A device for preventing wafer ring jamming

Abstract

The utility model provides a device of preventing wafer ring material blocking, including guide rail platform, first installation opening, second installation opening, first lift stop block and second lift stop block, wherein, guide rail platform is located one side of the wafer box of filling material and extends along X direction, the upper surface, lower surface and side wall of guide rail platform constitute a receiving cavity, first installation opening and second installation opening are apart from each other and located on the upper surface of guide rail platform along X direction, first lift stop block includes first cylinder and first baffle, the bottom of first cylinder is fixed in the receiving cavity and is below first installation opening, to drive first baffle to move up and down, second lift stop block includes second cylinder and second baffle, the bottom of second cylinder is fixed in the receiving cavity and is below second installation opening to drive second baffle to move up and down. The device of preventing wafer ring material blocking of the utility model can avoid the problem of wafer ring material blocking caused by the wafer ring being taken out of the wafer box by grabbing.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor integrated circuit manufacturing technology, and relates to a device for preventing wafer ring jamming. Background Technology

[0002] The semiconductor industry has become a core driving force for modern technology and industrial upgrading, and the wafer transfer process is a crucial hub throughout the entire manufacturing chain. The stability of this process directly determines product process precision and production efficiency, and maintains the reliable operation of the entire production line; therefore, ensuring smooth transfer is paramount. However, in actual production, wafer transfer machines often suffer from a persistent maintenance problem: during wafer retraction, the gripper frequently pulls the wafer ring out of the wafer cassette. This phenomenon causes the wafer ring attached to the wafer to protrude from the cassette, leading to jamming and triggering machine alarms. This not only interrupts production but also poses potential product quality risks. These problems can be caused by various factors, including but not limited to wafer ring warping, wafer cassette manufacturing differences, machine mechanical differences, and excessive gripper friction. Although operators often attempt to intervene by adjusting the gripper force and calibrating the pick-and-place height, these measures are unlikely to completely eliminate the problem.

[0003] Therefore, how to provide a device to prevent wafer ring jamming and avoid the wafer ring being pulled out of the wafer cassette by the gripper, thereby improving production stability, has become an important problem that needs to be solved by those skilled in the art.

[0004] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a device for preventing wafer ring jamming, which solves the problem in the prior art where the gripper pulls the wafer ring out of the wafer box, causing wafer ring jamming failure.

[0006] To achieve the above and other related objectives, this utility model provides a device for preventing wafer ring jamming, comprising:

[0007] A guide platform is located on one side of the wafer cassette to be filled and extends along the X direction. The guide platform includes an upper surface, a lower surface, and a sidewall located between the upper surface and the lower surface. The upper surface, the lower surface, and the sidewall form a receiving cavity.

[0008] The first mounting opening and the second mounting opening are spaced apart along the X direction on the upper surface of the guide rail platform, and the distance between the first mounting opening and the second mounting opening in the X direction is not less than the width of the wafer ring to be placed.

[0009] A first lifting stop and a second lifting stop, the first lifting stop including a first cylinder and a first baffle plate connected in sequence along the Z direction, the bottom of the first cylinder being fixed in the receiving cavity and below the first mounting opening, so as to drive the first baffle plate to move up and down; the second lifting stop including a second cylinder and a second baffle plate connected in sequence along the Z direction, the bottom of the second cylinder being fixed in the receiving cavity and below the second mounting opening, so as to drive the second baffle plate to move up and down.

[0010] Optionally, in the X and Y directions, the size of the first mounting opening is the same as the size of the first baffle plate, and the size of the second mounting opening is the same as the size of the second baffle plate.

[0011] Optionally, it further includes a first position sensor and a second position sensor, wherein the first position sensor is disposed on the side of the first baffle plate near the wafer cassette to be filled, and the second position sensor is disposed on the side of the second baffle plate near the wafer cassette to be filled.

[0012] Optionally, the first baffle plate has a first groove on the side near the wafer cassette to be filled, and the first position sensor is disposed in the first groove; the second baffle plate has a second groove on the side near the wafer cassette to be filled, and the second position sensor is disposed in the first groove.

[0013] Optionally, it further includes a first buffer pad and a second buffer pad, wherein the first buffer pad is disposed on the side of the first baffle plate near the wafer cassette to be filled and spaced apart from the first position sensor, and the second buffer pad is disposed on the side of the first baffle plate near the wafer cassette to be filled and spaced apart from the second position sensor.

[0014] Optionally, the shape of the first barrier plate includes any one of a square, rectangle, trapezoid, or regular hexagon.

[0015] Optionally, the first cylinder includes a first cylinder barrel and a first piston rod telescopically disposed inside the cylinder barrel. The first cylinder barrel is fixed to the lower surface of the guide rail platform and extends along the Z direction. The end of the first piston rod away from the first cylinder barrel is connected to the first baffle plate. The second cylinder includes a second cylinder barrel and a second piston rod telescopically disposed inside the cylinder barrel. The second cylinder barrel is fixed to the lower surface of the guide rail platform and extends along the Z direction. The end of the second piston rod away from the second cylinder barrel is connected to the second baffle plate.

[0016] Optionally, a first fixing screw is provided between the first baffle plate and the first cylinder, the first fixing screw passing through the first baffle plate and screwed into the first piston rod, and a second fixing screw is provided between the second baffle plate and the second cylinder, the second fixing screw passing through the second baffle plate and screwed into the piston rod.

[0017] Optionally, the number of the first fixing screws is one or more, and the number of the second fixing screws is one or more.

[0018] Optionally, in the Y direction, the width of both the first blocking plate and the width of the second blocking plate are smaller than the width of the guide rail platform.

[0019] As described above, the device for preventing wafer ring jamming of this utility model includes a guide rail platform, a first mounting opening, a second mounting opening, a first lifting stop, and a second lifting stop. The guide rail platform is located on one side of the wafer cassette to be filled and extends along the X direction. The guide rail platform includes an upper surface, a lower surface, and a sidewall located between the upper and lower surfaces. The upper surface, the lower surface, and the sidewall form a receiving cavity. The first mounting opening and the second mounting opening are spaced apart along the X direction on the upper surface of the guide rail platform. In the X direction, the distance between the first mounting opening and the second mounting opening is not less than the width of the wafer ring to be placed. The first lifting stop includes a first cylinder and a first baffle plate connected sequentially along the Z direction. The bottom of the first cylinder is fixed in the receiving cavity and is located below the first mounting opening to drive the first baffle plate to move up and down. The second lifting stop includes a second cylinder and a second baffle plate connected sequentially along the Z direction. The bottom of the second cylinder is fixed in the receiving cavity and is located below the second mounting opening to drive the second baffle plate to move up and down. The device for preventing wafer ring jamming of this invention can prevent the gripper from pulling the wafer ring out of the wafer cassette, thereby solving the long-standing problem of grippers pulling out wafers in semiconductor production, and improving the process quality, production efficiency and automation level of the production line. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of a gripper retracting from a wafer cassette.

[0021] Figure 2 This is a schematic diagram illustrating another type of gripper ejecting from the wafer cassette.

[0022] Figure 3 The image shown is a top view of the device for preventing wafer ring jamming according to this invention.

[0023] Figure 4 Displayed as Figure 3 A three-dimensional structural diagram of part A in the middle.

[0024] Figure 5 Displayed as Figure 3 Another three-dimensional structural diagram of part A.

[0025] Figure 6 This diagram shows one of the working states of the device for preventing wafer ring jamming according to this invention.

[0026] Figure 7 This is a schematic diagram illustrating yet another type of gripper ejecting from the wafer cassette.

[0027] Explanation of reference numerals in the attached drawings: 1. Wafer box, 1'. Wafer box to be filled, 2. Wafer ring, 2'. Wafer ring to be placed, 3. Gripper, 4. Guide rail platform, 5. First mounting opening, 6. Second mounting opening, 7. First lifting stop, 701. First blocking plate, 702. First cylinder, 8. First lifting stop, 801. Second blocking plate, 802. Second cylinder, 9. First position sensor, 10. Second position sensor, 11. First groove, 12. Second groove, 13. First buffer pad, 14. Second buffer pad, 15. First fixing screw, 16. Second fixing screw, L1. Spacing between the first mounting opening and the second mounting opening, L2. Width of the wafer ring to be placed, W1. Width of the first blocking plate, W2. Width of the second blocking plate, W3. Width of the guide rail platform. Detailed Implementation

[0028] In actual semiconductor manufacturing, wafers are typically attached to wafer rings for movement between different workstations. To improve production efficiency, wafer rings are placed in wafer cassettes during transport between different workstations. Production lines are typically equipped with various mechanical grippers to pick up wafer rings from or place them into the wafer cassettes. After the grippers place the wafer ring into the wafer cassette, under normal circumstances, please refer to [the relevant documentation / reference needed]. Figure 1 Gripper 3 will exit wafer cassette 1 independently, while wafer ring 2 will fully enter wafer cassette 1. However, due to factors such as the warpage of wafer ring 2, manufacturing differences in wafer cassette 1, mechanical differences in the machine itself, and excessive friction of the gripper, please refer to [the relevant documentation / reference]. Figure 2When the gripper 3 exits the wafer cassette 1, it will pull the wafer ring 2 out of the wafer cassette 1, causing part of the wafer ring 2 to protrude from the wafer cassette 1, which will cause a jamming problem, eventually triggering the machine alarm, affecting the production progress, and also posing a risk to the product quality.

[0029] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0030] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, whole, step, or component, but does not exclude the presence or addition of one or more other features, wholes, steps, or components.

[0031] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0032] In the detailed description of the embodiments of this utility model, for ease of explanation, the schematic diagrams illustrating the device structure may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0033] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the drawings for devices in use or operation. Furthermore, when a layer is referred to as being “between” two layers, it may be the only layer between the two layers, or there may be one or more layers in between.

[0034] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0035] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0036] This utility model provides a device for preventing wafer ring jamming. Please refer to [link / reference]. Figures 3 to 5 ,in, Figure 3 The image shown is a top view of the device for preventing wafer ring jamming according to this invention. Figure 4 Displayed as Figure 3 A three-dimensional structural diagram of part A in the middle. Figure 5 Displayed as Figure 3 Another three-dimensional structural diagram of part A. The device for preventing wafer ring jamming includes a guide rail platform 4, a first mounting opening 5, a second mounting opening 6, a first lifting stop 7, and a second lifting stop 8. The guide rail platform 4 is located on one side of the wafer cassette 1' to be filled and extends along the X direction. The guide rail platform 4 includes an upper surface, a lower surface, and a sidewall located between the upper surface and the lower surface. The upper surface, the lower surface, and the sidewall form a receiving cavity.

[0037] Specifically, the first mounting opening 5 and the second mounting opening 6 are spaced apart along the X direction on the upper surface of the guide rail platform 4, and in the X direction, the distance L1 between the first mounting opening 5 and the second mounting opening 6 is not less than the width L2 of the wafer ring 2' to be placed, so that the first lifting block 7 and the second lifting block 8 can prevent the wafer ring 2' to be placed from being carried out after they are raised.

[0038] Specifically, the first lifting block 7 includes a first cylinder 702 and a first baffle plate 701 connected sequentially along the Z direction. The bottom of the first cylinder 702 is fixed in the receiving cavity and is located below the first mounting opening 5, so as to drive the first baffle plate 701 to move up and down. The second lifting block 8 includes a second cylinder 802 and a second baffle plate 801 connected sequentially along the Z direction. The bottom of the second cylinder 802 is fixed in the receiving cavity and is located below the second mounting opening 6, so as to drive the second baffle plate 801 to move up and down.

[0039] Please see Figure 6After the gripper 3 completes the action of placing the wafer ring 2' into the wafer cassette, the first lifting block 7 and the second lifting block 8 automatically rise to block the wafer ring 2' and prevent it from being pulled out by the gripper 3. Subsequently, the gripper 3 returns to its initial position, and the first lifting block 7 and the second lifting block 8 automatically descend to their original positions. This effectively prevents the gripper 3 from pulling out the wafer ring 2' (for details on the gripper 3 pulling out the wafer ring 2', please refer to...). Figure 7 This significantly reduces the problem of material jamming caused by the wafer ring 2' extending out of the wafer box 1', thereby reducing the frequency of machine alarms and improving production efficiency.

[0040] In particular, this device for preventing wafer ring jamming does not require large-scale modifications to existing equipment or wafer cassettes; it only requires replacing the original guide rail platform of the equipment, resulting in low implementation costs. Furthermore, the first lifting stop 7 and the second lifting stop 8 can automatically lift and lower according to the movement of the gripper 3, reducing manual intervention by operators, lowering the risk of human error, and further improving the automation level of the production line.

[0041] As an example, in the X and Y directions, the size of the first mounting opening 5 is the same as the size of the first blocking plate 701, and the size of the second mounting opening 6 is the same as the size of the second blocking plate 801.

[0042] As an example, the system also includes a first position sensor 9 and a second position sensor 10. The first position sensor 9 is located on the side of the first baffle plate 701 near the wafer cassette 1' to be filled, and the second position sensor 10 is located on the side of the second baffle plate 801 near the wafer cassette 1' to be filled. The presence of the first position sensor 9 and the second position sensor 10 can detect the position of the wafer ring 2' to be placed. If the wafer ring 2' to be placed is not properly placed or has been pulled out, the first position sensor 9 and the second position sensor 10 will sound an alarm and prevent the lifting rod from rising, so as to prevent the first lifting block 7 and the second lifting block 8 from rising and damaging the wafer on the wafer ring 2' to be placed.

[0043] As an example, the first baffle plate 701 has a first groove 11 on the side near the wafer cassette 1' to be filled, and the first position sensor 9 is disposed in the first groove 11. The second baffle plate 801 has a second groove 12 on the side near the wafer cassette 1' to be filled, and the second position sensor 10 is disposed in the first groove 11.

[0044] As an example, it also includes a first buffer pad 13 and a second buffer pad 14. The first buffer pad 13 is disposed on the side of the first baffle plate 701 near the wafer cassette 1' to be filled and spaced apart from the first position sensor 9. The first buffer pad 13 is disposed on the side of the first baffle plate 701 near the wafer cassette 1' to be filled and spaced apart from the second position sensor 10. The presence of the first buffer pad 13 and the second buffer pad 14 can provide buffering when the first lifting block 7 and the second lifting block 8 collide with the wafer ring 2' to be placed.

[0045] As an example, the shape of the first barrier 701 includes any one of a square, rectangle, trapezoid, or regular hexagon.

[0046] As an example, the first cylinder 702 includes a first cylinder barrel and a first piston rod telescopically disposed inside the cylinder barrel. The first cylinder barrel is fixed to the lower surface of the guide rail platform 4 and extends in the Z direction. The end of the first piston rod away from the first cylinder barrel is connected to the first baffle plate 701. The second cylinder 802 includes a second cylinder barrel and a second piston rod telescopically disposed inside the cylinder barrel. The second cylinder barrel is fixed to the lower surface of the guide rail platform 4 and extends in the Z direction. The end of the second piston rod away from the second cylinder barrel is connected to the second baffle plate 801.

[0047] As an example, a first fixing screw 15 is provided between the first blocking plate 701 and the first cylinder 702. The first fixing screw 15 passes through the first blocking plate 701 and is screwed into the first piston rod. A second fixing screw 16 is provided between the second blocking plate 801 and the second cylinder 802. The second fixing screw 16 passes through the second blocking plate 801 and is screwed into the piston rod.

[0048] As an example, the number of the first fixing screws 15 is one or more, and the number of the second fixing screws 16 is one or more.

[0049] As an example, in the Y direction, the width W1 of the first blocking plate 701 and the width W2 of the second blocking plate 801 are both smaller than the width W3 of the guide rail platform 4.

[0050] In summary, the device for preventing wafer ring jamming of this utility model includes a guide rail platform, a first mounting opening, a second mounting opening, a first lifting stop, and a second lifting stop. The guide rail platform is located on one side of the wafer cassette to be filled and extends along the X direction. The guide rail platform includes an upper surface, a lower surface, and a sidewall located between the upper and lower surfaces. The upper surface, lower surface, and sidewall form a receiving cavity. The first mounting opening and the second mounting opening are spaced apart along the X direction on the upper surface of the guide rail platform, and the distance between the first mounting opening and the second mounting opening in the X direction is not less than the width of the wafer ring to be placed. The first lifting stop includes a first cylinder and a first baffle plate connected sequentially along the Z direction. The bottom of the first cylinder is fixed in the receiving cavity and is located below the first mounting opening to drive the first baffle plate to move up and down. The second lifting stop includes a second cylinder and a second baffle plate connected sequentially along the Z direction. The bottom of the second cylinder is fixed in the receiving cavity and is located below the second mounting opening to drive the second baffle plate to move up and down. This invention provides a device to prevent wafer rings from jamming, thus avoiding the gripper from pulling the wafer rings out of the wafer cassette. This solves the long-standing problem of grippers pulling out wafers in semiconductor production, improving the process quality, production efficiency, and automation level of the production line. Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0051] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A device for preventing wafer ring jamming, characterized in that, include: A guide platform is located on one side of the wafer cassette to be filled and extends along the X direction. The guide platform includes an upper surface, a lower surface, and a sidewall located between the upper surface and the lower surface. The upper surface, the lower surface, and the sidewall form a receiving cavity. The first mounting opening and the second mounting opening are spaced apart along the X direction on the upper surface of the guide rail platform, and the distance between the first mounting opening and the second mounting opening in the X direction is not less than the width of the wafer ring to be placed. A first lifting stop and a second lifting stop, the first lifting stop including a first cylinder and a first baffle plate connected in sequence along the Z direction, the bottom of the first cylinder being fixed in the receiving cavity and below the first mounting opening, so as to drive the first baffle plate to move up and down; the second lifting stop including a second cylinder and a second baffle plate connected in sequence along the Z direction, the bottom of the second cylinder being fixed in the receiving cavity and below the second mounting opening, so as to drive the second baffle plate to move up and down.

2. The device for preventing wafer ring jamming according to claim 1, characterized in that: In the X and Y directions, the size of the first mounting opening is the same as the size of the first blocking plate, and the size of the second mounting opening is the same as the size of the second blocking plate.

3. The device for preventing wafer ring jamming according to claim 1, characterized in that: It also includes a first position sensor and a second position sensor, wherein the first position sensor is disposed on the side of the first baffle plate near the wafer cassette to be filled, and the second position sensor is disposed on the side of the second baffle plate near the wafer cassette to be filled.

4. The device for preventing wafer ring jamming according to claim 3, characterized in that: The first barrier plate has a first groove on the side near the wafer cassette to be filled, and the first position sensor is disposed in the first groove. The second barrier plate has a second groove on the side near the wafer cassette to be filled, and the second position sensor is disposed in the first groove.

5. The device for preventing wafer ring jamming according to claim 3, characterized in that: It also includes a first buffer pad and a second buffer pad. The first buffer pad is disposed on the side of the first barrier plate near the wafer cassette to be filled and is spaced apart from the first position sensor.

6. The device for preventing wafer ring jamming according to claim 1, characterized in that: The shape of the first barrier plate includes any one of a square, rectangle, trapezoid, or regular hexagon.

7. The device for preventing wafer ring jamming according to claim 1, characterized in that: The first cylinder includes a first cylinder barrel and a first piston rod telescopically disposed inside the cylinder barrel. The first cylinder barrel is fixed to the lower surface of the guide rail platform and extends along the Z direction. The end of the first piston rod away from the first cylinder barrel is connected to the first baffle plate. The second cylinder includes a second cylinder barrel and a second piston rod telescopically disposed inside the cylinder barrel. The second cylinder barrel is fixed to the lower surface of the guide rail platform and extends along the Z direction. The end of the second piston rod away from the second cylinder barrel is connected to the second baffle plate.

8. The device for preventing wafer ring jamming according to claim 7, characterized in that: A first fixing screw is provided between the first baffle plate and the first cylinder. The first fixing screw passes through the first baffle plate and is screwed into the first piston rod. A second fixing screw is provided between the second baffle plate and the second cylinder. The second fixing screw passes through the second baffle plate and is screwed into the piston rod.

9. The device for preventing wafer ring jamming according to claim 8, characterized in that: The number of the first fixing screws is one or more, and the number of the second fixing screws is one or more.

10. The device for preventing wafer ring jamming according to claim 1, characterized in that: In the Y direction, the width of both the first blocking plate and the second blocking plate is smaller than the width of the guide rail platform.

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