Motor controller module, vehicle-mounted device and electric vehicle

CN224609733UActive Publication Date: 2026-08-07HUAWEI TECH CO LTD
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Patent Information

Application Number
CN202521067862.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-05-27
Publication Date
2026-08-07
Estimated Expiration
2035-05-27

AI Technical Summary

Technical Problem

[0002]为了减小电机控制器的体积来适应整车布置需求,将母线电容和散热器共用壳体来减少结构件,母线电容的壳体一般为塑料壳体,塑料壳体构成的散热器使得散热器的冷却水会从塑料壳体渗入到母线电容壳体的内腔,影响母线电容内腔的电容芯包的可靠性

Benefits of technology

[0059] In this embodiment, the circuit board, three-phase bridge arm, heat sink, and waterproof layer are stacked sequentially along the arrangement direction of the heat sink and the housing. This arrangement ensures that the three-phase bridge arm, heat sink, and waterproof layer do not occupy additional space on the circuit board outside the arrangement direction perpendicular to the heat sink and the housing. This makes the arrangement of the motor controller module compact, which is beneficial for the motor controller module to have a smaller volume and for the miniaturization of the motor controller.

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Abstract

The application provides a motor controller module, a vehicle-mounted device and an electric vehicle. The motor controller module comprises a bus capacitor and a waterproof layer. An inner cavity of a shell of the bus capacitor is used to accommodate a capacitor core package. Part of an outer surface of the shell is used to enclose a heat sink to form a cooling flow channel. The cooling flow channel is used to cool a three-phase bridge arm fixed on a side of the heat sink away from the shell. The three-phase bridge arm is used to receive power supply of a power battery of the electric vehicle through the capacitor core package and output three-phase current to drive a motor of the electric vehicle. The waterproof layer is distributed between the cooling flow channel and the capacitor core package. The waterproof layer is used to isolate the cooling flow channel and the capacitor core package, so as to avoid the cooling water of the cooling flow channel from penetrating into the inner cavity of the shell of the bus capacitor and affecting the reliability of the bus capacitor, thereby improving the operation reliability of the vehicle-mounted device.
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Description

Technical Field

[0001] This application relates to the field of electric vehicle technology, and in particular to a motor controller module, an on-board device, and an electric vehicle. Background Technology

[0002] To reduce the size of the motor controller to fit the overall vehicle layout requirements, the bus capacitor and radiator share a common housing to reduce structural components. The bus capacitor housing is generally made of plastic. The plastic housing of the radiator allows the radiator's cooling water to seep into the inner cavity of the bus capacitor housing, affecting the reliability of the capacitor core inside the bus capacitor housing. Utility Model Content

[0003] This application provides a motor controller module, an on-board device, and an electric vehicle to improve the reliability of the bus capacitor of the motor controller module.

[0004] In a first aspect, this application provides a motor controller module, which includes a bus capacitor and a water-insulating layer. The inner cavity of the bus capacitor's housing is used to accommodate the capacitor core, and a portion of the outer surface of the housing is used to surround a heat sink to form a cooling channel. The cooling channel is used to cool a three-phase bridge arm fixed to the side of the heat sink away from the housing. The three-phase bridge arm is used to receive power from the electric vehicle's power battery through the capacitor core and output three-phase current to drive the electric vehicle's motor. The water-insulating layer is distributed between the cooling channel and the capacitor core, and serves to isolate the cooling channel and the capacitor core.

[0005] In this embodiment, the inner cavity of the bus capacitor's housing is used to accommodate the capacitor core, and a portion of the outer surface of the housing is used to enclose the heat sink to form a cooling channel. This allows the cooling channel to share a portion of the bus capacitor's housing, resulting in higher integration and fusion of the motor controller module. It also reduces the thickness of the motor controller module, which helps to reduce the size of the vehicle-mounted device. Furthermore, it reduces the distance between the capacitor core and the cooling channel, which helps to improve the heat dissipation effect.

[0006] In this embodiment, the cooling channel is used to cool the three-phase bridge arm fixed to the side of the heat sink away from the housing. The three-phase bridge arm is used to receive power from the electric vehicle's power battery through the capacitor core and output three-phase current to drive the electric vehicle's motor, so that the three-phase bridge arm can continuously dissipate heat, which is beneficial to ensure the normal operation of the three-phase bridge arm.

[0007] In the embodiments of the application, the casing of the bus capacitor is generally a plastic casing. The cooling channels formed by the plastic casing allow cooling water to seep from the plastic casing into the inner cavity of the bus capacitor casing, affecting the reliability of the capacitor core in the inner cavity of the bus capacitor. By distributing a water-insulating layer between the cooling channels and the capacitor core, the cooling channels and the capacitor core can be isolated by the water-insulating layer, which can prevent the cooling water in the cooling channels from seeping into the inner cavity of the bus capacitor casing and affecting the reliability of the bus capacitor.

[0008] In the embodiment of the application, a cooling channel is formed by enclosing part of the outer surface of the bus capacitor shell with the heat sink, which reduces the thickness of the motor controller module and brings the cooling channel closer to the capacitor core, resulting in better heat dissipation for the capacitor core. A water-insulating layer is distributed between the cooling channel and the capacitor core, which isolates the cooling channel and the capacitor core. This reduces the thickness of the motor controller module while preventing cooling water in the cooling channel from seeping into the inner cavity of the bus capacitor shell, thus ensuring the reliability of the capacitor core.

[0009] In one embodiment, the projection of the waterproof layer along the arrangement direction of the heat sink and the housing covers the capacitor core package.

[0010] In the embodiment of the application, the projection of the waterproof layer along the arrangement direction of the heat sink and the shell covers the capacitor core, so that the capacitor core is arranged within the envelope of the waterproof layer along the arrangement direction of the heat sink and the shell. This allows the cooling water in the cooling channel to avoid flowing to the capacitor core when it seeps from the outer surface of the shell into the inner cavity of the shell. This is beneficial for effectively isolating the impact of moisture on the reliability of the capacitor core and improving the waterproof effect of the waterproof layer on the capacitor core.

[0011] In one embodiment, the projection of the water-resistant layer along the arrangement direction of the heat sink and the housing covers the cooling channels.

[0012] In this embodiment, the projection of the water-proof layer along the arrangement direction of the heat sink and the housing covers the cooling channel. When the cooling water in the cooling channel seeps into the housing of the bus capacitor, the larger water-proof layer can effectively block the seeping cooling water from entering the housing. This is beneficial to improving the water-proof effect of the water-proof layer on the capacitor core, thereby reducing the impact of moisture on the reliability of the capacitor core.

[0013] In one embodiment, the projection of the waterproof layer along the arrangement direction of the heat sink and the housing covers the capacitor core and cooling channels.

[0014] In this embodiment, the projection of the water-insulating layer along the arrangement direction of the heat sink and the housing covers the capacitor core and the cooling channel, so that the cooling water seeping into the housing from the cooling channel can be blocked by the water-insulating layer, and the moisture flowing towards the capacitor core along the arrangement direction of the heat sink and the housing can also be blocked by the water-insulating layer, so that the water-insulating layer has a better isolation effect on the cooling channel and the capacitor core.

[0015] In one embodiment, the thickness of the water-proof layer along the arrangement direction of the heat sink and the housing is less than the thickness of the portion of the housing used to form the cooling channel.

[0016] In this embodiment, the thickness of the water-insulating layer along the arrangement direction of the heat sink and the housing is less than the thickness of the portion of the housing used to form the cooling channel. This allows for a smaller height and lighter weight for the motor controller module while ensuring the water-insulating layer effectively isolates the capacitor core. It also simplifies the process of embedding the water-insulating layer into the housing of the bus capacitor, thus simplifying the manufacturing process.

[0017] In one embodiment, the outer surface of the housing is recessed towards the capacitor core to form a groove, which surrounds the heat sink to form a cooling channel. The housing also includes a plurality of protrusions, each protruding from the bottom of the groove toward its opening. A water-resistant layer is distributed on the bottom of the groove, the peripheral wall of the groove, and at least one of the plurality of protrusions.

[0018] In this embodiment, the outer surface of the housing is recessed towards the capacitor core to form a groove. This groove surrounds the heat sink to form a cooling channel, resulting in a smaller height for the motor controller module. The housing also includes multiple protrusions, each protruding from the bottom of the groove towards its opening. These protrusions can turbulent the cooling water in the cooling channel, thereby adjusting the flow resistance and flow distribution of the cooling water. Furthermore, the protrusions increase the heat dissipation area of ​​the housing in contact with the cooling water, which is beneficial for improving the heat dissipation efficiency of the motor controller module.

[0019] In this embodiment, the water-proof layer is distributed at least one of the bottom of the groove, the peripheral wall of the groove, and multiple protrusions. This can prevent cooling water in the cooling channel from seeping into the inner cavity of the shell from the bottom of the groove, the peripheral wall of the groove, and the protrusions, effectively reducing the impact of moisture on the reliability of the capacitor core in the inner cavity of the shell.

[0020] In one embodiment, the radiator further includes a partition plate arranged between the groove and the radiator plate along the arrangement direction of the radiator plate and the housing. The radiator plate is recessed away from the partition plate to form another groove. The partition plate is used to enclose the other groove to form another cooling channel. The radiator plate also includes multiple protrusions, each protruding from the bottom of the other groove toward its opening. The groove, partition plate, and radiator plate are stacked sequentially along the arrangement direction of the radiator plate and the housing, and the two cooling channels are stacked. A water-resistant layer is distributed at least one of the bottom of the groove, the peripheral wall of the groove, the peripheral wall of the other groove, and the multiple protrusions.

[0021] In this embodiment, the partition plate is used to enclose another groove to form another cooling channel, so that the motor controller module includes two cooling channels, which is beneficial to improving the heat dissipation effect of the three-phase bridge arm and capacitor core in the motor controller module.

[0022] In this embodiment, the water-proof layer is distributed at least one of the bottom of the groove, the peripheral wall of the groove, the peripheral wall of another groove, and multiple protrusions. This helps to prevent the cooling water from the two cooling channels from seeping into the inner cavity of the housing, reducing the possibility of moisture entering the inner cavity and affecting the capacitor core, and improving the reliability of the capacitor core.

[0023] In one embodiment, the water-proof layer includes a hydrophobic coating applied to the outer surface of the housing that forms a cooling channel; and / or the hydrophobic coating applied to the inner surface of the housing facing the capacitor core; and / or the hydrophobic coating applied at least to the surface of the capacitor core facing the cooling channel.

[0024] In this embodiment, a hydrophobic coating is used as a water-proof layer, which simplifies the processing of the water-proof layer and reduces the thickness of the motor controller module. Applying the hydrophobic coating to the outer surface of the housing that forms the cooling channel prevents cooling water in the cooling channel from seeping into the bus capacitor housing from the outer surface of the housing, thus avoiding moisture buildup in the housing cavity that could affect the reliability of the capacitor core.

[0025] In one embodiment, a hydrophobic coating is applied to the inner surface of the housing facing the capacitor core.

[0026] In this embodiment, a hydrophobic coating is applied to the inner surface of the housing facing the capacitor core, so that even if cooling water in the cooling channel seeps into the housing, it will not enter the inner cavity of the housing from the inner surface of the housing facing the capacitor core, thus affecting the reliability of the capacitor core.

[0027] In one embodiment, when the hydrophobic coating is applied to the inner surface of the housing facing the capacitor core, and the cooling channel does not have a water-proof layer, the area of ​​the hydrophobic coating along the arrangement direction of the heat sink and the housing covers the capacitor core, preventing water from the cooling channel from seeping into the inner surface of the housing from the bottom of the groove or the groove's peripheral wall and coming into contact with the capacitor core, thereby improving the water-proof effect on the capacitor core.

[0028] In one embodiment, a hydrophobic coating is applied at least to the surface of the capacitor core facing the cooling channel.

[0029] In this embodiment, a hydrophobic coating is applied to at least the surface of the capacitor core facing the cooling channel, so that even if the cooling water in the cooling channel seeps from the casing of the bus capacitor into the inner cavity of the casing, the hydrophobic coating on the surface of the capacitor core can isolate the effect of moisture on the capacitor core, thereby ensuring the reliability of the capacitor core operation.

[0030] In one embodiment, a hydrophobic coating is applied to all surfaces of the capacitor core package to enhance its water-repellent effect.

[0031] In one embodiment, a hydrophobic coating is applied to the outer surface of the housing that forms a cooling channel and the inner surface of the housing facing the capacitor core.

[0032] In this embodiment, a hydrophobic coating is applied to the outer surface of the housing that forms the cooling channel, preventing cooling water in the cooling channel from seeping into the housing of the bus capacitor. This avoids moisture generated by the cooling water in the inner cavity of the housing, which could affect the reliability of the capacitor core. The hydrophobic coating is also applied to the inner surface of the housing facing the capacitor core, ensuring that even if cooling water in the cooling channel seeps into the housing, it will not penetrate the hydrophobic coating on the inner surface of the housing and enter the inner cavity of the housing, thus affecting the reliability of the capacitor core.

[0033] In this embodiment, a hydrophobic coating is applied to the outer surface of the housing that forms the cooling channel and the inner surface of the housing facing the capacitor core, so that both the inner and outer surfaces of the bus capacitor housing are covered by the hydrophobic coating, providing double waterproof protection and improving the isolation effect of the waterproof layer on the cooling channel and the capacitor core.

[0034] In one embodiment, a hydrophobic coating is applied to the inner surface of the housing facing the capacitor core and at least to the surface of the capacitor core facing the cooling channel.

[0035] In this embodiment, a hydrophobic coating is applied to the inner surface of the housing facing the capacitor core, ensuring that even if cooling water in the cooling channels seeps into the housing, it will not enter the inner cavity of the housing and affect the reliability of the capacitor core. Applying the hydrophobic coating at least to the surface of the capacitor core facing the cooling channels ensures that even if cooling water in the cooling channels seeps from the bus capacitor housing into the inner cavity of the housing, the hydrophobic coating on the surface of the capacitor core can isolate the capacitor core from the influence of moisture, thereby ensuring the reliability of the capacitor core's operation.

[0036] In this embodiment, a hydrophobic coating is applied to the inner surface of the housing facing the capacitor core and at least to the surface of the capacitor core facing the cooling channel. On the one hand, the hydrophobic coating applied to the inner surface of the housing facing the capacitor core can prevent cooling water in the cooling channel from entering the inner cavity of the housing. On the other hand, even if cooling water passes through the hydrophobic coating applied to the inner surface of the housing facing the capacitor core, the hydrophobic coating on the surface of the capacitor core facing the cooling channel can still prevent moisture in the inner cavity from affecting the reliability of the capacitor core. This provides double water-proof protection and can improve the isolation effect of the water-proof layer on the cooling channel and the capacitor core.

[0037] In one embodiment, a hydrophobic coating is applied to the outer surface of the housing that forms a cooling channel and at least to the surface of the capacitor core facing the cooling channel.

[0038] In this embodiment, a hydrophobic coating is applied to the outer surface of the housing that forms the cooling channel, preventing cooling water in the cooling channel from seeping into the housing of the bus capacitor. This avoids moisture generated by the cooling water in the inner cavity of the housing, which could affect the reliability of the capacitor core. The hydrophobic coating is applied at least to the surface of the capacitor core facing the cooling channel, ensuring that even if cooling water seeps from the housing of the bus capacitor into the inner cavity of the housing, the hydrophobic coating on the surface of the capacitor core can isolate the capacitor core from the effects of moisture, thus guaranteeing the reliability of the capacitor core's operation.

[0039] In this embodiment, a hydrophobic coating is applied to the outer surface of the housing that forms the cooling channel and at least to the surface of the capacitor core facing the cooling channel. This ensures that even if cooling water in the cooling channel leaks from the hydrophobic coating on the outer surface of the housing that forms the cooling channel into the inner cavity of the housing, the hydrophobic coating on the surface of the capacitor core facing the cooling channel can still prevent moisture in the inner cavity from affecting the reliability of the capacitor core. This provides double waterproof protection and can improve the isolation effect of the waterproof layer on the cooling channel and the capacitor core.

[0040] In one embodiment, a hydrophobic coating is applied to the outer surface of the housing that forms a cooling channel, the inner surface of the housing facing the capacitor core, and at least to the surface of the capacitor core facing the cooling channel.

[0041] In this embodiment, a hydrophobic coating is applied to the outer surface of the housing that forms the cooling channel, preventing cooling water in the cooling channel from seeping into the housing of the bus capacitor. This avoids moisture generated in the inner cavity of the housing, which could affect the reliability of the capacitor core. The hydrophobic coating is also applied to the inner surface of the housing facing the capacitor core, ensuring that even if cooling water in the cooling channel seeps into the housing, it will not enter the inner cavity of the housing and affect the reliability of the capacitor core. Furthermore, the hydrophobic coating is applied at least to the surface of the capacitor core facing the cooling channel, ensuring that even if cooling water in the cooling channel seeps from the housing of the bus capacitor into the inner cavity of the housing, the hydrophobic coating on the surface of the capacitor core can isolate moisture from the capacitor core, thus guaranteeing the reliability of the capacitor core's operation.

[0042] In this embodiment, the hydrophobic coating is applied to the outer surface of the housing that forms the cooling channel, the inner surface of the housing facing the capacitor core, and at least to the surface of the capacitor core facing the cooling channel. This can prevent cooling water in the cooling channel from seeping into the inner cavity of the housing, and can also prevent moisture in the inner cavity from affecting the reliability of the capacitor core. It has multiple water-proof protections and can improve the isolation effect of the water-proof layer on the cooling channel and the capacitor core.

[0043] In one embodiment, a hydrophobic coating is applied to the bottom of the groove, the peripheral walls of the groove, and multiple protrusions to improve the water-repellent effect. In another embodiment, because the hydrophobic coating is applied to the bottom of the groove, the peripheral walls of the groove, and the multiple protruding surfaces, the cooling water in the cooling channel is isolated from the capacitor core from the outer surface of the housing. The area of ​​the hydrophobic coating along the arrangement direction of the heat sink and the housing can cover only the bottom of the groove, thereby achieving water repellency while reducing the material cost of the hydrophobic coating and simplifying the process.

[0044] In one embodiment, the waterproof layer includes a metal layer that is injection molded into a portion of the housing that forms a cooling channel.

[0045] In this embodiment, the water-proof layer includes a metal layer. The metal layer can improve the thermal conductivity of the housing while achieving water isolation between the cooling channel and the capacitor core, so that the heat of the capacitor core can be absorbed by the cooling channel more evenly and faster, which is beneficial to improving the heat dissipation effect of the motor controller module.

[0046] In this embodiment, the housing is made of plastic. Compared with plastic, metal has a higher structural strength. By injection molding a metal layer into the part of the housing that forms the cooling channel, the structural strength of the housing can be improved, thereby improving the reliability of the motor controller module.

[0047] In one embodiment, one surface of the metal layer is covered within a portion of the housing that forms a cooling channel, and at least a portion of the other surface of the metal layer is exposed within the cooling channel.

[0048] In this embodiment, one surface of the metal layer covers part of the housing that forms the cooling channel, so that the metal layer can improve the structural strength of the housing, while at least part of the other surface of the metal layer is exposed in the cooling channel, so that the metal layer can also improve the heat exchange efficiency between the housing and the cooling channel, thereby improving the heat dissipation efficiency of the capacitor core in the inner cavity of the housing.

[0049] In one embodiment, another surface of the metal layer is covered within a portion of the housing that forms a cooling channel, and at least a portion of one surface of the metal layer is exposed to the interior cavity of the housing.

[0050] In this embodiment, the other surface of the metal layer covers part of the housing that forms the cooling channel, so that the metal layer can improve the structural strength of the housing. At least part of one surface of the metal layer is exposed to the inner cavity of the housing, so that the metal layer can improve the efficiency of the capacitor core in transferring heat to the housing, which facilitates the cooling channel to absorb the heat generated by the capacitor core more quickly and is beneficial to improving the heat dissipation efficiency of the motor controller module.

[0051] In one embodiment, the waterproof layer includes a metal plate distributed between the capacitor core and the housing along the arrangement direction of the heat sink and the housing.

[0052] In this embodiment, metal plates are distributed between the capacitor core and the housing along the arrangement direction of the heat sink and the housing. This allows the metal plates to isolate the cooling channels on the outer surfaces of the capacitor core and the housing, which helps ensure the reliability of the capacitor core. Furthermore, the metal plates can be directly placed inside the housing cavity, simplifying the process and making operation convenient. The metal plates also enhance the thermal conductivity between the capacitor core and the housing, resulting in better heat dissipation for the capacitor core.

[0053] In one embodiment, the capacitor core is fixed to the inner cavity of the housing by encapsulation with potting compound. The metal plate distributed between the capacitor core and the housing along the arrangement direction of the heat sink and the housing can be encapsulated and fixed at the same time during the process of fixing the capacitor core with potting compound, thereby simplifying the fixing process of the metal plate.

[0054] In one embodiment, a cavity is formed within a portion of the housing that constitutes the cooling channel, and the cavity serves as a water-proof layer.

[0055] In this embodiment, a cavity is formed within the portion of the housing constituting the cooling channel. This cavity serves as a water-proof layer, allowing cooling water from the cooling channel to seep into and accumulate within it, making it less likely to further penetrate into the inner cavity of the housing. This effectively isolates the cooling channel from the capacitor core, thereby improving the reliability of the capacitor core. Using the cavity as a water-proof layer also eliminates the need for additional components or materials to isolate the cooling channel from the capacitor core, thus reducing production costs.

[0056] In one embodiment, the hydrophobic coating, metal layer, metal plate, and cavity can be combined as needed to improve the isolation effect between the cooling channel and the capacitor core, thereby improving the reliability of the capacitor core.

[0057] In one embodiment, the housing includes multiple circuit board fixing protrusions. These protrusions extend from the outer surface of the housing away from the capacitor core protrusions along the arrangement direction of the heat sink and the housing. The multiple circuit board fixing protrusions are used to fix the circuit board of the motor controller. The circuit board, three-phase bridge arm, heat sink, and waterproof layer are sequentially stacked along the arrangement direction of the heat sink and the housing. The multiple circuit board fixing protrusions are distributed on both sides of the heat sink along a first direction perpendicular to the arrangement direction of the heat sink and the housing. The waterproof layer, along the first direction, is distributed at least in the portion of the housing between the multiple circuit board fixing protrusions.

[0058] In this embodiment, the housing includes multiple circuit board fixing protrusions. Along the arrangement direction of the heat sink and the housing, the multiple circuit board fixing protrusions move away from the capacitor core protrusions on the outer surface of the housing. This allows the multiple circuit board fixing protrusions to fix the circuit boards on the outer side of the three-phase bridge arm along the arrangement direction of the heat sink and the housing, so that the arrangement of the circuit boards does not interfere with the arrangement of the three-phase bridge arm.

[0059] In this embodiment, the circuit board, three-phase bridge arm, heat sink, and waterproof layer are stacked sequentially along the arrangement direction of the heat sink and the housing. This arrangement ensures that the three-phase bridge arm, heat sink, and waterproof layer do not occupy additional space on the circuit board outside the arrangement direction perpendicular to the heat sink and the housing. This makes the arrangement of the motor controller module compact, which is beneficial for the motor controller module to have a smaller volume and for the miniaturization of the motor controller.

[0060] In this embodiment, multiple circuit board fixing protrusions are distributed on both sides of the heat sink along a first direction, which is perpendicular to the arrangement direction of the heat sink and the housing. A water-resistant layer is distributed at least in a portion of the housing between the multiple circuit board fixing protrusions along the first direction. A portion of the outer surface of the housing is used to enclose the heat sink to form a cooling channel, allowing the water-resistant layer to cover the cooling channel between the multiple circuit board fixing protrusions. The water-resistant layer being distributed at least in a portion of the housing between the multiple circuit board fixing protrusions along the first direction also reduces material usage while achieving water resistance, saving materials. Furthermore, it allows the water-resistant layer to avoid the circuit board fixing protrusions, simplifying the water-resistant layer arrangement process.

[0061] In one embodiment, the housing further includes two water inlets for communicating with the internal flow channels of the motor controller housing, and a waterproof layer is distributed at least in the portion of the housing between the two water inlets, with the waterproof layer spaced apart from the two water inlets.

[0062] In this embodiment of the application, the housing also includes two water inlets, which are used to connect the internal flow channels of the motor controller housing. This allows the cooling flow channels to receive cooling water from the internal flow channels of the motor controller housing through one of the water inlets and discharge cooling water from the cooling flow channels into the internal flow channels of the motor controller housing through the other water inlet, thereby realizing the circulation of cooling water within the motor controller module and the motor controller housing.

[0063] In this embodiment, the water-proof layer is distributed at least in the portion of the shell between the two water inlets. The water-proof layer is spaced apart from the two water inlets, which can avoid the water-proof layer crossing the two water inlets and affecting the water-proof effect of the water-proof layer. This is beneficial to improving the water-proof effect of the water-proof layer on the cooling channel and capacitor core.

[0064] Secondly, this application provides a vehicle-mounted device, wherein the housing of the vehicle-mounted device is used to accommodate a motor controller module as described in the first aspect, the electrical control slot of the housing is used to accommodate the motor controller module, and the internal flow channel of the housing is used to connect to the cooling flow channel in the motor controller module.

[0065] In the motor controller module of this application embodiment, a cooling channel is formed by enclosing part of the outer surface of the bus capacitor housing with the heat sink. This reduces the thickness of the motor controller module and brings the cooling channel closer to the capacitor core, resulting in better heat dissipation for the capacitor core. A water-insulating layer is distributed between the cooling channel and the capacitor core, which isolates the cooling channel and the capacitor core. This reduces the thickness of the motor controller module while preventing cooling water in the cooling channel from seeping into the inner cavity of the bus capacitor housing, thus ensuring the reliability of the capacitor core and improving the reliability of the vehicle-mounted device.

[0066] In one embodiment, the electrical control tank includes an inlet channel and an outlet channel. The inlet of the inlet channel and the outlet of the outlet channel are located on the outer side of the housing, while the outlet of the inlet channel and the inlet of the outlet channel are located on the inner side of the housing. The outlet of the inlet channel and the inlet of the outlet channel protrude from the bottom of the electrical control tank toward the opening of the tank. The outlet of the inlet channel and the inlet of the outlet channel are used to connect to the cooling channel in the motor controller module. The projection of the water-resistant layer is distributed at least between the outlet of the inlet channel and the inlet of the outlet channel, along the arrangement direction of the heat sink and the housing.

[0067] In this embodiment, the two water inlets of the housing are distributed on both sides of the inner cavity of the housing. A capacitor core is arranged below the two water inlets along the arrangement direction of the heat sink and the housing. The two water inlets are arranged at a high position, so that the outlet of the liquid inlet channel and the inlet of the liquid outlet channel protrude from the bottom of the electrical control tank toward the opening of the electrical control tank. This makes it convenient for the motor controller module to be installed into the electrical control tank. The two water inlets of the housing can be directly connected to the outlet of the liquid inlet channel and the inlet of the liquid outlet channel, simplifying the installation process.

[0068] In this embodiment, the outlet of the liquid inlet channel and the inlet of the liquid outlet channel are respectively connected to two water inlets of the shell, so that the cooling channels are arranged between the outlet of the liquid inlet channel and the inlet of the liquid outlet channel. Along the arrangement direction of the heat sink and the shell, the projection of the water-proof layer is distributed at least between the outlet of the liquid inlet channel and the inlet of the liquid outlet channel, which is beneficial to improving the water-proof effect of the water-proof layer on the cooling channels and the capacitor core.

[0069] Thirdly, this application provides an electric vehicle, which includes an on-board unit as described in the second aspect, wherein the motor of the on-board unit is used to receive power from a power battery through a motor controller module to drive the wheels.

[0070] The vehicle-mounted device in this embodiment includes a motor controller module. The motor controller module utilizes a portion of the outer surface of the bus capacitor's housing and a heat sink to form a cooling channel, which reduces the thickness of the motor controller module and brings the cooling channel closer to the capacitor core, resulting in better heat dissipation for the capacitor core. A water-insulating layer is distributed between the cooling channel and the capacitor core, using the water-insulating layer to isolate the cooling channel and the capacitor core. This reduces the thickness of the motor controller module while preventing cooling water in the cooling channel from seeping into the inner cavity of the bus capacitor's housing, thus ensuring the reliability of the capacitor core and improving the reliability of the vehicle-mounted device, thereby improving the reliability of the entire vehicle. Attached Figure Description

[0071] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0072] Figure 1 This is a schematic diagram of an electric vehicle provided in an embodiment of this application;

[0073] Figure 2 This is a schematic diagram of a vehicle-mounted device provided in an embodiment of this application;

[0074] Figure 3 This is an exploded schematic diagram of a vehicle-mounted device provided in an embodiment of this application;

[0075] Figure 4 This is an exploded view of a motor controller module provided in an embodiment of this application;

[0076] Figure 5 This is a schematic diagram of a vehicle-mounted device provided in an embodiment of this application;

[0077] Figure 6 This is a schematic diagram of a motor controller module provided in an embodiment of this application;

[0078] Figure 7 This is a cross-sectional view of the motor controller module provided in an embodiment of this application;

[0079] Figure 8 yes Figure 7 A partial enlarged view of the M1 section of the motor controller module;

[0080] Figure 9 This is another cross-sectional view of the motor controller module provided in the embodiments of this application;

[0081] Figure 10 This is another schematic diagram of the motor controller module provided in the embodiments of this application;

[0082] Figure 11 This is another schematic diagram of the motor controller module provided in the embodiments of this application;

[0083] Figure 12 This is another schematic diagram of the motor controller module provided in the embodiments of this application;

[0084] Figure 13 This is another schematic diagram of the motor controller module provided in the embodiments of this application;

[0085] Figure 14 This is another schematic diagram of the motor controller module provided in the embodiments of this application;

[0086] Figure 15 This is another schematic diagram of the motor controller module provided in the embodiments of this application;

[0087] Figure 16 This is another schematic diagram of the motor controller module provided in the embodiments of this application;

[0088] Figure 17 This is another schematic diagram of the motor controller module provided in the embodiments of this application;

[0089] Figure 18 This is another schematic diagram of the motor controller module provided in the embodiments of this application;

[0090] Figure 19 This is another schematic diagram of the motor controller module provided in the embodiments of this application;

[0091] Figure 20 This is another schematic diagram of the motor controller module provided in the embodiments of this application;

[0092] Figure 21 This is another schematic diagram of the motor controller module provided in the embodiments of this application. Detailed Implementation

[0093] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0094] To reduce the size of the motor controller while improving the reliability of the bus capacitor, this application provides a motor controller module. The motor controller module includes a bus capacitor and a water-insulating layer. The inner cavity of the bus capacitor's housing is used to accommodate the capacitor core, and part of the outer surface of the housing is used to surround the heat sink to form a cooling channel. This allows the bus capacitor and the cooling channel to share the same housing, reducing the size and weight of the motor controller module. The cooling channel is used to cool the three-phase bridge arm fixed to the side of the heat sink away from the housing. The three-phase bridge arm is used to receive power from the electric vehicle's power battery through the capacitor core and output three-phase current to drive the electric vehicle's motor. The water-insulating layer is distributed between the cooling channel and the capacitor core, and the water-insulating layer is used to isolate the cooling channel and the capacitor core, preventing the cooling water from the cooling channel from seeping into the inner cavity of the bus capacitor's housing and affecting the reliability of the bus capacitor.

[0095] Figure 1 This is a schematic diagram of an electric vehicle 1 provided in an embodiment of this application. Figure 2 This is a schematic diagram of a vehicle-mounted device 10 provided in an embodiment of this application.

[0096] In one embodiment, the electric vehicle 1 includes an onboard unit 10, a frame 20, and a power battery 30, such as Figure 1 As shown, the frame 20 is used to fix the power battery 30 and the vehicle-mounted device 10. In this embodiment, the vehicle-mounted device 10 is used to receive power from the power battery 30 and to drive the wheels 40.

[0097] In this embodiment, the power battery 30 may also be referred to as a battery pack. In this embodiment, the electric vehicle 1 refers to a wheeled device driven or towed by a power unit.

[0098] In one embodiment, the on-board unit 10 is a powertrain, such as... Figure 2 As shown, the vehicle-mounted device 10 includes a motor 11, a reducer 12, and a motor controller 13. In this embodiment, the motor 11 includes a motor shaft (not shown), a stator (not shown), and a rotor (not shown). The rotor is fixedly mounted on the motor shaft. The stator drives the rotor to rotate after receiving alternating current, thereby driving the motor shaft to rotate. The reducer 12 includes a gear assembly (not shown), an input shaft (not shown), and an output shaft (not shown). The motor shaft of the motor 11 is used for transmission connection with the input shaft of the reducer 12. The input shaft receives the power transmitted from the motor shaft of the motor 11 and transmits the power to the output shaft through the gear assembly. The output shaft is used to drive the wheels to rotate. In one embodiment, the reducer 12 is a parallel shaft reducer. In another embodiment, the reducer 12 is a planetary reducer.

[0099] In one embodiment, such as Figure 1 and Figure 2 As shown, the on-board device 10 is a motor controller 13, which controls the motor 11 of the electric vehicle 1 to drive the wheels 40 of the electric vehicle 1. The motor controller 13 receives the DC power supplied by the power battery 30 and converts the DC power into AC power to be supplied to the motor 11. The power battery 30 is connected to the windings of the motor 11 through the motor controller 13 to drive the motor 11.

[0100] Figure 3 This is an exploded schematic diagram of the vehicle-mounted device 10 provided in an embodiment of this application. Figure 4 This is an exploded view of a motor controller module 200 provided in an embodiment of this application.

[0101] In one embodiment, such as Figure 3 and Figure 4 As shown, the housing 100 of the vehicle-mounted device 10 includes an electrical control slot 110, which is used to house the motor controller module 200. The internal flow channel of the housing 100 is used to connect to the cooling flow channel 221 in the motor controller module 200. The motor controller module 200 is used to convert the DC power transmitted from the power battery 30 into AC power.

[0102] In one embodiment, such as Figure 4 As shown, the motor controller module 200 includes a bus capacitor 210, a heat sink 220, a three-phase bridge arm 230, and a circuit board 240.

[0103] In this embodiment, the bus capacitor 210 is used to stabilize the bus voltage and filter the DC current, including smoothing the DC voltage, eliminating high-frequency harmonics, and reducing voltage ripple. The bus capacitor 210 also has an energy storage function, including providing instantaneous energy, buffering instantaneous power demands, and absorbing feedback energy. In one embodiment, the bus capacitor 210 includes multiple capacitor cells 211, the number and capacity of which are designed according to requirements. When the capacitor cells 211 come into contact with water, it will affect the reliability of the bus capacitor 210 in its DC voltage regulation, filtering, and energy storage functions.

[0104] In this embodiment, the three-phase bridge arm 230 includes multiple power switching transistors (not shown), and is used to convert direct current (DC) to alternating current (AC). In one embodiment, the three-phase bridge arm 230 includes three power modules 231, each power module 231 including multiple power switching transistors, and each power module 231 is used to convert DC to one phase of AC. In one embodiment, the three power modules 231 are arranged sequentially.

[0105] In the embodiments of this application, such as Figure 3 and Figure 4 As shown, the radiator 220 is used to cool the three-phase bridge arm 230. The radiator 220 includes at least one cooling channel 221. The radiator 220 is used to connect the housing 100 of the vehicle-mounted device 10 and to the external vehicle cooling circulation system through the internal channel of the housing 100.

[0106] In one embodiment, such as Figure 3 and Figure 4 As shown, the electrical control tank 110 includes an inlet channel 111 and an outlet channel 112. The inlet 111a of the inlet channel 111 and the outlet 112a of the outlet channel 112 are located on the outer side of the housing 100 and are used to connect to the vehicle cooling circulation system. The outlet 111b of the inlet channel 111 and the inlet 112b of the outlet channel 112 are located on the inner side of the housing 100 and are used to connect to the cooling channel 221 in the motor controller module 200.

[0107] Figure 5 This is a schematic diagram of a vehicle-mounted device 10 provided in an embodiment of this application.

[0108] In one embodiment, the on-board unit 10 is a powertrain, such as... Figure 5 As shown, the housing 100 of the vehicle-mounted device 10 also includes a motor slot 120 and a reducer slot 130. The motor slot 120 is used to accommodate the stator and rotor of the motor 11, and the reducer slot 130 is used to accommodate the gear assembly of the reducer 12. The motor slot 120, reducer slot 130, and electronic control slot 110 are integrally integrated into the housing 100 of the vehicle-mounted device 10. Specifically, the slot opening 121 of the motor slot 120 and the slot opening 131 of the reducer slot 130 are opposite to each other along the axial direction of the vehicle-mounted device 10, and the electronic control slot 110 is stacked on the outer periphery of the slots of the motor slot 120 and the reducer slot 130. In this embodiment, the housing 100 integrally integrates the motor slot 120, reducer slot 130, and electronic control slot 110, making the arrangement of the motor 11, reducer 12, and motor controller 13 more compact and reducing the volume of the vehicle-mounted device 10.

[0109] Electric vehicle motor controllers require numerous electronic and electrical components, such as DC filters, bus capacitors, power modules, and heat sinks. The large number of parts results in a large controller size and low integration. To reduce the controller's size and fit the vehicle's overall layout, the bus capacitor and heat sink share a common housing to reduce structural components. However, the bus capacitor housing is typically made of plastic. This plastic housing allows cooling water to seep into the inner cavity of the bus capacitor housing, affecting the reliability of the capacitor core within the bus capacitor.

[0110] In this embodiment, a water-insulating layer is arranged between the cooling channel in the heat sink and the capacitor core of the bus capacitor. The water-insulating layer is used to isolate the cooling channel and the capacitor core, so as to prevent the cooling water of the cooling channel from seeping into the inner cavity of the bus capacitor shell and affecting the reliability of the bus capacitor.

[0111] The motor controller module 200 provided in the embodiments of this application will be described in detail below.

[0112] Figure 6 This is a schematic diagram of a motor controller module 200 provided in an embodiment of this application. Figure 7 This is a cross-sectional view of the motor controller module 200 provided in an embodiment of this application. Figure 8 yes Figure 7 A partial enlarged view of the M1 section of the motor controller module 200.

[0113] In one embodiment, such as Figure 4 , Figures 6 to 8 As shown, the motor controller module 200 in the vehicle-mounted device 10 includes a bus capacitor 210 and a water-insulating layer 250. The inner cavity 2121 of the housing 212 of the bus capacitor 210 is used to accommodate the capacitor core 211. Part of the outer surface 2122 of the housing 212 is used to surround the heat sink 222 to form a cooling channel 221. The cooling channel 221 is used to cool the three-phase bridge arm 230 fixed to the side of the heat sink 222 away from the housing 212. The three-phase bridge arm 230 is used to receive power from the power battery 30 of the electric vehicle 1 through the capacitor core 211 and output three-phase current to drive the motor 11 of the electric vehicle 1. The water-insulating layer 250 is distributed between the cooling channel 221 and the capacitor core 211, and the water-insulating layer 250 is used to isolate the cooling channel 221 and the capacitor core 211.

[0114] In this embodiment, the inner cavity 2121 of the housing 212 of the bus capacitor 210 is used to accommodate the capacitor core 211, and a portion of the outer surface 2122 of the housing 212 is used to enclose the heat sink 222 to form a cooling channel 221. This allows the cooling channel 221 to share a portion of the housing 212 of the bus capacitor 210, resulting in a higher degree of integration and fusion of the motor controller module 200. It also reduces the thickness of the motor controller module 200, which is beneficial for reducing the volume of the vehicle device 10. Furthermore, it reduces the distance between the capacitor core 211 and the cooling channel 221, which is beneficial for improving the heat dissipation effect.

[0115] In this embodiment, the cooling channel 221 is used to cool the three-phase bridge arm 230 fixed to the heat sink 222 on the side away from the housing 212. The three-phase bridge arm 230 is used to receive power from the power battery 30 of the electric vehicle 1 through the capacitor core 211 and output three-phase current to drive the motor 11 of the electric vehicle 1, so that the three-phase bridge arm 230 can continuously dissipate heat, which is beneficial to ensure the normal operation of the three-phase bridge arm 230.

[0116] In the embodiments of the application, the housing 212 of the bus capacitor 210 is generally a plastic housing 212. The cooling channel 221 formed by the plastic housing 212 causes the cooling water in the cooling channel 221 to seep from the plastic housing 212 into the inner cavity 2121 of the housing 212 of the bus capacitor 210, affecting the reliability of the capacitor core 211 in the inner cavity 2121 of the bus capacitor 210. By distributing the water-proof layer 250 between the cooling channel 221 and the capacitor core 211, the cooling channel 221 and the capacitor core 211 can be isolated by the water-proof layer 250, which can prevent the cooling water in the cooling channel 221 from seeping into the inner cavity 2121 of the housing 212 of the bus capacitor 210 and affecting the reliability of the bus capacitor 210.

[0117] In the embodiment of the application, a cooling channel 221 is formed by enclosing a portion of the outer surface 2122 of the casing 212 of the bus capacitor 210 with the heat sink 222. This reduces the thickness of the motor controller module 200 and brings the cooling channel 221 closer to the capacitor core 211, resulting in better heat dissipation for the capacitor core 211. A water-insulating layer 250 is distributed between the cooling channel 221 and the capacitor core 211, isolating the cooling channel 221 and the capacitor core 211. This reduces the thickness of the motor controller module 200 while preventing cooling water in the cooling channel 221 from seeping into the inner cavity 2121 of the casing 212 of the bus capacitor 210, thus ensuring the reliability of the capacitor core 211.

[0118] In one embodiment, the housing 212 of the bus capacitor 210 is made of polyphenylene sulfide, which can provide the bus capacitor 210 with lightweight, insulation and high temperature protection.

[0119] In one embodiment, such as Figure 7 and Figure 8 As shown, the projection of the Z-layer 250 along the arrangement direction of the heat sink 222 and the housing 212 covers the capacitor core package 211.

[0120] In the embodiment of the application, the projection of the water-insulating layer 250 along the Z-direction of the arrangement of the heat sink 222 and the housing 212 covers the capacitor core package 211, so that the capacitor core package 211 is arranged in the Z-direction of the arrangement of the heat sink 222 and the housing 212 within the envelope of the water-insulating layer 250. This allows the cooling water in the cooling channel 221 to avoid flowing to the capacitor core package 211 when it seeps from the outer surface 2122 of the housing 212 into the inner cavity 2121 of the housing 212. This is beneficial for effectively isolating the impact of moisture on the reliability of the capacitor core package 211 and improving the water-insulating effect of the water-insulating layer 250 on the capacitor core package 211.

[0121] In one embodiment, such as Figure 7 and Figure 8As shown, the projection of the Z-water barrier 250 along the arrangement direction of the heat sink 222 and the housing 212 covers the cooling channel 221.

[0122] In this embodiment, the projection of the water-insulating layer 250 along the arrangement direction of the heat sink 222 and the housing 212 covers the cooling channel 221. This allows the cooling water in the cooling channel 221 to seep into the housing 212 of the bus capacitor 210, effectively blocking the seeping cooling water through the larger water-insulating layer 250. This improves the water-insulating effect of the water-insulating layer 250 on the capacitor core 211, thereby reducing the impact of moisture on the reliability of the capacitor core 211.

[0123] In one embodiment, such as Figure 7 and Figure 8 As shown, the projection of the Z-layer 250 along the arrangement direction of the heat sink 222 and the housing 212 covers the capacitor core package 211 and the cooling channel 221.

[0124] In this embodiment, the projection of the water-insulating layer 250 along the Z-direction of the arrangement of the heat sink 222 and the housing 212 covers the capacitor core 211 and the cooling channel 221, so that the cooling water seeping into the housing 212 from the cooling channel 221 can be blocked by the water-insulating layer 250, and the moisture flowing towards the capacitor core 211 along the Z-direction of the arrangement of the heat sink 222 and the housing 212 can also be blocked by the water-insulating layer 250, so that the water-insulating layer 250 has a better isolation effect on the cooling channel 221 and the capacitor core 211.

[0125] In one embodiment, such as Figure 8 As shown, the thickness of the water-insulating layer 250 along the arrangement direction of the heat sink 222 and the housing 212 is less than the thickness of the portion of the housing 212 used to form the cooling channel 221.

[0126] In this embodiment, the thickness of the water-insulating layer 250 along the arrangement direction of the heat sink 222 and the housing 212 is less than the thickness of the portion of the housing 212 used to form the cooling channel 221. This allows the motor controller module 200 to be smaller and lighter while ensuring the water-insulating effect of the water-insulating layer 250 on the capacitor core 211. It also makes the process of embedding the water-insulating layer 250 into the housing 212 of the bus capacitor 210 simpler, simplifying the manufacturing process.

[0127] In one embodiment, such as Figure 4 , Figure 6 and Figure 7The outer surface 2122 of the housing 212 is recessed towards the capacitor core 211 to form a groove 2123. The groove 2123 is used to surround the heat sink 222 to form a cooling channel 221. The housing 212 also includes a plurality of protrusions 2124, each protruding from the bottom 2125 of the groove 2123 toward its opening 2126. For example... Figure 7 and Figure 8 As shown, the waterproof layer 250 is distributed in at least one of the bottom 2125 of the groove 2123, the peripheral wall 2127 of the groove 2123, and the plurality of protrusions 2124.

[0128] In this embodiment, the outer surface 2122 of the housing 212 is recessed towards the capacitor core 211 to form a groove 2123. The groove 2123 encloses the heat sink 222 to form a cooling channel 221, resulting in a smaller height for the motor controller module 200. The housing 212 also includes multiple protrusions 2124, each protruding from the bottom 2125 of the groove 2123 toward its opening 2126. These protrusions can turbulently flow the cooling water in the cooling channel 221, thereby adjusting the flow resistance and flow rate distribution of the cooling water. Furthermore, the protrusions 2124 increase the heat dissipation area of ​​the housing 212 in contact with the cooling water, which is beneficial for improving the heat dissipation efficiency of the motor controller module 200.

[0129] In this embodiment, the water-proof layer 250 is distributed in at least one of the groove bottom 2125, the groove peripheral wall 2127, and the multiple protrusions 2124 of the groove 2123. This can prevent cooling water in the cooling channel 221 from seeping into the inner cavity 2121 of the housing 212 from the groove bottom 2125, the groove peripheral wall 2127, and the protrusions 2124 of the groove 2123, effectively reducing the impact of moisture on the reliability of the capacitor core package 211 in the inner cavity 2121 of the housing 212.

[0130] Figure 9 This is another cross-sectional view of the motor controller module 200 provided in the embodiments of this application.

[0131] In one embodiment, such as Figure 4 and Figure 9As shown, the radiator 220 also includes a partition plate 223. The partition plate 223 is arranged between the groove 2123 and the radiator 222 along the Z-direction of the arrangement of the radiator plate 222 and the housing 212. The radiator plate 222 is recessed away from the partition plate 223 to form another groove 2221. The partition plate 223 is used to enclose the other groove 2221 to form another cooling channel 224. The radiator plate 222 also includes a plurality of protrusions 2222. Each protrusion 2222 protrudes from the bottom 2223 of the other groove 2221 toward its opening 2224. The groove 2123, the partition plate 223 and the radiator plate 222 are stacked in sequence along the Z-direction of the arrangement of the radiator plate 222 and the housing 212. The two cooling channels 221 and 224 are stacked in sequence. The waterproof layer 250 is distributed in at least one of the bottom 2125 of the groove 2123, the peripheral wall 2127 of the groove 2123, the peripheral wall of another groove 2221, and the plurality of protrusions 2124.

[0132] In this embodiment, the partition plate 223 is used to enclose another groove 2221 to form another cooling channel 224, so that the motor controller module 200 includes two cooling channels 221 and 224, which is beneficial to improving the heat dissipation effect of the three-phase bridge arm 230 and capacitor core 211 in the motor controller module 200.

[0133] In this embodiment, the water-proof layer 250 is distributed in at least one of the bottom 2125 of the groove 2123, the peripheral wall 2127 of the groove 2123, the peripheral wall of another groove 2221, and the multiple protrusions 2124. This helps to prevent the cooling water of the two cooling channels 221 and 224 from seeping into the inner cavity 2121 of the housing 212, reducing the possibility of moisture entering the inner cavity 2121 and affecting the capacitor core package 211, and improving the reliability of the capacitor core package 211.

[0134] In one embodiment, such as Figure 4 and Figure 6 As shown, the housing 212 includes multiple circuit board fixing protrusions 2130. Along the arrangement direction Z of the heat sink 222 and the housing 212, the multiple circuit board fixing protrusions 2130 protrude from the outer surface 2122 of the housing 212 away from the capacitor core package 211. The multiple circuit board fixing protrusions 2130 are used to fix the circuit board 240 of the motor controller 13. Along the arrangement direction Z of the heat sink 222 and the housing 212, the circuit board 240, the three-phase bridge arm 230, the heat sink 222, and the waterproof layer 250 are stacked sequentially. The multiple circuit board fixing protrusions 2130 are distributed along a first direction Y on both sides of the heat sink 222, and the first direction Y is perpendicular to the arrangement direction Z of the heat sink 222 and the housing 212. Along the first direction Y, the waterproof layer 250 is distributed at least in the portion of the housing 212 between the multiple circuit board fixing protrusions 2130.

[0135] In this embodiment, the housing 212 includes a plurality of circuit board fixing protrusions 2130. Along the arrangement direction Z of the heat sink 222 and the housing 212, the plurality of circuit board fixing protrusions 2130 protrude from the outer surface 2122 of the housing 212 away from the capacitor core package 211. This facilitates the plurality of circuit board fixing protrusions 2130 to fix the circuit board 240 on the outer side of the three-phase bridge arm 230 along the arrangement direction Z of the heat sink 222 and the housing 212, so that the arrangement of the circuit board 240 does not interfere with the arrangement of the three-phase bridge arm 230.

[0136] In this embodiment, the circuit board 240, the three-phase bridge arm 230, the heat sink 222 and the waterproof layer 250 are stacked sequentially along the Z-direction of the arrangement of the heat sink 222 and the housing 212. This arrangement ensures that the three-phase bridge arm 230, the heat sink 222 and the waterproof layer 250 do not occupy additional space of the circuit board 240 outside the Z-direction perpendicular to the arrangement of the heat sink 222 and the housing 212. This makes the arrangement of the motor controller module 200 compact, which is beneficial for the motor controller module 200 to have a smaller volume and for the miniaturization of the motor controller 13.

[0137] In this embodiment, multiple circuit board fixing protrusions 2130 are distributed along a first direction Y on both sides of the heat sink 222. The first direction Y is perpendicular to the arrangement direction Z of the heat sink 222 and the housing 212. A water-resistant layer 250 is distributed at least in a portion of the housing 212 between the multiple circuit board fixing protrusions 2130 along the first direction Y. A portion of the outer surface 2122 of the housing 212 is used to enclose the heat sink 222 to form a cooling channel 221, so that the water-resistant layer 250 can cover the cooling channel 221 between the multiple circuit board fixing protrusions 2130. The fact that the water-resistant layer 250 is distributed at least in a portion of the housing 212 between the multiple circuit board fixing protrusions 2130 along the first direction Y also reduces material usage and saves materials while achieving water resistance. It also allows the water-resistant layer 250 to avoid the circuit board fixing protrusions 2130, simplifying the arrangement process of the water-resistant layer 250.

[0138] in, Figure 4 and Figure 6 The 250 in the waterproof layer is only a schematic representation and does not indicate the specific structure.

[0139] In one embodiment, such as Figure 3 , Figure 4 and Figure 6 As shown, the housing 212 also includes two water inlets 2131, which are used to connect the internal flow channels of the housing 100a of the motor controller 13. The water-proof layer 250 is distributed at least in the portion of the housing 212 between the two water inlets 2131, and the water-proof layer 250 is spaced apart from the two water inlets 2131.

[0140] In this embodiment, the housing 212 further includes two water inlets 2131. The two water inlets 2131 are used to connect the internal flow channels of the housing 100a of the motor controller 13, so that the cooling flow channel 221 can receive cooling water in the internal flow channels of the housing 100a of the motor controller 13 through one of the water inlets 2131, and discharge cooling water from the cooling flow channel 221 into the internal flow channels of the housing 100a of the motor controller 13 through the other water inlet 2131, thereby realizing the flow of cooling water in the motor controller module 200 and the housing 100a of the motor controller 13.

[0141] In this embodiment, the water-proof layer 250 is distributed at least in the portion of the shell 212 between the two water inlets 2131. The water-proof layer 250 is spaced apart from the two water inlets 2131, which can avoid the water-proof layer 250 crossing the two water inlets 2131 and affecting the water-proof effect of the water-proof layer 250. This is beneficial to improving the water-proof effect of the water-proof layer 250 on the cooling channel 221 and the capacitor core package 211.

[0142] In one embodiment, such as Figure 3 , Figure 4 and Figure 6 As shown, the electrical control tank 110 includes an inlet channel 111 and an outlet channel 112. The outlet 111b of the inlet channel 111 and the inlet 112b of the outlet channel 112 protrude from the bottom 113 of the electrical control tank 110 toward the opening 114 of the electrical control tank 110. Along the Z-direction of the arrangement of the heat sink 222 and the housing 212, the projection of the water-proof layer 250 is at least distributed between the outlet 111b of the inlet channel 111 and the inlet 112b of the outlet channel 112.

[0143] In this embodiment, the two water inlets 2131 of the housing 212 are distributed on both sides of the inner cavity 2121 of the housing 212. A capacitor core package 211 is arranged below the two water inlets 2131 along the arrangement direction Z of the heat sink 222 and the housing 212. The arrangement position of the two water inlets 2131 is relatively high, so that the outlet 111b of the liquid inlet channel 111 and the inlet 112b of the liquid outlet channel 112 protrude from the bottom 113 of the electrical control tank 110 toward the opening 114 of the electrical control tank 110. This makes it convenient for the motor controller module 200 to be installed into the electrical control tank 110. The two water inlets 2131 of the housing 212 can be directly connected to the outlet 111b of the liquid inlet channel 111 and the inlet 112b of the liquid outlet channel 112, simplifying the installation process.

[0144] In this embodiment, the outlet 111b of the liquid inlet channel 111 and the inlet 112b of the liquid outlet channel 112 are respectively connected to the two water inlets 2131 of the housing 212, so that the cooling channel 221 is arranged between the outlet 111b of the liquid inlet channel 111 and the inlet 112b of the liquid outlet channel 112. Along the Z-direction of the arrangement of the heat sink 222 and the housing 212, the projection of the water-proof layer 250 is at least distributed between the outlet 111b of the liquid inlet channel 111 and the inlet 112b of the liquid outlet channel 112, which is beneficial to improve the water-proof effect of the water-proof layer 250 on the cooling channel 221 and the capacitor core 211.

[0145] In one embodiment, such as Figure 7 and Figure 8 As shown, the water-proof layer 250 includes a hydrophobic coating 251, which is applied to the outer surface 2122 of the housing 212 to form the cooling channel 221.

[0146] In this embodiment, a hydrophobic coating 251 is used as the water-proof layer 250, which simplifies the processing of the water-proof layer 250 and reduces the thickness of the motor controller module 200. Applying the hydrophobic coating 251 to the outer surface 2122 of the housing 212, which forms the cooling channel 221, prevents cooling water in the cooling channel 221 from seeping into the housing 212 of the bus capacitor 210 from the outer surface 2122. This avoids moisture generated in the inner cavity 2121 of the housing 212, which could affect the reliability of the capacitor core 211.

[0147] In one embodiment, a hydrophobic coating 251 is applied to the bottom 2125 of the groove 2123, the peripheral wall 2127 of the groove 2123, and the multiple protrusions 2124 to improve the water-proofing effect. In another embodiment, since the hydrophobic coating 251 is applied to the bottom 2125 of the groove 2123, the peripheral wall 2127 of the groove 2123, and the surfaces of the multiple protrusions 2124, the cooling water of the cooling channel 221 is isolated from the capacitor core 211 from the outer surface 2122 of the housing 212. The area of ​​the hydrophobic coating 251 along the Z-direction of the arrangement of the heat sink 222 and the housing 212 can cover the bottom 2125 of the groove 2123, thereby reducing the material cost of the hydrophobic coating 251 and simplifying the process while achieving water-proofing.

[0148] Figure 10 This is another schematic diagram of the motor controller module 200 provided in the embodiments of this application.

[0149] In one embodiment, such as Figure 10 As shown, a hydrophobic coating 251 is applied to the inner surface 2128 of the housing 212 facing the capacitor core package 211.

[0150] In this embodiment, a hydrophobic coating 251 is applied to the inner surface 2128 of the housing 212 facing the capacitor core 211, so that even if the cooling water in the cooling channel 221 seeps into the housing 212, it will not enter the inner cavity 2121 of the housing 212 from the inner surface 2128 facing the capacitor core 211 and affect the reliability of the capacitor core 211.

[0151] In one embodiment, when the hydrophobic coating 251 is applied to the inner surface 2128 of the housing 212 facing the capacitor core 211, and the cooling channel 221 does not have a water-proof layer 250, the area of ​​the hydrophobic coating 251 along the Z-direction of the arrangement of the heat sink 222 and the housing 212 covers the capacitor core 211, preventing water from the cooling channel 221 from seeping into the inner surface 2128 of the housing 212 from the bottom 2125 of the groove 2123 or the peripheral wall 2127 of the groove 2123 and coming into contact with the capacitor core 211, thereby improving the water-proof effect on the capacitor core 211.

[0152] Figure 11 This is another schematic diagram of the motor controller module 200 provided in the embodiments of this application.

[0153] In one embodiment, such as Figure 4 and Figure 11 As shown, the hydrophobic coating 251 is applied to at least the surface 2111 of the capacitor core 211 facing the cooling channel 221.

[0154] In this embodiment, a hydrophobic coating 251 is applied to at least the surface 2111 of the capacitor core 211 facing the cooling channel 221, so that even if cooling water in the cooling channel 221 seeps from the housing 212 of the bus capacitor 210 into the inner cavity 2121 of the housing 212, the hydrophobic coating 251 on the surface 2111 of the capacitor core 211 can isolate the influence of moisture on the capacitor core 211, thereby ensuring the reliability of the operation of the capacitor core 211.

[0155] In one embodiment, a hydrophobic coating 251 is applied to all surfaces of the capacitor core package 211 to enhance the water-repellent effect on the capacitor core package 211.

[0156] Figure 12 This is another schematic diagram of the motor controller module 200 provided in the embodiments of this application.

[0157] In one embodiment, such as Figure 12 As shown, a hydrophobic coating 251 is applied to the outer surface 2122 of the housing 212 that forms the cooling channel 221 and the inner surface 2128 of the housing 212 facing the capacitor core 211.

[0158] In this embodiment, a hydrophobic coating 251 is applied to the outer surface 2122 of the housing 212 that forms the cooling channel 221, preventing cooling water in the cooling channel 221 from seeping into the housing 212 of the bus capacitor 210. This avoids moisture generated in the inner cavity 2121 of the housing 212, which could affect the reliability of the capacitor core 211. The hydrophobic coating 251 is also applied to the inner surface 2128 of the housing 212 facing the capacitor core 211, ensuring that even if cooling water in the cooling channel 221 seeps into the housing 212, it will not penetrate the hydrophobic coating 251 outside the inner surface 2128 of the housing 212 and enter the inner cavity 2121 of the housing 212, thus preventing any impact on the reliability of the capacitor core 211.

[0159] In this embodiment, the hydrophobic coating 251 is applied to the outer surface 2122 of the housing 212 that forms the cooling channel 221 and the inner surface 2128 of the housing 212 facing the capacitor core 211, so that the inner and outer surfaces 2122 and 2128 of the housing 212 of the bus capacitor 210 are both covered by the hydrophobic coating 251, which has double water-proof protection and can improve the isolation effect of the water-proof layer 250 on the cooling channel 221 and the capacitor core 211.

[0160] Figure 13 This is another schematic diagram of the motor controller module 200 provided in the embodiments of this application.

[0161] In one embodiment, such as Figure 13 As shown, a hydrophobic coating 251 is applied to the inner surface 2128 of the housing 212 facing the capacitor core 211 and at least to the surface 2111 of the capacitor core 211 facing the cooling channel 221.

[0162] In this embodiment, a hydrophobic coating 251 is applied to the inner surface 2128 of the housing 212 facing the capacitor core 211, so that even if cooling water in the cooling channel 221 seeps into the housing 212, it will not enter the inner cavity 2121 of the housing 212 and affect the reliability of the capacitor core 211. The hydrophobic coating 251 is applied at least to the surface 2111 of the capacitor core 211 facing the cooling channel 221, so that even if cooling water in the cooling channel 221 seeps from the housing 212 of the bus capacitor 210 into the inner cavity 2121 of the housing 212, the hydrophobic coating 251 on the surface 2111 of the capacitor core 211 can isolate the capacitor core 211 from the influence of moisture, thereby ensuring the reliability of the capacitor core 211.

[0163] In this embodiment, a hydrophobic coating 251 is applied to the inner surface 2128 of the housing 212 facing the capacitor core 211 and at least to the surface 2111 of the capacitor core 211 facing the cooling channel 221. On the one hand, the hydrophobic coating 251 applied to the inner surface 2128 of the housing 212 facing the capacitor core 211 can prevent cooling water in the cooling channel from entering the inner cavity 2121 of the housing 212. On the other hand, even if cooling water passes through the hydrophobic coating 251 applied to the inner surface 2128 of the housing 212 facing the capacitor core 211, the hydrophobic coating 251 on the surface 2111 of the capacitor core 211 facing the cooling channel 221 can still prevent moisture in the inner cavity 2121 from affecting the reliability of the capacitor core 211. This provides double water-proof protection and can improve the isolation effect of the water-proof layer 250 on the cooling channel 221 and the capacitor core 211.

[0164] Figure 14 This is another schematic diagram of the motor controller module 200 provided in the embodiments of this application.

[0165] In one embodiment, such as Figure 14 As shown, a hydrophobic coating 251 is applied to the outer surface 2122 of the housing 212 that forms the cooling channel 221 and at least to the surface 2111 of the capacitor core 211 facing the cooling channel 221.

[0166] In this embodiment, a hydrophobic coating 251 is applied to the outer surface 2122 of the housing 212 that forms the cooling channel 221, preventing cooling water in the cooling channel 221 from seeping into the housing 212 of the bus capacitor 210. This avoids moisture generated in the inner cavity 2121 of the housing 212, which could affect the reliability of the capacitor core 211. The hydrophobic coating 251 is also applied at least to the surface 2111 of the capacitor core 211 facing the cooling channel 221. This ensures that even if cooling water in the cooling channel 221 seeps into the inner cavity 2121 of the housing 212 from the housing 210, the hydrophobic coating 251 on the surface 2111 of the capacitor core 211 can isolate moisture from the capacitor core 211, thus guaranteeing the reliability of the capacitor core 211.

[0167] In this embodiment, a hydrophobic coating 251 is applied to the outer surface 2122 of the housing 212 that forms the cooling channel 221 and at least to the surface 2111 of the capacitor core 211 facing the cooling channel 221. This ensures that even if cooling water in the cooling channel 221 leaks from the hydrophobic coating 251 on the outer surface 2122 of the housing 212 into the inner cavity 2121 of the housing 212, the hydrophobic coating 251 on the surface 2111 of the capacitor core 211 facing the cooling channel 221 can still prevent moisture in the inner cavity 2121 from affecting the reliability of the capacitor core 211. This provides double waterproof protection and improves the isolation effect of the waterproof layer 250 on the cooling channel 221 and the capacitor core 211.

[0168] Figure 15 This is another schematic diagram of the motor controller module 200 provided in the embodiments of this application.

[0169] In one embodiment, such as Figure 15 As shown, a hydrophobic coating 251 is applied to the outer surface 2122 of the housing 212 that forms the cooling channel 221, the inner surface 2128 of the housing 212 facing the capacitor core 211, and at least to the surface 2111 of the capacitor core 211 facing the cooling channel 221.

[0170] In this embodiment, a hydrophobic coating 251 is applied to the outer surface 2122 of the housing 212 that forms the cooling channel 221, preventing cooling water in the cooling channel 221 from seeping into the housing 212 of the bus capacitor 210. This avoids moisture generated in the inner cavity 2121 of the housing 212, which could affect the reliability of the capacitor core 211. The hydrophobic coating 251 is also applied to the inner surface 2128 of the housing 212 facing the capacitor core 211, ensuring that even if cooling water in the cooling channel 221 seeps into the housing 212, it will not enter the inner cavity 2121 of the housing 212 and affect the reliability of the capacitor core 211. The hydrophobic coating 251 is applied to at least the surface 2111 of the capacitor core 211 facing the cooling channel 221, so that even if the cooling water in the cooling channel 221 seeps from the casing 212 of the bus capacitor 210 into the inner cavity 2121 of the casing 212, the hydrophobic coating 251 on the surface 2111 of the capacitor core 211 can isolate the effect of moisture on the capacitor core 211, thereby ensuring the reliability of the operation of the capacitor core 211.

[0171] In this embodiment, the hydrophobic coating 251 is applied to the outer surface 2122 of the housing 212 that forms the cooling channel 221, the inner surface 2128 of the housing 212 facing the capacitor core 211, and at least to the surface 2111 of the capacitor core 211 facing the cooling channel 221. This can prevent cooling water in the cooling channel from seeping into the inner cavity 2121 of the housing 212, and can also prevent moisture in the inner cavity 2121 from affecting the reliability of the capacitor core 211. It has multiple water-proof protections and can improve the isolation effect of the water-proof layer 250 on the cooling channel 221 and the capacitor core 211.

[0172] Figure 16 This is another schematic diagram of the motor controller module 200 provided in the embodiments of this application.

[0173] In one embodiment, such as Figure 16 As shown, the waterproof layer 250 includes a metal layer 252, which is injection molded onto a portion of the housing 212 that forms the cooling channel 221.

[0174] In this embodiment, the water-proof layer 250 includes a metal layer 252. The metal layer 252 can improve the heat conduction of the housing 212 while achieving water isolation between the cooling channel 221 and the capacitor core 211, so that the heat of the capacitor core 211 can be absorbed by the cooling channel 221 more evenly and faster, which is beneficial to improving the heat dissipation effect of the motor controller module 200.

[0175] In this embodiment, the housing 212 is made of plastic. Compared with plastic, metal has a higher structural strength. By injection molding the metal layer 252 onto the part of the housing 212 that constitutes the cooling channel 221, the structural strength of the housing 212 can be improved, thereby improving the reliability of the motor controller module 200.

[0176] Figure 17 This is another schematic diagram of the motor controller module 200 provided in the embodiments of this application.

[0177] In one embodiment, such as Figure 17 As shown, one surface 2521 of the metal layer 252 is covered within a portion of the housing 212 that constitutes the cooling channel 221, and at least a portion of the other surface 2522 of the metal layer 252 is exposed within the cooling channel 221.

[0178] In this embodiment of the application, one surface 2521 of the metal layer 252 covers part of the housing 212 that constitutes the cooling channel 221, so that the metal layer 252 can improve the structural strength of the housing 212. At least part of the other surface 2522 of the metal layer 252 is exposed in the cooling channel 221, so that the metal layer 252 can also improve the heat exchange efficiency between the housing 212 and the cooling channel 221, thereby improving the heat dissipation efficiency of the capacitor core 211 in the inner cavity 2121 of the housing 212.

[0179] Figure 18 This is another schematic diagram of the motor controller module 200 provided in the embodiments of this application.

[0180] In one embodiment, such as Figure 18 As shown, another surface 2522 of the metal layer 252 covers a portion of the housing 212 that forms the cooling channel 221, and at least a portion of one surface 2521 of the metal layer 252 is exposed to the inner cavity 2121 of the housing 212.

[0181] In this embodiment, another surface 2522 of the metal layer 252 covers part of the housing 212 that constitutes the cooling channel 221, so that the metal layer 252 can improve the structural strength of the housing 212. At least part of one surface 2521 of the metal layer 252 is exposed to the inner cavity 2121 of the housing 212, so that the metal layer 252 can improve the efficiency of the capacitor core 211 in transferring heat to the housing 212, which facilitates the cooling channel 221 to absorb the heat generated by the capacitor core 211 more quickly, which is beneficial to improving the heat dissipation efficiency of the motor controller module 200.

[0182] Figure 19 This is another schematic diagram of the motor controller module 200 provided in the embodiments of this application.

[0183] In one embodiment, such as Figure 19 As shown, the waterproof layer 250 includes a metal plate 253, which is distributed between the capacitor core package 211 and the housing 212 along the arrangement direction Z of the heat dissipation plate 222 and the housing 212.

[0184] In this embodiment, a metal plate 253 is distributed between the capacitor core 211 and the housing 212 along the Z-direction of the heat sink 222 and the housing 212. This allows the metal plate 253 to isolate the cooling channels 221 on the outer surfaces 2122 of the capacitor core 211 and the housing 212, thus ensuring the reliability of the capacitor core 211. Furthermore, the metal plate 253 can be directly placed within the inner cavity 2121 of the housing 212, simplifying the process and making operation convenient. The metal plate 253 also enhances the thermal conductivity between the capacitor core 211 and the housing 212, resulting in better heat dissipation for the capacitor core 211.

[0185] Figure 20 This is another schematic diagram of the motor controller module 200 provided in the embodiments of this application.

[0186] In one embodiment, the capacitor core 211 is fixed to the inner cavity 2121 of the housing 212 by potting compound 214. The metal plate 253 distributed between the capacitor core 211 and the housing 212 along the Z-direction of the heat sink 222 and the housing 212 can be fixed by potting compound 214 while the capacitor core 211 is fixed, thus simplifying the fixing process of the metal plate 253.

[0187] Figure 21 This is another schematic diagram of the motor controller module 200 provided in the embodiments of this application.

[0188] In one embodiment, such as Figure 21 As shown, a cavity 2129 is formed in the part of the housing 212 that constitutes the cooling channel 221. The cavity 2129 is used as a water-proof layer 250.

[0189] In this embodiment, a cavity 2129 is formed within the portion of the housing 212 constituting the cooling channel 221. The cavity 2129 serves as a water-proof layer 250. Cooling water from the cooling channel 221 seeps into the cavity 2129 and accumulates there, making it less likely to seep further into the inner cavity 2121 of the housing 212. This isolates the cooling channel 221 from the capacitor core 211, thereby improving the reliability of the capacitor core 211. Using the cavity 2129 as a water-proof layer 250 also eliminates the need for additional components or materials to isolate the cooling channel 221 from the capacitor core 211, thus reducing production costs.

[0190] In one embodiment, the hydrophobic coating 251, the metal layer 252, the metal plate 253, and the cavity 2129 can be combined as needed to improve the isolation effect between the cooling channel 221 and the capacitor core 211, thereby improving the reliability of the capacitor core 211.

[0191] The motor controller module, vehicle-mounted device, and electric vehicle provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and embodiments of this application. The description of the embodiments above is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in specific embodiments and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A motor controller module, characterized in that, The motor controller module includes a bus capacitor and a waterproof layer. The inner cavity of the bus capacitor housing is used to accommodate the capacitor core. A portion of the outer surface of the housing is used to enclose a heat sink to form a cooling channel. The cooling channel is used to cool a three-phase bridge arm fixed to the heat sink on the side opposite to the housing. The three-phase bridge arm is used to receive power from the electric vehicle's battery through the capacitor core and output three-phase current to drive the electric vehicle's motor. The water-proof layer is distributed between the cooling channel and the capacitor core, and the water-proof layer is used to isolate the cooling channel and the capacitor core.

2. The motor controller module according to claim 1, characterized in that, The projection of the waterproof layer along the arrangement direction of the heat sink and the housing covers the capacitor core.

3. The motor controller module according to claim 1, characterized in that, The projection of the water-resistant layer along the arrangement direction of the heat sink and the housing covers the cooling channel.

4. The motor controller module according to claim 2, characterized in that, The projection of the water-resistant layer along the arrangement direction of the heat sink and the housing covers the cooling channel.

5. The motor controller module according to any one of claims 1-4, characterized in that, The thickness of the water-resistant layer along the arrangement direction of the heat sink and the housing is less than the thickness of the portion of the housing used to form the cooling channel.

6. The motor controller module according to any one of claims 1-4, characterized in that, The outer surface of the housing is recessed towards the capacitor core to form a groove, which surrounds the heat sink to form the cooling channel. The housing also includes multiple protrusions, each protruding from the bottom of the groove towards its opening, wherein: The waterproof layer is distributed at the bottom of the groove, the peripheral wall of the groove, and at least one of the plurality of protrusions.

7. The motor controller module according to claim 5, characterized in that, The outer surface of the housing is recessed towards the capacitor core to form a groove, which surrounds the heat sink to form the cooling channel. The housing also includes multiple protrusions, each protruding from the bottom of the groove towards its opening, wherein: The waterproof layer is distributed at the bottom of the groove, the peripheral wall of the groove, and at least one of the plurality of protrusions.

8. The motor controller module according to any one of claims 1-4 and 7, characterized in that, The water-proof layer includes a hydrophobic coating applied to the outer surface of the housing that forms the cooling channel; and / or The hydrophobic coating is applied to the inner surface of the housing facing the capacitor core; and / or The hydrophobic coating is applied at least to the surface of the capacitor core facing the cooling channel.

9. The motor controller module according to any one of claims 1-4 and 7, characterized in that, The waterproof layer includes a metal layer that is injection molded into a portion of the housing that forms the cooling channel.

10. The motor controller module according to claim 9, characterized in that, One surface of the metal layer is covered within a portion of the housing that forms the cooling channel, and at least a portion of the other surface of the metal layer is exposed to the cooling channel.

11. The motor controller module according to any one of claims 1-4, 7, and 10, characterized in that, The waterproof layer includes a metal plate, which is distributed between the capacitor core and the housing along the arrangement direction of the heat dissipation plate and the housing.

12. The motor controller module according to any one of claims 1-4, 7, and 10, characterized in that, A cavity is formed within the housing that constitutes the cooling channel, and the cavity serves as a water-proof layer.

13. The motor controller module according to any one of claims 1-4, 7, and 10, characterized in that, The housing includes multiple circuit board fixing protrusions. Along the arrangement direction of the heat sink and the housing, these protrusions extend from the outer surface of the housing away from the capacitor core protrusion. These protrusions are used to fix the circuit board of the motor controller. Along the arrangement direction of the heat sink and the housing, the circuit board, the three-phase bridge arm, the heat sink, and the waterproof layer are stacked sequentially, wherein: The plurality of circuit board fixing protrusions are distributed on both sides of the heat sink along a first direction, the first direction being perpendicular to the arrangement direction of the heat sink and the housing, and the waterproof layer is distributed at least in the portion of the housing between the plurality of circuit board fixing protrusions along the first direction.

14. The motor controller module according to any one of claims 1-4, 7, and 10, characterized in that, The housing also includes two water inlets for connecting to the internal flow channels of the motor controller housing. The waterproof layer is distributed at least in the portion of the housing between the two water inlets, and the waterproof layer is spaced apart from the two water inlets.

15. A vehicle-mounted device, characterized in that, The housing of the vehicle-mounted device is used to accommodate the motor controller module as described in any one of claims 1-14, the electrical control slot of the housing is used to accommodate the motor controller module, and the internal flow channel of the housing is used to connect to the cooling flow channel in the motor controller module.

16. The vehicle-mounted device according to claim 15, characterized in that, The electrical control tank includes an inlet channel and an outlet channel. The inlet of the inlet channel and the outlet of the outlet channel are located on the outer side of the housing, while the outlet of the inlet channel and the inlet of the outlet channel are located on the inner side of the housing. The outlet of the inlet channel and the inlet of the outlet channel protrude from the bottom of the electrical control tank towards the opening of the tank. The outlet of the inlet channel and the inlet of the outlet channel are used to connect to the cooling channel in the motor controller module, wherein: Along the arrangement direction of the heat sink and the housing, the projection of the water-proof layer is distributed at least between the outlet of the liquid inlet channel and the inlet of the liquid outlet channel.

17. An electric vehicle, characterized in that, The electric vehicle includes an on-board unit as described in claim 15 or 16, wherein the motor of the on-board unit is used to receive power from the power battery through the motor controller module to drive the wheels.