SENSOR MODULE AND METHOD FOR MANUFACTURING A SENSOR MODULE
DE602021031157T2Active Publication Date: 2025-05-21SONY SEMICON SOLUTIONS CORP
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Patent Information
- Application Number
- DE602021031157
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-02-10
- Publication Date
- 2025-05-21
- Estimated Expiration
- 2041-02-10
Abstract
A sensor module according to an embodiment of the present technology includes a sensor element, a first casing, a bracket, and a second casing. The first casing includes an opening end and accommodates therein the sensor element. The bracket fixes the first casing to an attachment target. The second casing includes a first surface that includes a first welding portion welded to the opening end, and a second surface that includes a second welding portion welded to the bracket, the second casing being fixed between the first casing and the bracket.
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