A silicon wafer dispensing apparatus

Abstract

The application discloses a silicon wafer distribution device, which comprises a first distribution device, a second distribution device and a third distribution device, the second distribution device and the third distribution device are arranged transversely, the second distribution device and the third distribution device are located on one side of the first distribution device, the first distribution device, the second distribution device and the third distribution device each comprise a transverse moving mechanism, a lifting mechanism and a suction cup assembly, the lifting mechanism is connected with the transverse moving mechanism, the transverse moving mechanism drives the lifting mechanism to move in the transverse direction, the suction cup assembly is connected with the lifting mechanism, the lifting mechanism drives the suction cup assembly to lift, and the suction cup assembly is used for adsorbing silicon wafers. The silicon wafer distribution device can realize distribution of silicon wafers, has high automation degree and improves distribution efficiency. Since the silicon wafers are distributed by being adsorbed by the suction cup assembly, the silicon wafers will not be damaged in the distribution process.

Description

Technical Field

[0001] This application relates to the field of solar cell technology, and more particularly to a silicon wafer dispensing device. Background Technology

[0002] In the field of solar cell manufacturing, efficient transportation and precise distribution of silicon wafers are crucial for ensuring a smooth and efficient production process. Current technologies typically involve conveying silicon wafers via a transport mechanism, followed by distribution by manual labor or robotic arms. Manual distribution is inefficient and may damage the wafers during the process. Robotic arms, while capable of handling silicon wafers, can also damage them during distribution. Summary of the Invention

[0003] This application provides a silicon wafer dispensing device to solve the problems existing in related technologies. The technical solution is as follows:

[0004] This application provides a silicon wafer dispensing device, including a first dispensing device, a second dispensing device, and a third dispensing device. The second and third dispensing devices are arranged laterally, and both are located on one side of the first dispensing device. Each of the first, second, and third dispensing devices includes a lateral movement mechanism, a lifting mechanism, and a suction cup assembly. The lifting mechanism is connected to the lateral movement mechanism, and the lateral movement mechanism drives the lifting mechanism to move laterally. The suction cup assembly is connected to the lifting mechanism, and the lifting mechanism drives the suction cup assembly to move up and down. The suction cup assembly is used to adsorb silicon wafers.

[0005] In one embodiment, the lifting mechanism includes a lifting drive component and a lifting component, the lifting drive component is connected to the lifting component, the lifting drive component drives the lifting component to move up and down, and the lifting drive component is connected to the traversing mechanism.

[0006] In one embodiment, the suction cup assembly includes a first fixing plate, a second fixing plate, and a third fixing plate connected together. The second fixing plate is located between the first fixing plate and the third fixing plate, and there is a gap between the second fixing plate and the first fixing plate, as well as between the second fixing plate and the third fixing plate. Suction cups are provided on the first fixing plate, the second fixing plate, and the third fixing plate.

[0007] In one embodiment, the silicon wafer is adsorbed by suction cups on the first fixing plate and the second fixing plate, and / or the silicon wafer is adsorbed by suction cups on the second fixing plate and the third fixing plate.

[0008] In one embodiment, the lifting drive assembly includes a lifting drive component, a first lifting drive wheel, a second lifting drive wheel, a lifting belt, and a lifting fixing plate. The lifting drive component is fixed to the lifting fixing plate, the second lifting drive wheel is rotatably connected to the lifting fixing plate, the first lifting drive wheel and the second lifting drive wheel are connected by a lifting belt, and the lifting drive component is connected to the first lifting drive wheel.

[0009] In one embodiment, the lifting assembly includes a lifting slide rail, a lifting connecting block, and a lifting connecting plate. The lifting slide rail is fixed to the lifting fixed plate, the lifting connecting plate is connected to the lifting belt through the lifting connecting block, the suction cup assembly is connected to the lifting connecting plate, and the lifting connecting plate is slidably connected to the lifting slide rail.

[0010] In one embodiment, the lifting and fixing plate is connected to the traversing mechanism.

[0011] In one embodiment, the lateral movement mechanism is a synchronous belt module.

[0012] In one embodiment, the first dispensing device further includes a cable chain assembly located on one side of the traversing mechanism, and the lifting mechanism is connected to the cable chain assembly.

[0013] The advantages or beneficial effects of the above technical solutions include at least the following:

[0014] The silicon wafer dispensing device of this application embodiment includes a first dispensing device, a second dispensing device, and a third dispensing device. Each of the first, second, and third dispensing devices includes a transverse mechanism, a lifting mechanism, and a suction cup assembly, the suction cup assembly being used to pick up silicon wafers. When used, the silicon wafer dispensing device of this application embodiment cooperates with existing silicon wafer transfer mechanisms. The first, second, and third dispensing devices can distribute silicon wafers from two transfer mechanisms to five transfer mechanisms. During dispensing, the suction cup assembly picks up the silicon wafers for dispensing. The silicon wafer dispensing device of this application embodiment can achieve silicon wafer dispensing with a high degree of automation, improving dispensing efficiency. Because the silicon wafers are dispensed by picking them up with the suction cup assembly, the silicon wafers are not damaged during the dispensing process.

[0015] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0016] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0017] Figure 1 A schematic diagram of a silicon wafer dispensing device;

[0018] Figure 2 Another schematic diagram of a silicon wafer dispensing device;

[0019] Figure 3 This is a schematic diagram of the structure of the first dispensing device;

[0020] Figure 4 Another structural schematic diagram of the first dispensing device;

[0021] Figure 5 A diagram showing the usage status of silicon wafer distribution equipment;

[0022] Figure 6 Another usage diagram of the silicon wafer distribution equipment;

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. First dispensing device; 2. Second dispensing device; 3. Third dispensing device; 11. Transverse mechanism; 12. Lifting mechanism; 13. Suction cup assembly; 14. Cable chain assembly; 121. Lifting drive assembly; 122. Lifting assembly; 1211. Lifting drive component; 1212. First lifting drive wheel; 1213. Second lifting drive wheel; 1214. Lifting belt; 1215. Lifting fixing plate; 1216. Motor fixing plate; 1217. Rotating base; 1221. Lifting slide rail; 1222. Lifting connecting block; 1223. Lifting connecting plate; 131. First fixing plate; 132. Second fixing plate; 133. Third fixing plate; 134. Fixing connecting block; 135. Suction cup; 3. Silicon wafer. Detailed Implementation

[0025] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0026] like Figures 1 to 3As shown in the figure, this application provides a silicon wafer dispensing device, including a first dispensing device 1, a second dispensing device 2, and a third dispensing device 3. The first dispensing device 1, the second dispensing device 2, and the third dispensing device 3 have identical structures. The second dispensing device 2 and the third dispensing device 3 are arranged laterally, and both are located on one side of the first dispensing device 1. Each of the first dispensing device 1, the second dispensing device 2, and the third dispensing device 3 includes a horizontal moving mechanism 11, a lifting mechanism 12, and a suction cup assembly 13. The lifting mechanism 12 is connected to the horizontal moving mechanism 11, and the horizontal moving mechanism 11 drives the lifting mechanism 12 to move laterally. The suction cup assembly 13 is connected to the lifting mechanism 12, and the lifting mechanism 12 drives the suction cup assembly 13 to rise and fall; the suction cup assembly 13 is used to adsorb silicon wafers.

[0027] like Figure 6 As shown, the silicon wafer distribution device of this application embodiment is used in conjunction with a conveying mechanism for silicon wafer transfer. The first distribution device 1, the second distribution device 2, and the third distribution device 3 can distribute silicon wafers 3 from two conveying mechanisms to five conveying mechanisms. During distribution, the silicon wafers 3 are picked up by the suction cup assembly 13. The silicon wafer distribution device of this application embodiment can achieve silicon wafer 3 distribution with a high degree of automation, improving distribution efficiency. Because the silicon wafers 3 are distributed by adsorbing them with the suction cup assembly 13, the silicon wafers 3 will not be damaged during the distribution process.

[0028] In one embodiment, to achieve lateral movement of the suction cup assembly 13 and the lifting mechanism 12, the lateral movement mechanism 11 is a synchronous belt module. This synchronous belt module can be any existing synchronous belt module, as long as it can drive the suction cup assembly 13 and the lifting mechanism 12 to move laterally. Its structure and working principle are existing technologies. The lifting mechanism 12 can be connected to a slide on the lateral movement mechanism 11, thereby driving the lifting mechanism 12 and the suction cup assembly 13 to move laterally.

[0029] In one embodiment, the first dispensing device 1 further includes a cable chain assembly 14, which is located on one side of the traversing mechanism 11, and the lifting mechanism 12 is connected to the cable chain assembly 14. The cable chain assembly 14 may also be based on existing technology.

[0030] In one embodiment, such as Figure 4 As shown, in order to realize the lifting and lowering of the suction cup assembly 13, the lifting mechanism 12 includes a lifting drive assembly 121 and a lifting assembly 122. The lifting drive assembly 121 is connected to the lifting assembly 122, and the lifting drive assembly 121 drives the lifting assembly 122 to lift and lower.

[0031] like Figure 5As shown, the lifting drive assembly 121 includes a lifting drive component 1211, a first lifting drive wheel 1212, a second lifting drive wheel 1213, a lifting belt 1214, and a lifting fixing plate 1215. The lifting drive component 1211 is a servo motor, and the lifting fixing plate 1215 is connected to the slide of the transverse mechanism 11 by bolts. The lifting drive component 1211 is fixed to the lifting fixing plate 1215 by a motor fixing plate 1216. Both the lifting drive component 1211 and the motor fixing plate 1216, as well as the motor fixing plate 1216 and the lifting fixing plate 1215, can be fixed by screws. The first lifting drive wheel 1212 and the second lifting drive wheel 1213 are located at opposite ends of the lifting fixing plate 1215, and the second lifting drive wheel 1213 is rotatably connected to the lifting fixing plate 1215. Specifically, a rotating base 1217 can be fixed to the lifting fixed plate 1215 with screws. A rotating shaft passes through the middle of the second lifting drive wheel 1213, and both ends of the rotating shaft can be fixedly connected to the rotating base 1217 with bolts, etc. The second lifting drive wheel 1213 can rotate relative to the rotating shaft. The lifting fixed plate 1215 and the cable chain assembly 14 can be connected through a connecting plate, etc.

[0032] The motor shaft of the lifting drive component 1211 is connected to the first lifting drive wheel 1212 and can drive the first lifting drive wheel 1212 to rotate. The first lifting drive wheel 1212 and the second lifting drive wheel 1213 are connected by a lifting belt 1214. When the lifting drive component 1211 is started, it drives the first lifting drive wheel 1212 connected to it to rotate, and the first lifting drive wheel 1212 drives the second lifting drive wheel 1213 to rotate through the lifting belt 1214.

[0033] To enable the lifting belt 1214 to drive the lifting assembly 122 to rise and fall during movement, the lifting assembly 122 includes a lifting slide rail 1221, a lifting connecting block 1222, and a lifting connecting plate 1223. The lifting slide rail 1221 is fixed to the lifting fixing plate 1215 by screws, and extends along the length of the lifting fixing plate 1215, located on one side of the lifting belt 1214. The lifting connecting plate 1223 is slidably connected to the lifting slide rail 1221, and can slide along the lifting slide rail 1221.

[0034] The lifting connecting plate 1223 is connected to the lifting belt 1214 via the lifting connecting block 1222. Specifically, the lifting connecting plate 1223 is fixed to the lifting connecting block 1222 with hex socket screws, and the lifting connecting block 1222 is connected to the lifting belt 1214 with screws. When the lifting belt 1214 reciprocates, it can drive the lifting connecting plate 1223 to reciprocate on the lifting slide rail 1221. The suction cup assembly 13 is connected to the lifting connecting plate 1223, thereby driving the suction cup assembly 13 to move via the lifting connecting plate 1223.

[0035] In one embodiment, the suction cup assembly 13 can simultaneously move two half-silicon wafers 3. Specifically, the suction cup assembly 13 includes a first fixing plate 131, a second fixing plate 132, and a third fixing plate 133 connected together. The suction cup assembly 13 also includes a fixing connecting block 134, with one end of the first fixing plate 131, the second fixing plate 132, and the second fixing plate 132 all connected to the fixing connecting block 134 by bolts. The fixing connecting block 134 is connected to a lifting fixing plate 1215 by bolts.

[0036] The second fixing plate 132 is located between the first fixing plate 131 and the third fixing plate 133, with a gap between the second fixing plate 132 and the first fixing plate 131, and between the second fixing plate 132 and the third fixing plate 133. Suction cups 135 are provided on the first fixing plate 131, the second fixing plate 132, and the third fixing plate 133. Specifically, suction cups 135 are provided on the side of the first fixing plate 131 and the third fixing plate 133 closest to the second fixing plate 132, and suction cups 135 are provided on the side of the second fixing plate 132 closest to the first fixing plate 131 and the side closest to the third fixing plate 133. The silicon wafer 3 is adsorbed by the suction cups 135 on the first fixing plate 131 and the second fixing plate 132, and / or the silicon wafer 3 is adsorbed by the suction cups 135 on the second fixing plate 132 and the third fixing plate 133. The suction cups 135 achieve adsorption of the silicon wafer through the principle of vacuum adsorption.

[0037] When adsorbing silicon wafers 3 using suction cup assembly 13, one suction cup assembly 13 can simultaneously adsorb two half-wafers of silicon wafers (double half-wafers). Specifically, suction cups 135 on the first fixing plate 131 and the second fixing plate 132 near the first fixing plate 131 jointly adsorb one silicon wafer 3, and suction cups 135 on the third fixing plate 133 and the second fixing plate 132 near the third fixing plate 133 jointly adsorb the other silicon wafer 3, thereby achieving the adsorption of two half-wafers of silicon wafers (double half-wafers).

[0038] like Figure 6 As shown, the operation flow of the silicon wafer distribution device in this application embodiment is as follows:

[0039] The dual-half silicon wafer 3 is first transported to positions A1 and A3 by two conveying mechanisms. The suction cup assembly 13 of the first distribution device 1 picks up the dual-half silicon wafer 3 at position A1, and the lifting mechanism 12 lifts the silicon wafer 3. Then, the lateral movement assembly of the first distribution device 1 moves the silicon wafer 3 to position A2, and the lifting mechanism 12 lowers the silicon wafer 3 to place it at position A2, realizing the movement of the silicon wafer 3 from position A1 to position A2. At the same time, the dual-half silicon wafer 3 at position A3 is transported to position C2 by the conveying mechanism, and the two conveying mechanisms simultaneously transport the dual-half silicon wafer 3 to positions A1, B2, and A3.

[0040] Next, the suction cup assembly 13 of the second distribution device 2 picks up the silicon wafer 3 at position B2 and lifts it up. The transverse mechanism 11 then moves the double-half silicon wafer 3 to position B1. Simultaneously, the suction cup assembly 13 of the third distribution device 3 picks up the silicon wafer 3 at position C2 and lifts it up. The transverse mechanism 11 then moves the double-half silicon wafer to position C1 for placement. At the same time, the silicon wafer at position A2 is conveyed to position D1 by the transfer mechanism.

[0041] Then, two conveyor mechanisms transport silicon wafers to positions A1, A3, B2, and C2. At this point, silicon wafers are present at all five conveyor positions (B1, B2, D1, C1, and C2), thus distributing the silicon wafers transported by the two conveyor mechanisms to these five conveyor mechanisms and sending silicon wafer 3 out. Next, the first distribution device 1 lifts the silicon wafer 3 at position A3 and transports it to position A2, while the silicon wafer 3 at position A1 is transported to position B2, and the two conveyor mechanisms transport silicon wafers to positions A1, C2, and A3. The second distribution device 2 transports the double half-wafer silicon wafer 3 at position B2 to position B1, and the third distribution device 3 transports the silicon wafer at position C2 to position C1. Then, the two conveyor mechanisms transport silicon wafers to positions A1, A3, B2, and C2, at which point silicon wafers are present at all five conveyor mechanisms (B1, B2, D1, C1, and C2). This cycle repeats to achieve the distribution of silicon wafers.

[0042] In this patent, A1, A2, A3, B1, B2, D1, C1, and C2 are merely position labels for ease of explanation. A1 and B2 are different positions on the same conveying mechanism, A2 and D1 are different positions on the same conveying mechanism, and A3 and C2 are different positions on the same conveying mechanism.

[0043] The silicon wafer distribution equipment of this application embodiment can automatically distribute silicon wafers. It features a compact structure, high degree of automation, and significantly improved work efficiency. Furthermore, it does not damage the silicon wafers during the distribution process, reducing the defect rate. This application embodiment achieves balanced wafer picking through two conveying mechanisms via a first distribution device 1, a second distribution device 2, and a third distribution device 3.

[0044] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0045] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0046] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A silicon wafer dispensing device, characterized in that, The device includes a first dispensing device, a second dispensing device, and a third dispensing device. The second and third dispensing devices are arranged horizontally and are located on one side of the first dispensing device. Each of the first, second, and third dispensing devices includes a horizontal moving mechanism, a lifting mechanism, and a suction cup assembly. The lifting mechanism is connected to the horizontal moving mechanism and drives the lifting mechanism to move horizontally. The suction cup assembly is connected to the lifting mechanism and drives the suction cup assembly to move up and down. The suction cup assembly is used to adsorb silicon wafers.

2. The silicon wafer dispensing device according to claim 1, characterized in that, The lifting mechanism includes a lifting drive component and a lifting component. The lifting drive component is connected to the lifting component and drives the lifting component to move up and down. The lifting drive component is also connected to the traverse mechanism.

3. The silicon wafer dispensing device according to claim 1, characterized in that, The suction cup assembly includes a first fixing plate, a second fixing plate, and a third fixing plate connected together. The second fixing plate is located between the first fixing plate and the third fixing plate. There is a gap between the second fixing plate and the first fixing plate, and between the second fixing plate and the third fixing plate. Suction cups are provided on the first fixing plate, the second fixing plate, and the third fixing plate.

4. The silicon wafer dispensing device according to claim 3, characterized in that, The silicon wafer is adsorbed by suction cups on the first fixing plate and the second fixing plate, and / or the silicon wafer is adsorbed by suction cups on the second fixing plate and the third fixing plate.

5. The silicon wafer dispensing device according to claim 2, characterized in that, The lifting drive assembly includes a lifting drive component, a first lifting drive wheel, a second lifting drive wheel, a lifting belt, and a lifting fixing plate. The lifting drive component is fixed to the lifting fixing plate, the second lifting drive wheel is rotatably connected to the lifting fixing plate, the first lifting drive wheel and the second lifting drive wheel are connected by a lifting belt, and the lifting drive component is connected to the first lifting drive wheel.

6. The silicon wafer dispensing device according to claim 5, characterized in that, The lifting assembly includes a lifting slide rail, a lifting connecting block, and a lifting connecting plate. The lifting slide rail is fixed to the lifting fixed plate. The lifting connecting plate is connected to the lifting belt through the lifting connecting block. The suction cup assembly is connected to the lifting connecting plate. The lifting connecting plate is slidably connected to the lifting slide rail.

7. The silicon wafer dispensing device according to claim 5, characterized in that, The lifting and fixing plate is connected to the transverse movement mechanism.

8. The silicon wafer dispensing apparatus according to any one of claims 1 to 7, characterized in that, The lateral movement mechanism is a synchronous belt module.

9. The silicon wafer dispensing apparatus according to any one of claims 1 to 7, characterized in that, The first dispensing device further includes a cable chain assembly located on one side of the traversing mechanism, and the lifting mechanism is connected to the cable chain assembly.

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