METHOD AND DEVICE FOR IN-SITU MEASUREMENT OF THE MUTUTAL INDUCTANCE BETWEEN EMBEDDED CONNECTIONS
DE602024005482T2Active Publication Date: 2026-06-17THE BOEING CO
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Patent Information
- Application Number
- DE602024005482
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2023-10-31
- Filing Date
- 2024-08-23
- Publication Date
- 2026-06-17
- Estimated Expiration
- 2044-08-23
AI Technical Summary
Technical Problem
Existing methods for measuring mutual inductance between embedded interconnects require disconnecting signal wires and using expensive test equipment, which is inefficient and time-consuming.
Method used
A system and method for in-situ measurement of mutual inductance using a coupling generator, sample and hold circuit, switched capacitor integrator, and comparator to induce and integrate a voltage on coupled transmission lines, leveraging correlated double sampling to improve measurement resolution and noise floor.
Benefits of technology
Enables efficient, low-power, and scalable measurement of mutual inductance in high-speed, high-density interconnects with minimal disruption to existing systems, improving measurement accuracy and reducing systematic artifacts.
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