Heating device arrangement

Abstract

Heating device arrangement (28), in particular an induction cooking device arrangement, comprising a set of heating modules (22), wherein a heating module (22) has a heating medium (24) for transferring heating energy to an object (18, 20) to be heated and a power unit (26) for supplying the heating medium (24) with power, and a control unit (27) which is provided for forming a heating group of heating modules (22) for heating the object (18, 20) depending on the position of an object (18, 20) to be heated relative to the heating modules (22), characterized by a cooling unit (40) for cooling the heating modules (22), wherein the cooling unit (40) has at least one heat sink unit (42, 44; 98) which serves to cool at least three heating modules (22), wherein the cooling unit (40) has a fan unit (62, 64) which, in conjunction with with the heat sink unit (42, 44;98) is provided for cooling at least three heating modules (22), wherein the fan unit (62, 64) has two fans (66, 68, 70, 72) arranged on both sides of the heat sink unit (42, 44; 98), and wherein one of the fans (66, 70) serves to blow cooling air to interact with the heat sink unit (42, 44, 98), while the other fan (68, 72) is used to draw in the cooling air heated by the alternating direction.

Description

[0001] The invention relates to a heating device arrangement, in particular an induction cooking device arrangement, according to the preamble of claim 1.

[0002] A heating device, in particular an induction cooktop, is known. This comprises a heating device arrangement with heating modules, each of which has a heating element and a power unit for supplying the heating element with heating power. The heating device arrangement is equipped with a cooling unit for cooling the heating modules during operation.

[0003] Publication WO 2006 / 032292 A1 discloses a cooktop with a set of heating modules, each heating module comprising a heating medium for transferring heat energy to an object to be heated and a power unit for supplying the heating medium with power. A control unit recognizes groups of heating modules occupied by an object to be heated as a contiguous area and controls the power units of the covered heating modules accordingly.

[0004] The publication DE 101 63 839 A1 teaches the use of a fan and a heat sink for cooling electronic components located in a cooktop.

[0005] The publication DE 199 55 457 A1 discloses a housing base made of aluminum, which acts as a heat sink, for cooling electronic components.

[0006] The publication EP 0 561 219 A1 discloses that, in order to protect against higher temperatures, the installed electronic components should be protected, and that it is advantageous to arrange the induction generating means on a heat sink which has cooling fins and corresponding cooling channels on its underside, through which a fan blows cooling air.

[0007] The object of the invention is in particular to provide a generic heating device arrangement with improved cooling properties.

[0008] The problem is solved according to the invention by the features of claim 1, while advantageous embodiments and further developments of the invention can be found in the dependent claims.

[0009] The invention relates to a heating device arrangement, in particular an induction cooking device arrangement, with a set of heating modules and a cooling unit for cooling the heating modules.

[0010] It is proposed that the cooling unit comprise at least one heat sink unit for cooling at least three heating modules. This enables particularly effective and rapid heat dissipation. The heat sink unit comprises at least one heat sink. In this context, a "heat sink" can be understood to be, in particular, a preferably one-piece body designed to absorb heat generated by at least one heating module, especially through power losses, and / or to dissipate it from a heat-absorbing point by conduction. For this purpose, the heat sink is made of a thermally conductive material, such as aluminum, copper, silver, etc. The heat sink unit preferably forms a heat-absorbing surface that is associated with at least three heating modules. Advantageously, the heat-absorbing surface faces the heating modules.The heat sink unit is preferably arranged in the area of ​​a heating module to be cooled, with the heat sink unit being positioned at a distance of less than 5 cm, preferably less than 3 cm, and preferably less than 1 cm from the heating module to be cooled. Heat absorption can occur through contact between the heat sink unit and the air surrounding the heating module to be cooled, and / or it can occur through direct contact between the heat sink unit and at least a portion of the heating module. Furthermore, heat generated by the heating module can be transferred from the heating module to the heat sink unit via a thermally conductive material, such as thermal paste.

[0011] According to the invention, a heating module comprises a heating medium for transferring heating energy to an object to be heated and a power unit for supplying the heating medium with power. The heating device arrangement according to the invention is particularly suitable for use in an induction heating device, such as an induction cooking appliance. The heating medium of the heating modules is preferably designed as an induction heating coil, which effects heating by means of an alternating magnetic field with a heating frequency, and the power units are, for example, designed as inverters for generating the heating frequency. For this purpose, the power units include, for example, electronic switching elements that provide the heating frequency by means of switching operations, which typically generate a large amount of heat during operation due to power losses.

[0012] A particularly advantageous cooling effect can be achieved if the heat sink unit serves to cool at least six, in particular at least ten, preferably at least twenty heating modules. In such a configuration of the heating device arrangement, in which a large number of heating modules are assigned to a common heat sink unit, not all heating modules are typically operated at their maximum power simultaneously during operation of the heating device. Heat generated by heating modules operating at high power can then be dissipated via areas of the heat sink unit corresponding to heating modules operating at lower power or remaining inactive.

[0013] It is further proposed that the heat sink unit forms a continuous heat absorption area for cooling at least three heating modules. This enables homogeneous heat conduction over a large volume. The heat absorption area is preferably designed as a continuous heat absorption surface. The continuous heat absorption area can be formed by a single, integral body. A heat absorption surface can be formed by at least a continuous portion of a side surface of the body. The continuous heat absorption area can also be formed by the interaction of at least two adjacent bodies. Preferably, the heat absorption area extends over a portion of the first body and continues uninterrupted over a portion of the second body adjacent to this portion of the first body. A continuous heat absorption surface can, for example, be formed by...formed by a side surface of the first body and a side surface of the second body adjacent to each other along a contact line, wherein the heat absorption surface of the first body extends from the side surface of the first body beyond the contact line into the side surface of the second body.

[0014] In an advantageous embodiment of the invention, it is proposed that the heat sink unit forms a heat absorption area which serves to cool at least a series of at least three heating modules, thereby achieving a structurally simple heating device arrangement. A "series" of heating modules can be understood in particular as a set of heating modules arranged consecutively along a common series axis.

[0015] Furthermore, it is proposed that the heat sink unit forms a heat absorption area for cooling at least two rows of heating modules, thereby enabling a particularly compact heating device arrangement. The rows preferably extend along different row axes, which are advantageously aligned parallel to each other. For this purpose, the row axes can be arranged on both sides of the heat sink unit. This is particularly suitable when the heating modules are arranged in a matrix configuration. The heat sink unit can then cool at least two matrix rows and / or at least two matrix columns.

[0016] In a preferred embodiment of the invention, it is proposed that the heat sink unit is designed as a one-piece heat sink, which allows for low assembly effort and homogeneous heat dissipation.

[0017] According to the invention, the heating device circuit includes a control unit designed to form a heating group of heating modules, depending on the position of the object to be heated relative to the heating modules. This allows for a high degree of flexibility in the application of a heating device in which the heating device arrangement is used. This is particularly suitable for use in a cooking appliance. The heating modules are preferably arranged below a cooktop. In group operation for heating the object, a heating group of heating modules preferably consists of heating modules from the set that are at least partially covered by the object located on the cooktop, in particular a cookware dish. The arrangement of the heating modules is preferably designed as a matrix arrangement.Heating modules in different rows and / or columns of the matrix arrangement can be at least partially covered by the object placed on the cooktop. The heating modules are preferably dimensioned such that a cookware of typical dimensions, such as a pot with a diameter of at least 8 cm, at least partially covers heating modules in different rows and columns. The set of heating modules defines a continuous cooking zone on the cooktop surface suitable for heating the object, which covers at least a predominant part of the cooktop surface, advantageously at least 60%, preferably at least 70%, and particularly advantageously at least 80%. When the object is repositioned on the cooktop, heating can be flexibly carried out in any chosen position within this cooking zone.The control unit is preferably designed to adjust the composition of the heating group to changes in the object's position relative to the heating modules, at least semi-automatically, and advantageously fully automatically. When another object is placed on the heating group, a further heating group can be formed to perform group operation. A heating device arrangement designed for group operation of the heating modules is preferably equipped with a large number of heating modules, in particular with at least six heating modules. To achieve high flexibility in positioning the object for heating, the heating device arrangement is preferably equipped with a set of at least ten, advantageously at least twenty, and particularly preferably at least forty heating modules. The control unit can be at least partially integrated with a processing unit, such as a microprocessor or microcontroller.

[0018] In group operation of the heating modules, the set of heating modules is distributed into heating groups and groups of unused heating modules. If a heating group corresponds to a first area of ​​the heat sink unit and an unused group corresponds to a second area of ​​the heat sink unit, heat generated in the operating group can be dissipated quickly and effectively via the second area. Areas of the heat sink unit corresponding to heating groups and unused heating groups are connected to each other via a common heat sink or via contact surfaces between different heat sinks, thus achieving rapid and effective temperature equalization between these areas.Furthermore, the heat sink unit can be designed to dissipate a smaller amount of heat than the amount of heat that would be generated if all the heating modules assigned to the heat sink unit were operated together at their respective maximum power.

[0019] Preferably, the heating modules each comprise a heating medium and a power unit for supplying power to the heating medium, with the heat sink unit forming a heat absorption area that serves to cool the power units. During operation of the heating device, the power units typically represent a major source of power losses. If, particularly in a heating device designed as an induction cooking appliance, the power units are configured as inverters for generating a heating frequency, these power losses are caused during switching operations of semiconductor components. Targeted heat absorption in the area of ​​the power units can advantageously prevent excessive cooling and the occurrence of high temperatures.

[0020] In a further embodiment of the invention, it is proposed that the heat sink unit forms a sub-section which serves as a protective means for shielding at least a portion of at least one of the heating modules against an electromagnetic field. This allows for advantageous, at least partial, electromagnetic shielding, thereby saving components, installation space, assembly effort, and costs. Advantageously, the sub-section of the heat sink unit serves to protect the power unit of a heating module, in particular against a heating field generated by a heating medium associated with the power unit. In this context, an "electromagnetic field" can be understood to be a magnetic and / or electric field. The sub-section of the heat sink unit can be made, in particular, of an antimagnetic material, such as...made of a non-ferromagnetic material, which advantageously allows for magnetic shielding of that part of the heating module.

[0021] Effective heat dissipation from the heat absorbed by the heat sink unit can be achieved if the heat sink unit incorporates at least one heat dissipation channel. The heat sink unit can also include a heat pipe filled with a certain amount of a heat transfer medium. This allows for rapid and advantageous temperature equalization across the heat sink unit. The heat pipe preferably extends longitudinally along the heat sink unit, ensuring a homogeneous temperature distribution over its entire length.

[0022] According to the invention, the cooling unit includes a fan unit which, in conjunction with the heat sink unit, is designed to cool at least three heating modules. This further increases the cooling efficiency of the cooling unit while saving components and installation space in the design of the fan unit.

[0023] A structurally simple design of the cooling unit can be achieved if the fan unit, in conjunction with the heat sink unit, serves to cool a series of at least three heating modules. The generated airflow can then run directly along the axis of the row.

[0024] If the fan unit, in conjunction with the heat sink unit, serves to cool at least two rows of heating modules, a particularly compact design of the heating device arrangement can be achieved.

[0025] According to the invention, particularly effective heat dissipation by generating a cooling airflow is achieved by the fan unit having two fans arranged on both sides of the heat sink unit. In this case, one of the fans serves to blow cooling air to interact with the heat sink unit, while the other fan is used to draw in the cooling air heated by the alternating direction of airflow.

[0026] Further advantages become apparent from the following description of the drawings. The drawings illustrate exemplary embodiments of the invention. The drawings, the description, and the claims contain numerous features in combination. A person skilled in the art will expediently consider the features individually and combine them into meaningful further combinations.

[0027] They show: Fig. 1 an induction hob with one cooking plate and one set of heating modules and two cookware units arranged on the cooking plate, Fig. 2 an internal arrangement of the induction hob made of Fig. 1 with the heating modules and a cooling unit in a top view, Fig. 3 a heating module in a schematic representation, Fig. 4 a heat sink of the cooling unit Fig. 2, Fig. 5 the arrangement from Fig. 2 in a sectional view, Fig. 6 an alternative heat sink for the cooling unit and Fig. 7 different extraction and discharge directions for a cooling airflow of the cooling unit.

[0028] Fig. Figure 1 shows a heating device 10 designed as an induction cooktop. The heating device 10 has a mounting frame 12 for attaching it to a worktop, a cooking plate 14 for placing cookware on it, and a control panel 16 for starting, stopping, and adjusting the heating operation. Two objects 18 and 20, designed as pots, are arranged on the cooking plate 14 and are each schematically represented by a solid circle. To perform a cooking operation, the heating device 10 is equipped with a set of heating modules 22. Each of these modules comprises a heating element 24 designed as an induction coil, which is arranged in Fig. 1 is schematically represented by a dashed rectangle. In the operation of a heating module 22, its heating medium 24 generates a heating signal in the form of an alternating magnetic field, which has a heating frequency, e.g., 25 kHz. The heating signal H induces electric currents in the metallic base of the objects 18, 20. These electric currents heat a feed located in the objects 18, 20. A heating medium 24 in the operation of the corresponding heating module 22 is supplied with an alternating electric current to generate the heating signal, which oscillates at the heating frequency. To generate this alternating current and to supply the heating medium 24 with power, the heating modules 22 are each equipped with a power unit 26 designed as an inverter. These power units 26 are in Fig. 2 shown.

[0029] The heating device 10 is designed to heat the objects 18, 20 by means of a group operation of the heating modules 22. For this purpose, the heating modules 22 are each equipped with a Fig. The heating module 22 is equipped with sensor means 25 as shown in Figure 3, which can detect whether the heating module 22 is at least partially covered by one of the objects 18, 20. Heating groups of heating modules 22 are formed by means of a grouping process not described in detail, each group being assigned to one of the objects 18, 20. If an operator starts a cooking operation of the heating device 10 using the control panel 16, this cooking operation is carried out using the heating modules 22 of both heating groups, while the other heating modules 22 that do not belong to any of the formed heating groups remain inactive. If the operator moves one of the objects 18, 20 on the hotplate 14 or places another cooking vessel on the hotplate 14, corresponding heating groups of heating modules 22 are adjusted or newly formed based on the new arrangement of the objects to be heated relative to the heating elements 24.The grouping processes for forming heating groups are carried out by means of a control unit 27 designed as a microprocessor, which is located in . Fig. 1 is shown as a dashed line.

[0030] In Fig. Figure 2 shows a heating device arrangement 28 of the heating device 10 in a top view, in which the set of heating modules 22 can be seen. Each heating module 22 has one of the heating elements 24 designed as induction coils, which are schematically represented in the figure as solid rectangles, and one of the power units 26 designed as inverters, represented by dashed rectangles. When the corresponding heating module 22 is operated, these power units 26 generate an alternating current at the heating frequency by means of switching operations effected by switching elements 30. Fig. 3) These switching elements 30 are designed as switching transistors. In this example, the power units 26 each have a pair of switching elements 30 designed as IGBTs (Insulated-Gate Bipolar Transistors or Bipolar Transistors with Insulated Gate Electrodes). Alternative designs of the switching elements 30, such as FET transistors (Field-Effect Transistors), are also conceivable. A representation of one of the heating modules 22 with a power unit 26, which has the switching elements 30, a heating element 24 designed as an induction coil, and one of the sensor elements 25 can be shown in the Fig. 3 can be taken.

[0031] The heating modules 22 are further arranged in a matrix configuration. In this example, the matrix configuration has four rows 32.1, 32.2, 32.3, 32.4 and twelve columns. Further embodiments of the matrix configuration with additional combinations of row and column numbers are conceivable. The heating elements 24, designed as induction coils, are received in a support element designed as a support matrix 38 (see also Fig. 5) The heating modules in a row 32.1, 32.2, 32.3, 32.4 each define a row axis, the row axes being aligned parallel to an axis 34. The heating modules 22 in a column each define a column axis, the column axes being aligned parallel to an axis 36 that is perpendicular to the axis 34.

[0032] When a heating module 22 is operated, heat is generated by the corresponding power unit 26, particularly through losses in its switching elements 30. In group operation of the set of heating modules 22, the heat generated by an operating heating group of heating modules 22 must be dissipated to prevent overheating of the heating device 10. To prevent damage to the heating device electronics, the temperature of the heating device 10 must be kept below 125°C. For this purpose, the heating device arrangement 28 is provided with a cooling unit 40. The cooling unit 40 has two heat sink units 42, 44, each of which is arranged below the support matrix 38 when viewed from the hotplate 14. The heat sink units 42, 44 each comprise two one-piece heat sinks 46, 48 and 50, 52, respectively, made of aluminum. The heat sink units 42, 44 each serve to cool two rows 32.1, 32.2 and 32, respectively.3, 32.4 of heating modules 22, which correspond to two rows of the matrix arrangement. In particular, the heat sink units 42, 44 serve to cool the power units 26 of the heating modules 22. For this purpose, two rows of power units 26 are arranged parallel to the axis 34 of the matrix arrangement on both sides of one of the heat sink units 42, 44. The heat sink units 42, 44 are identical, so the following description is limited to the heat sink unit 42.

[0033] The heat sinks 46, 48 are each designed as a cuboid body (see also Fig. 4), which, in the assembled state of the heating device arrangement 28, extends along the axis 34 of the matrix arrangement. The heat sinks 46, 48 also each have a contact surface 54 and 56 respectively (see also Fig. 4), via which they abut each other. The contact surfaces 54, 56 are each formed by a side surface of the respective heat sink 46 or 48, which is perpendicular to the main extension direction of the heat sink 46 or 48. The contact surfaces 54, 56 are identical, thus enabling effective heat transfer between the heat sinks 46, 48. Side surfaces of the heat sinks 46, 48 serve to cool the power units 26 during operation of the corresponding heating modules 22. In this context, a side surface 58.1 of the heat sink 46, in conjunction with a side surface 60.1 of the heat sink 48, forms a heat absorption area 61.1 for absorbing heat generated by the power units of the series 32.1 of heating modules 22 through power losses. This heat absorption area 61.1 is designed as a continuous heat absorption surface extending in the main extension direction of the cooling unit 42.In this embodiment, heat absorption is achieved via direct contact, specifically by the power units 26 of series 32.1 bearing against the heat absorption area 61.1. In a further embodiment, this can be achieved indirectly by arranging the power units 26 at a small distance from the heat absorption area 61.1. Furthermore, the use of a thermal conductor, such as thermal paste, to connect the power units 26 to the heat absorption area 61.1 is conceivable.

[0034] On the side of the heat sink unit 42 facing away from the side surfaces 58.1 and 60.1, a side surface 58.2 of the heat sink 46, in conjunction with a side surface 60.2 of the heat sink 48, forms a continuous heat absorption area 61.2, which serves to cool the row 32.2 of heating modules 22. The heat absorption areas 61.1 and 62.2 form a heat absorption area 61 of the heat sink unit 42, which serves to cool the rows 32.1 and 32.2 of heating modules 22. The description of the formation of heat absorption areas by the heat sink unit 42 also applies to the heat sink unit 44 and is not repeated here.

[0035] In group operation of the heating modules 22, the set of heating modules 22 is divided between the heating groups and the remaining, unused heating modules 22. Due to the large, continuous heat absorption areas 61 extending over the entire length of the rows 32, heat generated by the operated power units 26 of the heating groups can be dissipated via areas of the heat sink units 42, 44 facing the unused heating modules 22. In group operation of the heating modules 22, a rapid and effective temperature equalization can be achieved between regions of the heat sink units 42, 44 corresponding to the heating groups on the one hand and unused heating modules 22 on the other.

[0036] Furthermore, the cooling unit 40 is equipped with two fan units 62, 64, each assigned to a heat sink unit 42 or 44, respectively. Each fan unit 62, 64, in conjunction with its corresponding heat sink unit 42 or 44, serves to cool two rows 32 of the matrix arrangement of heating modules 22. The fan units 62, 64 each have two fans 66, 68 or 70, 72, respectively, arranged on both sides of the assigned heat sink unit 42 or 44. The fans 66, 68, 70, 72 are each located in the region of an end face 74 of a heat sink 46, 48, 50, 52, which extends perpendicular to the axis 34 of the matrix arrangement (see Fig. 4) The fan units 62, 64, by means of their respective fan pairs, each generate a cooling airflow 76 during operation of the heating device 10. This airflow runs parallel to the axis 34 in the main direction of extension of the heat sink units 42, 44 and is schematically represented by a dashed arrow. For this purpose, the fans 66, 70 draw in cool air and blow it into the heat sink units 42 and 44, respectively. The fans 68, 72 draw in the air heated in the heat sink unit 42 and 44, respectively, and discharge it to the outside. Viewed from the cooktop 14, the fans 66, 68, 70, 72 are each covered by a section 78 of a heat sink unit 42, 44, which is designed as a bridge (see also Fig. 4).

[0037] Fig. Figure 4 shows the heat sink 48 and the fan 66 associated with the heat sink 48 in a perspective view. The heat sink 48 has the side surface 60.2, which, in conjunction with the side surface 58.2 of the heat sink 46, forms the heat absorption area 61.2 (see Figure 4). Fig. 2), along which, in the assembled state of the heating device arrangement 28, power units 26 of the series 32.2 are arranged. The heat sink 48 further comprises a sub-section designed as a plateau 82, which is formed by a top surface that, in the assembled state of the heating device 10, faces the heating elements 24. The plateau 82 continues in the main extension direction of the heat sink 48 as the sub-section 78 designed as a web, below which the fan 66 is arranged. In the assembled state of the heating device arrangement 28, the heating elements 24 of the heating modules 22 are each arranged above the plateau 82 when viewed from the cooktop 14. Openings 84 are also formed from the plateau 82, which extend perpendicular to the plateau plane as air channels perpendicular to the plateau plane through the heat sink 48. These openings 84 allow an airflow into and out of the heat sink 48.In particular, effective cooling of the heating elements 24 arranged above the plateau 82 can be achieved. Furthermore, an underside 86 of the heat sink 48, which is arranged opposite the plateau 82, has ribs 88 that form heat dissipation channels 89 (see also ). Fig. 5) These heat dissipation channels 89, which extend in the main direction of extension of the heat sink 48 and, in the assembled state of the heating device arrangement 28, along the axis 34 of the matrix arrangement, enable particularly effective temperature equalization between areas of the heat sink 48. The underside of the heat sink 46 is identically designed, so that the heat dissipation channels 89 formed by the fins 88 continue into the heat sink 46 and thus run along the axis 34 over the entire heat sink unit 42.

[0038] In Fig. Figure 5 is a sectional view through part of the heating device arrangement 28. Fig. Figure 2 shows the heating elements 24 of rows 32.1 and 32.2, as well as the heat sink unit 42 with the heat sink 48. As described above, the heat sink 48 forms the heat absorption areas 61.1 and 62.2, which serve to cool a row 31.1 and 32.2, respectively, on either side of the heat sink 48. The plateau 82, on which the heating elements 24, designed as induction coils, are arranged, and the fins 88 forming the heat dissipation channels 89 are also visible. The power units 26 are connected via a circuit board 90 located below the heat sink 48 to a control electronics unit (not shown) of the heating device 10. The support matrix 38, which forms receiving areas 92 in which the heating elements 24 are received, is also visible. The support matrix 38, the heat sink 48 and the circuit board 90 are connected to each other via connecting elements not shown in detail.By arranging the heating elements 24 over the plateau 82 and the power units 26 at the heat absorption areas 61.1, 61.2 of the heat sink 48, the power units 26 are partially shielded from the heating field generated by the heating elements 24 by the plateau 82. Sections 94, 96 of the heat sink 48, each extending over the area of ​​the heating elements 24, serve as protective elements to shield the power units 26 from the heating field. Sections 94, 96 correspond to areas of the heat sink 48 that are each overlapped by a heating element 24. These are schematically delimited by dashed lines in the figure.

[0039] Fig. Figure 6 shows an alternative embodiment of the cooling unit 40 with the fan unit 62 and a heat sink unit 98. Features of the heat sink unit 98 that correspond to features of the heat sink unit 42 are not described here to avoid repetition and are designated with the same reference numerals in the figure. The heat sink unit 98 is formed by a one-piece heat sink 100, which, in the assembled state of the heating device arrangement 28, serves to cool the rows 32.1, 32.2 of heating modules 22 along their entire length. Side surfaces of the heat sink 100, extending parallel to the main direction of extension of the heat sink 100, form two heat absorption areas, one of which, heat absorption area 102.2, for cooling row 32.2, is visible in the figure. The heat absorption area 102.2 and another heat absorption area, not visible in the figure, for cooling row 32.The side surface of the heat sink 100 opposite the heat absorption area 102.2 forms a heat absorption area 102, which serves to cool the rows 32.1 and 32.2. The fan unit 62 has the fans 66, 68, which are arranged on both sides of the heat sink 100. In a further embodiment, a one-piece heat sink is conceivable, which is provided for cooling at least three, in particular at least four, rows of the matrix arrangement. A heat sink unit can also be formed by a one-piece heat sink, which is provided for cooling at least a predominant part of the matrix arrangement of heating modules 22, in particular for cooling the entire matrix arrangement.

[0040] In Fig.Figure 7 shows various combinations of air extraction and discharge directions for the cooling airflow 76 by means of the fans 66, 68 of the fan unit 62. The extraction or discharge direction can be aligned parallel or perpendicular to the main extension direction of the heat sink unit 42. Reference sign 10 Heating device 12 mounting frames 14 hotplates 16 Control panel 18 Item 20 Item 22 Heating module 24 heating elements 25 sensor media 26 power units 27 Control unit 28 Heating device arrangement 30 switching devices 32nd row 32.1 row 32.2 row 32.3 row 32.4 row 34 axle 36 axle 38 Carrier matrix 40 cooling units 42 Heat sink unit 44 Heat sink unit 46 heat sinks 48 heat sinks 50 heat sinks 52 heat sinks 54 Contact area 56 contact area 58.1 Side surface 58.2 Side surface 60.1 Side surface 60.2 Side surface 61 Heat absorption area 61.1 Heat absorption area 61.2 Heat absorption area 62 fan unit 64 fan unit 66 fans 68 fans 70 fans 72 fans 74 Front surface 76 Cooling airflow 78 Sub-area 82 Plateau 84 Opening 86 Underside 88 rib 89 Heat dissipation channel 90 printed circuit boards 92 Recording area 94 Sub-area 96 sub-area 98 Heat sink unit 100 heat sinks 102 Heat absorption area 102.2 Heat absorption area

Claims

[1] Heating device arrangement (28), in particular an induction cooking device arrangement, with a set of heating modules (22), wherein a heating module (22) has a heating means (24) for transmitting heating energy to an object (18, 20) to be heated and a power unit (26) for supplying the heating means (24) with power, and with a control unit (27) which is provided to form a heating group of heating modules (22) designed to heat the object (18, 20) depending on a position of an object (18, 20) to be heated relative to the heating modules (22), characterized bya cooling unit (40) for cooling the heating modules (22), wherein the cooling unit (40) has at least one heat sink unit (42, 44; 98) which serves to cool at least three heating modules (22), wherein the cooling unit (40) has a fan unit (62, 64) which, in cooperation with the heat sink unit (42, 44; 98), is provided for cooling at least three heating modules (22), wherein the fan unit (62, 64) has two fans (66, 68, 70, 72) which are arranged on both sides of the heat sink unit (42, 44; 98), and wherein one of the fans (66, 70) serves to blow cooling air for interaction with the heat sink unit (42, 44, 98), while the other fan (68, 72) is used to suck in the cooling air heated by the alternating direction. [2] Heating device arrangement (28) according to claim 1, characterized bythat the heat sink unit (42, 44; 98) forms a continuous heat absorption area (61.1, 61.2; 102.2) for cooling at least three heating modules (22). [3] Heating device arrangement (28) according to claim 1 or 2, characterized by that the heat sink unit (42, 44; 98) forms a heat absorption area (61.1, 61.2; 102.2) which serves to cool at least one row (32.1, 32.2, 32.3, 32.4) of at least three heating modules (22). [4] Heating device arrangement (28) according to one of the preceding claims, characterized by that the heat sink unit (42, 44; 98) forms a heat absorption area (61; 102) which serves to cool at least two rows (32.1, 32.2, 32.3, 32.4) of heating modules (22). [5] Heating device arrangement (28) according to one of the preceding claims, characterized by that the heat sink unit (98) is designed as a one-piece heat sink (100). [6] Heating device arrangement (28) according to one of the preceding claims, characterized by that the heating modules (22) each have a heating means (24) and a power unit (26) for supplying power to the heating means (24) and the heat sink unit (42, 44; 98) forms a heat absorption area (61; 102) which serves to cool the power units (26). [7] Heating device arrangement (28) according to one of the preceding claims, characterized by that the heat sink unit (42) forms a partial region (94, 96) which serves as a protective means for protecting at least a part of at least one of the heating modules (22) against an electromagnetic field. [8] Heating device arrangement (28) according to one of the preceding claims, characterized by that the heat sink unit (42; 98) forms at least one heat dissipation channel (89). [9] Heating device arrangement (28) according to one of the preceding claims, characterized bythat the fan unit (62, 64) in cooperation with the heat sink unit (42, 44; 98) serves to cool a row (32.1, 32.2, 32.3, 32.4) of at least three heating modules (22). [10] Heating device arrangement (28) according to one of the preceding claims, characterized by that the fan unit (62, 64) in cooperation with the heat sink unit (42, 44; 98) serves to cool at least two rows (32.1, 32.2, 32.3, 32.4) of heating modules (22). [11] Heating device, in particular induction cooking device, with a heating device arrangement (28) according to one of the preceding claims.

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