Fluid conduit for automatic coupling systems

JP1831010SActive Publication Date: 2026-07-07LAM RES CORP
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Patent Information

Application Number
JP2026002108D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Priority Date
2025-08-14
Filing Date
2026-02-04
Publication Date
2026-07-07
Estimated Expiration
2051-02-04

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Abstract

This article relates to the exhaust lines for precursor materials in semiconductor manufacturing equipment. It is used in combination with deposition equipment as an exhaust line for the storage and supply system of precursors.
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