A multilayer composite high rate thin film ceramic substrate structure

Abstract

The utility model relates to the technical field of ceramic substrate, and disclose a kind of multilayer composite high-speed thin film ceramic substrate structure, solve the problem that the heat dissipation effect of current electronic equipment is not good, it includes ceramic substrate layer, the top of the ceramic substrate layer is equipped with transition metal layer, transition metal layer and ceramic substrate layer between being equipped with strengthening mechanism, the top of transition metal layer is equipped with circuit layer, the top of circuit layer is equipped with solder resist, the inside of ceramic substrate layer is equipped with multiple heat dissipation channels, the bottom of ceramic substrate layer is equipped with multiple ventilation holes, and the ventilation hole and heat dissipation channel of corresponding position are interconnected, the bottom of ceramic substrate layer is evenly equipped with multiple heat dissipation fins;The utility model discloses when electronic equipment operates, air can flow in heat dissipation channel by fan and the like device, heat dissipation is facilitated, and the existence of heat dissipation fin increases the heat dissipation area, can accelerate the heat dissipation speed to ambient environment.

Description

Technical Field

[0001] This invention belongs to the field of ceramic substrate technology, specifically a multilayer composite high-speed thin-film ceramic substrate structure. Background Technology

[0002] With the continuous advancement of technology, electronic devices are developing towards miniaturization, portability, and high performance. For example, portable electronic devices such as smartphones, tablets, and wearable devices require the integration of more functions and electronic components within a limited space, while also ensuring that the devices have high-speed data processing capabilities, efficient communication functions, and stable performance. This requires circuit boards to have higher integration and better electrical performance, and traditional circuit board materials and structures can no longer meet these requirements.

[0003] Electronic components in electronic devices generate a lot of heat when they are working. Especially in the case of high integration and high performance, heat dissipation is more prominent. If the heat cannot be dissipated in a timely and effective manner, the temperature of electronic components will rise, thereby reducing their performance, shortening their service life, and even causing equipment failure. Traditional circuit board materials have limited heat dissipation performance and cannot meet the heat dissipation requirements of high-performance electronic devices. Utility Model Content

[0004] In view of the above situation and to overcome the defects of the prior art, this utility model provides a multilayer composite high-speed thin-film ceramic substrate structure, which effectively solves the problem of poor heat dissipation in current electronic devices.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a multilayer composite high-speed thin-film ceramic substrate structure, comprising a ceramic substrate layer, a transition metal layer on top of the ceramic substrate layer, a reinforcing mechanism between the transition metal layer and the ceramic substrate layer, a circuit layer on top of the transition metal layer, and a solder resist layer on top of the circuit layer.

[0006] The ceramic substrate layer has multiple heat dissipation channels inside, and multiple ventilation holes at the bottom of the ceramic substrate layer. The ventilation holes and heat dissipation channels are interconnected at the corresponding positions. Multiple heat dissipation fins are evenly distributed at the bottom of the ceramic substrate layer.

[0007] Preferably, the reinforcing mechanism includes a plurality of reinforcing strips and V-shaped reinforcing plates located between the ceramic substrate layer and the transition metal layer, with the reinforcing strips and V-shaped reinforcing plates arranged alternately.

[0008] Preferably, the ceramic substrate layer is made of ceramic material.

[0009] Preferably, the transition metal layer is made of a metal alloy.

[0010] Preferably, the circuit layer is composed of a thin metal film.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. The ceramic substrate layer made of ceramic material can effectively conduct heat, which helps to solve the heat dissipation problem. Through the cooperation between heat dissipation channels, ventilation holes and heat dissipation fins, when the electronic device is running, the air can flow in the heat dissipation channels through devices such as fans, which facilitates the dissipation of heat. The presence of heat dissipation fins increases the heat dissipation area and can accelerate the dissipation of heat to the surrounding environment.

[0013] 2. By setting reinforcing strips and V-shaped reinforcing plates between the ceramic substrate layer and the transition metal layer, the strength of the entire ceramic substrate can be enhanced. Attached Figure Description

[0014] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0015] In the attached diagram:

[0016] Figure 1 This is a schematic diagram of the high-speed thin-film ceramic substrate structure of the multilayer composite of this utility model;

[0017] Figure 2 This is a schematic diagram of the ceramic substrate layer structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the reinforcing mechanism of this utility model.

[0019] In the diagram: 1. Ceramic substrate layer; 2. Reinforcing mechanism; 201. Reinforcing strip; 202. V-shaped reinforcing plate; 3. Transition metal layer; 4. Circuit layer; 5. Solder mask layer; 6. Heat dissipation fins; 7. Ventilation holes; 8. Heat dissipation channel. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0021] Example 1, by Figure 1This utility model relates to a multilayer composite high-speed thin-film ceramic substrate structure, including a ceramic substrate layer 1, a transition metal layer 3 on top of the ceramic substrate layer 1, a reinforcing mechanism 2 between the transition metal layer 3 and the ceramic substrate layer 1, a circuit layer 4 on top of the transition metal layer 3, and a solder resist layer 5 on top of the circuit layer 4. The ceramic substrate layer 1 is made of ceramic material and has advantages such as high strength, high thermal conductivity, high insulation, high mechanical stress, shape stability, strong bonding force, and corrosion resistance. It can provide stable physical support and good insulation performance for the entire substrate. The transition metal layer 3 is made of metal alloy material and has good adhesion and conductivity. The circuit layer 4 is composed of metal thin film and has good electrical and thermal conductivity. It can realize the miniaturization of high-precision circuits and undertake the functions of conducting electricity and carrying current. The solder resist layer 5 is made of organic polymer materials such as epoxy resin and acrylic resin with appropriate fillers and additives. It has good insulation performance, corrosion resistance, and heat resistance. It can prevent solder diffusion, protect the circuit and insulation, avoid problems such as solder short circuits during the soldering process, and improve the reliability and stability of the substrate.

[0022] Specifically, by Figure 2 As shown, the ceramic substrate layer 1 has multiple heat dissipation channels 8 inside, and multiple ventilation holes 7 are provided at the bottom of the ceramic substrate layer 1. The ventilation holes 7 at the corresponding positions are connected to the heat dissipation channels 8. Multiple heat dissipation fins 6 are uniformly provided at the bottom of the ceramic substrate layer 1.

[0023] When the electronic device is running, air flows through the heat dissipation channel 8 through devices such as fans to dissipate heat. At the same time, the air is exhausted through the ventilation holes 7, and the presence of heat dissipation fins 6 increases the heat dissipation area and accelerates the dissipation of heat to the surrounding environment.

[0024] Specifically, by Figure 3 As shown, the reinforcing mechanism 2 includes a plurality of reinforcing strips 201 and V-shaped reinforcing plates 202 located between the ceramic substrate layer 1 and the transition metal layer 3, with the reinforcing strips 201 and V-shaped reinforcing plates 202 being arranged alternately;

[0025] In use, multiple reinforcing strips 201 are provided between the ceramic substrate layer 1 and the transition metal layer 3 to effectively enhance the strength of the entire ceramic substrate. At the same time, multiple V-shaped reinforcing plates 202 are provided between the ceramic substrate layer 1 and the transition metal layer 3, and the V-shaped reinforcing plates 202 and the reinforcing strips 201 are arranged alternately to further ensure the strength of the entire ceramic substrate.

Claims

1. A multilayer composite high-speed thin-film ceramic substrate structure, comprising a ceramic substrate layer (1), characterized in that: The ceramic substrate layer (1) is provided with a transition metal layer (3) on top, and a reinforcing mechanism (2) is provided between the transition metal layer (3) and the ceramic substrate layer (1). The transition metal layer (3) is provided with a circuit layer (4) on top, and a solder resist layer (5) is provided on top of the circuit layer (4). The ceramic substrate layer (1) has multiple heat dissipation channels (8) inside, and multiple ventilation holes (7) are provided at the bottom of the ceramic substrate layer (1). The ventilation holes (7) at the corresponding positions are connected to the heat dissipation channels (8). Multiple heat dissipation fins (6) are uniformly provided at the bottom of the ceramic substrate layer (1).

2. The multilayer composite high-speed thin-film ceramic substrate structure according to claim 1, characterized in that: The strengthening mechanism (2) includes a plurality of reinforcing strips (201) and V-shaped reinforcing plates (202) located between the ceramic substrate layer (1) and the transition metal layer (3), with the reinforcing strips (201) and V-shaped reinforcing plates (202) arranged alternately.

3. The high-speed thin-film ceramic substrate structure of a multilayer composite according to claim 1, characterized in that: The ceramic substrate layer (1) is made of ceramic material.

4. The multilayer composite high-speed thin-film ceramic substrate structure according to claim 1, characterized in that: The transition metal layer (3) is made of a metal alloy.

5. The multilayer composite high-speed thin-film ceramic substrate structure according to claim 1, characterized in that: The circuit layer (4) is made of a thin metal film.

Images