A cooling vest for data storage

Abstract

The utility model discloses a kind of heat dissipation waistcoat for data storage, the heat dissipation waistcoat includes fixed base, metal heat dissipation bottom plate, metal heat dissipation seat and multiple groups of heat dissipation structure. Fixed base is set below data storage, is U-shaped groove structure, slot wall is provided with air hole, inside is equipped with telescopic link and support spring, to support and fix metal heat dissipation bottom plate. Heat dissipation bottom plate is pasted with the lower surface of data storage by heat conduction pad, and is equipped with vertical heat dissipation fin, forms air duct with the direction consistent with air hole. The upper surface of data storage is set metal heat dissipation seat, heat dissipation seat is pasted with storage by heat conduction pad, heat dissipation seat has fin group on and cooperates heat conduction copper pipe, improves overall heat dissipation efficiency. The present application can effectively improve the heat dissipation performance of data storage under high load operation, reduce temperature rise, improve system stability and service life.

Description

Technical Field

[0001] This utility model relates to a heat dissipation cover for a data storage device. Background Technology

[0002] With the continuous increase in the capacity and speed of data storage, its power consumption and heat generation have increased significantly. Especially in applications such as high-performance computing, servers, and gaming consoles, storage devices are prone to overheating during prolonged high-frequency operation. Traditional heat dissipation methods mainly rely on single-sided heat sinks or thermal pads, which have limited heat dissipation paths and insufficient efficiency, often failing to meet the demands of high-power storage devices and easily leading to decreased device stability or even hardware damage. Therefore, there is an urgent need for a well-structured heat dissipation device with significant heat dissipation effects to ensure the normal operation of data storage devices. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a heat dissipation cover for data storage.

[0004] A heatsink for a data storage device includes a strip-shaped PCB board. One end of the PCB board has gold fingers that connect to a hard drive socket on the motherboard. The other end of the PCB board has a semi-circular hole that connects to a copper pillar on the motherboard via screws. The heatsink includes a mounting base positioned below the data storage device. The mounting base is a U-shaped groove with several evenly distributed rectangular ventilation holes on its sidewalls. Several vertical telescopic rods are located within the groove, with their tops connected to a metal heatsink base. The upper surface of the metal heatsink base is connected to the data storage device via a thermal pad. The lower surface is fitted with a metal heat sink base plate. A support spring is provided between the metal heat sink base plate and the bottom of the slot to provide support for the metal heat sink base plate. The support spring is sleeved on the outside of the telescopic rod. Several vertically arranged heat sink fins are arranged on the lower surface of the metal heat sink base plate. The gaps between the heat sink fins form heat dissipation channels. The direction of the heat dissipation channels is consistent with the direction of the ventilation holes on the side wall of the slot. A metal heat sink base is provided above the data storage device. The lower surface of the metal heat sink base is fitted with the upper surface of the data storage device through a thermal pad. Several fin groups are provided on the metal heat sink base. Thermal conductive copper pipes are provided between the fin groups. Threaded holes are provided on the side of the metal heat sink base. The metal heat sink base is connected to the elongated hole on the fixed base by screws.

[0005] As a further improvement, the heat-conducting copper pipe has a hollow structure and a heat-conducting medium can flow inside. The heat-conducting copper pipe can be connected to the circulating cooling water circuit. The hollow structure and the flow of the medium allow it to work with the water cooling system, significantly improving heat dissipation efficiency and making it suitable for high-end servers or overclocking scenarios.

[0006] As a further improvement, the metal heat sink is provided with a metal decorative panel on the outside. The metal decorative panel enhances the appearance quality, while protecting the heat sink from external mechanical damage and strengthening the structure.

[0007] As a further improvement, the telescopic rod is constructed of nested metal tubes with an anti-detachment structure at the joint. The telescopic rod uses a sleeved tube with an anti-detachment structure to improve reliability and prevent loosening and displacement during long-term use.

[0008] As a further improvement, the metal heat sink and metal heat sink base are made of copper or aluminum, and the heat sink components are made of copper or aluminum, taking into account both thermal conductivity and manufacturing cost, to meet different application needs.

[0009] As a further improvement, the thermal pad is a silicone pad or a phase change thermal pad. The thermal pad uses silicone or phase change material to improve the interface thermal conductivity and ensure stability under different usage environments.

[0010] Beneficial effects:

[0011] Double-sided heat dissipation design: The memory is held between the metal heat dissipation base plate and the metal heat dissipation seat, forming a double-sided heat dissipation path, which greatly improves heat dissipation efficiency.

[0012] Airflow optimization: The bottom plate fins and the ventilation holes on the tank wall are aligned in the same direction, which helps to form effective convection and enhance the air heat dissipation effect.

[0013] Adaptive structure: The telescopic rod and support spring give the base plate elastic support, ensuring a tight fit and improving heat conduction.

[0014] High-efficiency heat conduction: It can be used with heat-conducting copper pipes and circulating cooling media to adapt to water cooling systems and further reduce the temperature.

[0015] Material advantages: Copper or aluminum heat dissipation elements combined with silicone or phase change thermal pads balance thermal conductivity and cost control.

[0016] Appearance and Protection: Metal decorative panels enhance the overall aesthetics and protect the internal structure. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of a heat dissipation jacket used for data storage.

[0018] Figure 2 This is an assembly drawing of a heat sink for a data storage device;

[0019] Figure 3 This is a cross-sectional view of a heat dissipation jacket used for data storage.

[0020] 1. Data storage device 2. Hard disk socket 3. Copper pillar 4. Fixing base 5. Ventilation hole 6. Telescopic rod 7. Metal heat sink base 8. Thermal pad 9. Support spring 10. Heat sink 11. Metal heat sink base 12. Fin assembly 13. Thermal copper pipe Detailed Implementation

[0021] To enhance understanding of this utility model, the present utility model will be further described in detail below with reference to the embodiments and accompanying drawings. These embodiments are only used to explain the present utility model and do not constitute a limitation on the scope of protection of the present utility model.

[0022] like Figures 1-3 As shown, a heat sink for a data storage device includes a data storage device 1, a hard disk socket 2, a copper pillar 3, a fixed base 4, a ventilation hole 5, a telescopic rod 6, a metal heat sink base 7, a thermal pad 8, a support spring 9, heat sink fins 10, a metal heat sink seat 11, a fin assembly 12, and a thermally conductive copper pipe 13.

[0023] A heat sink for a data storage device includes a base 4, which is positioned below the data storage device 1 and has a U-shaped cross-section. Rectangular ventilation holes 5 are evenly spaced on the sidewalls of the slot, and several telescopic rods 6 are installed inside. The tops of the telescopic rods 6 are connected to a metal heat sink base 7. The metal heat sink base 7 is bonded to the lower surface of the data storage device 1 via a thermal pad 8. Vertical heat dissipation fins 10 are provided on the lower surface of the metal heat sink base 7, forming heat dissipation channels between adjacent fins 10. Support springs 9 are sleeved on the outside of the telescopic rods 6 to provide elastic support for the base plate.

[0024] A metal heat sink 11 is installed above the data storage device 1, and it is attached to the upper surface of the storage device via a thermal pad 8. Multiple fin groups 12 are arranged on the outer surface of the heat sink, and heat-conducting copper pipes 13 are embedded between the fin groups 12. Coolant can flow into the copper pipes to improve heat dissipation performance. Threaded holes are provided on the side of the heat sink, which mate with the elongated holes of the fixing base 4, and are secured with screws for stable installation.

[0025] In addition, the heat sink can be covered with a metal decorative panel to enhance its appearance and strength; the telescopic rod 6 adopts a socket-type metal round tube and has an anti-detachment structure at the connection to prevent displacement or loosening. In terms of materials, the heat sink and heat sink base can be made of copper or aluminum, and the thermal pad 8 can be made of silicone or phase change material to ensure heat transfer efficiency.

[0026] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heatsink for a data storage device, the data storage device comprising a strip-shaped PCB board, one end of the PCB board having gold fingers connected to a hard drive socket on a motherboard, and the other end of the PCB board having a semi-circular hole connected to a copper pillar on the motherboard by screws, characterized in that... The heat dissipation heat sink includes a fixed base located below the data storage device. The fixed base is a U-shaped groove with several evenly distributed rectangular ventilation holes on its sidewalls. Several vertical telescopic rods are located inside the groove, with the tops of the telescopic rods connected to a metal heat dissipation base plate. The upper surface of the metal heat dissipation base plate is attached to the lower surface of the data storage device via a thermal pad. A support spring is provided between the metal heat dissipation base plate and the bottom of the groove to provide support for the metal heat dissipation base plate. The support spring is sleeved on the outside of the telescopic rods. Several vertically arranged heat dissipation fins are located on the lower surface of the metal heat dissipation base plate, with the gaps between the heat dissipation fins forming a heat dissipation channel. The direction of the heat dissipation channel is consistent with the direction of the ventilation holes on the sidewalls of the groove. A metal heat sink is located above the data storage device, with its lower surface attached to the upper surface of the data storage device via a thermal pad. The metal heat sink has several fin groups, with thermally conductive copper pipes between the fin groups. The side of the metal heat sink has threaded holes, and the metal heat sink is connected to the elongated hole on the fixed base via screws.

2. The heat dissipation heat shield for a data storage device according to claim 1, characterized in that, The heat-conducting copper pipe has a hollow structure and can allow heat-conducting medium to flow inside. The heat-conducting copper pipe can be connected to the circulating cooling water circuit.

3. A heat dissipation jacket for a data storage device according to claim 1, characterized in that, The metal heat sink is provided with a metal decorative panel on the outside.

4. A heat dissipation heat sink for a data storage device according to claim 1, characterized in that, The telescopic rod is constructed of nested metal tubes, with an anti-detachment structure at the joint of the metal tubes.

5. A heat dissipation heat sink for a data storage device according to claim 1, characterized in that, The metal heat sink and the metal heat sink base are made of copper or aluminum.

6. A heat dissipation heat sink for a data storage device according to claim 1, characterized in that, The thermal pad is a silicone pad or a phase change thermal pad.

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