A pre-mounting structure for semiconductor device integration

Abstract

The utility model relates to the technical field of semiconductor equipment especially relates to a kind of pre-installation structure of semiconductor equipment integration, including pedestal and 3D equipment main body, 3D equipment main body is set in pedestal end, and two L type long side fixed plates are symmetrically equipped in 3D equipment main body end portion.The utility model is fixed by setting rectangular fixed hole and circular fixed hole, and 3D equipment main body is fixedly installed by pedestal fixing piece and equipment fixing piece, shortens the installation time and debugging period of pre-set equipment, improves the work efficiency of operator, by setting reinforcing rib, reduce the static deformation condition of multiple L type long side fixed plate and multiple L type short side fixed plate, by setting multiple mounting plate, operator connects pipeline and 3D equipment main body bottom by mounting plate, by pre-installing pipeline and 3D equipment main body, while supporting 3D equipment, reduce the installation time of 3D equipment main body to reach the scene, improve the working efficiency when docking pipeline.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a pre-installed structure for semiconductor equipment integration. Background Technology

[0002] With the increasing demands for semiconductor installation efficiency, the application of piping in 3D equipment is becoming more and more common. Positioning devices utilize advanced installation technology in 3D equipment, enabling installers to stably install related devices, thus facilitating operation and improving work efficiency.

[0003] Piping is a crucial part of the semiconductor equipment installation process. In traditional technology, some piping for semiconductor equipment is laid in the space below the floor, while the other part extends above the floor to connect with the semiconductor equipment's above-floor connectors. Since the semiconductor equipment installation process requires interfacing with many 3D devices, this method has several drawbacks. In some cases, piping installation is only performed after the semiconductor equipment has arrived on-site and been installed to ensure assembly accuracy, which leads to longer installation time and affects installation efficiency. Utility Model Content

[0004] The purpose of this invention is to solve the problems of long installation time and low pipeline efficiency in the production site in the prior art, and to propose a pre-installation structure for integrated semiconductor equipment.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A pre-installed structure for semiconductor device integration includes a base and a 3D device body. The 3D device body is disposed at the end of the base. Two L-shaped long-side fixing plates and two L-shaped short-side fixing plates are symmetrically arranged at the end of the 3D device body. Multiple device fixing components for fixing the 3D device body are arranged linearly around the 3D device body. Multiple base fixing components for fixing the base are arranged linearly around the 3D device body. Multiple pipes are also provided below the base.

[0007] Preferably, the 3D device body has multiple device fixing holes on its four sides, and the device fixing holes are compatible with the device fixing parts.

[0008] Preferably, the base end has multiple base fixing holes around its perimeter, and the base fixing holes are compatible with the base fixing components.

[0009] Preferably, the ends of the L-shaped long side fixing plate and the L-shaped short side fixing plate are respectively provided with multiple reinforcing ribs in a linear manner, and the reinforcing ribs are arranged in a triangular shape.

[0010] Preferably, the ends of the L-shaped long side fixing plate and the L-shaped short side fixing plate are respectively provided with a plurality of circular fixing holes, and the bottom of the L-shaped long side fixing plate and the L-shaped short side fixing plate are respectively provided with a plurality of rectangular fixing holes symmetrically.

[0011] Preferably, the pipe end is provided with a mounting plate, and the mounting plate and the pipe are provided in a one-to-one correspondence. The end of the mounting plate is provided with a plurality of second mounting holes in a circular pattern, and the bottom of the 3D equipment body is provided with a plurality of first mounting holes.

[0012] Compared with the prior art, the present invention has the following advantages:

[0013] 1. By setting rectangular and circular fixing holes, the operator can fix and install the main body of the 3D equipment through the base fixing parts and equipment fixing parts, which shortens the installation time and debugging cycle of the preset equipment and improves the work efficiency of the operator. By setting reinforcing ribs, the static deformation of multiple L-shaped long side fixing plates and multiple L-shaped short side fixing plates is reduced.

[0014] 2. This utility model sets up multiple mounting plates, and the operator connects the pipes to the bottom of the 3D equipment body through the mounting plates. By pre-installing the pipes and the 3D equipment body, the installation time of the 3D equipment body after it arrives at the site is reduced while supporting the 3D equipment body, and the work efficiency of connecting the pipes is improved. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a base fixing component and an equipment fixing component of a pre-installation structure for semiconductor equipment integration proposed in this utility model;

[0016] Figure 2 This invention provides a schematic diagram of a mounting plate and a 3D device main body part of a pre-installed structure for semiconductor device integration.

[0017] In the diagram: 1. Base; 2. 3D equipment body; 3. Pipe; 4. L-shaped long side fixing plate; 5. L-shaped short side fixing plate; 6. Base fixing component; 7. Equipment fixing component; 8. Reinforcing rib; 9. Rectangular fixing hole; 10. Circular fixing hole; 11. Base fixing hole; 12. First mounting hole; 13. Equipment fixing hole; 14. Mounting plate; 15. Second mounting hole. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0019] Reference Figures 1-2 A pre-installed structure for semiconductor device integration includes a base 1 and a 3D device body 2. The 3D device body 2 is located at the end of the base 1. Multiple device fixing holes 13 are provided on the four sides of the 3D device body 2, and the device fixing holes 13 are adapted to the device fixing parts 7. The external thread of the rod of the device fixing part 7 is engaged with the internal thread of the device fixing hole 13, which facilitates the operator to align the device fixing part 7 with the device fixing hole 13, improves the positioning efficiency during installation, and provides support for the device fixing part 7.

[0020] Multiple base fixing holes 11 are provided around the end of the base 1, and the base fixing holes 11 are compatible with the base fixing parts 6. The external thread of the rod of the base fixing parts 6 is connected with the internal thread of the base fixing holes 11, which makes it convenient for operators to align the base fixing parts 6 and the base fixing holes 11, improving the positioning efficiency during installation. This setting provides support for the base fixing parts 6.

[0021] It should be noted that, due to the lack of positioning aids in some working environments, it is difficult to pre-install the 3D equipment body 2, which increases the installation time when the equipment arrives at the work site. By using two L-shaped long side fixing plates 4 and two L-shaped short side fixing plates 5 for the pre-installation of the 3D equipment body 2, the positioning accuracy of the operator during installation is improved.

[0022] Two L-shaped long-side fixing plates 4 are symmetrically arranged at the ends of the 3D equipment body 2, and two L-shaped short-side fixing plates 5 are symmetrically arranged at the ends of the 3D equipment body 2. Multiple equipment fixing parts 7, which are internal hex bolts, are arranged linearly around the 3D equipment body 2 to fix the 3D equipment body 2. Multiple base fixing parts 6, which are internal hex bolts, are arranged linearly around the 3D equipment body 2 to fix the base 1. This arrangement improves the stability when fixing the 3D equipment body 2.

[0023] The ends of the L-shaped long side fixing plate 4 and the L-shaped short side fixing plate 5 are respectively provided with multiple reinforcing ribs 8 in a linear manner, and the reinforcing ribs 8 are arranged in a triangular shape to reduce the static deformation of the L-shaped long side fixing plate 4 and the L-shaped short side fixing plate 5, improve the natural frequency, and reduce the resonance of the equipment caused by environmental vibration.

[0024] Multiple circular fixing holes 10 are provided at the ends of the L-shaped long side fixing plate 4 and the L-shaped short side fixing plate 5, which facilitates the operator to position and install the equipment fixing parts 7. This setting provides support for the L-shaped long side fixing plate 4 and the L-shaped short side fixing plate 5.

[0025] The bottom of the L-shaped long side fixing plate 4 and the L-shaped short side fixing plate 5 are respectively provided with multiple rectangular fixing holes 9. The base fixing component 6 extends into the equipment fixing hole 13 through the rectangular fixing holes 9, which makes it convenient for the operator to position and install the base fixing component 6. This setting provides support for the L-shaped long side fixing plate 4 and the L-shaped short side fixing plate 5.

[0026] Multiple pipes 3 are provided below the base 1. The mounting plate 14 is fixed to the end of the pipe 3 by bolt assembly, and the mounting plate 14 and the pipe 3 are set one-to-one. Multiple hexagon socket head cap screws are provided around the mounting plate 14. Multiple second mounting holes 15 are opened in a circular shape at the end of the mounting plate 14. Multiple first mounting holes 12 are opened at the bottom of the 3D equipment body 2. The external thread of the hexagon socket head cap screw is connected with the internal thread of the first mounting hole 12. This setting improves the positioning accuracy of the operator when installing multiple pipes 3.

[0027] It should be noted that, in most cases, the pipes 3 are connected after the main body 2 of the 3D equipment arrives on site, which results in a long construction period and inconvenience. After supporting the main body 2 of the 3D equipment, multiple pipes 3 are connected to the main body 2 of the 3D equipment. After the overall equipment arrives on site, multiple pipes 3 are connected to the pre-installed equipment, which shortens the installation time of the pre-installed equipment and improves the piping efficiency.

[0028] The bolt assemblies described above are all prior art. A bolt assembly includes a bolt and a threaded hole for threading two components together.

[0029] The functional principle of this utility model can be explained through the following operation methods:

[0030] The operator places two L-shaped long side fixing plates 4 and two L-shaped short side fixing plates 5 symmetrically around the 3D equipment body 2. The operator inserts multiple equipment fixing parts 7 into the circular fixing holes 10. The equipment fixing parts 7 are threadedly connected to the circular fixing holes 10 and the equipment fixing holes 13, thereby fixing the two L-shaped long side fixing plates 4, the two L-shaped short side fixing plates 5 and the 3D equipment body 2.

[0031] The operator places the 3D equipment body 2 at the end of the base 1, and then inserts multiple base fixing parts 6 into the rectangular fixing holes 9. The base fixing parts 6 are inserted into the base fixing holes 11 through the rectangular fixing holes 9 and the base fixing holes 11. The base fixing parts 6 are threaded together through the rectangular fixing holes 9 and the base fixing holes 11, thereby fixing the two L-shaped long side fixing plates 4, the two L-shaped short side fixing plates 5 and the 3D equipment body 2.

[0032] The operator moves the pipe 3 to align the second mounting hole 15 in the mounting plate 14 with the first mounting hole 12 at the bottom of the 3D equipment body 2, and then connects the second mounting hole 15 and the first mounting hole 12 with bolts, so that the pipe 3 is installed at the bottom of the 3D equipment body 2, realizing the pre-installation of the integrated equipment.

[0033] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A pre-mount structure for semiconductor device integration, comprising a base and a 3D device body, characterized in that, The main body of the 3D device is located at the end of the base. Two L-shaped long-side fixing plates and two L-shaped short-side fixing plates are symmetrically arranged at the end of the main body of the 3D device. Multiple device fixing parts for fixing the main body of the 3D device are arranged linearly around the main body of the 3D device. Multiple base fixing parts for fixing the base are arranged linearly around the main body of the 3D device. Multiple pipes are also arranged below the base.

2. The pre-mount structure for semiconductor device integration according to claim 1, wherein The 3D equipment has multiple mounting holes on its four sides, and these mounting holes are compatible with the equipment fasteners.

3. The pre-mount structure for semiconductor device integration according to claim 2, wherein Multiple base fixing holes are provided around the end of the base, and the base fixing holes are compatible with the base fixing components.

4. The pre-mount structure for semiconductor device integration according to claim 3, wherein The ends of the L-shaped long side fixing plate and the L-shaped short side fixing plate are each provided with multiple reinforcing ribs in a linear fashion, and the reinforcing ribs are arranged in a triangular shape.

5. The pre-mount structure for semiconductor device integration according to claim 4, wherein The ends of the L-shaped long side fixing plate and the L-shaped short side fixing plate are each provided with multiple circular fixing holes, and the bottoms of the L-shaped long side fixing plate and the L-shaped short side fixing plate are each provided with multiple rectangular fixing holes symmetrically.

6. The pre-mount structure for semiconductor device integration according to claim 5, wherein The pipe end is equipped with a mounting plate, and the mounting plate and the pipe are set one-to-one. The end of the mounting plate has multiple second mounting holes in a circular shape, and the bottom of the 3D equipment body has multiple first mounting holes.

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