DEVICE AND METHOD FOR PACKAGING, HANDLING OR TESTING SENSORS
DE602018091696T2Active Publication Date: 2026-06-10ROSEMOUNT AEROSPACE INC
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Patent Information
- Application Number
- DE602018091696
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2017-04-17
- Filing Date
- 2018-04-16
- Publication Date
- 2026-06-10
- Estimated Expiration
- 2038-04-16
AI Technical Summary
Technical Problem
MEMS devices, such as pressure sensors, are difficult to package, handle, and test due to their small size, which is labor-intensive and challenging.
Method used
A method involving encapsulation of wire bonds, separation of sensor assemblies, and use of a flexible substrate array with an enclosure for simultaneous handling and testing of multiple sensors, facilitated by a test sheet that allows for pressurization of the sensor interior.
Benefits of technology
Facilitates easier handling and testing of MEMS devices by reducing time, cost, and labor through simultaneous processing of multiple sensors, enhancing efficiency and ease of integration into guide wires.
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