A tester structure for semiconductor power devices

Abstract

The utility model discloses a kind of tester structures of semiconductor power device, including base, the right side of base top is equipped with control instrument, the left side of base top is equipped with testing mechanism for realizing the test operation to semiconductor power device, including in the testing mechanism: test component, including the test box of installation in base top left side, the top of test box is equipped with pressure relief valve, test box is electrically connected with control instrument, the utility model relates to semiconductor device test technical field.This semiconductor power device's tester structure, through the quick dismounting of test board of setting dismounting component can be realized, rotating control block can drive dismounting rod and clamping groove clamping or separation, the time of replacing different model test board is shortened to within 30 seconds, to adapt different model semiconductor power device for subsequent test operation quickly, greatly improve test efficiency and equipment compatibility.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device testing technology, specifically to a tester structure for semiconductor power devices. Background Technology

[0002] The reference patent title is: A Semiconductor Power Device (Authorization Announcement No.: CN216671611U, Authorization Announcement Date: 2022.06.03), comprising: a semiconductor power device body, a heat dissipation groove provided on the outer wall of the semiconductor power device body, and a lead core fixed on one side of the semiconductor power device body, a ceramic protective cover placed outside the lead core, and a heat insulation pad fixed on the other side of the lead core. The ceramic protective cover outside the lead core has good insulation and thermal conductivity. With the protection and thermal conductivity of the ceramic, the lead core will not experience current splitting or concentration when current passes through it. Rosin flux is filled between the ceramic protective cover and the lead core. This rosin flux can prevent oxidation of the lead core after current passes through it. Without oxidation, heat release is reduced. Moreover, the rosin flux itself also has the effect of assisting thermal conduction, which also plays a role in heat transfer and dispersion.

[0003] Based on the aforementioned documents, the electrical performance of semiconductor power devices (such as IGBTs, MOSFETs, SiC devices, etc.) is closely related to their operating environment temperature. During device production, testing, and R&D, it is necessary to simulate different temperature conditions for comprehensive testing. In the existing technology, semiconductor power device testers have the following shortcomings: the test socket and the tester are mostly fixedly connected. When different models of devices need to be tested, changing the test socket is cumbersome, requiring the disassembly of multiple fasteners, which is time-consuming and affects testing efficiency; the internal temperature control structure of the test chamber is poorly designed, resulting in poor temperature uniformity and making it difficult to accurately simulate the actual working environment of the device. Therefore, this utility model provides a semiconductor power device tester structure. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a tester structure for semiconductor power devices, solving the problems of cumbersome replacement of test components and insufficient temperature control accuracy in existing testers.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a tester structure for semiconductor power devices, comprising a base, a control instrument mounted on the right side of the top of the base, and a test mechanism provided on the left side of the top of the base for performing test operations on the semiconductor power devices, the test mechanism comprising:

[0006] The testing assembly includes a test box mounted on the top left side of the base. A pressure relief valve is installed on the top of the test box. The test box is electrically connected to a control instrument. A fixing seat is installed at the bottom of the inner cavity of the test box. A symmetrical assembly groove is opened on the top of the fixing seat. A test plate is installed inside the fixing seat through a disassembly and assembly assembly. Multiple sets of mating interfaces are installed on both sides of the test plate. A symmetrical assembly plate is installed at the bottom of the test plate. The surface of the assembly plate is slidably connected to the inner surface of the assembly groove. A snap-fit ​​groove is opened on the surface of the assembly plate.

[0007] The temperature control component is located inside the test chamber and is used to regulate the internal temperature of the test chamber.

[0008] Preferably, the disassembly and assembly assembly includes a control screw rotatably mounted inside the fixed base. One end of the control screw extends through to the outside of the fixed base and is fixedly connected to a control block. A sliding block is threaded onto the surface of the control screw. The two sides of the sliding block are connected to a transmission assembly, which allows the disassembly and assembly rod to slide inside the fixed base. One end of the disassembly and assembly rod engages with the inner surface of the engagement groove.

[0009] Preferably, the transmission assembly includes a transmission rod rotatably mounted on both sides of the sliding block, one end of the transmission rod being rotatably connected to a transmission plate, and one side of the transmission plate being fixedly connected to the other end of the disassembly rod.

[0010] Preferably, a guide rail is installed at the bottom of the inner cavity of the fixed seat, the surface of the guide rail is slidably connected to the bottom of the sliding block, and a symmetrical limiting rail is installed on the inner wall of the fixed seat, the surface of the limiting rail is slidably connected to the inside of the transmission plate.

[0011] Preferably, the temperature control assembly includes heating templates installed on both sides of the inner wall of the test chamber, a temperature sensor installed on the top of the test chamber, and a cooling pipe installed on the rear side of the inner wall of the test chamber. The heating templates are electrically connected to the control instrument.

[0012] Preferably, both ends of the refrigeration pipe extend through to the outside of the test chamber and are fixedly connected to a coolant tank via connecting pipes. The coolant tank is installed inside the base, and a circulation pump and a compressor refrigeration unit are installed inside the coolant tank. The circulation pump is used to drive the coolant to circulate within the refrigeration pipe.

[0013] Beneficial effects

[0014] This invention provides a tester structure for semiconductor power devices. Compared with the prior art, it has the following advantages:

[0015] 1. The structure of this semiconductor power device tester allows for quick loading and unloading of the test board through its assembly and disassembly components. Rotating the control block enables the assembly and disassembly rod to engage or disengage with the slot, reducing the time for changing different models of test boards to less than 30 seconds. This allows for rapid adaptation to different models of semiconductor power devices for subsequent testing operations, significantly improving testing efficiency and equipment compatibility.

[0016] 2. The structure of this semiconductor power device tester, through the inclusion of a temperature control component and a layout design with heating templates on both sides and a cooling pipe on the rear, combined with real-time monitoring by a temperature sensor, enables the internal temperature of the test chamber to be adjusted from -40℃ to 150℃, with a temperature control accuracy of ±1℃. This meets the testing requirements under different temperature environments. The pressure relief valve installed on the top of the test chamber can automatically balance the air pressure inside the chamber, preventing damage to the equipment due to excessive air pressure caused by drastic temperature changes, thus improving the safety and service life of the tester. Attached Figure Description

[0017] Figure 1 This is a three-dimensional schematic diagram of the external structure of this utility model;

[0018] Figure 2 This is a three-dimensional schematic diagram of the internal structure of the test box of this utility model;

[0019] Figure 3 This is a schematic diagram of the internal structure of the fixing base of this utility model;

[0020] Figure 4 This is a three-dimensional schematic diagram of the test component of this utility model.

[0021] In the diagram: 1-Base, 2-Control instrument, 3-Testing mechanism, 31-Testing component, 311-Test box, 312-Pressure relief valve, 313-Fixed seat, 314-Assembly slot, 315-Test plate, 316-Assembly plate, 317-Snap-fit ​​slot, 32-Temperature control component, 321-Heating template, 322-Temperature sensor, 323-Refrigeration pipe, 4-Disassembly and assembly component, 41-Control screw, 42-Control block, 43-Sliding block, 44-Transmission component, 441-Transmission rod, 442-Transmission plate, 45-Disassembly and assembly rod, 5-Guide slide rail, 6-Limit slide rail. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4 This utility model provides a technical solution:

[0024] A tester structure for a semiconductor power device includes a base 1, a control instrument 2 mounted on the right side of the top of the base 1, and a test mechanism 3 located on the left side of the top of the base 1 for performing test operations on the semiconductor power device. The test mechanism 3 includes:

[0025] The test assembly 31 includes a test box 311 installed on the top left side of the base 1. A pressure relief valve 312 is installed on the top of the test box 311. The test box 311 is electrically connected to the control instrument 2. A fixed seat 313 is installed at the bottom of the inner cavity of the test box 311. A symmetrical assembly groove 314 is opened on the top of the fixed seat 313. A test plate 315 is installed inside the fixed seat 313 through the disassembly and assembly assembly 4. Multiple sets of mating interfaces are installed on both sides of the test plate 315. A symmetrical assembly plate 316 is installed at the bottom of the test plate 315. The surface of the assembly plate 316 is slidably connected to the inner surface of the assembly groove 314. A snap-fit ​​groove 317 is opened on the surface of the assembly plate 316.

[0026] Temperature control component 32 is located inside test chamber 311 and is used to regulate the internal temperature of test chamber 311.

[0027] The control instrument 2 includes a touch screen and an embedded control system, which can send control commands to the heating template 321 and the cooling pipe 323, and receive feedback data from the temperature sensor 322 and the test board 314.

[0028] The inner wall of the test chamber 311 is equipped with a heat insulation layer, and the preset opening pressure of the pressure relief valve 312 is 1.05-1.1 standard atmospheres;

[0029] The front of the test chamber 311 is equipped with a sealed door, which is surrounded by high-temperature resistant silicone sealing rings. The sealed door is fitted with double-layered tempered glass.

[0030] Test board 315: The substrate is FR-4 epoxy resin board with a thickness of 5mm, and the surface is covered with a 2mm thick polytetrafluoroethylene insulating layer. The top test hole has a diameter of 1-3mm and the spacing is customized according to the device pins. The built-in gold-plated beryllium copper probe has an elastic stroke of 0.5mm and a contact resistance of ≤5mΩ to ensure reliable conduction with the device pins.

[0031] In this embodiment, the disassembly and assembly assembly 4 includes a control screw 41 rotatably installed inside the fixed base 313. One end of the control screw 41 extends through to the outside of the fixed base 313 and is fixedly connected to a control block 42. A sliding block 43 is threadedly connected to the surface of the control screw 41. The two sides of the sliding block 43 are connected to the transmission assembly 44 so that the disassembly and assembly rod 45 slides inside the fixed base 313. One end of the disassembly and assembly rod 45 is engaged with the inner surface of the locking groove 317.

[0032] In this embodiment, the transmission assembly 44 includes a transmission rod 441 rotatably mounted on both sides of the sliding block 43. One end of the transmission rod 441 is rotatably connected to a transmission plate 442, and one side of the transmission plate 442 is fixedly connected to the other end of the disassembly rod 45.

[0033] The disassembly and assembly component 4 enables quick loading and unloading of the test board 315. Rotating the control block 42 will cause the disassembly and assembly rod 45 to engage or disengage from the slot 317, reducing the time to replace different models of test boards 315 to less than 30 seconds. This allows for rapid adaptation to different models of semiconductor power devices for subsequent testing operations, significantly improving testing efficiency and equipment compatibility.

[0034] In this embodiment, a guide rail 5 is installed at the bottom of the inner cavity of the fixed base 313. The surface of the guide rail 5 is slidably connected to the bottom of the sliding block 43. A symmetrical limiting rail 6 is installed on the inner wall of the fixed base 313. The surface of the limiting rail 6 is slidably connected to the inside of the transmission plate 442.

[0035] The transmission plate 442 can be slidably limited by the limiting slide rail 6; the sliding block 43 can be slidably limited by the guide slide rail 5.

[0036] In this embodiment, the temperature control component 32 includes a heating template 321 installed on both sides of the inner wall of the test chamber 311, a temperature sensor 322 installed on the top of the test chamber 311, and a cooling pipe 323 installed on the rear side of the inner wall of the test chamber 311. The heating template 321 is electrically connected to the control instrument 2.

[0037] Temperature sensor 322: It adopts a PT1000 platinum resistance thermometer, which is encapsulated in a stainless steel probe and connected to the control instrument through a four-wire system to eliminate lead resistance error.

[0038] In this embodiment, both ends of the cooling pipe 323 extend through to the outside of the test chamber 311 and are fixedly connected to the coolant tank through connecting pipes. The coolant tank is installed inside the base 1. A circulation pump and a compressor refrigeration unit are installed inside the coolant tank. The circulation pump is used to drive the coolant to circulate in the cooling pipe 323.

[0039] External coolant tank: capacity 5-10L, built-in compressor refrigeration unit such as a small refrigerator compressor, cooling capacity 500-800W.

[0040] By incorporating a temperature control component 32 and employing a layout design with heating templates 321 on both sides and a cooling pipe 323 on the rear, combined with real-time monitoring by a temperature sensor 322, the internal temperature adjustment range of the test chamber 311 can reach -40℃ to 150℃, with a temperature control accuracy of ±1℃. This meets the testing requirements under different temperature environments. The pressure relief valve 312 installed on the top of the test chamber 311 can automatically balance the air pressure inside the chamber, preventing damage to the equipment due to excessive air pressure caused by drastic temperature changes, thus improving the safety and service life of the tester.

[0041] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0042] During operation, when the test board 315 needs to be installed, the mounting plate 316 at the bottom of the test board 315 is aligned with the mounting groove 314 and slid in. Rotating the control block 42 causes the control screw 41 to rotate, moving the sliding block 43 on the surface of the guide rail 5 at the bottom of the inner cavity of the fixed seat 313. This causes the transmission rod 441 to move, pushing the transmission plates 442 on both sides outward along the limit rail 6. This, in turn, causes the disassembly rod 45 to insert into the snap-fit ​​groove 317 on the mounting plate 316, thus fixing the test board 315. For disassembly, rotating the control block 42 in the opposite direction will move the disassembly rod 45. Remove the card slot 317 to facilitate the replacement of the test board 315. After the test board 315 is installed, insert the contact terminal of the semiconductor power device to be tested into the test hole at the top of the test board 315 to form an electrical connection. Then close the door of the test box 311 and input the test parameters through the touch screen of the control instrument 2, including the target temperature such as -40℃, 25℃, 125℃, the test voltage range such as 0-1000V, the test duration, etc. After clicking "Start Test", the control instrument 2 sends a command to the control module in the test box 311 to trigger the temperature control component 32 and the test circuit to start.

[0043] In the temperature control component 32, the heating templates 321 on both sides of the inner wall of the test chamber 311 are graphene heating sheets, which are connected to the control instrument 2 through wires. The temperature sensor 322 on the top of the test chamber 311 is a PT platinum resistance thermometer, which can detect the temperature inside the test chamber 311 in real time. The cooling pipe 323 on the rear side of the inner wall of the test chamber 311 is a serpentine copper pipe, whose two ends pass through the test chamber 311 and are connected to the external coolant circulation system. The cooling is achieved by driving the coolant to flow through the circulation pump. The heating templates 321 and the cooling pipe 323 work together. Under the feedback of the temperature sensor 322, the temperature control module in the control instrument 2 automatically adjusts to achieve precise control of the internal temperature of the test chamber 311.

[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A tester structure for semiconductor power devices, comprising a base (1), characterized in that: A control instrument (2) is installed on the right side of the top of the base (1), and a test mechanism (3) is provided on the left side of the top of the base (1) for performing test operations on semiconductor power devices. The test mechanism (3) includes a test component (31), including a test box (311) installed on the left side of the top of the base (1). A pressure relief valve (312) is installed on the top of the test box (311). The test box (311) is electrically connected to the control instrument (2). A fixing seat (313) is installed at the bottom of the inner cavity of the test box (311). The top of the fixing seat (313) has an opening. A symmetrical assembly slot (314) is provided. Inside the fixed base (313), a test plate (315) is installed via a disassembly assembly (4). Multiple sets of mating interfaces are installed on both sides of the test plate (315). A symmetrical assembly plate (316) is installed at the bottom of the test plate (315). The surface of the assembly plate (316) is slidably connected to the inner surface of the assembly slot (314). A snap-fit ​​groove (317) is provided on the surface of the assembly plate (316). A temperature control assembly (32) is provided inside the test chamber (311) to regulate the temperature inside the test chamber (311).

2. The structure of a tester for a semiconductor power device according to claim 1, characterized in that: The disassembly assembly (4) includes a control screw (41) rotatably mounted inside the fixed base (313). One end of the control screw (41) extends through to the outside of the fixed base (313) and is fixedly connected to a control block (42). A sliding block (43) is threaded onto the surface of the control screw (41). The two sides of the sliding block (43) are connected to a transmission assembly (44) so ​​that the disassembly rod (45) slides inside the fixed base (313). One end of the disassembly rod (45) engages with the inner surface of the snap-fit ​​groove (317).

3. The structure of a tester for a semiconductor power device according to claim 2, characterized in that: The transmission assembly (44) includes a transmission rod (441) rotatably mounted on both sides of the sliding block (43). One end of the transmission rod (441) is rotatably connected to a transmission plate (442), and one side of the transmission plate (442) is fixedly connected to the other end of the disassembly rod (45).

4. The structure of a tester for a semiconductor power device according to claim 3, characterized in that: The bottom of the inner cavity of the fixed seat (313) is equipped with a guide slide rail (5), the surface of the guide slide rail (5) is slidably connected to the bottom of the sliding block (43), and the inner wall of the fixed seat (313) is equipped with a symmetrical limiting slide rail (6), the surface of the limiting slide rail (6) is slidably connected to the inside of the transmission plate (442).

5. The structure of a tester for a semiconductor power device according to claim 1, characterized in that: The temperature control assembly (32) includes heating templates (321) installed on both sides of the inner wall of the test chamber (311), a temperature sensor (322) installed on the top of the test chamber (311), and a cooling pipe (323) installed on the rear side of the inner wall of the test chamber (311).

6. The structure of a tester for a semiconductor power device according to claim 5, characterized in that: The two ends of the refrigeration pipe (323) extend through to the outside of the test box (311) and are fixedly connected to the coolant tank through the connecting pipe. The coolant tank is installed inside the base (1). The coolant tank is equipped with a circulation pump and a compressor refrigeration unit. The circulation pump is used to drive the coolant to circulate in the refrigeration pipe (323).

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