Monitor and its implantable sensor

Abstract

The application discloses a monitoring instrument and an implantable sensor thereof. The monitoring instrument comprises a housing assembly, an implantable sensor, a guide needle and a circuit board assembly. The implantable sensor is connected with the housing assembly, the guide needle is arranged in the housing assembly and is used for driving at least part of the implantable sensor to be inserted into a human body. The circuit board assembly is arranged in the housing assembly and is signal-connected with the implantable sensor. The implantable sensor comprises a conductive layer, an insulating layer and a sacrificial layer, and the conductive layer and the insulating layer are arranged alternately. The implantable sensor has a connecting area connected with the housing assembly, and the sacrificial layer is arranged in a laminated mode in the connecting area. When the implantable sensor is subjected to an acting force due to human body activities or the like, the sacrificial layer is used for being damaged by the acting force at a position adjacent to the conductive layer and the insulating layer under the action of the external force, thereby playing a role of protecting the conductive layer and reducing the probability of affecting signal transmission due to the fracture of the conductive layer.

Description

Technical Field

[0001] This application relates to the field of implantable blood glucose monitoring technology, specifically to a monitor and its implantable sensor. Background Technology

[0002] Diabetes can lead to numerous complications such as coma, poisoning, neuropathy, and cardiovascular disease. Therefore, diabetic patients need to know whether their glucose levels are within a safe range. However, traditional measurement methods are cumbersome, involve deep incisions, cause significant pain, and can only measure a single value, making it impossible for diabetic patients to understand their glucose levels in real time. To enable diabetic patients to understand their glucose levels in real time, some choose to use monitoring devices with implantable sensors. At least part of the implantable sensor is implanted in the body and comes into contact with bodily fluids.

[0003] However, during use, the signals from the implanted sensors in existing monitoring devices may exhibit scattered points and disconnections, thus requiring improvement. Utility Model Content

[0004] The main technical problem this invention addresses is that, during the use of existing monitoring instruments, the signals from implanted sensors may exhibit scattered points and disconnections.

[0005] In a first aspect, one embodiment provides a monitoring device, comprising:

[0006] Housing assembly;

[0007] An implantable sensor, wherein the implantable sensor is connected to the housing assembly;

[0008] A guide needle is disposed in the housing assembly and is used to drive at least a portion of the implantable sensor into the human body so that the implantable sensor comes into contact with bodily fluids;

[0009] and a circuit board assembly disposed on the housing assembly, the circuit board assembly being signal-connected to the implanted sensor;

[0010] The implantable sensor includes a conductive layer, an insulating layer, and a sacrificial layer, with the conductive layer and the insulating layer alternately disposed. The conductive layer is used to transmit electrical signals, and the insulating layer is used to insulate the conductive layer.

[0011] The implantable sensor has a connection area that connects to the housing assembly. A sacrificial layer is disposed in the connection area. The sacrificial layer is designed to be destroyed by an external force before the adjacent position of the conductive layer and the insulating layer, thereby protecting the conductive layer.

[0012] In one embodiment, the implantable sensor includes a first part and a second part. The first part is used to connect to the housing assembly. One end of the second part is connected to the first part, and the other end is used to be inserted into the human body. The second part is bent and disposed on the first part. The connection area is located at the position adjacent to the first part and the second part, and the shape of the sacrificial layer is adapted to the connection area.

[0013] In one embodiment, the base layer further includes a base layer comprising a first side and a second side disposed opposite to each other, the conductive layer comprising a first conductive layer, the insulating layer comprising a first insulating layer, and the first conductive layer, the first insulating layer and the sacrificial layer being sequentially stacked on the first side of the base layer in a direction away from the base layer.

[0014] In one embodiment, the conductive layer further includes a second conductive layer and a third conductive layer, and the insulating layer further includes a second insulating layer and a third insulating layer. The second conductive layer, the second insulating layer, the third conductive layer, and the third insulating layer are sequentially stacked on the second side of the substrate in a direction away from the substrate.

[0015] In one embodiment, the sacrificial layer is configured as a single-layer structure.

[0016] In one embodiment, the sacrificial layer is configured as a multi-layered structure stacked together.

[0017] In one embodiment, the sacrificial layer includes a conductive material layer and / or an insulating material layer, wherein the conductive material layer of the sacrificial layer is used for non-electrical signal transmission functions.

[0018] In one embodiment, a fastening layer is provided between the conductive layer and the insulating layer, the fastening layer being used to enhance the adhesion between the conductive layer and the insulating layer.

[0019] In one embodiment, the housing assembly has a mounting slot, the implantable sensor is connected to the mounting slot, and at least a portion of the connection area is located within the mounting slot;

[0020] The housing assembly includes a first housing and a second housing, the first housing being connected to the second housing and the second housing being oriented toward a human body; the circuit board assembly is disposed between the first housing and the second housing, and the mounting groove is located in the second housing; the mounting groove is filled with an adhesive block, and at least a portion of the sacrificial layer is bonded to the adhesive block.

[0021] In a second aspect, one embodiment provides an implantable sensor including a conductive layer, an insulating layer, and a sacrificial layer, wherein the conductive layer and the insulating layer are alternately disposed, the conductive layer is used to transmit electrical signals, and the insulating layer is used to insulate the conductive layer; the implantable sensor has a connection area for connection with a housing assembly, the sacrificial layer is disposed in the connection area, and the sacrificial layer is used to be destroyed by the force before the adjacent positions of the conductive layer and the insulating layer under the action of external force, so as to protect the conductive layer.

[0022] According to the monitoring device and its implantable sensor of the above embodiments, the monitoring device includes a housing assembly, an implantable sensor, a guide needle, and a circuit board assembly. The implantable sensor is connected to the housing assembly, and the guide needle is also connected to the housing assembly. The guide needle is used to drive at least a portion of the implantable sensor into the human body, so that the implantable sensor comes into contact with bodily fluids. The circuit board assembly is connected to the housing assembly and is signal-connected to the implantable sensor. The implantable sensor includes a conductive layer, an insulating layer, and a sacrificial layer, with the conductive and insulating layers alternately disposed. The conductive layer is used to transmit electrical signals, and the insulating layer is used to insulate the conductive layer. The implantable sensor has a connection area connected to the housing assembly. The sacrificial layer is stacked in the connection area and is used to protect the conductive layer by being destroyed by the force applied before the adjacent positions of the conductive and insulating layers under the action of external force. When using the monitoring device, at least a portion of the implantable sensor is inserted into the human body, so that the implantable sensor comes into contact with bodily fluids, and the corresponding detection signal is transmitted to the circuit board assembly through the conductive layer. When an implanted sensor is subjected to force due to human activity or other reasons, the sacrificial layer is destroyed at the adjacent position of the conductive layer and the insulating layer before the force is applied, thereby absorbing the force and reducing the force transmitted to the conductive layer. This protects the conductive layer, reduces the probability of signal transmission being affected by the breakage of the conductive layer, and thus reduces the occurrence of signal scattering and disconnection. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the monitoring instrument in one embodiment of this application;

[0024] Figure 2 This is an exploded view of the monitor in one embodiment of this application;

[0025] Figure 3 This is a schematic diagram of the structure of an implantable sensor installed in a second housing from a first perspective in one embodiment of this application;

[0026] Figure 4 This is an exploded view of an implanted sensor and a second housing in one embodiment of this application;

[0027] Figure 5 This is a schematic diagram of the structure of an implantable sensor installed in a second housing from a second perspective in one embodiment of this application;

[0028] Figure 6 This is a schematic diagram of the structure of an implantable sensor installed in the second housing from a third perspective in one embodiment of this application;

[0029] Figure 7 This is a schematic diagram of the structure of an implantable sensor installed in the second housing from a fourth perspective in one embodiment of this application;

[0030] Figure 8 This is a schematic diagram of the structure of an implanted sensor from a first perspective in one embodiment of this application;

[0031] Figure 9 This is a schematic diagram of the structure of an implanted sensor from a second perspective in one embodiment of this application;

[0032] Figure 10 This is a schematic diagram of the structure of an implanted sensor from a third perspective in one embodiment of this application;

[0033] Figure 11 This is a schematic diagram of the structure of an implanted sensor from a fourth perspective in one embodiment of this application;

[0034] Figure 12 For this application Figure 11 Enlarged view of point A in the middle;

[0035] Reference numerals: 100, housing assembly; 110, first housing; 120, second housing; 130, mounting groove; 200, implantable sensor; 210, base layer; 211, first side; 212, second side; 220, conductive layer; 221, first conductive layer; 222, second conductive layer; 223, third conductive layer; 230, insulating layer; 231, first insulating layer; 232, second insulating layer; 233, third insulating layer; 240, sacrificial layer; 241, conductive material layer; 242, insulating material layer; 250, first part; 260, second part; 300, guide pin; 400, circuit board assembly; 500, adhesive; 600, cap post; 700, sealing plug. Detailed Implementation

[0036] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0037] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0038] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0039] This embodiment provides a monitoring instrument.

[0040] Please refer to Figure 1-12 The monitor includes a housing assembly 100, an implantable sensor 200, a guide needle 300, and a circuit board assembly 400.

[0041] Please refer to Figure 1-3In sections 8-12, the implantable sensor 200 is connected to the housing assembly 100. A guide needle 300 is disposed in the housing assembly 100 and is used to guide at least a portion of the implantable sensor 200 into the human body so that the implantable sensor 200 comes into contact with bodily fluids. A circuit board assembly 400 is disposed in the housing assembly 100 and is signal-connected to the implantable sensor 200. The implantable sensor 200 includes a conductive layer 220, an insulating layer 230, and a sacrificial layer 240. The conductive layer 220 and the insulating layer 230 are alternately disposed. The conductive layer 220 is used to transmit electrical signals, and the insulating layer 230 is used to insulate the conductive layer 220. The implantable sensor 200 has a connection area connected to the housing assembly 100. The sacrificial layer 240 is disposed in the connection area and is used to protect the conductive layer 220 by being destroyed by the force applied before the adjacent position of the conductive layer 220 and the insulating layer 230 under the action of external force.

[0042] When using the monitor, at least a portion of the implantable sensor 200 is inserted into the human body via the guide needle 300, allowing the implantable sensor 200 to come into contact with bodily fluids and transmit the corresponding detection signal to the circuit board assembly 400 through the conductive layer 220. When the implantable sensor 200 is subjected to force due to human activity, the sacrificial layer 240 is damaged before the adjacent position of the conductive layer 220 and the insulating layer 230, thereby absorbing the force and reducing the force transmitted to the conductive layer 220. This protects the conductive layer 220, reduces the probability of signal transmission being affected by the breakage of the conductive layer 220, and thus reduces the occurrence of signal scattering and disconnection.

[0043] Please refer to Figure 1-3 Regarding points 8-12, it should be noted that during the development of this product, the inventor discovered that the monitoring instrument's signal exhibited scattered points and disconnections, and that other similar products on the market also showed this phenomenon to varying degrees during experiments. The inventor then analyzed this phenomenon and deduced the following principle underlying its occurrence.

[0044] The principle behind this phenomenon is as follows: The implantable sensor 200 needs to be fixed with UV glue. During the process of fixing the implantable sensor 200 with UV glue, the UV glue will shrink, causing the part of the implantable sensor 200 in contact with the glue to be subjected to outward tensile stress. Therefore, the part of the implantable sensor 200 implanted in the human body will bend back and forth slightly due to human movement. This process will cause the conductive layer 220 used for electrical signal transmission to tear (the interlayer bonding force is limited).

[0045] In this embodiment, a sacrificial layer 240 with weaker adhesion is printed on the local area of ​​the implantable sensor 200 where the force is greater. If the printed sacrificial layer 240 is torn, it will not affect the original performance of the implantable sensor 200, and it can also weaken the force of the conductive layer 220 that transmits signals, so as to protect the conductive layer 220. In other words, the sacrificial layer 240 can also be understood as a kind of "protective layer".

[0046] Please refer to Figure 8-12 Specifically, the sacrificial layer 240 can be formed by local spraying or local immersion, or it can be manufactured by processes such as magnetron sputtering, 3D printing, photolithography, or laser direct writing. The insulating layer 230 can be made of PET, epoxy resin, PI, PU, ​​PP, or PC, and the conductive layer 220 can be made of metal, carbon, graphene, or composite conductive materials.

[0047] Of course, other methods can also be used to protect the conductive layer 220. For example, silicone adhesive (which has low hardness after curing and is less prone to the above-mentioned tearing phenomenon), UV adhesive with low hardness after curing expansion, materials with stronger adhesion for the conductive layer 220 and the insulating layer 230, and adding a non-functional layer (fastening layer) with stronger adhesion between the conductive layer 220 and the insulating layer 230, etc.

[0048] Please refer to Figure 1-3 In one embodiment, as described in 8-12, the implantable sensor 200 includes a first portion 250 and a second portion 260. The first portion 250 is for connection to the housing assembly 100. One end of the second portion 260 is connected to the first portion 250, and the other end is for insertion into the human body. The second portion 260 is bent and disposed within the first portion 250. A connection region is located adjacent to the first portion 250 and the second portion 260, and the shape of the sacrificial layer 240 is adapted to the connection region.

[0049] Since the adjacent positions of the first portion 250 and the second portion 260 are typically used for connection with the mounting slot 130 of the housing assembly 100, when the implanted sensor 200 is subjected to force due to human activity, significant stress is easily generated at these positions, increasing the probability of tearing of the conductive layer 220. The connection area, located at the adjacent positions of the first portion 250 and the second portion 260, allows the sacrificial layer 240 to cover these adjacent positions, enabling the sacrificial layer 240 to more easily absorb the aforementioned stress and thus better protect the conductive layer 220. It is understood that the shapes of the sacrificial layer 240 and the connection area can be flexibly set according to the actual design requirements of the implanted sensor 200.

[0050] Please refer to Figure 1-3In one embodiment, as shown in 8-12, the monitor further includes a base layer 210, which includes a first side 211 and a second side 212 disposed opposite to each other. A conductive layer 220 includes a first conductive layer 221, and an insulating layer 230 includes a first insulating layer 231. The first conductive layer 221, the first insulating layer 231, and the sacrificial layer 240 are sequentially stacked on the first side 211 of the base layer 210 in a direction away from the base layer 210.

[0051] When the monitoring instrument is working, signals are transmitted through the first conductive layer 221, and the first insulating layer 231 insulates the first conductive layer 221 from the external environment. The sacrificial layer 240 absorbs the force by being damaged by the applied force, thereby weakening the force transmitted to the first conductive layer 221 and thus protecting the first conductive layer 221. It can be understood that, in one embodiment, the base layer 210, from a functional classification perspective, can also be regarded as a type of insulating layer 230, serving an insulating function.

[0052] Please refer to Figure 1-3 In one embodiment, as shown in 8-12, the conductive layer 220 further includes a second conductive layer 222 and a third conductive layer 223, and the insulating layer 230 further includes a second insulating layer 232 and a third insulating layer 233. The second conductive layer 222, the second insulating layer 232, the third conductive layer 223 and the third insulating layer 233 are sequentially stacked on the second side 212 of the base layer 210 in a direction away from the base layer 210.

[0053] When the monitoring instrument is working, signals are transmitted through the second conductive layer 222 and the third conductive layer 223. The second insulating layer 232 insulates the second conductive layer 222 from the third conductive layer 223, and the third insulating layer 233 insulates the third conductive layer 223 from the external environment. It is understood that, depending on actual needs, a sacrificial layer 240 may also be provided on the second insulating layer 232 and / or the third insulating layer 233 to protect the second conductive layer 222 and / or the third conductive layer 223.

[0054] Please refer to Figure 8-10 In one embodiment, the sacrificial layer 240 is configured as a single-layer structure.

[0055] The force is weakened by destroying the single-layer sacrificial layer 240, thereby protecting the conductive layer 220. Specifically, the single-layer conductive layer 220 can be an insulating material layer 242 or a conductive material layer 241. When the single-layer conductive layer 220 is configured as a conductive material layer 241, the conductive material layer 241 does not serve to transmit signals, and destruction of the conductive material layer 241 does not affect the signal transmission of the implanted sensor 200.

[0056] Please refer to Figure 8-12 In one embodiment, the sacrificial layer 240 is configured as a multi-layered structure with stacked layers.

[0057] The force is weakened by damaging the multiple sacrificial layers 240, thereby protecting the conductive layer 220. For example, the sacrificial layer 240 may include a conductive material layer 241 and an insulating material layer 242 stacked sequentially. Furthermore, the conductive material layer 241 does not serve to transmit signals, and damage to this conductive material layer 241 does not affect the signal transmission of the implanted sensor 200.

[0058] Please refer to Figure 1-3 In one embodiment, as described in 8-12, the sacrificial layer 240 includes a conductive material layer 241 and / or an insulating material layer 242, wherein the conductive material layer 241 of the sacrificial layer 240 is used for non-electrical signal transmission functions.

[0059] When the sacrificial layer 240 is configured as a single layer, it can be a single layer of conductive material 241 or insulating material 242. When the sacrificial layer 240 is configured as a multilayer layer, it can include a layer of conductive material 241 and a layer of insulating material 242 stacked sequentially. The conductive material layer 241 can be made of the same material as the first conductive layer 221, and the insulating material layer 242 can be made of the same material as the first insulating layer 231. This is beneficial in ensuring that the sacrificial layer 240 is destroyed first during the force transmission process, thereby better protecting the conductive layer 220. On the other hand, it can also prevent the sacrificial layer 240 from being needlessly destroyed when subjected to a force far below the stress limit of the conductive layer 220. Specifically, the insulating material layer 242 can be made of PET, epoxy resin, PI, PU, ​​PP or PC, and the conductive material layer 241 can be made of metal, carbon, graphene or composite conductive material.

[0060] Please refer to Figure 8-10 In one embodiment, a fastening layer (not shown) is provided between the conductive layer 220 and the insulating layer 230 to enhance the adhesion between the conductive layer 220 and the insulating layer 230.

[0061] The adhesion between the conductive layer 220 and the insulating layer 230 is enhanced by the fastening layer, which further helps to reduce the probability of the conductive layer 220 being torn under force, thereby improving the reliability of the implantable sensor 200 during use.

[0062] Please refer to Figure 4-8In one embodiment, the housing assembly 100 has a mounting slot 130 to which the implantable sensor 200 is connected, with at least a portion of the connection area located within the mounting slot 130. The housing assembly 100 includes a first housing 110 and a second housing 120 connected to each other, the second housing 120 being oriented towards a human body. A circuit board assembly 400 is disposed between the first housing 110 and the second housing 120, with the mounting slot 130 located within the second housing 120. The mounting slot 130 is filled with an adhesive block, and at least a portion of the sacrificial layer 240 is bonded to the adhesive block.

[0063] On one hand, the implantable sensor 200 is mounted on the second housing 120 by placing at least a portion of the connection area within the mounting groove 130 and injecting adhesive into the mounting groove 130. On the other hand, after the adhesive cures, it forms an adhesive block, and at least a portion of the sacrificial layer 240 is bonded to the adhesive block. During the curing process, the adhesive shrinks, and the portion of the sacrificial layer 240 in contact with the adhesive is subjected to outward tensile stress. Furthermore, the portion of the implantable sensor 200 inserted into the human body will bend slightly due to human movement, making the sacrificial layer 240 more susceptible to damage under stress, thus providing better protection for the conductive layer 220. It is also understood that without the sacrificial layer 240, the insulating layer 230 covering the conductive layer 220 would bond with the adhesive, increasing the likelihood of the conductive layer 220 being torn and damaged under stress.

[0064] Please refer to Figure 1-3 In one embodiment, the monitor further includes an adhesive patch 500 disposed on the housing assembly 100 facing the human body, and the adhesive patch 500 is used to adhere to the human body to secure the housing assembly 100.

[0065] When using the monitor, the adhesive patch 500 can be attached to the skin to fix the monitor in place.

[0066] Please refer to Figure 1-3 In one embodiment, as described in 8-12, the monitor further includes a cap 600 and a sealing plug 700, the cap 600 being detachably connected to the housing assembly 100, the cap 600 having a through channel for receiving at least a portion of the implanted sensor 200, and the sealing plug 700 for sealing the end of the channel away from the housing assembly 100.

[0067] Before using the monitor, the space enclosed by the cap 600 and the sealing plug 700 accommodates at least a portion of the implantable sensor 200, thereby protecting the implantable sensor 200. When the monitor needs to be used, the cap 600 can be removed from the housing assembly 100 so that at least a portion of the implantable sensor 200 can be implanted into the human body.

[0068] On the other hand, this embodiment also provides an implantable sensor 200.

[0069] Please refer to Figure 1-12 The implantable sensor 200 includes a conductive layer 220, an insulating layer 230, and a sacrificial layer 240. The conductive layer 220 and the insulating layer 230 are alternately disposed. The conductive layer 220 is used to transmit electrical signals, and the insulating layer 230 is used to insulate the conductive layer 220. The implantable sensor 200 has a connection area for connection with the housing assembly 100. The sacrificial layer 240 is stacked in the connection area. The sacrificial layer 240 is designed to be destroyed by the force applied before the adjacent position of the conductive layer 220 and the insulating layer 230 under the action of external force, so as to protect the conductive layer 220.

[0070] When using the implantable sensor 200, at least a portion of the implantable sensor 200 is inserted into the human body to bring it into contact with bodily fluids. When the implantable sensor 200 is subjected to force due to human activity or other reasons, the sacrificial layer 240 is damaged before the adjacent position of the conductive layer 220 and the insulating layer 230, thereby absorbing the force and reducing the force transmitted to the conductive layer 220. This protects the conductive layer 220 and reduces the probability of signal transmission being affected by the breakage of the conductive layer 220.

[0071] The above-described specific examples are for illustrative purposes only and are not intended to limit the scope of this invention. Those skilled in the art can make various simple deductions, modifications, or substitutions based on the concept of this invention.

Claims

1. A monitoring instrument, characterized in that, include: Housing assembly; An implantable sensor, wherein the implantable sensor is connected to the housing assembly; A guide needle is disposed in the housing assembly and is used to drive at least a portion of the implantable sensor into the human body so that the implantable sensor comes into contact with bodily fluids; and a circuit board assembly disposed on the housing assembly, the circuit board assembly being signal-connected to the implanted sensor; The implantable sensor includes a conductive layer, an insulating layer, and a sacrificial layer, with the conductive layer and the insulating layer alternately disposed. The conductive layer is used to transmit electrical signals, and the insulating layer is used to insulate the conductive layer. The implantable sensor has a connection area that connects to the housing assembly. A sacrificial layer is disposed in the connection area. The sacrificial layer is designed to be destroyed by an external force before the adjacent position of the conductive layer and the insulating layer, thereby protecting the conductive layer.

2. The monitoring instrument as described in claim 1, characterized in that, The implantable sensor includes a first part and a second part. The first part is used to connect with the housing assembly. One end of the second part is connected to the first part, and the other end is used to be inserted into the human body. The second part is bent and disposed on the first part. The connection area is located at the position adjacent to the first part and the second part. The shape of the sacrificial layer is adapted to the connection area.

3. The monitoring instrument as described in claim 1, characterized in that, It also includes a base layer, which includes a first side and a second side disposed opposite to each other. The conductive layer includes a first conductive layer, and the insulating layer includes a first insulating layer. The first conductive layer, the first insulating layer and the sacrificial layer are sequentially stacked on the first side of the base layer in a direction away from the base layer.

4. The monitoring instrument as described in claim 3, characterized in that, The conductive layer further includes a second conductive layer and a third conductive layer, and the insulating layer further includes a second insulating layer and a third insulating layer. The second conductive layer, the second insulating layer, the third conductive layer, and the third insulating layer are sequentially stacked on the second side of the base layer in a direction away from the base layer.

5. The monitoring instrument as described in claim 1, characterized in that, The sacrificial layer is configured as a single-layer structure.

6. The monitoring instrument as described in claim 1, characterized in that, The sacrificial layer is configured as a multi-layered structure with stacked layers.

7. The monitoring instrument as described in claim 1, characterized in that, The sacrificial layer includes a conductive material layer and / or an insulating material layer, wherein the conductive material layer of the sacrificial layer is used for non-electrical signal transmission functions.

8. The monitoring instrument as described in claim 1, characterized in that, A fastening layer is provided between the conductive layer and the insulating layer, and the fastening layer is used to enhance the adhesion between the conductive layer and the insulating layer.

9. The monitoring instrument according to any one of claims 1-8, characterized in that, The housing assembly has a mounting slot, the implantable sensor is connected to the mounting slot, and at least a portion of the connection area is located within the mounting slot; The housing assembly includes a first housing and a second housing, the first housing being connected to the second housing and the second housing being oriented toward a human body; the circuit board assembly is disposed between the first housing and the second housing, and the mounting groove is located in the second housing; the mounting groove is filled with an adhesive block, and at least a portion of the sacrificial layer is bonded to the adhesive block.

10. An implantable sensor, characterized in that, The implantable sensor comprises a conductive layer, an insulating layer, and a sacrificial layer, wherein the conductive layer and the insulating layer are alternately disposed. The conductive layer is used to transmit electrical signals, and the insulating layer is used to insulate the conductive layer. The implantable sensor has a connection area for connecting to a housing assembly, and the sacrificial layer is disposed in the connection area. The sacrificial layer is designed to be destroyed by the force applied before the adjacent positions of the conductive layer and the insulating layer under the action of external force, so as to protect the conductive layer.

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