SENSOR MODULE AND METHOD FOR MANUFACTURING A SENSOR MODULE

DE602021031157T2Active Publication Date: 2025-05-21SONY SEMICON SOLUTIONS CORP
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Patent Information

Application Number
DE602021031157
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-02-10
Publication Date
2025-05-21
Estimated Expiration
2041-02-10
Patent Text Reader

Abstract

A sensor module according to an embodiment of the present technology includes a sensor element, a first casing, a bracket, and a second casing. The first casing includes an opening end and accommodates therein the sensor element. The bracket fixes the first casing to an attachment target. The second casing includes a first surface that includes a first welding portion welded to the opening end, and a second surface that includes a second welding portion welded to the bracket, the second casing being fixed between the first casing and the bracket.
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