White pad for wafer rough polishing

By introducing a non-Newtonian fluid layer and a grid-like cavity structure into the wafer polishing pad, the problem of local buffer failure caused by micro-airbag rupture was solved, thereby improving the uniformity of the wafer surface, extending its service life, and optimizing the planarization effect.

CN224390781UActive Publication Date: 2026-06-23ANHUI HECHEN NEW MATERIAL CO LTD
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Patent Information

Application Number
CN202521585522.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-07-29
Publication Date
2026-06-23
Estimated Expiration
2035-07-29

AI Technical Summary

Technical Problem

In actual use, the micro-airbags of existing wafer polishing pads are prone to breakage, leading to localized buffer failure and affecting continuous operation.

Method used

A non-Newtonian fluid layer is introduced into the fluid flow cavity within the polishing pad. The viscosity of the fluid changes with pressure and shear rate to achieve adaptive buffering. It flexibly adheres to the wafer surface under low pressure and forms rigid support under high pressure or high frequency vibration. Combined with the grid-like cavity and nested pads, it forms an encapsulated thin-layer structure to avoid local failure.

Benefits of technology

It improves wafer surface uniformity, reduces localized unplanarization, extends service life, and optimizes global planarization by controlling temperature through a heat dissipation structure.

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Abstract

The utility model discloses a white pad for wafer rough polishing, and belongs to the technical field of polishing pads. A white pad for wafer rough polishing comprises a polishing pad layer, a fluid storage pad is arranged at the upper end of the polishing pad layer, the upper end of the fluid storage pad is connected with a base surface layer in a sealed mode, an integrally-formed fluid flowing cavity is formed in the fluid storage pad, and a non-Newtonian fluid layer is stored in the fluid flowing cavity. The problems that in the actual using process of an existing wafer grinding pad, due to the fact that the micro air bags are damaged, local buffering of the polishing pad fails, and continuous work is affected are solved, in the grinding process of the non-Newtonian fluid layer, the viscosity changes along with pressure and the shearing rate in real time, self-adaptive buffering is achieved, and the service life of the polishing pad is prolonged. And the response speed of reducing the edge collapse of the wafer caused by local stress concentration is higher, and by matching with the action of the grinding particles, local missed polishing can be reduced, and the surface uniformity is improved.
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