Multi-channel communication slave station system based on IO-Link
By using an IO-Link-based multi-channel communication slave system, and utilizing the IO-Link interface and chip, main control chip, and isolation high-side switch module, one-to-one remote connection of sensors is achieved. This solves the problems of redundant communication links and wasted chip resources caused by daisy chains, and enables flexible expansion and power safety.
Patent Information
- Application Number
- CN202520665711.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-10
- Publication Date
- 2026-03-17
- Estimated Expiration
- 2035-04-10
AI Technical Summary
In existing technologies, connecting sensors via a daisy chain (serial connection) results in a lengthy communication link, and bus-based communication places high demands on communication chips, leading to resource waste and unnecessary costs.
A multi-channel communication slave system based on IO-Link is adopted, including an IO-Link interface, an IO-Link communication chip and a master control chip. They are connected through an SPI interface, an isolated high-side switch module is provided, and an electrical signal sensor and a driver chip are added to achieve one-to-one remote connection. The isolated high-side switch module and the signal isolation module form a multi-level collaborative control architecture.
It effectively solves the problems of redundant communication links and wasted chip resources in traditional technologies, and achieves flexible expansion and power safety, meeting the Class-B industrial safety standard.
Smart Images
Figure CN224005493U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of industrial control technology, and in particular to a multi-channel communication slave system based on IO-Link. Background Technology
[0002] IO-Link is an open communication protocol and interface standard in the field of industrial automation, designed to enable bidirectional intelligent communication between field devices such as sensors and actuators and controllers (such as PLCs). Based on the IEC 61131-9 international standard, it simplifies device connections through digital transmission, improving the flexibility and intelligence of industrial systems. In a typical industrial equipment and system pyramid, the top layer consists of HMIs and PLCs, responsible for human-machine interaction and process logic processing. The second layer is the IO-Link master station, connected in series on the industrial bus. It can send information from the bus to the IO-Link master station or collect and upload data from slave stations to the bus. The IO-Link master station typically has 4 or 8 slave ports, to which IO-Link slave stations can be connected. The third layer consists of IO-Link slave stations, each independently connected to a slave port of the master station. Slave stations often work with standard sensors and actuators to implement basic actions on industrial production lines.
[0003] In industrial settings, communication between devices such as PLCs and HMIs is typically achieved through bus communication. Common industrial buses include EtherCAT, EtherNet / IP, ModBus, and ProfitNet. Devices on the bus are often connected in a daisy-chain (serial) configuration, which inevitably leads to lengthy communication links when installing a large number of sensors. Furthermore, bus communication places high demands on the communication chips, and using such chips in sensor devices results in wasted resources and unnecessary costs.
[0004] Therefore, a new technical solution is urgently needed to solve the above-mentioned technical problems. Utility Model Content
[0005] The purpose of this invention is to overcome the problems of the prior art and provide a multi-channel communication slave system based on IO-Link. This system addresses the technical issues in the prior art where daisy-chain (serial) connections inevitably lead to lengthy communication links when installing a large number of sensors, and where bus-type communication places high demands on communication chips, resulting in resource waste and unnecessary costs for sensor devices.
[0006] The above objectives are achieved through the following technical solutions:
[0007] A multi-channel communication slave system based on IO-Link includes interconnected IO-Link interfaces and IO-Link communication chips. A master control chip is connected to the IO-Link communication chip via an SPI interface. The master control chip is connected to at least one isolation high-side switch module via an SPI bus.
[0008] Furthermore, the IO-Link interface is an IO-Link Class-B interface.
[0009] Furthermore, the IO-Link communication chip is model L6364Q; the DIO pin of the IO-Link communication chip is connected to the DIO pin of the IO-Link interface, the CQ pin of the IO-Link communication chip is connected to the CQ pin of the IO-Link interface, and the VIN pin of the IO-Link communication chip is connected to the 24V auxiliary power input pin of the IO-Link interface.
[0010] Furthermore, the main control chip is an STM32G071CBT6TR; the SPI1-OUT pin of the main control chip is connected to the SPI1-INT pin of the IO-Link communication chip, the SPI1-MOSI pin of the main control chip is connected to the SPI1-MISO pin of the IO-Link communication chip, the SPI1-MISO pin of the main control chip is connected to the SPI1-MOSI pin of the IO-Link communication chip, the SPI1-CS pin of the main control chip is connected to the SPI1-CS pin of the IO-Link communication chip, the SPI1-SCK pin of the main control chip is connected to the SPI1-SCK pin of the IO-Link communication chip, the VIN pin of the main control chip is connected to the 3.3V-OUT pin of the IO-Link communication chip, and the GND pin of the main control chip is connected to the GND pin of the IO-Link communication chip as ground.
[0011] Furthermore, the isolation high-side switch module is model ISO8200AQTR.
[0012] Furthermore, there are four isolation high-side switch modules, which are connected to the main control chip via the SPI bus, including a first isolation high-side switch module, a second isolation high-side switch module, a third isolation high-side switch module, and a fourth isolation high-side switch module.
[0013] Furthermore, the OUT-EN pin of the isolation high-side switch module is connected to the OUT-EN pin of the main control chip; the SPI2-MOSI pin of the isolation high-side switch module is connected to the SPI2-MOSI pin of the main control chip; the SPI2-MISO pin of the isolation high-side switch module is connected to the SPI2-MISO pin of the main control chip; the SPI2-CS pin of the isolation high-side switch module is connected to the SPI2-CS pin of the main control chip; the SPI2-SCK pin of the isolation high-side switch module is connected to the SPI2-SCK pin of the main control chip; the PGOOD pin of the isolation high-side switch module is connected to the PGOOD pin of the main control chip; and the FAULT pin of the isolation high-side switch module is connected to the FAULT pin of the main control chip.
[0014] Furthermore, the isolation high-side switch module is also connected to a multi-purpose expansion interface module.
[0015] Furthermore, it also includes a power management module connected to the IO-Link interface.
[0016] Furthermore, it also includes a signal isolation module connected between the IO-Link communication chip and the main control chip.
[0017] This invention provides a multi-channel communication slave system based on IO-Link, implemented using the IO-Link communication chip L6364 and the STM32G071 main controller as a platform. Different IO-Link slaves with different functions can be achieved by pairing the main controller with different sensor chips or driver chips. The use of an isolated high-side switch isolates the power supply at the control end from the power supply at the load end, ensuring power safety. One-to-one remote connection is achieved using the IO-Link communication chip, and the addition of a high-side switch enables a group of SPI communication controlling eight output points. This system effectively solves the problems of traditional daisy-chain (serial) connections, which inevitably lead to lengthy communication links when installing a large number of sensors, and the high requirements for communication chips in bus-type communication, which wastes resources and incurs unnecessary costs when using such chips in sensor devices. Attached Figure Description
[0018] Figure 1 This is a circuit diagram of a multi-channel communication slave system based on IO-Link as described in this utility model. Detailed Implementation
[0019] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. The described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0020] like Figure 1 As shown, this solution provides a multi-channel communication slave system based on IO-Link, including an interconnected IO-Link interface J1 and an IO-Link communication chip U2. A master control chip U5 is connected to the IO-Link communication chip U2 via an SPI interface and is used to perform system logic control, multi-channel device scheduling, and communication protocol conversion. The master control chip U5 is connected to at least one isolation high-side switch module via an SPI bus. The isolation high-side switch module is used to receive master control commands and drive external loads, supporting electrical isolation and overcurrent protection.
[0021] The IO-Link communication chip U2 is directly connected to the IO-Link interface J1 and is responsible for data encoding, decoding and physical layer signal processing of the IO-Link protocol.
[0022] In this embodiment, the main control chip U5 coordinates the IO-Link communication of the IO-Link communication chip U2 with the load drive of the isolated high-side switch module through the SPI bus, forming a multi-level collaborative control architecture.
[0023] In this embodiment, the IO-Link interface J1 is an IO-Link Class-B interface, which is the interface definition for M12-5P. It is used for high-power devices that require additional power supply, such as motors, solenoid valves, etc. Its wiring sequence corresponds to the 24V positive terminal of the control terminal, the 24V positive terminal of the load terminal, the negative terminal of the control terminal, the communication line, and the negative terminal of the load terminal.
[0024] It should be noted that the IO-Link interface J1 has 5 pins, including pin 1 (GND), pin 2 (24V), pin 3 (CQ), pin 4 (DIO), and pin 5 (24V). Pin 1 (GND) is used for grounding, serving as the system reference ground (L-), providing a reference potential for power circuits and signals to ensure electrical safety. Pin 2 is used for auxiliary power input, providing redundant power supply in parallel with pin 5 to enhance current carrying capacity or provide additional power support for high-power devices. Pin 3 (CQ) is the communication quality signal, used to transmit IO-Link communication data (C / Q channel) and monitor communication quality (such as signal strength, bit error rate, etc.). Pin 4 (DIO) is used for digital input / output, supporting bidirectional digital signal transmission, and is used for device status feedback, configuration switching, or general I / O functions for non-IO-Link communication. Pin 5 is used for main power input, providing 24V DC power to power connected IO-Link slave devices.
[0025] In this embodiment, the IO-Link communication chip U2 is model L6364Q, such as STMicroelectronics' L6364Q dual-channel IO-Link transceiver; the DIO pin of the IO-Link communication chip U2 is connected to the DIO pin of the IO-Link interface J1, the CQ pin of the IO-Link communication chip U2 is connected to the CQ pin of the IO-Link interface J1, and the VIN pin of the IO-Link communication chip U2 is connected to the 24V auxiliary power input pin of the IO-Link interface J1.
[0026] In this embodiment, the main control chip U5 is an STM32G071CBT6TR. The SPI1-OUT pin of the main control chip U5 is connected to the SPI1-INT pin of the IO-Link communication chip U2 as an interrupt signal for interrupt request. The IO-Link communication chip U2 sends an interrupt request (such as data ready or communication error) to the main control chip U5 through this pin.
[0027] The SPI1-MOSI pin of the main control chip U5 is connected to the SPI1-MISO pin of the IO-Link communication chip U2 as a data output for master output and slave input. The main control chip U5 sends data (instructions or configuration parameters) to the IO-Link communication chip U2 through this pin.
[0028] The SPI1-MISO pin of the main control chip U5 is connected to the SPI1-MOSI pin of the IO-Link communication chip U2 as a data input for master-slave output. The main control chip U5 receives data (response or status information from the device to the master) from the IO-Link communication chip U2 through this pin.
[0029] The SPI1-CS pin of the main control chip U5 is connected to the SPI1-CS pin of the IO-Link communication chip U2 as a chip select signal for chip select control. The main control chip U5 selects the IO-Link communication chip U2 for communication through this pin (active low level), allowing multiple devices to share the same SPI bus.
[0030] The SPI1-SCK pin of the main control chip U5 is connected to the SPI1-SCK pin of the IO-Link communication chip U2 as a clock signal for clock synchronization. The main control chip U5 provides the clock signal to coordinate the data transmission timing of the SPI bus.
[0031] The VIN pin of the main control chip U5 is connected to the 3.3V-OUT pin of the IO-Link communication chip U2 as a power output for the power supply link. The IO-Link communication chip U2 provides 3.3V power to the main control chip U5 to ensure the stable operation of the main control chip U5.
[0032] The GND pin of the main control chip U5 is connected to the GND pin of the IO-Link communication chip U2 as a ground, for common ground connection, to ensure that the potential reference of the IO-Link communication chip U2 and the main control chip U5 is consistent, and to avoid signal interference.
[0033] This embodiment establishes an SPI communication architecture through this connection, implementing master-slave mode and an interrupt mechanism, wherein:
[0034] Master-slave mode: The master control chip U5 acts as the SPI master device and the IO-Link communication chip U2 acts as the slave device. The master sends commands through MOSI and MISO receives the responses.
[0035] Interrupt mechanism: The IO-Link communication chip U2 uses the interrupt service routine of the SPI1-INT active master control chip U5 to realize real-time event processing (such as sudden changes in device state).
[0036] This embodiment also establishes a power supply relationship through this link, enabling the 3.3V-OUT of the IO-Link communication chip U2 to directly power the VIN of U5, simplifying the power supply design; and reduces the grounding impedance and improves signal integrity by connecting multiple GND pins in parallel.
[0037] The isolation high-side switch module described in this embodiment is model ISO8200AQTR, which is an 8-channel isolation high-side smart power solid-state relay launched by STMicroelectronics.
[0038] As an optimization of this embodiment, there are four isolation high-side switch modules, which are respectively connected to the main control chip U5 via the SPI bus, including a first isolation high-side switch module U6, a second isolation high-side switch module U7, a third isolation high-side switch module U8, and a fourth isolation high-side switch module U9.
[0039] Specifically, the OUT-EN pin of the isolation high-side switch module is connected to the OUT-EN pin of the main control chip U5 for output enable control. The main control chip U5 directly controls the switch channel enable state of the isolation high-side switch module (high level activates output, low level disables).
[0040] The SPI2-MOSI pin of the isolated high-side switch module is connected to the SPI2-MOSI pin of the main control chip U5 for master device output and slave device input; the main control chip U5 sends control commands (such as channel switching, PWM parameters, etc.) to the isolated high-side switch module through this pin.
[0041] The SPI2-MISO pin of the isolation high-side switch module is connected to the SPI2-MISO pin of the master control chip U5 for master device input and slave device output; the isolation high-side switch module feeds back status information (such as current load current, fault code, etc.) to the master control chip U5 through this pin.
[0042] The SPI2-CS pin of the isolation high-side switch module is connected to the SPI2-CS pin of the main control chip U5 as a chip select signal. The main control chip U5 selects the isolation high-side switch module for communication through this pin (active low level), allowing multiple modules to share the same SPI bus.
[0043] The SPI2-SCK pin of the isolation high-side switch module is connected to the SPI2-SCK pin of the main control chip U5 as a clock synchronization signal: the main control chip U5 provides the SPI clock to coordinate the data transmission timing (such as sampling on the rising edge and latching on the falling edge).
[0044] The PGOOD pin of the isolation high-side switch module is connected to the PGOOD pin of the main control chip U5 for power status monitoring. The isolation high-side switch module feeds back the power status to the main control chip U5 through this pin (high level indicates normal power supply, low level indicates overvoltage / undervoltage / overtemperature).
[0045] The FAULT pin of the isolation high-side switch module is connected to the FAULT pin of the main control chip U5 and is used for fault feedback signal. When the isolation high-side switch module detects overcurrent, short circuit or thermal shutdown, it sends a low-level alarm signal to the main control chip U5 through this pin.
[0046] Specifically, the SPI2-MOSI, SPI2-MISO, SPI2-CS, and SPI2-SCK pins serve as core control and communication pins; the OUT-EN, PGOOD, and FAULT pins serve as enable and protection pins.
[0047] This solution adopts an isolation design and multiple protection mechanisms to meet the Class-B industrial safety standard; it uses SPI bus cascading to support up to 32 modules, enabling flexible expansion.
[0048] In addition, the isolation high-side switch module is also connected to a multi-purpose expansion interface module GPIO*8, which is used to connect the main control chip U5 and the isolation high-side switch module to realize power supply, signal control and grounding circuit.
[0049] Specifically, the VDD pin of the isolation high-side switch module is connected to the GPIO*8 of the multi-purpose expansion interface module. of The VIN pin is connected as the logic-side power input, and is controlled by the GPIO multi-purpose expansion interface module. *8's VIN provides 3.3V / 5V power to power the logic control circuitry of the isolated high-side switch module;
[0050] The GPIO pins of the isolated high-side switch module are connected to the GPIO0 pins of the multi-purpose expansion interface module GPIO*8 as general-purpose inputs / outputs. The main controller sends control signals (such as output enable and PWM duty cycle) to the isolated high-side switch module through GPIO0.
[0051] The GND pin of the isolation high-side switch module is connected to the GND pin of the multi-purpose expansion interface module GPIO*8 for common ground connection, ensuring that the potential reference of the logic side (control signal) and the load side (drive power supply) are consistent, and suppressing common-mode interference.
[0052] This embodiment also includes a power management module U1, model L7983, connected to the IO-Link interface J1, used to convert the 24V input voltage to 5V and 3.3V system power supply in this system.
[0053] As an optimization of this embodiment, a signal isolation module U3, model D3SX2500000E, is also included, which is connected between the IO-Link communication chip U2 and the main control chip U5 to realize electrical isolation of the SPI bus signal.
[0054] As a further optimization of this solution, the system also includes a reset monitoring module U4, model STM6322SWYGF, which is used to monitor the 5V power supply voltage in real time and trigger the system reset signal (RST) when an abnormality occurs.
[0055] The above description is only for illustrating the embodiments of this utility model and is not intended to limit this utility model. For those skilled in the art, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A multi-channel communication slave station system based on IO-Link, characterized in that The IO-Link interface (J1) and the IO-Link communication chip (U2) are connected with each other, and the main control chip (U5) is connected with the IO-Link communication chip (U2) through an SPI interface; the main control chip (U5) is connected with at least one isolated high-side switch module through an SPI bus.
2. The multi-channel communication slave station system based on IO-Link according to claim 1, characterized in that, The IO-Link interface (J1) is an IO-Link Class-B interface.
3. The IO-Link based multi-channel communication slave station system according to claim 1 or 2, characterized in that, The model of the IO-Link communication chip (U2) is L6364Q; the DIO pin of the IO-Link communication chip (U2) is connected with the DIO pin of the IO-Link interface (J1), the CQ pin of the IO-Link communication chip (U2) is connected with the CQ pin of the IO-Link interface (J1), and the VIN pin of the IO-Link communication chip (U2) is connected with the 24V auxiliary power input pin of the IO-Link interface (J1).
4. The multi-channel communication slave station system based on IO-Link according to claim 3, characterized in that, The model of the main control chip (U5) is STM32G071CBT6TR; the SPI1-OUT pin of the main control chip (U5) is connected with the SPI1-INT pin of the IO-Link communication chip (U2), the SPI1-MOSI pin of the main control chip (U5) is connected with the SPI1-MISO pin of the IO-Link communication chip (U2), the SPI1-MISO pin of the main control chip (U5) is connected with the SPI1-MOSI pin of the IO-Link communication chip (U2), the SPI1-CS pin of the main control chip (U5) is connected with the SPI1-CS pin of the IO-Link communication chip (U2), the SPI1-SCK pin of the main control chip (U5) is connected with the SPI1-SCK pin of the IO-Link communication chip (U2), the VIN pin of the main control chip (U5) is connected with the 3.3V-OUT pin of the IO-Link communication chip (U2), and the GND pin of the main control chip (U5) is connected with the GND pin of the IO-Link communication chip (U2) as a ground.
5. The IO-Link based multi-channel communication slave system of claim 4, wherein, The model of the isolated high-side switch module is ISO8200AQTR.
6. The multi-channel communication slave station system based on IO-Link of claim 5, wherein, The isolated high-side switch module has four, which are respectively connected with the main control chip (U5) through the SPI bus, and include a first isolated high-side switch module (U6), a second isolated high-side switch module (U7), a third isolated high-side switch module (U8) and a fourth isolated high-side switch module (U9).
7. The multi-channel communication slave station system based on IO-Link of claim 5, wherein, The OUT-EN pin of the isolation high-side switch module is connected with the OUT-EN pin of the main control chip (U5), the SPI2-MOSI pin of the isolation high-side switch module is connected with the SPI2-MOSI pin of the main control chip (U5), the SPI2-MISO pin of the isolation high-side switch module is connected with the SPI2-MISO pin of the main control chip (U5), the SPI2-CS pin of the isolation high-side switch module is connected with the SPI2-CS pin of the main control chip (U5), the SPI2-SCK pin of the isolation high-side switch module is connected with the SPI2-SCK pin of the main control chip (U5), the PGOOD pin of the isolation high-side switch module is connected with the PGOOD pin of the main control chip (U5), and the FAULT pin of the isolation high-side switch module is connected with the FAULT pin of the main control chip (U5).
8. The multi-channel communication slave station system based on IO-Link of claim 5, wherein, A multipurpose expansion interface module GPIO*8 is further connected to the isolation high-side switch module.
9. The multi-channel communication slave station system based on IO-Link of claim 1, wherein, A power management module (U1) connected with the IO-Link interface (J1) is further included.
10. The multi-channel communication slave station system based on IO-Link of claim 1, wherein, A signal isolation module (U3) connected between the IO-Link communication chip (U2) and the main control chip (U5) is further included.