METHOD FOR PRODUCING A HYBRID COMPONENT AND ASSOCIATED HYBRID COMPONENT
By using a sacrificial layer to form trenches around the detection circuit, the method addresses thermal expansion-induced stress in hybrid components, reducing cleavage risks and ensuring structural integrity.
FR3170701A1Pending Publication Date: 2026-06-26LYNRED
Patent Information
- Application Number
- FR2024015212
- Authority / Receiving Office
- FR · FR
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2026-06-26
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Abstract
The invention relates to a method for making a hybrid component (20) comprising the following steps: fixing a detection circuit (21) onto a reading circuit (22); and applying an adhesive (24) between the detection circuit (21) and the reading circuit (22); depositing a sacrificial layer on the detection circuit (21) before the step of fixing the detection circuit (21) onto the reading circuit (22), such that the sacrificial layer extends at least over the edges (27) of the detection circuit (21); and removing the sacrificial layer after the step of applying the adhesive (24) between the detection circuit (21) and the reading circuit (22) so as to form trenches (25) around said detection circuit (21). For short: Figure 6.
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Citation Information
Patent Citations
Method to control underfill fillet width
US20140048934A1
Flip-chip package with underfill dam for stress control
US6940182B2
Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages
US7301222B1
Electromagnetic radiation detector and its production process
US5574285A
Method for producing infrared detectors
WO2013167553A1