High-efficiency heat dissipation type multi-interface AI edge computing device
By employing a design that arranges heat dissipation fins and heat conduction platforms inside and outside a metal casing in AI edge computing devices, the problems of poor heat dissipation and structural redundancy are solved, achieving efficient heat dissipation and convenient multi-interface functionality, and adapting to the needs of miniaturization and embedded deployment.
Patent Information
- Application Number
- CN202521383901.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-03
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-07-03
AI Technical Summary
Existing AI edge computing devices suffer from poor heat dissipation, redundant structures, and limited interfaces, making it difficult to meet the demands of computing power intensity, multi-device connectivity, and miniaturized deployment.
It adopts a design with heat dissipation fins and heat conduction platforms arranged inside and outside the metal shell. Combined with multiple sets of parallel heat dissipation fins and heat conduction platforms, it increases the contact area and air convection channels. It integrates multiple interface modules and uses aluminum alloy one-piece die casting to improve heat conduction efficiency and interface convenience.
It achieves efficient heat dissipation, avoids noise and dust accumulation problems, supports multiple interface applications, has a compact structure, is suitable for embedded deployment, and improves the device's response speed and ease of use.
Smart Images
Figure CN224682617U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation technology for AI edge computing devices, specifically to a high-efficiency heat dissipation multi-interface AI edge computing device. Background Technology
[0002] AI edge computing devices are devices that deploy artificial intelligence (AI) computing capabilities close to the data source at the edge to enable real-time data processing, analysis, and decision-making. Compared to traditional cloud computing models, edge computing devices process data locally, reducing data transmission latency, improving response speed, reducing reliance on network bandwidth, and enhancing data privacy and security.
[0003] With the widespread adoption of AI technology in edge computing and smart terminals, mini AI devices need to simultaneously meet the demands of high computing power (high heat generation), multi-device connectivity (complex interface requirements), and miniaturized deployment. Existing technologies have the following shortcomings: 1) Heat dissipation bottleneck: Traditional mini PCs rely on fans for cooling, which easily accumulates dust and generates a lot of noise; passive cooling designs have insufficient heat dissipation area and cannot match the high power consumption of AI chips; 2) Limited interfaces: They only support conventional USB / Ethernet ports, lacking compatibility with dual-network redundancy, multi-screen display, and high-speed data transmission (such as Type-C), limiting the expansion of AI functions (such as video analysis and edge networking); 3) Structural redundancy: The shell and heat dissipation module are separated, resulting in a large size that is difficult to adapt to embedded deployment scenarios. Utility Model Content
[0004] This invention provides a high-efficiency heat dissipation multi-interface AI edge computing device to solve the technical problems of poor heat dissipation and structural redundancy in existing AI edge computing devices.
[0005] To address the aforementioned issues, the high-efficiency heat dissipation multi-interface AI edge computing device provided by this utility model adopts the following technical solution: A high-efficiency heat dissipation multi-interface AI edge computing device includes: The metal casing houses the motherboard, which integrates an AI processing unit, CPU, memory, and storage modules. Heat dissipation fins are arranged on the outside of the metal casing. There are multiple sets of heat dissipation fins, and each set of heat dissipation fins is parallel to each other. A heat conduction platform, which is arranged inside the metal housing, is used to connect the motherboard and the inner wall of the metal housing to quickly transfer the heat of the motherboard to the metal housing, and then dissipate it from the heat dissipation fins. The interface module, located on one side of the metal casing, includes an RJ45 network interface, an HDMI video interface, a USB 3.0 interface, a Type-C interface, a power interface, an audio interface, and an RS485 interface.
[0006] Furthermore, multiple sets of heat dissipation fins are arranged in parallel at the upper end of the metal casing, and air convection channels are formed between the sets of heat dissipation fins to enhance heat dissipation efficiency.
[0007] Furthermore, the height of the heat dissipation fins is 8-12mm, and the spacing between adjacent heat dissipation fins is 2-4mm.
[0008] Furthermore, the heat dissipation fins are trapezoidal in shape, narrower at the top and wider at the bottom, to increase the contact area between the lower part and the metal casing.
[0009] Furthermore, the heat-conducting platform is supported at the bottom of the motherboard to connect the motherboard and the metal casing, so that a heat dissipation gap is formed between the motherboard and the bottom wall of the metal casing, avoiding heat accumulation at the bottom of the motherboard.
[0010] Furthermore, the number of heat conduction platforms is four, which are respectively arranged at the four corners of the bottom of the motherboard.
[0011] Furthermore, each heat-conducting platform is fitted with a thermally conductive silicone layer that connects to the motherboard on its outer periphery to achieve passive heat dissipation.
[0012] Furthermore, the spacing between the interfaces of the interface module is greater than or equal to 5mm to avoid interference from plugging and unplugging, and the layout adopts a network port-video port-data port arrangement to improve the ease of operation.
[0013] Furthermore, the bottom of the metal casing is also provided with anti-slip pads and wall-mounting holes, supporting both desktop and embedded deployment modes.
[0014] Furthermore, the heat dissipation fins and the metal casing are integrally die-cast from aluminum alloy.
[0015] The beneficial effects of the high-efficiency heat dissipation multi-interface AI edge computing device provided by this utility model are: 1) Multiple heat dissipation fins serve the function of heat dissipation for the metal casing, which can dissipate the heat in the gas inside the metal casing, while the heat conduction platform can quickly conduct the heat on the motherboard to the heat dissipation fins through the metal casing, further accelerating the dissipation of heat inside the device. 2) The heat dissipation fins and heat conduction platform are one outside and one inside, which is simple in structure but has a significant heat dissipation effect and avoids the phenomenon of redundant results. 3) The orderly arrangement of multiple interfaces avoids interference from plugging and unplugging, making it more convenient to use; 4) The metal casing is made of aluminum alloy through die casting, which ensures the continuity of heat conduction and improves the heat capture capability.
[0016] In summary, through the above-mentioned design, this utility model effectively solves the technical problems of poor heat dissipation and structural redundancy in existing AI edge computing devices. Attached Figure Description
[0017] The above and other objects, features, and advantages of the present invention will become readily understood by reading the following detailed description of exemplary embodiments with reference to the accompanying drawings. In the drawings, several embodiments of the present invention are shown by way of example and not limitation, and like or corresponding reference numerals denote like or corresponding parts, wherein: Figure 1 This is a front view of the high-efficiency heat dissipation multi-interface AI edge computing device provided by this utility model. Figure 2 This is an internal schematic diagram of the high-efficiency heat dissipation multi-interface AI edge computing device provided by this utility model. Figure 1 ; Figure 3 This is an internal schematic diagram of the high-efficiency heat dissipation multi-interface AI edge computing device provided by this utility model. Figure 2 .
[0018] Explanation of reference numerals in the attached figures: 1. Metal casing; 2. Motherboard; 3. Heat sink fins; 4. Heat dissipation platform; 5. RJ45 network interface; 6. HDMI video interface; 7. USB 3.0 interface; 8. Type-C interface; 9. Power interface; 10. RS485 interface; 11. Air convection channel; 12. Heat dissipation spacer; 13. Thermal conductive silicone layer; 14. Wall mount hole. Detailed Implementation
[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Those skilled in the art should understand that the embodiments described below are only some, not all, of the embodiments disclosed. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.
[0020] The principles and spirit of this utility model will be explained in detail below with reference to several representative embodiments.
[0021] An embodiment of the high-efficiency heat-dissipating multi-interface AI edge computing device provided by this utility model: like Figures 1 to 3As shown, the high-efficiency heat-dissipating multi-interface AI edge computing device includes a metal casing 1, heat dissipation fins 3, a heat conduction platform 4, and an interface module. A motherboard 2 is housed inside the metal casing 1, integrating an AI processing unit, CPU, memory, and storage modules. Multiple sets of heat dissipation fins 3 are arranged on the outer side of the metal casing 1, and these sets are parallel to each other. The heat conduction platform 4 is located on the inner side of the metal casing 1, connecting the motherboard 2 to the inner wall of the metal casing 1 to quickly transfer heat from the motherboard 2 to the metal casing 1, where it is then dissipated through the heat dissipation fins 3.
[0022] The interface module is located on one side of the metal housing 1, including an RJ45 network interface 5, an HDMI video interface 6, a USB 3.0 interface 7, a Type-C interface 8, a power interface 9, an audio interface, and an RS485 interface 10.
[0023] The advantages of the entire solution are: 1) Breakthrough in heat dissipation: The integrated heat dissipation fins 3 and heat conduction platform 4 design significantly improve heat dissipation efficiency. The fanless design is maintenance-free and low-noise; 2) Innovative interfaces: It covers all scenarios of AI edge computing networking, display, and data interaction, and is compatible with applications such as video analysis, smart gateways, and edge servers; 3) Flexible deployment: The miniaturized (palm-sized) + wall-mounted design can be embedded in small spaces such as cabinets and walls, expanding the application boundaries of AI devices.
[0024] like Figure 1 As shown, specifically, multiple sets of heat dissipation fins 3 are arranged in parallel on the upper end of the metal casing 1, and air convection channels 11 are formed between each set of heat dissipation fins 3 to enhance heat dissipation efficiency. The height of the heat dissipation fins 3 is 8-12mm, and the spacing between adjacent heat dissipation fins 3 is 2-4mm.
[0025] Furthermore, the heat dissipation fins 3 have a trapezoidal structure that is narrower at the top and wider at the bottom to increase the contact area between the lower part and the metal casing 1, thereby enhancing the heat dissipation function. In other embodiments, the heat dissipation fins 3 may also have a structure with the same width at both the top and bottom.
[0026] like Figure 2 and Figure 3 As shown, the heat conduction platform 4 is supported at the bottom of the motherboard 2 to connect the motherboard 2 and the metal casing 1, thereby forming a heat dissipation gap 12 between the motherboard 2 and the bottom wall of the metal casing 1 to prevent heat accumulation at the bottom of the motherboard 2. The heat conduction platform 4 is made of a metal thermally conductive material, such as a copper heat conduction pillar. In other embodiments, the heat conduction platform 4 may also be arranged on the side of the motherboard 2.
[0027] Specifically, there are four heat dissipation platforms 4, which are respectively arranged at the four corners of the bottom of the motherboard 2. Each heat dissipation platform 4 is covered with a thermally conductive silicone layer 13 that connects to the motherboard 2. The motherboard 2 is in close contact with the heat dissipation platform 4 through the thermally conductive silicone layer 13 to achieve passive heat dissipation.
[0028] In this embodiment, the spacing between the interfaces of the interface module is greater than or equal to 5mm to avoid interference during plugging and unplugging, and the interface is arranged in a network port-video port-data port manner to improve operational convenience. In other embodiments, the spacing between the interfaces can be less than 5mm, for example, 4.9mm.
[0029] In this embodiment, the bottom of the metal housing 1 is also provided with anti-slip pads and wall-mounting holes 14, supporting both desktop and embedded deployment modes. This allows for diverse installation scenarios and meets various usage needs.
[0030] In this embodiment, the heat dissipation fins 3 and the metal housing 1 are integrally die-cast from aluminum alloy.
[0031] The working principle of the high-efficiency heat dissipation multi-interface AI edge computing device provided by this utility model is as follows: multiple sets of heat dissipation fins 3 undertake the heat dissipation function of the metal shell 1, which can dissipate the heat in the gas inside the metal shell 1, while the heat conduction platform 4 can quickly conduct the heat on the motherboard 2 to the heat dissipation fins 3 through the metal shell 1, further accelerating the dissipation of heat inside the device; the heat dissipation fins 3 and the heat conduction platform 4 are one outside and one inside, with a simple structure but significant heat dissipation effect, avoiding the phenomenon of redundant results; the orderly arrangement of multiple interfaces is neat and avoids plug-in interference, making it more convenient to use; the metal shell 1 is made of aluminum alloy in one piece by die casting to ensure the continuity of heat conduction and improve the heat capture capability.
Claims
1. A high-efficiency heat dissipation multi-interface AI edge computing device, characterized in that, include: The metal casing houses the motherboard, which integrates an AI processing unit, CPU, memory, and storage modules. Heat dissipation fins are arranged on the outside of the metal casing. There are multiple sets of heat dissipation fins, and each set of heat dissipation fins is parallel to each other. A heat conduction platform, which is arranged inside the metal housing, is used to connect the motherboard and the inner wall of the metal housing to quickly transfer the heat of the motherboard to the metal housing, and then dissipate it from the heat dissipation fins. The interface module, located on one side of the metal casing, includes an RJ45 network interface, an HDMI video interface, a USB 3.0 interface, a Type-C interface, a power interface, an audio interface, and an RS485 interface. The spacing between the interfaces of the interface module is greater than or equal to 5mm to avoid interference from plugging and unplugging, and the interface is arranged in the manner of network port-video port-data port to improve the ease of operation; The bottom of the metal casing is also equipped with anti-slip pads and wall-mounting holes, supporting both desktop and embedded deployment modes.
2. The high-efficiency heat dissipation multi-interface AI edge computing device according to claim 1, characterized in that: Multiple sets of heat dissipation fins are arranged in parallel at the upper end of the metal casing, and air convection channels are formed between the sets of heat dissipation fins to enhance heat dissipation efficiency.
3. The high-efficiency heat dissipation multi-interface AI edge computing device according to claim 2, characterized in that: The height of the heat dissipation fins is 8-12mm, and the spacing between adjacent heat dissipation fins is 2-4mm.
4. The high-efficiency heat dissipation multi-interface AI edge computing device according to claim 2 or 3, characterized in that: The heat dissipation fins have a trapezoidal structure that is narrower at the top and wider at the bottom to increase the contact area between the lower part and the metal casing.
5. The high-efficiency heat dissipation multi-interface AI edge computing device according to any one of claims 1 to 3, characterized in that: The heat-conducting platform is supported at the bottom of the motherboard to connect the motherboard and the metal casing, so as to form a heat dissipation gap between the motherboard and the bottom wall of the metal casing and avoid heat accumulation at the bottom of the motherboard.
6. The high-efficiency heat dissipation multi-interface AI edge computing device according to claim 5, characterized in that: The number of heat conduction platforms is four, which are respectively arranged at the four corners of the bottom of the motherboard.
7. The high-efficiency heat dissipation multi-interface AI edge computing device according to claim 6, characterized in that: Each heat dissipation platform is covered with a thermally conductive silicone layer that connects to the motherboard to achieve passive heat dissipation.
8. The high-efficiency heat dissipation multi-interface AI edge computing device according to any one of claims 1 to 3, characterized in that: The heat dissipation fins and the metal casing are integrally die-cast from aluminum alloy.