metal layer and the source / drain metal layer SD may be connected by vias.

[0096] by Figure 6 As shown in the example, when fabricating the display substrate 100, firstly, a gate metal layer (Gate) can be formed on the substrate 110; then, a second insulating layer (1232) is formed; then, a semiconductor layer (Active) is formed on the second insulating layer 1232; then, a source / drain metal layer (SD) is formed, and while fabricating the source, drain, and data lines of the source / drain metal layer (SD), a first antenna circuit (2131) can be formed; then, a first insulating layer (1231) is formed on the source / drain metal layer (SD); then, a display pixel 122, including a first electrode 1221, is formed.

[0097] It should be noted that since the source / drain metal layer SD generally adopts a Mo / Al (molybdenum / aluminum) metal structure, its conductivity, thermal conductivity, corrosion resistance and other properties are worse than those of copper metal. When used as an antenna circuit 213, its power extraction performance will be poor and the refresh time will be longer when transmitting large amounts of data, such as refreshing some images with high power consumption. However, it will not add any extra process steps and the process is more simplified.

[0098] In practical applications, the material of the first antenna circuit 2131 can be selected according to the actual application scenario. For example, if the first antenna circuit 2131 is made of copper, it is suitable for more scenarios, while if the first antenna circuit 2131 is made of source-drain metal and / or gate metal, it can be used for non-payment application scenarios.

[0099] Please see Figures 3 to 4 , Figures 7 to 8 As shown, in some exemplary embodiments, the peripheral area D includes a first border area DO adjacent to the circuit board 200. The display pixel 122 includes a first electrode 1221, an ink capsule, and a second electrode, at least one of the second electrode and the first electrode 1221 including a connection point F located in the first border area DO.

[0100] For example, the first electrode 1221 is the anode, and the second electrode is the cathode. The cathode can be a continuously arranged whole-surface electrode. The connection point F can be located on the second electrode and can be used to connect to the circuit board 200. The first antenna circuit 2131 is arranged in the first frame area DO and does not overlap with the orthographic projection of the connection point F on the substrate 110.

[0101] In this way, the connection point F of the electrode can be retained in the first frame area DO, and the area other than the connection point F can be used as the antenna clearance area to arrange the first antenna circuit 2131.

[0102] For example, connection point F can include, but is not limited to, the silver point.

[0103] In related technologies, the cathode connection point in an e-ink screen is a dual-ear design, meaning the cathode has two connection points, one on the left and one on the right. To provide more space for the first antenna circuit 2131, please refer to [link to relevant documentation]. Figure 4As shown, in some embodiments of this disclosure, the first frame region DO has an extension length along the first direction X, and the first frame region DO is divided into a first region S1 and a second region S2 along the first direction X; wherein, there is only one connection point F, the connection point F is located in the first region S1, the antenna circuit 213 is located in the second region S2, and the orthogonal projection area of ​​the second region S2 on the substrate 110 is larger than the orthogonal projection area of ​​the first region S1 on the substrate 110. In this way, by setting only one connection point F, in other words, optimizing the connection point F of the second electrode to a single-ear design, more antenna clearance space can be provided to improve antenna performance.

[0104] It is understandable that in practical applications, when the performance requirements for the antenna are not high or the space in the first frame area DO is sufficient, there can be two connection points F. For example, in the first direction X, the first antenna circuit 2131 can be located between two connection points F.

[0105] In some embodiments, the first antenna circuit 2131 may include a first coil-type antenna circuit formed by winding around at least one conductive wire. For example, the first antenna circuit 2131 may be formed by winding a single-turn coil. Alternatively, the first antenna circuit 2131 may also be formed by winding a double-turn coil.

[0106] Considering that the width of the first frame area DO is not increased as much as possible, the first antenna circuit 2131 can be arranged by means of a single-turn coil.

[0107] For example, in the first coil antenna circuit, the coil thickness is... The coil width is 50±5μm, and the gap between adjacent coils is 10±1μm. This results in better data transmission performance for the near-field communication module.

[0108] It is understandable, of course, that the selection of specific parameters for the coil in the first coil-type antenna circuit is not limited to this.

[0109] In addition, such as Figure 7 and Figure 8 As shown, in some exemplary embodiments, a pad area S3 is further provided in the first frame area DO, and the pad area S3 is provided with the pads 201 of the circuit board 200. The first antenna circuit 2131 includes a main body a and a connecting part b; the main body a is located on the periphery of the pad area S3 and does not overlap with the orthographic projection of the pad area S3 on the substrate 110; the connecting part b is electrically connected to the circuit board 200 through the pads 201. For example, there may be two connecting parts b, and the two connecting parts b are connected to the circuit board 200 through the pads 201 to form a loop.

[0110] In the above scheme, by arranging the main body a of the first antenna circuit 2131 around the pad area S3, for example, as shown in the figure, the main body a partially surrounds the pad area S3, so as to optimize the arrangement of the space of the first frame area DO and make full use of the space.

[0111] For example, pad 201 can be directly connected to the corresponding connection part b.

[0112] In related technologies, the pads of the circuit board are generally connected to the antenna metal layer via vias on the electrodes. Since the electrodes are generally made of indium tin oxide (ITO), the data transmission performance is not as good as directly connecting to the metal, and the contact area is not as large as directly connecting the metal connection part b to the pad. Therefore, directly connecting the pad 201 to the connection part b can improve the transmission performance. Furthermore, since the pad 201 and the first antenna circuit 2131 are located in the peripheral area D, they will not affect the display.

[0113] In addition, in related technologies, the e-ink screen also has test traces (AT traces) in the first bezel area. Due to the presence of test traces, if the first wireless circuit is integrated in the first bezel area, the arrangement space of the first wireless circuit will be compressed, and the presence of test traces will cause signal interference.

[0114] In some embodiments of this disclosure, the display substrate 100 further includes test traces disposed in the peripheral region D. These test traces are at least located in the bonding region DP, and no test traces are disposed in the first border region DO. This eliminates the need for test traces in the first border region DO, and instead places the test traces only in the bonding region DP. This provides more space for the first antenna circuit 2131 and also avoids signal interference.

[0115] It should also be noted that in some embodiments, the circuit board 200 is adjacent to the first frame area DO of the display board 100, and part of the circuit of the near field communication module is disposed on the circuit board 200. The circuit board 200 can be connected to the display board 100 through the flexible flat cable 220 and the pad. The circuit board 200 is far away from the cutting line of the display board 100, which can prevent cutting static electricity during the cutting of the display board and subsequent reliability corrosion.

[0116] In some embodiments, such as Figure 2 As shown, an electronic device, such as a mobile phone, includes a built-in near-field communication module 5 and a built-in wireless charging module 4. The built-in near-field communication module 5 is located on the side away from the display screen bonding area DP of the electronic device, and the built-in wireless charging module 4 is located on the side of the built-in near-field communication module 5 closer to the display screen bonding area of ​​the electronic device.

[0117] When the e-ink display module is applied in the housing of an electronic device, the display substrate 100 of the e-ink display module can at least partially overlap with the orthographic projection of the wireless charging module 4 on the display screen of the electronic device, and the orthographic projection of the first antenna circuit 2131 on the display screen of the electronic device is at least partially located between the wireless charging module 4 and the near-field communication module 5 built into the electronic device.

[0118] In some embodiments, the bonding area DP can be the lower border of the e-ink display module, and the first border area DO can be the upper border of the e-ink display module. When the e-ink display module is used in a mobile phone case, since the camera module of the mobile phone is generally located on the upper side, the display substrate 100 of the e-ink display module can be placed below the camera module, while the circuit board 200 can be placed above the display substrate 100 and located on one side of the camera module.

[0119] Generally, the near-field communication module 5 built into an electronic device, such as a mobile phone, is located on the upper back of the phone, while the wireless charging module 4 built into the mobile phone is located on the near-field communication module and faces the display area AA of the e-ink display module. When the e-ink display module is applied to a mobile phone case, after the mobile phone case is attached to the mobile phone, the first antenna circuit 2131 can be located between the wireless charging module 4 and the near-field communication module 5 built into the mobile phone.

[0120] In this way, on the one hand, since the first antenna circuit 2131 is far away from the display area AA of the e-ink display module, it will not increase the extra load of the display area AA and will not affect the display refresh, thus avoiding any impact of the first antenna circuit 2131 on the display; on the other hand, since the first antenna circuit 2131 is not directly facing the wireless charging module 4 built into the mobile phone, it can avoid shielding the wireless charging module 4 and prevent damage to the wireless charging module 4; furthermore, since the first antenna circuit 2131 is located in the first bezel area DO, compared with the solution of externally mounted antenna circuit 213 of the near-field communication module in related technologies, the first antenna circuit 2131 is closer to the near-field communication module 5 built into the mobile phone, which is more conducive to signal and power transmission.

[0121] In other exemplary embodiments, such as Figures 9 to 12 As shown, a second antenna circuit 2132 can be integrated into the display area AA of the display substrate 100. The display area AA of the display substrate 100 includes a plurality of pixel aperture areas P distributed in an array. The orthographic projection of the second antenna circuit 2132 on the substrate 110 does not overlap with the orthographic projection of the pixel aperture areas P on the substrate 110. For example, the second antenna circuit 2132 can be disposed in a non-display area and arranged in a mesh pattern. In this way, the second antenna circuit 2132 can be avoided from affecting the pixel aperture ratio.

[0122] by Figure 9As shown in the example, the pixel circuit 121 of the display substrate 100 includes multiple gate lines 1211 and multiple data lines 1212. The multiple gate lines 1211 and multiple data lines 1212 intersect each other to define multiple pixel opening regions P, and the area between adjacent pixel opening regions P is a non-display area. The second antenna circuit 2132 can be disposed in the non-display area. The orthographic projection of the second antenna circuit 2132, the gate lines 1211, and the data lines 1212 on the substrate 110 can at least partially overlap or not overlap.

[0123] In some embodiments, such as Figure 10 As shown, any one of the pixel circuit 121, the first electrode 1221, the ink capsule, and the second electrode is disposed on a different layer from the second antenna circuit 2132. For example, the electronic ink display layer 120 also includes a plurality of insulating layers 123, including a first insulating layer 1231 in the electronic ink display layer 120 that is furthest from the substrate 110; wherein the second antenna circuit 2132 is located in the display area AA and is stacked on the side of the first insulating layer 1231 that is furthest from the substrate 110.

[0124] Specifically, with Figure 10 As shown in the example, the gate metal layer is located on the side of the source / drain metal layer SD that is close to the substrate 110, and the display pixel 122 is located on the side of the source / drain metal layer SD that is away from the substrate 110. The plurality of insulating layers 123 may include a second insulating layer 1232 located between the gate metal layer and the source / drain metal layer SD, and a first insulating layer 1231 located between the source / drain metal layer SD and the display pixel 122. The second antenna circuit 2132 is stacked on the side of the first insulating layer 1231 that is away from the substrate 110.

[0125] In this way, there is no need to add an additional insulating layer. The second antenna circuit 2132 can be directly fabricated on the first insulating layer 1231 in the original electronic ink display layer 120. Based on the existing fabrication process of the electronic ink display layer 120, only one additional fabrication process for the second antenna circuit 2132 needs to be added, which is simple. For example, the second antenna circuit 2132 can be fabricated using an etching process.

[0126] by Figure 10 As shown in the example, when fabricating the display substrate 100, firstly, a gate metal layer (Gate) can be formed on the substrate 110; then, a second insulating layer 1232 is formed; then, a semiconductor layer (Active) is formed on the second insulating layer 1232; then, a source / drain metal layer (SD) is formed; then, a first insulating layer 1231 is formed on the source / drain metal layer (SD); then, a first antenna circuit 2131 is formed on the first insulating layer 1231, and finally, a display pixel 122 including a first electrode 1221 is formed.

[0127] For example, the second antenna circuit 2132 can be made of a conductive material, such as copper or other metals.

[0128] Because of its extremely high electrical conductivity, copper coils can transmit more current under the same conditions, thus improving antenna efficiency. Copper forms a thin film of copper oxide in air, which protects the internal metal from further oxidation, extending the antenna's lifespan. Copper is easy to process, allowing it to be easily manufactured into coils of various shapes and sizes to meet the needs of different antenna designs. Copper's high thermal conductivity helps in effective heat dissipation in high-power applications, reducing performance degradation caused by overheating. Copper has good mechanical strength, capable of withstanding certain tensile and compressive forces, enabling the coil to maintain stable performance in various environments. Compared to other conductive materials (such as silver), copper is relatively inexpensive and cost-effective, making it suitable for mass production and application. Therefore, copper, as a material for antenna coils, not only provides excellent electrical performance but also possesses favorable physical properties.

[0129] In the above embodiments, the orthographic projections of the second antenna circuit 2132, the gate line 1211, and the data line 1212 on the substrate 110 may at least partially overlap or not overlap. For example, the second antenna circuit 2132 may be arranged parallel to the gate line 1211 and / or the data line 1212. It should be noted that when the orthographic projections of the second antenna circuit 2132, the gate line 1211, and the data line 1212 on the substrate 110 at least partially overlap, a capacitance will be formed between the second antenna circuit 2132 and the source / drain metal layer SD, causing the loading on the data line 1212 to increase, which will affect the pixel charging rate and lead to problems such as difficulty in screen refresh.

[0130] In another embodiment, such as Figures 11 to 12 As shown, at least one of the gate metal layer (Gate) and the source / drain metal layer (SD) may also include the pattern of the second antenna circuit 2132. In other words, the second antenna circuit 2132 may also be fabricated using the gate metal layer (Gate) and / or the source / drain metal layer (SD). In this way, the second antenna circuit 2132 can be formed simultaneously with the fabrication of the pixel circuit 121.

[0131] by Figure 12As shown in the example, when fabricating the display substrate 100, firstly, a gate metal layer (Gate) can be formed on the substrate 110. While fabricating the gate and gate line patterns on the gate metal layer (Gate), a first antenna circuit 2131 can be formed. Then, a second insulating layer (1232) is fabricated. Then, a semiconductor layer (Active) is formed on the second insulating layer (1232). Then, a source / drain metal layer (SD) is fabricated. While fabricating the source, drain, and data lines patterns on the source / drain metal layer (SD), a second antenna circuit 2132 can be formed. Then, a first insulating layer (1231) is formed on the source / drain metal layer (SD). Then, a display pixel 122, including a first electrode 1221, is formed.

[0132] It should be noted that since the source / drain metal layer SD generally adopts a Mo / Al (molybdenum / aluminum) metal structure, its conductivity, thermal conductivity, corrosion resistance and other properties are worse than those of copper metal. When used as an antenna circuit 213, its power extraction performance will be poor and the refresh time will be longer when transmitting large amounts of data, such as refreshing some images with high power consumption. However, it will not add any extra process steps and the process is more simplified.

[0133] In practical applications, the material of the second antenna circuit 2132 can be selected according to the actual application scenario. For example, if the second antenna circuit 2132 is made of copper, it is suitable for more scenarios, while if the second antenna circuit 2132 is made of source-drain metal and / or gate metal, it can be used for non-payment application scenarios.

[0134] In addition, for example, Figure 11 and Figure 12 As shown, the gate metal layer includes a first portion c in the second antenna circuit 2132, and the source / drain metal layer SD includes a second portion d in the second antenna circuit 2132. The electronic ink display layer 120 also includes a second insulating layer 1232 located between the gate metal layer and the source / drain metal layer SD. The first portion c and the second portion d are connected through a via V on the second insulating layer 1232. For example, the first portion c and the second portion d can be connected to each other to form a mesh through the via V on the second insulating layer 1232.

[0135] It should be noted that when the source / drain metal layer SD and the gate metal layer Gate are used to directly form the second antenna circuit 2132, for high PPI (resolution) products, there may be insufficient storage capacitors, which may cause the screen to appear washed out and affect the display quality.

[0136] Furthermore, since the second wireless circuit is integrated into the display area AA of the display substrate 100, in applications such as mobile phone cases, the second wireless circuit may be directly opposite the wireless charging module 4 of the mobile phone. The metal of the second wireless circuit will have a shielding effect, causing damage to the wireless charging module 4 of the mobile phone. Therefore, in practical applications, the wireless circuit of the near-field communication module of the e-ink display module can be integrated into the display area AA or the peripheral area D of the display substrate 100, depending on the specific application scenario.

[0137] In some embodiments, the second antenna circuit 2132 includes a second coil-type antenna circuit formed by being wound around at least one conductive wire. For example, the second antenna circuit 2132 may be formed by being wound around a single-turn coil. Alternatively, the second antenna circuit 2132 may also be formed by being wound around a double-turn coil.

[0138] To minimize the impact on pixel aperture ratio when deploying the second antenna circuit 2132, it is exemplarily possible that the second antenna circuit 2132 is formed by a single-turn coil. For example, in the second coil-type antenna circuit, the coil thickness is... The coil width is 6±2μm, and the gap between adjacent coils is 20±1μm. It is understandable, however, that the specific parameters of the coils in the second coil-type antenna circuit are not limited to these.

[0139] Furthermore, embodiments of this disclosure provide an electronic device housing, comprising:

[0140] Protective housing, with a transparent area on the protective housing; and

[0141] The e-ink display module provided in this embodiment is housed in a protective housing, and the display area AA of the display substrate 100 is set to correspond to the transparent area.

[0142] An electronic device housing can be used as a casing for an electronic device, and may include a protective casing. An e-ink display module can be mounted on the protective casing. For example, the electronic device can be a mobile phone, tablet, laptop, or other device with an NFC module. Correspondingly, if the electronic device is a mobile phone, the housing can be a phone case, and the e-ink display module can be mounted on this phone case. This allows the user to operate the control application of the e-ink display module (such as an application installed on the phone) to select the content to be displayed and send it to the e-ink phone case for display, thus enabling screen scrolling on the e-ink phone case.

[0143] Furthermore, this disclosure provides an electronic price tag, including:

[0144] Protective housing, with a transparent area on the protective housing; and

[0145] The e-ink display module provided in this embodiment is disposed on a protective housing, and the display area AA of the display substrate 100 is set corresponding to the transparent area.

[0146] Electronic shelf labels can communicate wirelessly with NFC-enabled devices (such as smartphones and tablets) and transfer data without contact. Users simply need to bring an NFC-enabled device close to the electronic shelf label to perform operations such as fast data transfer, information reading, and payment.

[0147] Other essential components of the electronic device housing and electronic price tag (such as driver chips) are readily understood by those skilled in the art and will not be described in detail here, nor should they be construed as limiting this disclosure. Since the principle by which this electronic device housing and electronic price tag solves the problem is similar to that of the e-ink display module described above, the embodiments of the electronic device housing and electronic price tag provided in this disclosure can be referred to the embodiments of the e-ink display module provided in this disclosure, and will not be described again here.

[0148] The following points need to be explained:

[0149] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0150] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0151] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0152] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. The scope of protection of this disclosure shall be determined by the scope of the claims.

Claims

1. An ink screen display module, characterized by, The display substrate has a display area and a peripheral area surrounding the display area, and comprises a substrate and an electronic ink display layer provided on the substrate, the electronic ink display layer being at least partially located in the display area. The circuit substrate is adjacent to the display substrate and comprises at least a communication circuit of a near field communication module. The antenna circuit of the near field communication module is further integrated on the substrate, and the antenna circuit is connected to the communication circuit, and the antenna circuit comprises a first antenna circuit located in the peripheral area and / or a second antenna circuit located in the display area. The peripheral area comprises a first bezel area and a binding area arranged oppositely, and the circuit substrate is adjacent to the first bezel area of the circuit substrate.

2. The ink screen display module of claim 1, wherein, The electronic ink display layer comprises a pixel circuit and a plurality of display pixels, and the first antenna circuit does not overlap with the pixel circuit and the display pixels in orthographic projection on the substrate.

3. The ink screen display module of claim 1, wherein, The display pixel comprises a first electrode, an ink capsule and a second electrode arranged in a stack, and any one of the pixel circuit, the first electrode, the ink capsule and the second electrode is arranged in a layer different from the first antenna circuit.

4. The ink screen display module of claim 3, wherein, The electronic ink display layer further comprises a plurality of insulating layers, and the plurality of insulating layers comprise a first insulating layer farthest from the substrate in the electronic ink display layer; and the first antenna circuit is located in the peripheral area and is stacked on a side of the first insulating layer away from the substrate.

5. The ink screen display module of claim 4, wherein, The pixel circuit comprises a plurality of gate lines, a plurality of data lines and a thin film transistor comprising a gate, a source and a drain; the electronic ink display layer comprises patterns of a gate metal layer and a source-drain metal layer, the gate metal layer comprising the gate and the gate lines, and the source-drain metal layer comprising patterns of the source, the drain and the data lines; and at least one of the gate metal layer and the source-drain metal layer further comprises a pattern of the first antenna circuit.

6. The ink screen display module of claim 3, wherein, The peripheral area comprises a first bezel area adjacent to the circuit substrate; the display pixel comprises a first electrode, an ink capsule and a second electrode, at least one of the second electrode and the first electrode comprising a connection point located in the first bezel area, the connection point being connected to the circuit substrate; and the first antenna circuit is arranged in the first bezel area and does not overlap with the connection point in orthographic projection on the substrate.

7. The ink screen display module of claim 3, wherein, The first bezel area has an extension length along a first direction, and the first bezel area is divided into a first region and a second region along the first direction; the connection point is only one, the connection point is located in the first region, the antenna circuit is located in the second region, and the orthographic projection area of the second region on the substrate is greater than the orthographic projection area of the first region on the substrate.

8. The ink screen display module of claim 7, wherein, The first antenna circuit comprises a first coil type antenna circuit formed by at least one conductive wire.

9. The ink screen display module of claim 3, wherein, ​ 10. The ink screen display module of claim 9, wherein, The first coil type antenna circuit has a coil thickness of The coil width is 50 ± 5 μm, and the gap between adjacent coils is 10 ± 1 μm.

11. The ink screen display module of claim 3, wherein, The peripheral area includes a first frame area adjacent to the circuit substrate, and a pad area is further provided in the first frame area, and the pad area is arranged with pads of the circuit substrate; wherein the first antenna circuit includes a main body part and a connecting part; the main body part is located at the periphery of the pad area and does not overlap with the normal projection of the pad area on the substrate; and the connecting part is electrically connected with the circuit substrate through the pad area.

12. The ink screen display module of claim 1, wherein, The display area includes a plurality of pixel opening areas arranged in an array, and the normal projection of the second antenna circuit on the substrate does not overlap with the normal projection of the pixel opening areas on the substrate.

13. The ink screen display module of claim 12, wherein: The electronic ink display layer includes a pixel circuit and a display pixel, the display pixel includes a first electrode, an ink capsule and a second electrode arranged in a stack; any one of the pixel circuit, the first electrode, the ink capsule and the second electrode is arranged in a layer different from the second antenna circuit.

14. The ink screen display module of claim 13, wherein: The electronic ink display layer further includes a plurality of insulating layers, the plurality of insulating layers include a first insulating layer farthest from the substrate in the electronic ink display layer; wherein the second antenna circuit is located in the display area, and is stacked on a side of the first insulating layer away from the substrate.

15. The ink screen display module of claim 13, wherein: The pixel circuit includes a plurality of gate lines, a plurality of data lines and a thin film transistor, the thin film transistor includes a gate, a source and a drain; the electronic ink display layer includes patterns of a gate metal layer and a source-drain metal layer, the gate metal layer includes the gate and the gate lines; the source-drain metal layer includes patterns of the source, the drain and the data lines; wherein at least one of the gate metal layer and the source-drain metal layer further includes a pattern of the second antenna circuit.

16. The ink screen display module of claim 15, wherein: The gate metal layer includes a first part of the second antenna circuit, the source-drain metal layer includes a second part of the second antenna circuit, and the electronic ink display layer further includes a second insulating layer between the gate metal layer and the source-drain metal layer, the first part and the second part are connected through a via on the second insulating layer.

17. The ink screen display module of claim 12, wherein: The second antenna circuit includes a second coil type antenna circuit formed by at least one conductive wire.

18. The ink screen display module of claim 17, wherein, The second coil type antenna circuit has a coil thickness of The coil width is 6 ± 2 μm, and the gap between adjacent coils is 20 ± 1 μm.

19. The ink screen display module of claim 2, wherein, The display substrate further includes a test trace provided in the peripheral area, wherein the test trace is provided at least in the binding area, and the test trace is not provided at least in the first frame area.

20. An electronic device housing, characterized by It comprises: a protective shell, the protective shell is provided with a transparent area; and The ink screen display module as claimed in any one of claims 1 to 19 is provided on the protective shell, and the display area of the display substrate corresponds to the transparent area.

21. An electronic price label, characterized by It comprises: The ink screen display module as claimed in any one of claims 1 to 19.

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