charger and vehicle

Abstract

Charger (100), showing: a housing (10) that defines a receiving cavity (11); a heat dissipation module (20) which is received in the receiving cavity (11), wherein the heat dissipation module (20) comprises a heat dissipation element (21) and an insert (22), the heat dissipation element (21) defining a water channel groove (211) and at least a part of the insert (22) extending into the water channel groove (211); and a power module (30) comprising a power device (31), wherein the power device (31) is received in the receiving cavity (11) and is thermally connected to the heat dissipation module (20) by a heat-conducting element (36).

Description

Technical field

[0001] This disclosure relates to the field of vehicle technology and in particular to a charger and a vehicle. Background of the Revelation

[0002] In recent years, with the rapid development of new energy electric vehicles (NEVs), energy efficiency, environmental protection, safety, and lightweight construction have become key development areas for future NEVs. An integrated charger in an NEV has the capability to fully charge the vehicle's battery safely and automatically. Based on data provided by a battery management system (BMS), the charger can dynamically adjust charging current or voltage parameters and perform appropriate actions to complete the charging process.

[0003] During operation, a power device in the charger can generate a large amount of heat, which requires timely heat dissipation. Brief summary of the Revelation

[0004] One purpose of the disclosure is to provide a charger and a vehicle that can dissipate heat in a timely manner for a power device in the charger.

[0005] To achieve the purpose of the revelation, the following technical solutions are provided in the revelation.

[0006] According to a first aspect, the disclosure provides a charger. The charger comprises a housing, a heat dissipation module, and a power module. The housing defines a receiving cavity. The heat dissipation module is received within the receiving cavity. The heat dissipation module comprises a heat dissipation element and an insert. The heat dissipation element defines a water channel groove. At least a portion of the insert extends into the water channel groove. The power module comprises a power device. The power device is received within the receiving cavity and is thermally connected to the heat dissipation module by a thermally conductive element.

[0007] According to one embodiment, the power module further comprises a power board, and the power device is attached to a surface of the power board that faces the heat dissipation module.

[0008] According to one embodiment, the insert has a sealing section and a projecting section. The sealing section is connected around the projecting section. The sealing section is connected to the heat dissipation element and seals an opening of the water channel groove. The projecting section extends into the water channel groove. The insert and the heat dissipation element together define a three-dimensional water channel.

[0009] According to one embodiment, a heat dissipation groove is defined at one end of the protruding section, facing away from an upper surface. An opening of the heat dissipation groove is oriented in the same direction as the opening of the water channel groove.

[0010] According to one embodiment, the heat dissipation module further comprises a water channel cover plate. The water channel cover plate seals an opening in the water channel groove. The water channel cover plate and the heat dissipation element together define a three-dimensional water channel.

[0011] According to one embodiment, the insert has a projecting section and a connecting section. The projecting section is connected to the water channel cover plate and is spaced apart from an inner wall of the water channel groove. The connecting section is connected to an outer circumferential surface of the projecting section, projects from it, and rests against the inner wall of the water channel groove.

[0012] According to one embodiment, the housing comprises a lower housing and a cover plate. The lower housing defines the receiving cavity. The cover plate is connected to one end of the lower housing and seals an opening of the receiving cavity. One end of the cover plate and the lower housing defines a mounting hole, and the other end of the cover plate and the lower housing is provided with a mounting section. The mounting section is compatible with the mounting hole to connect the cover plate and the lower housing.

[0013] According to one embodiment, the power module further comprises a power supply. The power supply is connected to the power board and housed in the mounting cavity. The power supply is thermally connected to the heat dissipation module.

[0014] According to one embodiment, the power module further comprises a magnetic element. A receiving groove is also defined at one end of the heat dissipation module, facing away from an opening of the water channel groove. The water channel groove surrounds a side wall of the receiving groove. The magnetic element is received in the receiving groove.

[0015] According to a second aspect, a vehicle is further provided in the disclosure. The vehicle comprises a vehicle body, a power consumption device, and the charger, which is described in one of the various embodiments according to the first aspect. The charger is located in the vehicle body. The charger is configured to receive an alternating current (AC), convert the received AC into a direct current (DC), and output the converted DC to the power consumption device to supply power to the power consumption device.

[0016] The heat dissipation module is configured to include the heat dissipation element and the insert, with at least part of the insert extending into the water channel groove of the heat dissipation element. As such, the insert reduces the volume available for the flow of a cooling medium within the water channel groove, allowing the cooling medium to flow close to a wall surface of the heat dissipation element. This enables the heat from the power device to be transferred to the heat dissipation module via the heat-conducting element in a timely manner, resulting in high heat dissipation efficiency. Brief description of the drawings

[0017] To more clearly describe technical solutions in embodiments of the disclosure or the prior art, the following provides a brief introduction to the accompanying drawings, which are necessary for describing the embodiments or the prior art. Obviously, the accompanying drawings in the following description illustrate only some embodiments of the disclosure. Based on these drawings, those skilled in the field can also derive other drawings without inventive effort. Fig. Figure 1 is a schematic exploded view of a charger according to one embodiment. Fig. Figure 2 is a perspective structural view of a part of a charger according to one embodiment. Fig. Figure 3 is a schematic cross-sectional structural view of a part of a charger according to one embodiment. Fig. Figure 4 is a bottom view of a charger according to one embodiment. Fig. Figure 5 is a schematic cross-sectional structural view of a part of a charger according to a further embodiment. Fig. Figure 6 is a perspective view of an insert according to one embodiment. Reference symbol list 100 chargers 10 cases 11 Receiving cavity 12 Floor wall 13 side perimeter wall 14 Cover plate 15 mounting holes 16 Fastening section 20 Heat dissipation module 21 Heat dissipation element 211 Water channel groove 212 upper surface 213 first side surface 214 second side surface 215 Heat dissipation advantage 22 deployment 221 Sealing section 222 preceding section 223 Heat dissipation groove 224 Connecting section 23 Water channel cover plate 24 recordings 30 Power module 31 Power device 32 Power board 33 Benefit provision 34 capacitive device 35 magnetic element 36 heat-conducting element 40 nozzle Detailed description of the embodiments

[0018] The following will clearly and completely describe technical solutions of embodiments of the disclosure with reference to the accompanying drawings of embodiments of the disclosure. Obviously, the embodiments described herein are only some embodiments, rather than all embodiments, of the disclosure. Based on the embodiments of the disclosure, all other embodiments obtained by those skilled in the art without inventive effort shall fall within the scope of protection of the disclosure.

[0019] It can be noted that when a component is described as "attached to" another component, the component may be directly attached to the other component, or an intermediate component may exist between them. Similarly, when a component is described as "connected to" another component, the component may be directly attached to the other component, or an intermediate component may exist between them.

[0020] Unless otherwise defined, all technical and scientific terms used in the disclosure have the same meaning as generally understood by those skilled in the art in the field of disclosure. The terms used in the description of the disclosure serve only to describe embodiments, rather than to limit the disclosure. The term "and / or," as used in the disclosure, includes any and all combinations of one or more of the related listed elements.

[0021] Some embodiments of the disclosure are described in detail below with reference to the accompanying drawings. Different embodiments and features within those embodiments can be combined without conflict.

[0022] It can be on Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5 to Fig. Reference is made to Section 6. A vehicle is provided in the disclosure. The vehicle comprises a vehicle body (not shown in the figure), a power consumption device (not shown in the figure), and a charger 100 in embodiments of the disclosure. The charger 100 is arranged in the vehicle body. The charger 100 is configured to receive an alternating current (AC), convert the received AC into a direct current (DC), and output the converted DC to the power consumption device to supply power to the power consumption device.

[0023] The vehicle can be an electric vehicle or a hybrid electric vehicle. The vehicle body includes, but is not limited to, a vehicle frame. The electrical power consumption device includes, but is not limited to, vehicle lights, a display instrument, a vehicle-mounted air conditioning system, a sound system, etc., and the electrical power consumption device is supported by the vehicle body.

[0024] Optionally, the charger 100 can be connected and secured to the vehicle body by welding, gluing, snapping, screwing, riveting, magnetic connection, or similar methods; this is not limited here. The charger 100 can output DC power to the electrical device to supply it with power.

[0025] The vehicle can optionally be equipped with a power battery. The Charger 100 can be configured to receive an initial AC signal and output an initial DC signal, allowing the Charger 100 to convert the input AC signal into the high-voltage DC required by the power battery, thus supplying power to the power battery. The Charger 100 is connected to the vehicle's power battery. The Charger 100 can convert the high-voltage DC input from the power battery into a low-voltage DC, thereby drawing power from the power battery and supplying power to the vehicle's electrical devices.

[0026] The charger 100, in embodiments of the disclosure, is used for the vehicle in embodiments of the disclosure, and the charger 100 supplies power to the electrical power consumption device. As such, in addition to achieving a high power density, the charger 100 can dissipate heat generated during operation in a timely manner, thereby guaranteeing the operational reliability of the charger 100.

[0027] The charger 100 in embodiments of the disclosure is described in detail below.

[0028] It can be on Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5 to Fig. Reference is made to Section 6. The charger 100 is provided in embodiments of the disclosure. The charger 100 comprises a housing 10, a heat dissipation module 20, and a power module 30. The housing 10 defines a receiving cavity 11 with an opening at one end of the receiving cavity 11.

[0029] The housing 10 can be made of a material with high structural strength, which may be, in particular, a metal, high-strength plastic, ceramic, or the like. For example, the metal material may be aluminum, aluminum alloy, magnesium alloy, iron, iron alloy, or the like. The housing 10 can be designed as a one-piece structure, meaning it is a single-piece structure manufactured by a one-piece forming process. This one-piece forming process may specifically be stamping, casting, or the like, without limitation. Alternatively, the housing 10 can have a split structure, with parts of the housing 10 being joined and fastened together by welding, gluing, snap-fitting, screwing, or the like.

[0030] In one embodiment as in Fig. As illustrated in Figure 2, the housing 10 has a sub-housing. The sub-housing has a bottom wall 12 and a side wall 13. The side wall 13 is connected around the bottom wall 12. The side wall 13 and the bottom wall 12 together define the receiving cavity 11.

[0031] The lower housing is of a one-piece or a split structure. The bottom wall 12 can be connected to and attached to the side perimeter wall 13 by welding, gluing, snap-fitting, bolting, or the like. Optionally, the bottom wall 12 can be circular, rectangular, square, polygonal, or the like, without limitation herein. The side perimeter wall 13 is connected around the bottom wall 12 and interacts with the bottom wall 12 to form a cylindrical shape, a prismatic shape, or the like, without limitation herein.

[0032] Optionally, the housing 10 also includes a cover plate 14. The cover plate 14 is connected to one end of the lower housing and seals an opening of the receiving cavity 11.

[0033] Optionally, the cover plate 14 is connected to an end of the side perimeter wall 13 that faces away from the bottom wall 12 and seals an opening of the receiving cavity 11.

[0034] In one embodiment as in Fig. Figure 1 illustrates that one of the cover plate 14 and the lower housing defines a mounting hole 15, and the other of the cover plate 14 and the lower housing is provided with a mounting section 16. The mounting section 16 is compatible with the mounting hole 15 to connect the cover plate 14 and the lower housing.

[0035] The shapes of the mounting hole 15 and the mounting section 16 are not specifically restricted. Optionally, the mounting hole 15 can be circular, square, triangular, regular polygonal, or the like, as long as the shape of the mounting section 16 corresponds to the shape of the mounting hole 15.

[0036] Optionally, the cover plate 14 defines the mounting hole 15, and one end of the side perimeter wall 13, facing away from the bottom wall 12, is provided with the mounting section 16. Alternatively, in another embodiment, the cover plate 14 is provided with the mounting section 16, and the side perimeter wall 13 defines the mounting hole 15, which is not limited here.

[0037] When the cover plate 14 is connected to the sub-housing, the mounting section 16 extends into the mounting hole 15, which can provide accurate positioning for the connection between the cover plate 14 and the sub-housing and does not require an additional connecting structure, thus simplifying installation.

[0038] The heat dissipation module 20 is received in the receiving cavity 11 and connected to the housing 10.

[0039] The heat dissipation module 20 is configured for the flow of a cooling medium to exchange heat with a device. In some embodiments, the heat dissipation module 20 can be a three-dimensional water channel, a planar water channel, a flow channel plate, or the like; this is not specifically limited. The cooling medium can be water, ethylene glycol solution, mineral oil, fluorinated liquid, deionized water, etc., or a gaseous heat transfer medium such as air; this is not specifically limited.

[0040] Optionally, the heat dissipation module 20 can be connected to and attached to the housing 10, or it can be detachably connected to the housing 10. The heat dissipation module 20 can be connected to the housing 10 by welding, gluing, snapping, screwing, riveting, magnetic connection, or the like; there are no specific restrictions on this method.

[0041] In one embodiment as in Fig. 1 and Fig. As illustrated in Figure 2, the charger 100 further comprises a nozzle 40, which is configured to convey a cooling medium. Optionally, the nozzle 40 is implemented as two nozzles, and the two nozzles 40 are spaced apart from each other on the side circumferential wall 13 and both communicate with the heat dissipation module 20.

[0042] In one embodiment as in Fig. 2 and Fig. As illustrated in Figure 3, the heat dissipation module 20 defines a three-dimensional flow channel. The heat dissipation module 20 has an upper surface 212 which faces an opening of the receiving cavity 11.

[0043] In particular, the three-dimensional flow channel may have a U-shaped three-dimensional water channel, several U-shaped three-dimensional water channels connected in parallel or in series, an S-shaped water channel or the like, which is not limited here.

[0044] In one embodiment as in Fig. 2 and Fig. As illustrated in Figure 3, the heat dissipation module 20 comprises a heat dissipation element 21 and an insert 22. The heat dissipation element 21 defines a water channel groove 211. At least part of the insert 22 extends into the water channel groove 211.

[0045] The heat dissipation element 21 is connected to the base wall 12 and projects from it. An opening of the water channel groove 211 is oriented in the opposite direction to the opening of the receiving cavity 11. The insert 22 is connected to the heat dissipation element 21 and seals the opening of the water channel groove 211 to define a three-dimensional water channel.

[0046] In one embodiment, the heat dissipation element 21 and the housing 10 are of a single-piece structure; that is, the heat dissipation element 21 projects from the bottom wall 12 toward the opening of the receiving cavity 11. With such an arrangement, the housing 10 fulfills the functions of both mechanical protection and partial heat dissipation and is compact in structure. Furthermore, assembly operations can be reduced and production efficiency improved.

[0047] Alternatively, the heat dissipation element 21 and the base wall 12 can have a split structure. The heat dissipation element 21 and the base wall 12 can be connected and fastened to each other by welding, gluing, snapping, screwing, riveting or the like, which is not limited here.

[0048] Optionally, the opening of the water channel groove 211 is turned away from the upper surface 212 (i.e., the opening of the water channel groove 211 is opposite to the opening of the receiving cavity 11).

[0049] Optionally, the upper surface 212 of the heat dissipation element 21 is parallel to a surface of the bottom wall 12 facing the opening of the receiving cavity 11, so that a power device 31 can be thermally connected to the heat dissipation element 21. Optionally, as shown in Fig. As illustrated in Figure 3, the opening of the water channel groove 211 is flush with a surface of the bottom wall 12 of the housing 10, facing away from the opening of the receiving cavity 11. With this arrangement, the insert 22 seals the opening of the water channel groove 211 to define a three-dimensional water channel, and the opening of the water channel groove 211 is oriented in the opposite direction to the opening of the receiving cavity 11. This allows the power device 31 to be attached to the power module 30 and placed in the receiving cavity 11, and the insert 22 and the heat dissipation element 21 to be mounted. As such, the assembly is flexible, and any accidentally leaking coolant can be prevented from flowing into the receiving cavity 11.

[0050] As in Fig. 2 and Fig. As illustrated in Figure 3, the power module 30 includes the power device 31. The power device 31 is received in the receiving cavity 11 and is thermally connected to the upper surface 12 of the heat dissipation element 21 by a thermally conductive element 36.

[0051] The power module 30 is configured to efficiently and controllably convert an input AC signal into a DC signal suitable for battery operation. The power device 31 can be at least one metal-oxide-semiconductor field-effect transistor (MOSFET), a full-bridge power module, a half-bridge power module, etc., or it can be any other feasible power component. A MOSFET is a fundamental unit that forms various complex circuits. The basic structure of a MOSFET mainly consists of a source, a drain, and a gate. The source and drain of the MOSFET are formed by high doping and can be classified as n-type (NMOS) or p-type (PMOS), depending on the device type. A MOSFET provided in this embodiment can be, but is not limited to, an N-channel enhancement MOSFET or a P-channel enhancement MOSFET.The FET can be a high-power MOSFET, a medium-power MOSFET, or a low-power MOSFET, but is not limited to these. A full-bridge power module is a power conversion unit that has four power-switching devices (e.g., four FETs). A half-bridge power module is a power conversion unit that has two power-switching devices (e.g., two FETs). By alternately switching on multiple power-switching devices, both the full-bridge and half-bridge power modules can achieve DC-AC conversion or voltage regulation.

[0052] For example, the power device 31 is a full-bridge power module. In a specific embodiment, the full-bridge power module comprises a first circuit bridge branch, a second circuit bridge branch, and a first capacitor bridge branch. The first circuit bridge branch comprises a first upper-switch chip unit and a first lower-switch chip unit, wherein a first end of the first upper-switch chip unit is electrically connected to a second end of the first lower-switch chip unit by a metal structure. The second circuit bridge branch comprises a second upper-switch chip unit and a second lower-switch chip unit, and a first end of the second upper-switch chip unit is electrically connected to a second end of the second lower-switch chip unit by a metal structure. The first circuit bridge branch and the second circuit bridge branch are arranged asymmetrically.Both a second end of the first upper-switch chip unit and a second end of the second upper-switch chip unit are electrically connected to a positive DC terminal via a metal structure, and both a first end of the first lower-switch chip unit and a first end of the second lower-switch chip unit are electrically connected to a negative DC terminal via a metal structure. A first end of the first capacitor bridge branch is coupled to the positive DC terminal, a second end of the first capacitor bridge branch is coupled to the negative DC terminal, and the first capacitor bridge branch is positioned closer to and between the first upper-switch and first lower-switch chip units to reduce the commutation loop between them.With such an arrangement, the packaging volume of the power module can be reduced, and the overall commutation performance of a circuit can be guaranteed.

[0053] The power device 31 can be a switching element that serves as the charger 100, but is not limited to this. It can be understood that the power device 31 can also be configured to control a current, to serve as a variable resistor, or to serve as a constant current source. The function of the power module 30 is not intended to be a limitation for the charger 100 provided in this embodiment.

[0054] The number of power device(s) 31 can be one, two, three, or more, but is not limited thereto. The number of power device(s) 31 can be adjusted according to the actual application requirements of the charger 100. It can be understood that the number of power device(s) 31 is not intended to be a limitation for the charger 100 provided in this embodiment. In schematic views of embodiments of the disclosure, multiple power devices 31 are used as an example for illustration. Optionally, if the number of power device(s) 31 is multiple, an orthographic projection of each of the multiple power devices 31 onto the base wall 12 partially overlaps with the orthographic projection of the heat dissipation module 20 onto the base wall 12.

[0055] The power device 31 can be attached to the heat dissipation module 20, but is not limited to this, so that heat generated during the operation of the power device 31 can be transferred to the heat dissipation module 20 for effective heat dissipation. In some embodiments, the power device 31 can be spaced a certain distance from the heat dissipation module 20, and the heat from the power device 31 is conducted to the heat dissipation module 20 by means of another heat-dissipating medium.

[0056] Optionally, the power device 31 is tightly attached to the upper surface 212, or the power device 31 is connected to the upper surface 212 by the thermally conductive element 36. The power device 31 can be connected to the upper surface 212 by gluing, welding, or the like, or it can be tightly attached to the heat dissipation module 20 using other structures such as a spring clamp, which is not specifically restricted. Optionally, the power device 31 can also be attached to the upper surface 212 by the thermally conductive element 36.

[0057] In some other embodiments, the power device 31 can be thermally connected to another part of the heat dissipation module 20.

[0058] In one specific embodiment, the thermally conductive element 36 can be a substrate, which can specifically be a ceramic substrate, a metal substrate, a composite substrate, or the like. The thermally conductive element 36 can also be made of any other feasible material with high thermal conductivity, without any specific limitation.

[0059] With such an arrangement, the heat from the power device 31 can be transferred directly or through the heat-conducting element 36 to the upper surface 212 of the heat dissipation module 20, thereby improving the heat dissipation efficiency.

[0060] In a specific embodiment, the three-dimensional water channel comprises a first water channel (not shown in the figure), a second water channel (not shown in the figure), and a third water channel (not shown in the figure) connected sequentially. The first water channel is opposite to and spaced apart from the third water channel. A surface of the first water channel facing the opening of the receiving cavity 11, a surface of the second water channel facing the opening of the receiving cavity 11, and a surface of the third water channel facing the opening of the receiving cavity 11 together form the upper surface 212. Each of the multiple power devices 31 is tightly attached to the surface of the first water channel facing the opening of the receiving cavity 11 and to the surface of the third water channel facing the opening of the receiving cavity 11.Optionally, at least some of the multiple power devices 31 can also be attached close to the surface of the second water channel, which faces the opening of the receiving cavity 11.

[0061] With such an arrangement, if the power device 31 is designed as several power devices, the several power devices 31 can be arranged around the heat dissipation module 20 and are subject to heat dissipation through the heat dissipation module 20, thereby improving the heat dissipation efficiency.

[0062] In embodiments of the disclosure, the heat dissipation module 20 is configured to include the heat dissipation element 21 and the insert 22, and at least part of the insert 22 extends into the water channel groove 211 of the heat dissipation element 21. As such, the insert 22 can reduce the volume available for the flow of a cooling medium within the water channel groove 211, so that the cooling medium flows near a wall surface of the heat dissipation element 21, and the heat from the power device 31 can be transferred to the heat dissipation module 20 in a timely manner via the heat-conducting element 36, thereby achieving high heat dissipation efficiency.

[0063] In one embodiment as in Fig. As illustrated in Figure 3, the heat dissipation element 21 has a first side surface 213 and a second side surface 214, which is opposite the first side surface 213. Both the first side surface 213 and the second side surface 214 are connected between the upper surface 212 and the bottom wall 12. The distance between the first side surface 213 and the second side surface 214 gradually decreases from an end of the heat dissipation element 21 connected to the bottom wall 12 to an end of the heat dissipation element 21 facing away from the bottom wall 12.

[0064] The first side surface 213 and the second side surface 214 can each be a flat surface, a folded surface, a curved surface, or any combination thereof, without limitation. It can be understood that the first side surface 213 and the second side surface 214 each form part of an outer circumferential surface of the heat dissipation element 21, and that the wall thickness of each of the two side walls of the heat dissipation element 21 can be substantially uniform, that is, the distance between two side walls of the water channel groove 211 gradually decreases from one end of the heat dissipation element 21 connected to the bottom wall 12 to the end of the heat dissipation element 21 facing away from the bottom wall 12.

[0065] Optionally, the gradual decrease in the distance between the first side surface 213 and the second side surface 214 can be uniform, uneven, or abrupt, without limitation. Optionally, the shape of the insert 22 is adapted to the shape of the heat dissipation element 21, meaning that the distance between two opposite side surfaces of the insert 22 also decreases gradually from one end of the heat dissipation element 21 connected to the bottom wall 12 towards the end of the heat dissipation element 21 facing away from the bottom wall 12.

[0066] This arrangement allows the inclined first side surface 213 and second side surface 214 to increase the heat dissipation area of ​​the side walls of the heat dissipation element 21, while reducing the interior space occupied by the heat dissipation element 21 in the charger 100.

[0067] Optional, as in Fig. As illustrated in Figure 3, several heat dissipation projections 215, arranged at intervals, are provided on a bottom wall of the water channel groove 211 (that is, a wall surface of the water channel groove 211 facing away from the upper surface 12 of the heat dissipation element 21), and the multiple heat dissipation projections 215 can increase the heat dissipation area of ​​the heat dissipation element 21. Optionally, the heat dissipation projection 215 can be in a streamlined shape, which can reduce water resistance.

[0068] In one embodiment, the power module 30 further comprises a power board 32. The power device 31 is attached to a surface of the power board 32 that faces the heat dissipation module 20.

[0069] The power board 32 can be a printed circuit board, but is not limited to this. The power board 32 covers the opening of the receiving cavity 11. Both the orthographic projection of the heat dissipation module 20 onto the bottom wall 12 and the orthographic projection of the power device 31 onto the bottom wall 12 are positioned in the orthographic projection of the power board 32 onto the bottom wall 12.

[0070] Optionally, the power device 31 can be connected to and attached to the power board 32 by welding, gluing, snapping, screwing or the like, which is not specifically restricted.

[0071] With such an arrangement, the power device 31 can, in addition to transferring heat to the heat dissipation module 20 for heat dissipation, also utilize a heat-dissipating copper foil or a metal substrate of the power board 32 to support the heat dissipation of the power board 32 of the power device 31, thereby improving the heat dissipation efficiency.

[0072] In one embodiment as in Fig. As illustrated in Figure 3, the insert 22 has a sealing section 221 and a projecting section 222. The sealing section 221 is connected around the projecting section 222. The sealing section 221 is connected to the heat dissipation element 21 and seals an opening of the water channel groove 211. The projecting section 222 extends into the water channel groove 211. The insert 22 and the heat dissipation element 21 together define a three-dimensional water channel.

[0073] The insert 22 can be of a one-piece structure, that is, the insert 22 is of a one-piece structure manufactured by a one-piece forming process. The one-piece forming process can specifically be stamping, casting, injection molding, or the like, which is not limited herein. Alternatively, the insert 22 can be of a split structure, and the sealing section 221 can be connected to and attached to the foreground section 222 by welding, gluing, snapping, screwing, or the like.

[0074] Optionally, the upper surface 212 of the heat dissipation element 21 is parallel to a surface of the bottom wall 12 facing the opening of the receiving cavity 11, so that the power device 31 can be thermally connected to the heat dissipation element 21. Optionally, as shown in Fig. As illustrated in Figure 3, the opening of the water channel groove 211 is flush with a surface of the bottom wall 12 of the housing 10, which faces away from the opening of the receiving cavity 11.

[0075] The heat dissipation element 21 and the insert 22 can be of a one-piece or a split structure, which is not restricted here. The insert 22 can be an elastic or a rigid element, as long as the insert 22 can be in a sealing connection with the heat dissipation element 21, which is not specifically restricted. In a specific embodiment, the insert 22 can be connected to and attached to the heat dissipation element 21 by friction welding.

[0076] Optionally, a surface of the insert 22 facing away from the opening of the receiving cavity 11 is flush with a surface of the heat dissipation element 21 at the opening of the water channel groove 211. This arrangement allows a surface of the charger housing 100 to form a single unit with good integrity, a simple process, and low cost.

[0077] The cross-sectional shape of the preceding section 222 (in the orthographic projection of the preceding section 222 in a direction of extension of the three-dimensional water channel) can be a rectangle, square, semicircle, trapezoid, triangle, or the like, without limitation herein. Optionally, the shape of the preceding section 222 is adapted to the shape of the heat dissipation element 21.

[0078] By providing the foregoing section 222, the three-dimensional water channel can be positioned closer to the wall surface of the heat dissipation element 21, and when the cooling medium flows in the three-dimensional water channel, the cooling medium can better dissipate heat for positions where heat-generating devices such as the power device 31 and a power supply 33 are located, thereby achieving high heat dissipation efficiency.

[0079] In one embodiment as in Fig. 3 and Fig. As illustrated in Figure 4, a heat dissipation groove 223 is defined at one end of the preceding section 222, facing away from an upper surface 212. An opening of the heat dissipation groove 223 is oriented in the same direction as the opening of the water channel groove 211.

[0080] A heat dissipation groove 223 can be defined, and the shape of the heat dissipation groove 223 corresponds to the shape of the water channel groove 211. Alternatively, several heat dissipation grooves 223 can be defined, and the multiple heat dissipation grooves 223 arranged at intervals are defined at one end of the preceding section 222 that faces away from the upper surface 212, which is not limited here.

[0081] With such an arrangement, compared to the case where a surface of the aforementioned section 222 facing away from the upper surface 212 is a flat surface, the arrangement of the heat dissipation groove 223 increases the surface area of ​​the aforementioned section 222, and the heat transferred from the heat-generating device to the cooling medium can be dissipated more rapidly through a side wall of the heat dissipation groove 223, thereby improving the heat dissipation efficiency. Furthermore, by providing the heat dissipation groove 223, i.e., by taking a measure to locally reduce the wall thickness of the aforementioned section 222, the aforementioned section 222 can maintain a uniform wall thickness to avoid internal defects caused by an excessively thick wall of the aforementioned section 222.

[0082] In another embodiment, as in Fig. 5 and Fig. As illustrated in Figure 6, the heat dissipation module 20 also includes a water channel cover plate 23. The water channel cover plate 23 seals an opening of the water channel groove 211. The water channel cover plate 23 and the heat dissipation element 21 together define a three-dimensional water channel.

[0083] Optionally, the insert 22 is included in the water channel groove 211, and one end of the insert 22, which faces away from the upper surface 212, is connected to the water channel cover plate 23.

[0084] With such an arrangement, the water channel cover plate 23 and the heat dissipation element 21 jointly define the three-dimensional water channel, and the insert 22 is included in the water channel groove 211 to reduce the volume of the water channel groove 211. As such, the three-dimensional water channel can be positioned closer to the upper surface 212, the first side surface 213, and the second side surface 214 of the heat dissipation element 21, and when the cooling medium flows in the three-dimensional water channel, it can dissipate heat more effectively to locations where heat-generating devices such as the power device 31 and a power supply 33 are located, thereby achieving high heat dissipation efficiency.

[0085] In one embodiment as in Fig. 5 and Fig. As illustrated in Figure 6, the insert 22 has a projecting section 222 and a connecting section 224. The projecting section 222 is connected to the water channel cover plate 23 and is spaced from an inner wall of the water channel groove 211. The connecting section 224 is connected to an outer circumferential surface of the projecting section 222 and projects from it, abutting the inner wall of the water channel groove 211.

[0086] The preceding section 222 and the connecting section 224 may be of a one-piece or a split structure, without limitation. The connecting section 224 may be configured as one or more connecting sections, without specific limitation. Optionally, the connecting section 224 may be configured as multiple connecting sections, the multiple connecting sections 224 arranged at intervals on the outer circumferential surface of the preceding section 222, and each of the multiple connecting sections 224 abuts the inner wall of the water channel groove 211.

[0087] With such an arrangement, the insert 22 can be attached relative to the heat dissipation element 21 by the connecting section 224 without any additional connecting structure, thus simplifying assembly.

[0088] In one embodiment as in Fig. As illustrated in Figure 1, the power module 30 also includes a power supply 33. The power supply 33 is connected to the power board 32 and is housed in the receiving cavity 11. The power supply 33 is thermally connected to the heat dissipation module 20.

[0089] The power supply 33 is configured to provide the required isolated, multi-channel, low-voltage DC power for a control circuit (digital signal processor (DSP) / microcontroller unit (MCU)), a driver circuit, a sampling circuit, a communication interface, a fan, and the like on the power board 32. Optionally, the power supply 33 is provided by a low-power flyback converter or inductor-inductor-capacitor (LLC) switching power supply module and draws power directly from an input AC or intermediate DC bus. The power supply 33 can also use any other feasible structure capable of providing low-voltage DC power; there are no specific limitations.

[0090] Optionally, the power supply 33 can be connected to and attached to the power board 32 by welding, gluing, snapping, screwing or the like, which is not specifically restricted.

[0091] In embodiments of the disclosure, the power board 32, the power device 31, and the power supply 33 are integrated into the power module 30, and both the power device 31 and the power supply 33 are thermally connected to the heat dissipation module 20. This allows the heat dissipation module 20 to dissipate heat for both the power device 31 and the power supply 33, thereby achieving high heat dissipation efficiency, and there is no need to dissipate heat for the power device 31 and the power supply 33 separately, thus improving the utilization rate of the interior of the charger 100.

[0092] In one embodiment as in Fig. As illustrated in Figure 1, the charger 100 further comprises a magnetic element 35. A receiving groove 24 is also defined at one end of the heat dissipation module 20, facing away from an opening of the water channel groove 211. The water channel groove 211 surrounds a side wall of the receiving groove 24. The magnetic element 35 is received in the receiving groove 24.

[0093] The magnetic element 35 contains core magnet components such as a transformer and an inductor, but is not limited to these. The magnetic element 35 converts, transmits, and regulates electrical energy based on the principle of electromagnetic induction, thereby achieving the efficient and stable operation of the charger 100.

[0094] With this arrangement, the magnetic element 35 is positioned in the receiving groove 24 of the heat dissipation module 20, allowing full utilization of the interior space of the charger 100. Furthermore, the cooling medium can flow three-dimensionally through the three-dimensional water channel of the heat dissipation module 20 to dissipate heat from the magnetic element 35; the contact area is large, thus improving the heat dissipation effect.

[0095] In one embodiment as in Fig. As illustrated in Figure 1, the power module 30 further comprises a capacitive device 34. The capacitive device 34 is connected to the power board 32 and is housed in the receiving cavity 11. The capacitive device 34 is thermally connected to the heat dissipation module 20. The power supply 33 and the capacitive device 34 are each arranged on opposite sides of the heat dissipation module 20.

[0096] The capacitive device 34 can be configured to absorb the surge voltage when the power device 31 is switched off, to filter out differential-mode / common-mode noise, to provide a low-impedance path, and the like, which can ensure stable, efficient, and safe operation of a system. Optionally, the capacitive device 34 can include multiple capacitors, all of which are connected to the power board 32 and housed in the mounting cavity 11.

[0097] Optionally, one of the power supply 33 and the capacitive device 34 is arranged on one side of the first water channel facing the side circumferential wall 13, and the other of the power supply 33 and the capacitive device 34 is arranged on one side of the third water channel facing the side circumferential wall 13, which is not specifically restricted.

[0098] By providing the capacitive device 34 and arranging the power supply 33 and the capacitive device 34 on the two opposite sides of the heat dissipation module 20, heat accumulation on one side can be avoided, and the heat dissipation module 20 can dissipate heat for several separate heat-generating devices, thereby achieving high heat dissipation efficiency.

[0099] In the description of embodiments of the disclosure, it may be noted that orientation or position relationships indicated by terms such as "center", "on", "under", "left", "right", "vertical", "horizontal", "inside", "outside" and the like, are orientation or position relationships based on the accompanying drawings, serve only to facilitate the description of the disclosure and to simplify the description, and do not explicitly or implicitly indicate that the related devices or elements must be in a particular orientation or must be constructed or operated in a particular orientation, and therefore they must not be interpreted as a limitation of the disclosure.

[0100] The above embodiments are only preferred embodiments of the disclosure and cannot be used to limit the scope of the claims of this disclosure. Those skilled in the art can understand all or part of the process for realizing the above embodiments of the disclosure, and equivalent modifications made in accordance with the claims of this disclosure still fall within the scope of the disclosure.

Claims

[1] Charger (100), comprising: a housing (10) that defines a receiving cavity (11); a heat dissipation module (20) which is received in the receiving cavity (11), wherein the heat dissipation module (20) comprises a heat dissipation element (21) and an insert (22), the heat dissipation element (21) defining a water channel groove (211) and at least a part of the insert (22) extending into the water channel groove (211); and a power module (30) comprising a power device (31), wherein the power device (31) is received in the receiving cavity (11) and is thermally connected to the heat dissipation module (20) by a heat-conducting element (36). [2] Charger (100) according to claim 1, wherein the power module (30) further comprises a power board (32) and the power device (31) is attached to a surface of the power board (32) which faces the heat dissipation module (20). [3] Charger (100) according to claim 1, wherein the insert (22) has a sealing section (221) and a projecting section (222), the sealing section (221) is connected around the projecting section (222), the sealing section (221) is connected to the heat dissipation element (21) and seals an opening of the water channel groove (211), the projecting section (222) extends into the water channel groove (211) and the insert (22) and the heat dissipation element (21) together define a three-dimensional water channel. [4] Charger (100) according to claim 3, wherein a heat dissipation groove (223) is defined at an end of the preceding section (222) which is facing away from an upper surface (212) of the heat dissipation element, and an opening of the heat dissipation groove (223) is oriented in the same direction as the opening of the water channel groove (211). [5] Charger (100) according to claim 1, wherein the heat dissipation module (20) further comprises a water channel cover plate (23), the water channel cover plate (23) seals an opening of the water channel groove (211) and the water channel cover plate (23) and the heat dissipation element (21) together define a three-dimensional water channel. [6] Charger (100) according to claim 5, wherein the insert (22) has a projecting section (222) and a connecting section (224), the projecting section (222) being connected to the water channel cover plate (23) and being spaced apart from an inner wall of the water channel groove (211), and the connecting section (224) being connected to and projecting from an outer circumferential surface of the projecting section (222) and bearing against the inner wall of the water channel groove (211). [7] Charger (100) according to claim 1, wherein the housing (10) comprises a lower housing and a cover plate (14), the lower housing defining the receiving cavity (11), the cover plate (14) being connected to one end of the lower housing and sealing an opening of the receiving cavity (11); and one of the cover plate (14) and the lower housing defining a mounting hole (15), the other of the cover plate (14) and the lower housing being provided with a mounting section (16) and the mounting section (16) being compatible with the mounting hole (15) to connect the cover plate (14) and the lower housing. [8] Charger (100) according to claim 2, wherein the power module (30) further comprises a power supply (33), the power supply (33) is connected to the power board (32) and is received in the receiving cavity (11) and the power supply (33) is thermally connected to the heat dissipation module (20). [9] Charger (100) according to claim 1, wherein the power module (30) further comprises a magnetic element (35), a receiving groove (24) is further defined at one end of the heat dissipation module (20) which is facing away from an opening of the water channel groove (211), the water channel groove (211) surrounds a side wall of the receiving groove (24) and the magnetic element (35) is received in the receiving groove (24). [10] Vehicle comprising a vehicle body, a power consumption device and the charger (100) according to any one of claims 1 to 9, wherein the charger (100) is arranged in the vehicle body and the charger (100) is configured to receive an alternating current (AC), convert the received AC into a direct current (DC) and output the converted DC to the power consumption device to supply power to the power consumption device.

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