Folder, bus bar, module, and method for manufacturing the same

Abstract

To facilitate equipping of a bus bar or an electronic component and suppress the noise resistance or the inductance.SOLUTION: A module 2 includes a folder 6 having component arranging units 16-1 and 16-2 and a bus bar 7 in at least one side part or both side parts of a bus bar arranging unit 18. The module 2 includes: a bus bar 7 (a positive bus bar 8 and a negative bus bar 10) in which a positive electrode bus bar piece (a positive electrode part 40) and a negative electrode bus bar piece (a negative electrode part 42) are alternately arranged and are exposed in the bus bar arranging unit 18; and a plurality of electronic components 4 arranged in the component arranging unit.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a folder, a bus bar, a module for mounting a plurality of electronic components, and a method for manufacturing the same. [Background technology]

[0002] 2. Description of the Related Art Electronic devices that use a plurality of polarized electronic components, such as capacitors, use a module that is equipped with a positive bus bar and a negative bus bar and on which a plurality of electronic components are mounted.

[0003] With regard to this electronic component module, a busbar and capacitor assembly structure is known which has a pair of opposing positive and negative busbars, multiple wiring sections arranged at regular intervals in parallel, and capacitors are connected by alternately arranging the positive and negative terminals of the capacitors on the wiring sections (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 9-308267 Summary of the Invention [Problem to be solved by the invention]

[0005] Incidentally, an electronic component module is, for example, a component in which a plurality of electronic components are mounted on a folder together with a positive bus bar and a negative bus bar, and is mounted on various electronic devices. For this reason, the electronic component module is subject to restrictions in terms of appearance and functionality from the electronic device in which it is mounted.

[0006] When there are restrictions on the mounting space and placement position of an electronic module for a particular electronic device, it is necessary to devise an arrangement of electronic components and a housing, etc., and measures such as wiring, electrode placement, miniaturization, weight reduction, and ease of mounting are required.

[0007] Regarding electrical characteristics, it is also necessary to satisfy characteristic conditions such as suppression of potential fluctuations, noise resistance, and suppression of inductance.

[0008] In view of the above problems, an object of the present disclosure is to facilitate the mounting of bus bars and electronic components and to achieve noise resistance and inductance suppression. [Means for solving the problem]

[0009] In order to achieve the above object, the folder of the present disclosure includes a busbar arrangement portion for arranging busbars, and positive busbar pieces for connecting a positive lead of an electronic component and negative busbar pieces for connecting a negative lead of the electronic component are exposed and arranged alternately on the busbar arrangement portion.

[0010] The folder may include a component placement section on at least one side of the bus bar placement section.

[0011] In this folder, the busbar placement section may be provided with a slit section, and an electronic component lead may be placed on the positive busbar piece or the negative busbar piece by passing through the slit section.

[0012] This folder may include a first component placement section on one side of the busbar placement section and a second component placement section on the other side of the busbar placement section, with the electronic components placed in the first component placement section and the second component placement section facing each other across the busbar placement section, and the positive leads of the electronic components being placed on the common positive busbar piece and the negative leads being placed on the common negative busbar piece.

[0013] In this folder, the busbars include a positive busbar having a busbar side portion connected to the positive busbar piece, and a negative busbar having a busbar side portion connected to the negative busbar piece, and the busbar side portion of the positive busbar and the busbar side portion of the negative busbar may be installed so as to overlap each other.

[0014] In this folder, the busbar may include opposing first and second busbar sides connected by the positive busbar piece or the negative busbar piece.

[0015] In this folder, the busbar arrangement section may include a separation wall disposed between the positive busbar piece and the negative busbar piece to provide insulation.

[0016] In order to achieve the above object, the busbar disclosed herein includes a positive busbar, a negative busbar, a positive busbar piece that is provided for the positive busbar and connected to a positive lead of an electronic component, and a negative busbar piece that is provided for the negative busbar, arranged alternately with the positive busbar pieces, and connected to the negative lead of the electronic component.

[0017] In this busbar, the negative busbar may be arranged so as to overlap the positive busbar on the inside, and the positive busbar piece may be exposed from a through hole provided in the negative busbar.

[0018] In order to achieve the above-mentioned object, the module of the present disclosure includes a folder having a component placement section on at least one side or both sides of a busbar placement section, a busbar, a busbar having positive and negative busbar pieces alternately arranged and exposed in the busbar placement section, and a plurality of electronic components arranged in the component placement section.

[0019] This module may include a first component arrangement section on one side of the busbar arrangement section and a second component arrangement section on the other side of the busbar arrangement section, and the electronic components arranged on the first component arrangement section and the second component arrangement section may be arranged facing each other across the busbar arrangement section, with the positive leads of the opposing electronic components connected to the common positive busbar piece and the negative leads connected to the common negative busbar piece.

[0020] In order to achieve the above object, according to the method for manufacturing a module disclosed herein, the method includes the steps of: installing busbars by exposing positive and negative busbar pieces in a busbar arrangement section of a folder and arranging them alternately; arranging electronic components in the component arrangement section of the folder, and arranging a positive lead on the positive busbar piece and a negative lead on the negative busbar piece; and welding the positive lead to the positive busbar piece and the negative lead to the negative busbar piece.

[0021] The method for manufacturing the module may include a step of manufacturing the folder including the bus bar arrangement portion and the component arrangement portion. Effect of the Invention

[0022] According to the present disclosure, any of the following effects can be obtained. <folder> (1) The positive and negative busbar pieces of the busbars arranged in the busbar arrangement section of the folder are exposed and arranged alternately, so that the positive lead of each electronic component arranged in the component arrangement section can be arranged and connected to the positive busbar piece exposed from the folder, and the negative lead of each electronic component arranged in the component arrangement section can be arranged and connected to the negative busbar piece.

[0023] <Busbar> (2) The busbars arranged in the busbar arrangement section of the folder include a positive busbar and a negative busbar, and the busbar side portion of the positive busbar is arranged between the opposing busbar sides of the negative busbar, thereby making the busbars on the module and folder more robust and improving shielding performance.

[0024] <module> (3) According to this module, electronic components are arranged in component placement sections on at least one or both sides of the busbar placement section, and the positive lead of each electronic component is connected to the positive busbar piece of the busbar and the negative lead of each electronic component is connected to the negative busbar piece of the busbar, thereby providing a module in which multiple electronic components are connected in parallel or in series on the folder.

[0025] <Module manufacturing method> (4) The positive and negative busbars are arranged in the busbar arrangement section of the folder, and electronic components can be easily arranged in the component arrangement sections on at least one or both sides of the busbar arrangement section. The positive lead of each electronic component can be arranged in the positive busbar piece of the busbar, and the negative lead of each electronic component can be arranged in the negative busbar piece, which improves connectivity between the busbar and the positive or negative lead and enables the manufacturing process to be simplified and expedited. [Brief description of the drawings]

[0026] [Figure 1] FIG. 1A is a perspective view showing an electronic component module according to an embodiment, and FIG. 1B is a perspective view showing an example of an electronic component. [Diagram 2] FIG. 2 is a diagram showing an equivalent circuit of the electronic component module. [Diagram 3] FIG. 3A is a perspective view showing a positive bus bar and a negative bus bar, and FIG. 3B is a perspective view showing the electronic component module excluding a folder. [Figure 4] FIG. 4 is a perspective view showing the mounting of electronic components in component placement sections of a folder and the connection of the electronic components to bus bars. [Diagram 5] FIG. 5A is a partial cross-sectional view showing an electronic component holding structure of a component placement section, and FIG. 5B is a partial cross-sectional view showing an electronic component lead holding and connection structure on a folder. [Figure 6] FIG. 6 is a partial plan view showing the arrangement of electronic components on a folder. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] A folder, a bus bar, and an electronic component module according to an embodiment of the present disclosure include, for example, a plurality of electronic components 4, a folder 6, and a bus bar, as shown in FIGS.

[0028] The folder of the present disclosure includes, for example, a busbar arrangement section 18 and a component arrangement section, as shown in folder 6. The component arrangement section may include, for example, a first component arrangement section 16-1 on one side of busbar arrangement section 18, or a second component arrangement section 16-2 on the other side of busbar arrangement section 18, or may include both component arrangement section 16-1 and component arrangement section 16-2 as in an embodiment described later.

[0029] The busbars include, for example, positive busbars 8 and negative busbars 10, with positive busbar pieces on the positive busbars 8 and negative busbar pieces on the negative busbars 10. The positive busbar pieces and negative busbar pieces are exposed from the busbar arrangement portion 18 and arranged alternately.

[0030] The positive busbar 8 and the positive busbar piece, and the negative busbar 10 and the negative busbar piece are separated by a separation means formed in the busbar arrangement portion 18, thereby providing insulation between the two.

[0031] The positive leads 34-1 of the multiple electronic components 4 arranged in the component arrangement section are connected to a positive bus bar piece, and the negative leads 34-2 are connected to a negative bus bar piece, so that the electronic components 4 are connected in parallel or in series.

[0032] <Effects of the embodiment> With this configuration, according to one embodiment, it is possible to facilitate the mounting of bus bars and electronic components, and to achieve noise resistance and inductance suppression. EXAMPLES

[0033] <Electronic component module> Fig. 1A shows an electronic component module (hereinafter simply referred to as a "module") according to an embodiment of the present disclosure. The configuration shown in Fig. 1A is an example of the module of the present disclosure, and the present disclosure is not limited to such a configuration.

[0034] The module 2 according to the embodiment includes a plurality of electronic components 4, a folder 6, a bus bar 7, a positive electrode terminal portion 12, and a negative electrode terminal portion 14.

[0035] Each electronic component 4 is a polar electronic component having a positive electrode and a negative electrode, such as a capacitor, a storage battery, a diode, etc. In this module 2, nine electronic components 4 are used as the plurality of electronic components 4.

[0036] The folder 6 is a formed body made of insulating synthetic resin, which is an example of an insulating material. The folder 6 includes a first component placement section 16-1, a busbar placement section 18, and a second component placement section 16-2. The component placement section 16-1 is disposed on one side of the busbar placement section 18, and the component placement section 16-2 is disposed on the other side of the busbar placement section 18.

[0037] The bus bars 7 include a positive bus bar 8 and a negative bus bar 10. The positive bus bar 8 is placed on the inside and the negative bus bar 10 is placed over the positive bus bar 8, so that the positive bus bar 8 and the negative bus bar 10 are arranged in an overlapping state.

[0038] In this embodiment, a pair of component arrangement sections 16-1, 16-2 are formed on either side of a bus bar arrangement section 18. Five electronic components 4 are arranged in the component arrangement section 16-1, and four electronic components 4 are arranged in the component arrangement section 16-2.

[0039] The positive bus bar 8 and / or the negative bus bar 10 are conductive members for connecting a plurality of electronic components 4, and may be made of a highly rigid, good conductor material such as copper or aluminum.

[0040] As described above, in the busbar arrangement section 18, the positive busbar 8 is placed on the inside and the negative busbar 10 is placed over the positive busbar 8, so that the positive busbar 8 and the negative busbar 10 are arranged in an overlapping state. In the busbar arrangement section 18, a surrounding wall 20 is formed to surround the end portions of the positive busbar 8 and the negative busbar 10. A plurality of partition walls 22 are provided to separate the busbar arrangement section 18 from each of the component arrangement sections 16-1, 16-2, and the busbar arrangement section 18 is partitioned by the respective partition walls 22. The surrounding wall 20 and the partition walls 22 are one example of an insulating means for insulating at least the positive electrode side from the negative electrode side.

[0041] A plurality of separation walls 24 are erected at both ends of each partition wall 22 to separate and insulate the bus bar arrangement portion 18 from the component arrangement portions 16-1 and 16-2, and each separation wall 24 is formed with a locking portion 26 for locking an electronic component 4. The separation walls 24 are an example of an insulating means for insulating the positive electrode side from the negative electrode side.

[0042] In this embodiment, five of the nine electronic components 4 are arranged in a parallel direction and held in component placement section 16-1, and four electronic components 4 are similarly arranged and held in component placement section 16-2. The electronic components 4 on the component placement section 16-1 side and the electronic components 4 on the component placement section 16-2 side are arranged with their lead sides facing each other.

[0043] <Electronic Components 4> 1B shows electronic components 4 used in module 2. Each electronic component 4 has a cylindrical case portion 28, and a curved recess 32 is uniformly formed on the circumferential surface of case portion 28 on the sealing portion 30 side. Curved recess 32 engages with locking portion 26 described above, and locking portion 26 positions case portion 28 on folder 6 and prevents it from moving.

[0044] A positive electrode lead 34-1 and a negative electrode lead 34-2 are drawn out to the sealing portion 30. In each electronic component 4 used in this module 2, the positive electrode lead 34-1 and the negative electrode lead 34-2 are both bent with their tip ends expanded from the sealing portion 30. The positive electrode lead 34-1 and the negative electrode lead 34-2 have the same shape and are symmetrical about the center line O. For this reason, a polarity discrimination mark 38 is displayed by engraving or the like on the bottom surface portion 36 of the case portion 28 in order to distinguish between the positive electrode lead 34-1 and the negative electrode lead 34-2. In this embodiment, a negative polarity indication is formed as the polarity discrimination mark 38 at a position corresponding to the negative electrode lead 34-2.

[0045] <Equivalent circuit of module 2> FIG. 2 shows an equivalent circuit of the module 2.

[0046] The positive busbar 8 has five positive electrode portions 40 as the multiple positive electrode portions, and the negative busbar 10 has five negative electrode portions 42 as the multiple negative electrode portions, with the positive electrode portions 40 and the negative electrode portions 42 being arranged alternately. The positive electrode portions 40 are an example of a positive electrode busbar piece of the present disclosure, and the negative electrode portions 42 are an example of a negative electrode busbar piece of the present disclosure.

[0047] A connection protrusion 44 is formed at a lead connection position on each positive electrode portion 40 and each negative electrode portion 42. A positive electrode bus bar terminal portion 46 connected to the positive electrode terminal portion 12 is formed at the end of the positive electrode bus bar 8, and a negative electrode bus bar terminal portion 48 connected to the negative electrode terminal portion 14 is formed at the end of the negative electrode bus bar 10.

[0048] A positive electrode lead 34-1 of each electronic component 4 is connected to each positive electrode portion 40, and a negative electrode lead 34-2 is connected to each negative electrode portion 42. As a result, each electronic component 4 is connected in parallel by the positive electrode bus bar 8 and the negative electrode bus bar 10. Therefore, if each electronic component 4 is, for example, a capacitor, a combined capacitance can be taken from between the positive electrode bus bar terminal portion 46 and the negative electrode bus bar terminal portion 48.

[0049] <Busbar 7> A in Fig. 3 shows a busbar 7. A positive busbar 8 in this busbar 7 has a busbar frame 50-1 with a C-shaped cross section, and a plurality of positive electrode portions 40 and negative electrode arrangement portions 52 of the negative electrode busbar 10 are alternately provided at the top of this busbar frame 50-1. The negative electrode arrangement portions 52 are windows provided with an insulating space for the negative electrode portions 42 of the negative electrode busbar 10, and are an example of a through hole that allows the positive electrode portions 40 to pass through.

[0050] The busbar frame 50-1 is provided with a first busbar side portion 50-11 and a second busbar side portion 50-12 facing each other, and each of the first busbar side portion 50-11 and the second busbar side portion 50-12 is connected to a plurality of positive electrode portions 40 and has a plurality of negative electrode arrangement portions 52. In this embodiment, the positive electrode busbar terminal portion 46 is formed on the second busbar side portion 50-12, but this may be omitted. Also, the positive electrode busbar terminal portion 46 may be formed on the first busbar side portion 50-11.

[0051] The negative busbar 10 has a busbar frame 50-2 that has a C-shaped cross section, similar to the positive busbar 8, and has a plurality of negative electrode portions 42 and positive electrode arrangement portions 54 of the positive busbar 8 alternately arranged at the top of the busbar frame 50-2. The positive electrode arrangement portions 54 are windows for exposing the positive electrode portions 40 of the positive busbar 8, and are an example of through holes through which the negative electrode portions 42 pass.

[0052] Similar to the busbar frame 50-1, the busbar frame 50-2 has a first busbar side portion 50-21 and a second busbar side portion 50-22 opposed to each other, and the first busbar side portion 50-21 and the second busbar side portion 50-22 are connected to a plurality of negative electrode portions 42 and have a plurality of positive electrode arrangement portions 54. In this embodiment, the negative electrode busbar terminal portion 48 is formed on the second busbar side portion 50-22, but this may be omitted. Also, the negative electrode busbar terminal portion 48 may be formed on the first busbar side portion 50-21.

[0053] The distance between the first busbar side portion 50-21 and the second busbar side portion 50-22 on the busbar frame 50-2 side is set wider than the distance between the first busbar side portion 50-11 and the second busbar side portion 50-12 on the busbar frame 50-1 side. Therefore, the first busbar side portion 50-11 and the second busbar side portion 50-12 on the busbar frame 50-1 side are disposed such that an insulating distance is included within the distance between the first busbar side portion 50-21 and the second busbar side portion 50-22 on the busbar frame 50-2 side.

[0054] In this manner, the positive electrode portions 40 and the negative electrode portions 42 are alternately arranged on the bus bar 7, and the positive electrode portions 40 are arranged between the adjacent negative electrode portions 42.

[0055] <Overlapping Form of Positive Bus Bar 8 and Negative Bus Bar 10 and Connection of Electronic Components 4> FIG. 3B shows module 2 without holder 6, and illustrates the connection between positive bus bar 8 and negative bus bar 10, which are arranged in an overlapping state, and electronic components 4. FIG.

[0056] The positive busbar 8 and the negative busbar 10 form a stacked structure in which the positive busbar 8 is disposed on the inside and the negative busbar 10 is disposed on the outside. In this stacked structure, the negative electrode portion 42 is disposed in the negative electrode arrangement portion 52 of the positive busbar 8, and the positive electrode portion 40 is disposed in the positive electrode arrangement portion 54 of the negative busbar 10. Therefore, the positive electrode portions 40 and the negative electrode portions 42 are exposed at the same height and alternately arranged. In this embodiment, the first busbar side portions 50-11, 50-21 and the second busbar side portions 50-12, 50-22 of the busbar frames 50-1, 50-2 are set to the same height, and the cutting depth of the negative electrode arrangement portion 52 and the positive electrode arrangement portion 54 is adjusted to set an insulating interval between the positive electrode portion 40 and the negative electrode portion 42.

[0057] The positive electrode portion 40 has a connection protrusion 44 provided at a connection position, to which the positive electrode lead 34-1 of the electronic component 4 is connected. Similarly, the negative electrode portion 42 has a connection protrusion 44 provided at a connection position, to which the negative electrode lead 34-2 of the electronic component 4 is connected.

[0058] As shown in B of Figure 3, in the module 2 excluding the folder 6, if the positive electrode lead 34-1 of the electronic component 4 is welded to each positive electrode portion 40 of the positive electrode bus bar 8 and the negative electrode lead 34-2 of the electronic component 4 is welded to the negative electrode bus bar 10, the positive electrode bus bar 8 and the negative electrode bus bar 10 that are overlapping with each electronic component 4 are integrated and can stand on their own apart from the folder 6.

[0059] <Holding structure of component arrangement sections 16-1, 16-2 and bus bar arrangement section 18 of folder 6 and electronic component 4> FIG. 4 shows the component arrangement sections 16-1 and 16-2 of the folder 6, the bus bar arrangement section 18, and the electronic component 4.

[0060] A fitting recess 56 into which the case 28 of the electronic component 4 is fitted is formed in each of the component placement sections 16-1, 16-2 of the folder 6. A pair of first holding pieces 58-1, 58-2 are formed at a distance from each other on the parallel edges of the fitting recess 56, and a second holding piece 60 having a width greater than that of the holding pieces 58-1, 58-2 is formed on the opposing side of the holding pieces 58-1, 58-2. A holding piece 60 is formed on the adjacent fitting recess 56 side in the space between the holding pieces 58-1, 58-2.

[0061] A rectangular through-hole 62 is formed in the fitting recess 56. The case 28 of the electronic component 4 is exposed in this through-hole 62, so that the case 28 can be operated from the through-hole 62 side and heat from the electronic component 4 can be released.

[0062] A separation wall 24 is formed in the bus bar arrangement portion 18, interposed between the positive electrode portion 40 and the negative electrode portion 42 of the positive bus bar 8 to insulate the two from each other, so that the positive electrode portion 40 and the negative electrode portion 42 are insulated by the separation wall 24.

[0063] As described above, the bus bar arrangement section 18 is formed with partition walls 22 that separate the component arrangement sections 16-1, 16-2, and these partition walls 22 separate the sealing sections 30 of the electronic components 4 from the component arrangement sections 16-1, 16-2. These partition walls 22 insulate the electronic components 4 from the positive electrode section 40 and the negative electrode section 42. A separation wall 24 is interposed between the partition wall 22 on the component arrangement section 16-1 side and the partition wall 22 on the component arrangement section 16-2 side, and the two are integrated together.

[0064] The partition wall 22 is formed with a slit portion 64 through which the positive electrode lead 34-1 and the negative electrode lead 34-2 of the electronic component 4 pass. The slit portion 64 has an inclined surface for guiding the inserted positive electrode lead 34-1 and negative electrode lead 34-2 to the deepest portion of the slit portion 64.

[0065] <Mounting of Electronic Components 4 to Component Placement Sections 16-1 and 16-2 of Folder 6> FIG. 5A shows a state in which electronic components 4 are mounted on component placement sections 16-1 and 16-2 of folder 6, and the mounting process thereof.

[0066] The gap between the holding pieces 58-1, 58-2 and the holding piece 60 on the inlet side is set to be slightly narrower than the width of the electronic component 4 (in this case, the diameter width).

[0067] When the case portion 28 of the electronic component 4 is positioned between the retaining pieces 58-1, 58-2 and 60 and pressure is applied in the direction indicated by the arrow, the retaining pieces 58-1, 58-2 and 60 expand due to the elasticity of the folder material, allowing the case portion 28 of the electronic component 4 to be inserted into the mating recess 56.

[0068] The curved recess 32 of the electronic component 4 is matched with the locking portion 26 , and the locking portion 26 is slid to slide the electronic component 4 into the fitting recess 56 .

[0069] Therefore, the case portion 28 of the electronic component 4 inserted into each fitting recess 56 is held by fitting into the fitting recess 56 and by the elasticity of the folder material between the holding pieces 58-1, 58-2 and the holding piece 60.

[0070] <Lead holding structure of electronic component 4 in folder 6> FIG. 5B shows the lead holding structure of the folder 6.

[0071] When the electronic component 4 is properly inserted into the fitting recess 56, the electronic component 4 is positioned by the engagement of the curved recess 32 and the locking portion 26. At this time, the positive electrode lead 34-1 can be passed through the slit portion 64 and guided to the positive electrode portion 40 of the positive electrode bus bar 8 to contact the connection protrusion 44, and the negative electrode lead 34-2 can be passed through the slit portion 64 and guided to the negative electrode portion 42 of the negative electrode bus bar 10 to contact the connection protrusion 44.

[0072] <Insulation retention structure between bus bar frames 50-1 and 50-2 on folder 6> 5B, a plurality of separation walls 24 are provided in the folder 6 between the positive electrode portion 40 and the negative electrode portion 42, and a plurality of separation walls 25 are formed integrally with a pair of adjacent separation walls 24. The respective separation walls 25 are formed opposite to each other and protrude in the thickness direction of the folder 6, and are formed in a direction intersecting the separation walls 24.

[0073] One of the separation walls 25 is disposed between the second busbar side portion 50-12 of the busbar frame 50-1 and the second busbar side portion 50-22 of the busbar frame 50-2, and is interposed between the busbar frames 50-1, 50-2 to insulate them from each other and to allow the folder 6 to hold the busbar frames 50-1, 50-2. Although not shown, the other separation wall 25 is also disposed between the first busbar side portion 50-11 of the busbar frame 50-1 and the first busbar side portion 50-21 of the busbar frame 50-2, and is interposed between the busbar frames 50-1, 50-2 to insulate them from each other and to allow the folder 6 to hold the busbar frames 50-1, 50-2.

[0074] <Folder 6 part type> FIG. 6 shows the positive electrode part 40, the negative electrode part 42 and the electronic components 4 arranged in the folder 6 of the module 2.

[0075] In this module 2, if the width (e.g., diameter) of each electronic component 4 is Wφ, its center is O1, the distance between adjacent electronic components 4 is di (≧0) and their centers are O2, then the distance Wf between the centers O1-O2 can be expressed by Equation 1. Wf = Wi / 2 = (Wφ + di) / 2 Equation 1 In each of the component placement sections 16-1 and 16-2, the electronic components 4 are arranged with the distance Wf between the centers O1 and O2 as a unit.

[0076] In this formula 1, if di=0, formula 1 can be expressed as formula 2. Wf=Wφ / 2...Equation 2 In this case, the electronic components 4 are arranged in units of half the width of the electronic component 4 (=Wφ / 2) in each of the component placement sections 16-1 and 16-2.

[0077] In this embodiment, when looking at electronic components 4-1A and 4-1B on the component placement section 16-1 side and electronic component 4-2C on the component placement section 16-2 side, the centers O1 on the component placement section 16-1 side and the centers O2 on the component placement section 16-2 side are aligned with each other. In other words, the center O1 of electronic component 4-2C is aligned with the center O2 between electronic components 4-1A and 4-1B, and electronic components 4-1A, 4-1B and 4-2C are displaced and aligned with respect to each other by the distance Wf between the centers O1-O2.

[0078] Also, if di=0, the electronic components 4-1A, 4-1B and 4-2C can be arranged in units of at least half the width of the electronic component 4.

[0079] <Manufacturing of Module 2> The manufacture of the module 2 includes an electronic component acquisition process, a lead shaping process, a folder manufacturing process, a bus bar manufacturing process, a module assembly process, and the like.

[0080] Electronic component acquisition step: In this electronic component acquisition step, desired electronic components 4 for configuring the module 2 are acquired by selecting the electronic components 4 or by manufacturing the electronic components 4.

[0081] Lead shaping process: In the case where the positive electrode lead 34-1 and the negative electrode lead 34-2 in the polar electronic component 4 differ in length or shape, the positive electrode lead 34-1 and the negative electrode lead 34-2 are shaped to have the same length and in the same shape so as to be suitable for the module 2. This shaping process has already been described, so a detailed description is omitted.

[0082] Folder manufacturing process: In order to realize a module 2 using predetermined electronic components 4, a folder 6 having component placement sections 16-1, 16-2 and a bus bar placement section 18 is manufactured as a configuration suitable for this module 2. This folder 6 may be shaped using insulating synthetic resin.

[0083] Busbar manufacturing process: As with the folder 6, in order to realize a module 2 using predetermined electronic components 4, the positive busbar 8 and the negative busbar 10 are manufactured by shaping copper or aluminum plates to form a configuration suitable for this module 2. The shapes of these have already been described, so they will not be described here.

[0084] Module assembly process: This module assembly process includes a process of mounting the positive busbar 8 and the negative busbar 10, a process of mounting the electronic components 4, and a process of welding the leads. In the process of mounting the positive busbar 8 and the negative busbar 10, the positive busbar 8 and the negative busbar 10 are overlapped with the positive busbar 8 on the inside, and the positive electrode portion 40 and the negative electrode portion 42 are exposed and arranged alternately in an overlapped state. The positive busbar 8 and the negative busbar 10 in this overlapped state are mounted in the busbar arrangement portion 18 from the rear side of the folder 6.

[0085] After the positive bus bar 8 and the negative bus bar 10 are attached, five electronic components 4 are attached to component arrangement section 16-1 of folder 6, and four electronic components 4 are attached to component arrangement section 16-2. In this case, the five electronic components 4 in component arrangement section 16-1 have the same polarity arrangement, and the positive lead 34-1 of each electronic component 4 is arranged in the positive electrode portion 40 of the positive bus bar 8, and the negative lead 34-2 is arranged in the negative electrode portion 42 of the negative bus bar 10.

[0086] The four electronic components 4 in the component placement section 16-2 are inverted to have the same polarity arrangement, and similarly, the positive lead 34-1 of each electronic component 4 is arranged in the positive electrode portion 40 of the positive electrode bus bar 8, and the negative lead 34-2 is arranged in the negative electrode portion 42 of the negative electrode bus bar 10.

[0087] After the electronic components 4 are mounted, the positive electrode lead 34-1 of each electronic component 4 is welded to the positive electrode portion 40, and the negative electrode lead 34-2 of each electronic component 4 is welded to the negative electrode portion 42. For example, laser welding is used for this welding.

[0088] Through these steps, the module 2 shown in A of Fig. 1 can be manufactured. In this manufacturing method, nine electronic components 4 are connected in parallel on a folder 6 by welding to a positive bus bar 8 and a negative bus bar 10.

[0089] <Effects of the embodiment> According to this embodiment, any one of the following effects can be obtained.

[0090] (1) In folder 6, component placement section 16-1 is formed on one side of busbar placement section 18, and component placement section 16-2 is formed on the other side. Positive busbars 8 and negative busbars 10 are mounted in busbar placement section 18, and electronic components 4 are mounted in each of component placement sections 16-1, 16-2. Therefore, the thickness of module 2 is only slightly larger than the diameter of electronic components 4, for example, thereby preventing module 2 from becoming larger, and it is possible to easily mount positive busbars 8 and negative busbars 10 and electronic components 4 in folder 6.

[0091] (2) The positive electrode portions 40 of the positive busbars 8 mounted on the busbar arrangement portion 18 and the negative electrode portions 42 of the negative busbars 10 are arranged alternately in a row, and the positive electrode lead 34-1 can be connected to the positive electrode portions 40 and the negative electrode lead 34-2 can be connected to the negative electrode portions 42 in the shortest distance, so that an increase in inductance between the phases can be suppressed and potential fluctuations on the anode side relative to the negative electrode ground can be suppressed, thereby suppressing noise. Therefore, a module 2 with suppressed noise and inductance can be realized.

[0092] (3) The first busbar side portion 50-11 of the positive busbar 8 and the first busbar side portion 50-21 of the negative busbar 10, and the second busbar side portion 50-12 of the positive busbar 8 and the second busbar side portion 50-22 of the negative busbar 10 are each stacked and mounted in the busbar arrangement portion 18 of the folder 6, and each electronic component 4 can be mounted in a planar manner in the component arrangement portions 16-1, 16-2. This makes it possible to reduce the size and weight of the module 2 and facilitates the mounting of the electronic components 4 in the folder 6.

[0093] (4) The first busbar side portion 50-11 of the positive busbar 8 and the first busbar side portion 50-21 of the negative busbar 10, and the second busbar side portion 50-12 of the positive busbar 8 and the second busbar side portion 50-22 of the negative busbar 10 are each stacked and mounted in the busbar arrangement portion 18, and the positive electrode portion 40 and the negative electrode portion 42 are exposed from the busbar arrangement portion 18 and arranged alternately. Therefore, the positive electrode portion 40 and the positive electrode lead 34-1, and the negative electrode portion 42 and the negative electrode lead 34-2 can be easily welded together.

[0094] (5) The partition wall 22 separating each component arrangement section 16-1, 16-2 from the bus bar arrangement section 18 has a slit section 64 formed therein to allow the positive lead 34-1 and the negative lead 34-2 to pass therethrough. The wall of the slit section 64 has an inclined surface that expands outward. Therefore, during mounting, the positive lead 34-1 and the negative lead 34-2 of each electronic component 4 are positioned and guided through the slit section 64 to be placed in the positive electrode section 40 or the negative electrode section 42 to which they are to be connected.

[0095] (6) The positive electrode portion 40 of the positive electrode bus bar 8 and the negative electrode portion 42 of the negative electrode bus bar 10 are arranged in a planar manner and insulated by the separation wall 24, so that the positive electrode lead 34-1 to the positive electrode portion 40 and the negative electrode lead 34-2 to the negative electrode portion 42 can be connected by welding or the like either individually or simultaneously.

[0096] (7) The positive busbar 8, which is arranged in an overlapping state in the busbar arrangement section 18, is on the inside, and the positive electrode portion 40 and the negative electrode portion 42 are arranged in a row from the negative busbar 10. Therefore, the positive leads 34-1 and the negative leads 34-2 of the multiple electronic components 4 can be aligned and arranged on either side of the busbar arrangement section 18, thereby making it possible to efficiently mount the electronic components 4 and to miniaturize the module 2.

[0097] (8) The positive electrode portion 40 and the negative electrode portion 42 exposed to the bus bar arrangement portion 18 from the overlapping positive electrode bus bar 8 and the negative electrode bus bar 10 are separated and insulated by the separation wall 24, so that the positive electrode lead 34-1 and the negative electrode lead 34-2 of each electronic component 4 are maintained in a non-contact state on the bus bar, thereby improving the reliability of the connection.

[0098] (9) Since positive bus bar 8 and negative bus bar 10 are arranged in the same position in bus bar arrangement portion 18 with positive bus bar 8 on the inside, the area occupied by the bus bars in module 2 can be reduced.

[0099] (10) The first busbar side portion 50-11 and the second busbar side portion 50-12 of the positive busbar 8 are arranged between the first busbar side portion 50-21 and the second busbar side portion 50-22 of the opposing negative busbar 10. Therefore, by holding the negative busbar 10 at ground potential, the positive busbar 8 can be shielded by the negative busbar 10, and noise emitted from the positive side due to voltage fluctuations on the positive side can be suppressed.

[0100] (11) In the busbar arrangement section 18 of the folder 6, adjacent positive electrode sections 40 and negative electrode sections 42 are individually divided by the surrounding wall 20, the partition wall 22 and the separation wall 24. Therefore, simply by installing each positive electrode section 40 and negative electrode section 42 within the section defined by the surrounding wall 20, the partition wall 22 and the separation wall 24, the positive electrode busbar 8 and the negative electrode busbar 10 can be positioned at a predetermined position in the folder 6, and the positive electrode busbar 8 and the negative electrode busbar 10 can be held in the folder 6 without contacting each other.

[0101] (12) When the positive electrode leads 34-1 and negative electrode leads 34-2 of the electronic components 4 arranged in each of the component arrangement sections 16-1, 16-2 are connected to the positive electrode bus bar 8 and negative electrode bus bar 10 arranged in the bus bar arrangement section 18, the folder 6 is fixed to the electronic components 4 and the positive electrode bus bar 8 and the negative electrode bus bar 10 in a gripped state between each electronic component 4 and the positive electrode bus bar 8 and the negative electrode bus bar 10, and the electronic components 4 can be integrated with the folder 6, thereby improving the robustness of the module 2.

[0102] (13) The polarity discrimination marks 38 on the bottom surface 36 of each electronic component 4 can be used to distinguish differences and uniformity in the arrangement of each electronic component 4, making it easy to distinguish between the left and right directions of the electronic components 4 mounted in each component arrangement portion 16-1, 16-2 and between the positive lead 34-1 and the negative lead 34-2 and the positive electrode portion 40 and the negative electrode portion 42, and the like, thereby improving the reliability of the module 2.

[0103] (14) If the positive leads 34-1 of each electronic component 4 on component placement section 16-1 and component placement section 16-2 are connected to a common positive portion 40 and their negative leads 34-2 are connected to a common negative portion 42, the opposing electronic components 4 can be displaced by at least half of their width and arranged regularly, making it possible to standardize the arrangement of each electronic component 4 on the component placement section 16-1 side and the arrangement of each electronic component 4 on the component placement section 16-2 side, and thus making it possible to standardize and regularize the arrangement of each electronic component 4 on module 2. This makes it easier to check the arrangement and connection of electronic components 4 on module 2, thereby improving the reliability of module 2.

[0104] Other Embodiments The folder, module and manufacturing method thereof of the present disclosure include the following variations.

[0105] (1) Although a capacitor has been illustrated as an example of electronic component 4, other polar electronic components such as electrolytic capacitors, power storage devices such as batteries, diodes, transistors, etc. may be used instead of a capacitor, and in some cases electronic components such as resistors may also be included.

[0106] (2) The folder 6 has a first component placement section 16-1 on one side of the busbar placement section 18 and a second component placement section 16-2 on the other side, but may have either or both of the first component placement section 16-1 or the second component placement section 16-2 on at least one side of the busbar placement section 18.

[0107] (3) The holder 6 is made of insulating synthetic resin to achieve an insulating structure. However, the holder 6 may be made of a conductive material and an insulating layer may be formed on the surface of the conductive material to achieve an insulating structure.

[0108] (4) Although copper and aluminum are exemplified as good conductors for the positive bus bar 8 and / or the negative bus bar 10, other good conductors such as silver may be used.

[0109] (5) Although welding is used to connect electronic components 4 to positive bus bar 8 and / or negative bus bar 10, solder or a conductive adhesive may also be used.

[0110] As described above, the most preferred embodiment of the present disclosure has been described. The technology of the present disclosure is not limited to the above description. Various modifications and changes are possible for those skilled in the art based on the claims or the gist of the present disclosure. It goes without saying that such modifications and changes are included in the scope of the present disclosure. [Industrial Applicability]

[0111] According to the folder, busbar, module, and method of manufacturing the same disclosed herein, the folder is provided with a busbar arrangement section and a component arrangement section, and the positive and negative busbar pieces of the busbar are exposed and arranged alternately in the busbar arrangement section, so that the positive lead of each electronic component arranged in the component arrangement section can be arranged and connected to the positive busbar piece exposed from the folder, and the negative lead of the electronic component can be arranged and connected to the negative busbar piece, making it easy to mount the busbar and electronic components and improving noise resistance and inductance suppression. [Explanation of symbols]

[0112] 2 Electronic component module 4, 4-1A, 4-1B, 4-2C Electronic Components 6 Folders 7 Busbar 8 Positive busbar 10 Negative busbar 12 Positive terminal 14 Negative terminal section 16-1, 16-2 Parts placement section 18 Busbar arrangement section 20 Siege Wall 22 Partition Wall 24, 25 Separation wall 26 Locking part 28 Case part 30 Sealing part 32 Curved recess 34-1 Positive lead 34-2 Negative lead 36 Bottom part 38 Polarity discrimination mark 40 Positive electrode part (positive bus bar piece) 42 Negative electrode part (negative electrode bus bar piece) 44 Connection protrusion 46 Positive bus bar terminal 48 Negative bus bar terminal 50-1, 50-2 busbar frame 50-11, 50-21 First busbar side 50-12, 50-22 Second busbar side 52 Negative electrode arrangement section 54 Positive electrode placement section 56 Fitting recess 58-1, 58-2 First holding piece 60 Second holding piece 62 Through hole 64 Slit section

Claims

1. A folder comprising a busbar arrangement section for arranging busbars, in which positive busbar pieces for connecting a positive lead of an electronic component and negative busbar pieces for connecting a negative lead of the electronic component are exposed and arranged alternately on the busbar arrangement section.

2. The folder according to claim 1 , further comprising a component placement section on at least one side of the bus bar placement section.

3. The folder according to claim 1 , further comprising a slit portion in the busbar placement portion, and an electronic component lead is placed on the positive busbar piece or the negative busbar piece by passing through the slit portion.

4. 3. The folder according to claim 1, further comprising a first component placement section on one side of the busbar placement section and a second component placement section on the other side of the busbar placement section, wherein electronic components placed on the first component placement section and the second component placement section are opposed to each other across the busbar placement section, and wherein positive leads of the electronic components are placed on the common positive busbar piece and negative leads of the electronic components are placed on the common negative busbar piece.

5. 3. The folder according to claim 1, wherein the busbars include a positive busbar having a busbar side portion connected to the positive busbar piece, and a negative busbar having a busbar side portion connected to the negative busbar piece, and the busbar side portion of the positive busbar and the busbar side portion of the negative busbar are installed so as to overlap each other.

6. The folder of claim 1 or 2, wherein the busbar includes a first busbar side and a second busbar side that are opposed and connected by the positive busbar piece or the negative busbar piece.

7. 3. The folder according to claim 1, further comprising a separation wall disposed between the positive busbar piece and the negative busbar piece to provide insulation therebetween in the busbar arrangement section.

8. A positive bus bar; A negative bus bar; a positive bus bar piece provided for the positive bus bar and connected to a positive lead of an electronic component; a negative bus bar piece provided for the negative bus bar and arranged alternately with the positive bus bar piece and connected to a negative lead of the electronic component; Including, busbars.

9. The bus bar according to claim 8 , wherein the negative bus bar is arranged by overlapping the positive bus bar on the inside, and the positive bus bar piece is exposed from a through hole provided in the negative bus bar.

10. a folder including a component placement section on at least one side or both sides of a busbar placement section; A bus bar, a bus bar in which positive and negative bus bar pieces of the bus bar are alternately arranged and exposed in the bus bar arrangement portion; A plurality of electronic components arranged in the component placement section; Includes modules.

11. 11. The module according to claim 10, comprising a first component placement section on one side of the busbar placement section and a second component placement section on the other side of the busbar placement section, wherein the electronic components placed on the first component placement section and the second component placement section are placed facing each other with the busbar placement section in between, and the positive leads of the facing electronic components are connected to the common positive busbar piece and the negative leads are connected to the common negative busbar piece.

12. a step of installing the busbars by exposing the positive busbar pieces and the negative busbar pieces to the busbar arrangement portion of the folder and arranging them alternately; placing an electronic component in a component placement section of the folder, and placing a positive electrode lead on the positive busbar piece and a negative electrode lead on the negative busbar piece; welding the positive electrode lead to the positive electrode bus bar piece and the negative electrode lead to the negative electrode bus bar piece; A method for manufacturing a module comprising:

13. The method for manufacturing the module according to claim 12 , further comprising a manufacturing step of the folder including the bus bar arrangement portion and the component arrangement portion.

Images