DOUBLE-SIDED POLISHING DEVICE AND DOUBLE-SIDED POLISHING PROCESS

Abstract

To provide a double-sided polishing device that can suppress a workpiece shape deviation from a target shape after completion of final polishing and achieve a desired workpiece shape, a control device (30) configured to control a polishing machine (10) based on measurement results from a thickness measuring device (20) comprises: a first learning device (31) that has learned a correlation between a main polishing condition, an outer edge flatness, and an in-plane flatness; a second learning device (32) that has learned a correlation between an endpoint polishing condition, a degree of change in the in-plane flatness when the main polishing is complete, a degree of change in the outer edge flatness when the main polishing is complete, and an amount of change in the outer edge flatness during endpoint polishing; and a main polishing condition correction section (33) configured toto correct the main polishing condition at a time of correction by the main polishing condition, which is obtained by inputting into the first learning unit (31) a setpoint for the outer edge flatness and a correction setpoint for the in-the-plane flatness, which are obtained from a learning result of the first learning unit (31), and a main polisher termination condition setting section (34) which is configured to set a main polisher termination condition using the change amount of the outer edge flatness obtained from a learning result of the second learning unit (32).