A ceramic substrate for electronic components generating waste heat and a method of its manufacture
CZ310738B6Active Publication Date: 2026-07-01ZAPADOCESKA UNIVERZITA V PLZNI +1
4 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- CZ · CZ
- Patent Type
- Patents
- Current Assignee / Owner
- ZAPADOCESKA UNIVERZITA V PLZNI
- Filing Date
- 2024-10-02
- Publication Date
- 2026-07-01
Abstract
The ceramic substrate (1) is monolithic, and it contains an integrated channel (2) for the passage of heat-transfer medium. From the outside the ceramic substrate (1) is adapted for direct printing using conductive patterns (3, 4) and for the direct mounting of electronic components (5) generating waste heat, particularly for the power module applications, for the effective dissipation of waste heat.
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Process for the manufacture of a metal-ceramic substrate
EP3326986A1
Semiconductor device and ceramic circuit substrate, and producing method of semiconductor device
US20150255419A1
Power module with integrated cooling device
US20200187385A1
Module with Connection Lugs for Supply Lines
US20210384115A1