Substrate processing device

Abstract

To provide a substrate processing device capable of preventing generated particles from adhering to a substrate, even if particles are generated in a support section.SOLUTION: A substrate processing device according to an embodiment comprises: a chamber; a conveyance section which is provided inside the chamber for conveying a substrate in a first direction; a pipe which is provided inside the chamber, faces the conveyance section, extends in a second direction intersecting the first direction, and is supplied with processing liquid; a plurality of nozzles which are provided inside the chamber and arranged side by side at predetermined intervals on a portion of the pipe facing the conveyance section; a holder which extends in the second direction, holds the pipe inside the chamber, and has both ends located outside the chamber; a support section which is provided outside the chamber for supporting each of both ends of the holder; and a drive section which reciprocates the holder supported by the support section in the second direction.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] Embodiments of the present invention relate to a substrate processing apparatus.

Background Art

[0002] There is an apparatus that supplies a processing liquid to the surface of a substrate used in a liquid crystal display or the like to process the substrate. For example, an apparatus has been proposed that sprays a processing liquid from a plurality of nozzles onto the surface of a substrate being conveyed by a conveying device to process the substrate. In such an apparatus, in order to supply the processing liquid evenly to the surface of the substrate, while reciprocating a member provided with a plurality of nozzles in a direction intersecting the conveying direction of the substrate, the processing liquid is sprayed from the plurality of nozzles onto the surface of the substrate. In this case, a support portion that supports the member provided with the plurality of nozzles is provided inside a chamber in which the substrate is conveyed. (For example, refer to Patent Document 1)

[0003] Here, when the member provided with the plurality of nozzles reciprocates, friction may occur between the member and the support portion, generating particles. In recent years, the size of substrates has been increasing, the size of the member provided with the plurality of nozzles has been increasing, and consequently, the weight of the member has been increasing. When the weight of the member increases, particles are more likely to be generated.

[0004] As described above, the support portion that supports the member provided with the plurality of nozzles is provided inside the chamber in which the substrate is conveyed. Therefore, when particles are generated in the support portion, the generated particles may adhere to the substrate being conveyed inside the same chamber. If particles adhere to the substrate, the processing quality may deteriorate. Therefore, even if particles are generated in the support portion, it has been desired to develop a substrate processing apparatus capable of suppressing the generated particles from adhering to the substrate.

Prior Art Documents

Patent Documents

[0005]

Patent Document No. 1

[0006] The problem to be solved by the present invention is to provide a substrate processing apparatus that can suppress the adhesion of generated particles to a substrate even if particles are generated in a support portion. MEANS FOR SOLVING THE PROBLEM

[0007] A substrate processing apparatus according to an embodiment includes a chamber, a transport unit provided inside the chamber for transporting a substrate in a first direction, a pipe provided inside the chamber, facing the transport unit, extending in a second direction intersecting the first direction, and to which a processing liquid is supplied, a plurality of nozzles provided inside the chamber at a predetermined interval side by side in a portion of the pipe facing the transport unit, a holder extending in the second direction, holding the pipe inside the chamber, and having both side ends provided outside the chamber, a support portion provided outside the chamber for supporting each of both side ends of the holder, and a drive unit for reciprocally moving the holder supported by the support portion in the second direction. EFFECTS OF THE INVENTION

[0008] According to an embodiment of the present invention, there is provided a substrate processing apparatus that can suppress the adhesion of generated particles to a substrate even if particles are generated in a support portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Mode for Carrying Out the Invention

[0010] Hereinafter, embodiments will be exemplified with reference to the drawings. In each drawing, the same reference numerals are given to the same components, and detailed descriptions are omitted as appropriate. Note that the arrows X, Y, and Z in each figure represent three mutually orthogonal directions. For example, the X direction (corresponding to an example of the first direction) can be the conveyance direction of the substrate.

[0011] FIG. 1 is a schematic plan view for exemplifying the substrate processing apparatus 1 according to the present embodiment. FIG. 2 is a plan view depicting the substrate processing apparatus 1 shown in FIG. 1 with the processing liquid supply unit 4 and the moving unit 5 omitted. FIG. 3 is a plan view depicting the substrate processing apparatus 1 shown in FIG. 1 with the transfer unit 3 omitted. Note that FIGS. 2 and 3 are reference drawings for making the configuration of the substrate processing apparatus 1 easier to understand. FIG. 4 is a cross-sectional view taken along line A-A of the substrate processing apparatus 1 in FIG. 1. FIG. 5 is a cross-sectional view taken along line B-B of the substrate processing apparatus 1 in FIG. 1.

[0012] As shown in FIGS. 1 to 5, the substrate processing apparatus 1 includes, for example, a chamber 2, a transfer unit 3, a processing liquid supply unit 4, and a moving unit 5.

[0013] As shown in FIGS. 1 and 5, the chamber 2 includes, for example, an inner wall portion 21, an outer wall portion 22, a bottom portion 23, and a ceiling portion 24. The inner wall portion 21 has a flat plate shape and extends in the X direction. A pair of inner wall portions 21 are provided side by side in the Y direction with a predetermined interval therebetween. The outer wall portion 22 has a flat plate shape and extends in the X direction. In the Y direction, the outer wall portion 22 is provided outside each of the pair of inner wall portions 21. The outer wall portion 22 and the inner wall portion 21 are provided side by side in the Y direction with a predetermined interval therebetween.

[0014] As shown in FIG. 5, the bottom portion 23 is provided between the inner wall portions 21 and below the transfer unit 3. That is, the bottom portion 23 is inside the chamber 2 and is provided on the side opposite to the pipe 41 side of the processing liquid supply unit 4 with respect to the transfer unit 3. The bottom portion 23 is provided so as to cover the region below the transfer unit 3. The bottom portion 23 receives the processing liquid 101 supplied from the upper surface of the substrate 100 by the plurality of nozzles 42 of the processing liquid supply unit 4 and discharged from the upper surface of the substrate 100.

[0015] In the Y direction, the central portion of the bottom portion 23 is located farther from the transfer unit 3 than the peripheral portion of the bottom portion 23. The bottom portion 23 is inclined in a direction away from the transfer unit 3 as it goes toward the central portion in the Y direction. A discharge port 23a is provided in the central portion of the bottom portion 23. In this way, the processing liquid 101 discharged from the upper surface of the substrate 100 and received by the bottom portion 23 can be collected in the central portion of the bottom portion 23 and discharged from the discharge port 23a. Therefore, the recovery efficiency of the processing liquid 101 can be improved.

[0016] Here, in recent years, the substrate 100 to be processed has been increasing in size. Therefore, the dimensions of the bottom portion 23 in the Y direction tend to become larger. When the dimensions of the bottom portion 23 in the Y direction become larger, it becomes difficult to attach the bottom portion 23 to the space between the inner wall portions 21 and 21, or to remove the bottom portion 23 from the space between the inner wall portions 21 and 21.

[0017] Therefore, as shown in FIG. 5, in the Y direction, the bottom portion 23 can be divided into a portion 23b and a portion 23c. For example, in the Y direction, the end portion of the portion 23c on the portion 23b side can be bent toward the conveying unit 3 side, and the vicinity of the end portion of the portion 23b on the portion 23b side can be placed on the bent end portion of the portion 23c. If the bottom portion 23 is divided in the Y direction, even if the dimensions of the bottom portion 23 become larger, the attachment and detachment of the bottom portion 23 become easy.

[0018] FIG. 6 is a schematic cross-sectional view for exemplifying a bottom portion 123 according to another embodiment. As shown in FIG. 6, the bottom portion 123 has a region 123a, a region 123b, and a region 123c. Note that the number of regions is not limited to three. The number of regions can be two or more. In the Y direction, the regions 123a, 123b, and 123c are provided side by side.

[0019] Each of the regions 123a, 123b, and 123c is provided with a discharge port 23a. In the region 123a, the discharge port 23a is provided on the central side of the region 123a in the Y direction. Similar to the case of the bottom portion 23 described above, the central side of the region 123a in the Y direction is located farther from the conveying unit 3 than the peripheral portion of the region 123a. The region 123a is inclined in a direction away from the conveying unit 3 as it goes toward the central side in the Y direction.

[0020] In region 123b, the discharge port 23a is provided on the central side of region 123b in the Y direction. The central side of region 123b in the Y direction is located farther from the transport unit 3 than the peripheral portion of region 123b. Region 123b is inclined in a direction away from the transport unit 3 as it goes toward the central side in the Y direction.

[0021] In region 123c, the discharge port 23a is provided on the central side of region 123c in the Y direction. The central side of region 123c in the Y direction is located farther from the transport unit 3 than the peripheral portion of region 123c. Region 123c is inclined in a direction away from the transport unit 3 as it goes toward the central side in the Y direction. Therefore, the processing liquid 101 received in each of regions 123a, 123b, and 123c is collected on the central side of each, and is discharged from the discharge port 23a provided on the central side of each.

[0022] In this case, as shown in FIG. 6, in the Y direction, the dimensions of each of regions 123a, 123b, and 123c are smaller than the dimensions of the bottom portion 23 described above. Therefore, the inclination angle in each of regions 123a, 123b, and 123c can be made larger than the inclination angle of the bottom portion 23. If the inclination angle becomes larger, in each of regions 123a, 123b, and 123c, the received processing liquid 101 can be efficiently collected and discharged from the discharge port 23a. Therefore, the recovery efficiency of the processing liquid 101 can be further improved.

[0023] Also, if the inclination angle in each of regions 123a, 123b, and 123c is made the same as the inclination angle of the bottom portion 23 described above, the dimensions of each of regions 123a, 123b, and 123c in the Z direction can be made smaller than the dimensions of the bottom portion 23. That is, the thinning of the bottom portion 123 can be achieved. On one hand, if the dimensions of each of region 123a, region 123b, and region 123c in the Z direction are made the same as the dimensions of the bottom portion 23 described above, the inclination angles of region 123a, region 123b, and region 123c can be made larger than the inclination angle of the bottom portion 23. That is, the discharge of the processing liquid can be made more efficient.

[0024] As shown in FIG. 5, the ceiling portion 24 is plate-shaped and covers the end portion of the chamber 2 on the side opposite to the bottom portion 23 side.

[0025] As shown in FIGS. 1, 2, 4, and 5, the transfer unit 3 is provided inside the chamber 2 and transfers the substrate 100 in the X direction. The transfer unit 3 is provided between the nozzle 42 of the processing liquid supply unit 4 and the bottom portion 23 of the chamber 2. The transfer unit 3 has, for example, a shaft 31, rollers 32, and a drive unit 33.

[0026] The shaft 31 is columnar and extends in one direction. The shaft 31 extends, for example, in the Y direction. The axial dimension of the shaft 31 can be appropriately changed according to the dimension of the substrate 100 in the Y direction, for example. A plurality of shafts 31 are provided. The plurality of shafts 31 can be arranged side by side in the X direction with a predetermined interval. The number and interval of the plurality of shafts 31 can be appropriately changed according to the dimension of the substrate 100 in the X direction. The shaft 31 can be, for example, a core material surface containing metal, carbon, etc. coated with resin (for example, PVC, PFA, PVDF).

[0027] The roller 32 is cylindrical and a plurality of rollers 32 can be provided for one shaft 31. The plurality of rollers 32 are arranged side by side in the Y direction with a predetermined interval. The number and interval of the plurality of rollers 32 can be appropriately changed according to the dimension of the substrate 100 in the Y direction.

[0028] The drive unit 33 can be provided, for example, in the space between the inner wall portion 21 and the outer wall portion 22 of the chamber 2. The drive unit 33 extends, for example, in the X direction. One end side of a plurality of shafts 31 in the Y direction is connected to the drive unit 33. The drive unit 33 rotates the plurality of shafts 31 in the same direction. By rotating the plurality of shafts 31 in the same direction, the plurality of rollers 32 rotate in the same direction, and thus the substrate 100 placed on the plurality of rollers 32 is conveyed in the X direction. The drive unit 33 can also perform operations such as starting the conveyance of the substrate 100, stopping the conveyance, changing the conveyance direction, and changing the conveyance speed. The drive unit 33 can include, for example, a motor and an inverter, or can include a control motor such as a servo motor.

[0029] The processing liquid supply unit 4 supplies the processing liquid 101 toward the upper surface of the substrate 100, recovers the processing liquid 101 discharged from the upper surface of the substrate 100 and received by the bottom portion 23, and supplies the recovered processing liquid 101 to the upper surface of the substrate 100 again. That is, the processing liquid supply unit 4 circulates and reuses the processing liquid 101 supplied to the upper surface of the substrate 100.

[0030] Here, the processing liquid 101 can be a chemical solution for processing the surface of the substrate 100 used for a liquid crystal display or the like. The processing liquid 101 can be, for example, an aqueous solution of hydrogen fluoride (also referred to as hydrofluoric acid, fluoric acid, etc.). The concentration of hydrogen fluoride in the aqueous solution of hydrogen fluoride is, for example, 5% or less.

[0031] In order to use such a processing liquid 101, among the elements provided in the chamber 2, the conveyance unit 3, the processing liquid supply unit 4, and the moving unit 5, the elements that come into contact with the processing liquid 101 and the elements that may come into contact with the processing liquid 101 are formed of a material having resistance to the processing liquid 101. For example, when the processing liquid 101 is an aqueous solution of hydrogen fluoride, these elements can be formed of resins such as PVC, PFA, and PVDF. Alternatively, these elements can also be formed of those in which the surface of a metal or the like is coated with the above-described resin or the like.

[0032] As shown in FIGS. 1, 3, 4, and 5, the processing liquid supply unit 4 has, for example, a pipe 41, a nozzle 42, a tank 43, a temperature control unit 44, a detection unit 45, a pump 46, a control valve 47, and a drain valve 48. The pipe 41 and the nozzle 42 are provided inside the chamber 2. The tank 43, the temperature control unit 44, the detection unit 45, the pump 46, the control valve 47, and the drain valve 48 can be provided, for example, outside the chamber 2.

[0033] The pipe 41 has a cylindrical shape and faces the conveying unit 3. The pipe 41 extends in a direction intersecting the X direction (corresponding to an example of the second direction). The direction intersecting the X direction is, for example, a direction orthogonal to the X direction (Y direction) or a direction inclined with respect to the X direction (a direction deviated from the Y direction). In FIGS. 1 and 3, the case of the direction orthogonal to the X direction (Y direction) is illustrated. The axial dimension of the pipe 41 can be appropriately changed according to, for example, the dimension of the substrate 100 in the Y direction. A plurality of pipes 41 can be provided. The plurality of pipes 41 are arranged side by side in the X direction, for example, with a predetermined interval. The number and interval of the plurality of pipes 41 can be appropriately changed according to, for example, the dimension of the substrate 100 in the X direction. For example, one end of the pipe 41 can be closed. The processing liquid 101 is supplied into the internal space of the pipe 41 from, for example, the other end side of the pipe 41.

[0034] A plurality of nozzles 42 can be provided for one pipe 41. The plurality of nozzles 42 can be provided at a portion of the pipe 41 facing the conveying unit 3. The plurality of nozzles 42 are arranged side by side in the direction in which the pipe 41 extends, with a predetermined interval. The number and interval of the plurality of nozzles 42 can be appropriately changed according to the dimension of the substrate 100 in the Y direction. For example, the nozzle 42 sprays the processing liquid 101 in a mist form toward the upper surface of the substrate 100. The nozzle 42 can be, for example, a conical nozzle, a fan-shaped nozzle, or the like. The nozzle 42 illustrated in FIGS. 4 and 5 is a conical nozzle.

[0035] The tank 43 is box-shaped and has a space for storing the processing liquid 101 inside. The tank 43 is provided in the lower space of the chamber 2 with a width from near one end of the chamber 2 to near the central part. The tank 43 stores the processing liquid 101 received by the bottom 23. An inflow part 43a1 is provided on the ceiling 43a of the tank 43. The inflow part 43a1 is provided in the tank 43 near the end on the central part side of the chamber 2. The inflow part 43a1 is connected to the discharge port 23a of the bottom 23 through, for example, a pipe or the like. The bottom surface 43b of the tank 43 is inclined with respect to, for example, the Y direction. More specifically, the bottom surface 43b is inclined so as to descend from one end side of the chamber 2 toward the central part side. In the Z direction, a discharge part 43b1 can be provided at the lowest part (the end on the inflow part 43a1 side) of the bottom surface 43b of the tank 43.

[0036] The discharge part 43b1 is a cylindrical pipe and bends at a right angle directly below the connection part with the tank 43. The bending direction is, for example, the direction of the other end of the chamber 2 (the left direction in the drawing). Also, the discharge part 43b1 is provided such that the edge on the other end side of the chamber 2 at the connection port of the discharge part 43b1 with the tank 43 coincides with the inner wall of the side surface 43d on the inflow part 43a1 side of the tank 43. Note that the discharge part 43b1 may be provided such that the upper end side of the horizontal part after bending at a right angle among the parts bent at a right angle is connected to the lower end part of the side surface 43d of the tank 43, and the remaining vertically oriented part is connected to the bottom surface 43b of the tank 43.

[0037] An outflow part 43c1 can be provided on the side surface 43c of the tank 43 on the side opposite to the side where the discharge port 23a is provided. The outflow part 43c1 is connected to the end of the pipe 41 on the side opposite to the closed side through, for example, a pipe 43c2 or the like.

[0038] The temperature control unit 44 controls so that the temperature of the processing liquid 101 stored inside the tank 43 is within a predetermined range. The temperature control unit 44 can be provided, for example, on the side surface 43d of the tank 43 on the side where the discharge port 23a is provided.

[0039] The temperature control unit 44 has, for example, a heating unit 44a and a pump 44b. The heating unit 44a and the pump 44b are provided outside the tank 43. The heating unit 44a and the pump 44b are connected between an outlet 43d1 and an inlet 43d2 provided on a side surface 43d of the tank 43 via a pipe 43d3 or the like.

[0040] The pump 44b causes the processing liquid 101 stored inside the tank 43 to flow from the outlet 43d1 toward the inlet 43d2.

[0041] The heating unit 44a heats the processing liquid 101 flowing from the outlet 43d1 toward the inlet 43d2. For example, the heating unit 44a heats the processing liquid 101 stored inside the tank 43 so that the temperature of the processing liquid 101 is within a predetermined range based on a signal from a temperature sensor (not shown) provided inside the tank 43.

[0042] The detection unit 45 detects the state of the processing liquid 101 stored inside the tank 43. The detection unit 45 detects, for example, the concentration of hydrogen fluoride contained in an aqueous solution of hydrogen fluoride and the concentration of contaminants generated by processing the upper surface of the substrate 100. The detection unit 45 can be, for example, a conductivity meter or the like.

[0043] The detection unit 45 is provided, for example, inside the tank 43. The detection unit 45 can be provided, for example, on the bottom surface 43b of the tank 43. In this case, if the detection unit 45 is provided in the vicinity of the heating unit 44a, the detection value from the detection unit 45 may be affected by noise from the heating unit 44a. Therefore, it is preferable that the distance between the detection unit 45 and the heating unit 44a is long. For example, as shown in FIG. 5, the detection unit 45 can be provided on the opposite side of the temperature control unit 44 with the central portion of the tank 43 interposed therebetween. For example, the detection unit 45 can be provided in the vicinity of a side surface 43c of the tank 43 that faces the side surface 43d where the heating unit 44a is provided.

[0044] The pump 46 is connected between the outflow portion 43c1 of the tank 43 and the end of the pipe 41 on the side opposite to the closed side. The pump 46 supplies the processing liquid 101 stored inside the tank 43 to the internal space of the pipe 41. The processing liquid 101 supplied to the internal space of the pipe 41 is supplied from the nozzle 42 to the upper surface of the substrate 100.

[0045] The control valve 47 is connected, for example, between the outflow portion 43c1 of the tank 43 and the pump 46. The control valve 47 controls at least either the flow rate or the pressure of the processing liquid 101 supplied to the internal space of the pipe 41 by the pump 46.

[0046] The drain valve 48 is connected, for example, to the discharge portion 43b1 of the tank 43. The drain valve 48 can be, for example, an on-off valve or the like. For example, when it is detected by the detection unit 45 that the concentration of contaminants contained in the processing liquid 101 has exceeded a predetermined value, maintenance for exchanging the processing liquid 101 can be performed. For example, the drain valve 48 can be opened to discharge the processing liquid 101 stored inside the tank 43. When the processing liquid 101 stored inside the tank 43 has been discharged, the drain valve 48 can be closed and a new processing liquid 101 can be supplied to the inside of the tank 43.

[0047] Here, as shown in FIGS. 4 and 5, the amount of the processing liquid 101 supplied to the region directly below between the nozzles 42 on the upper surface of the substrate 100 is less than the amount of the processing liquid 101 supplied to the region directly below the nozzle 42 on the upper surface of the substrate 100.

[0048] In this case, as shown in FIG. 4, the substrate 100 is conveyed in the X direction by the conveying unit 3. Therefore, the processing liquid 101 is supplied to the entire region of the upper surface of the substrate 100 in the X direction. However, if the substrate 100 is only conveyed in the X direction by the conveying unit 3, there will be areas with a large amount and areas with a small amount of the processing liquid 101 on the upper surface of the substrate 100 in the Y direction. That is, unevenness in the amount of the processing liquid 101 occurs on the upper surface of the substrate 100, and there is a risk that the processing quality will deteriorate.

[0049] Therefore, the substrate processing apparatus 1 according to the present embodiment is provided with a moving unit 5. As shown in FIG. 5, the moving unit 5 reciprocates the pipe 41 in a direction intersecting the X direction. The reciprocating distance can be, for example, about half the distance between the nozzles 42 in the direction in which the pipe 41 extends.

[0050] FIG. 7 is a schematic cross-sectional view for exemplifying the moving unit 5. Note that FIG. 7 is a cross-sectional view taken along the line C-C of the moving unit 5 in FIG. 3. As shown in FIG. 7, the moving unit 5 includes, for example, a holder 51, a support unit 52, a drive unit 53, and a seal unit 54.

[0051] The holder 51 extends in the direction in which the pipe 41 extends and holds the pipe 41 inside the chamber 2. Both end portions of the holder 51 are provided outside the chamber 2. The holder 51 includes, for example, a beam 51a, a pipe holding portion 51b, and an arm 51c. The beam 51a extends in the direction in which the pipe 41 extends. At least one beam 51a can be provided for a plurality of pipes 41. For example, as shown in FIG. 3, a pair of beams 51a can also be provided for a plurality of pipes 41.

[0052] A plurality of pipe holding portions 51b are provided at the end portion of the beam 51a on the side of the conveying unit 3. The plurality of pipe holding portions 51b are arranged side by side in the direction in which the beam 51a extends. A hole penetrating in the direction in which the beam 51a extends is provided in the plurality of pipe holding portions 51b, and the pipe 41 is attached inside the hole.

[0053] The arm 51c can be provided in a pair with respect to one beam 51a. The pair of arms 51c are provided at respective ends on both sides of the beam 51a. The arm 51c has, for example, a columnar shape and extends in the direction in which the beam 51a extends.

[0054] The beam 51a and the pipe holding portion 51b are provided inside the chamber 2 (inside the inner wall portion 21). The vicinity of the end of the arm 51c on the beam 51a side is provided inside the chamber 2 (inside the inner wall portion 21). The vicinity of the end of the arm 51c on the side opposite to the beam 51a side is provided outside the chamber 2 (outside the outer wall portion 22). The central portion of the arm 51c is provided inside the seal portion 54.

[0055] The support portion 52 is provided outside the chamber 2 (outside the outer wall portion 22). The support portion 52 supports respective ends (arms 51c) on both sides of the holder 51. The support portion 52 can be provided in a pair with respect to at least one beam 51a. Further, the support portion 52 supports the pipe 41 via the holder 51 and can change the position of the pipe 41 (nozzle 42) in a direction intersecting the X direction.

[0056] The support portion 52 has, for example, a linear motion portion 52a, a bracket 52b, and a housing 52c. The linear motion portion 52a can be a bearing capable of linear motion in a direction intersecting the X direction (orthogonal direction (Y direction) in the present embodiment). The linear motion portion 52a can be provided, for example, on a pedestal 22a provided on the outer wall portion 22 of the chamber 2.

[0057] The bracket 52b is provided on the linear motion portion 52a. As shown in FIG. 3, when a pair of beams 51a are provided for a plurality of pipes 41, one bracket 52b can be provided for the pair of beams 51a.

[0058] FIG. 8 is a schematic diagram for exemplifying the case where one bracket 52b is provided for a pair of beams 51a. As shown in FIG. 8, when one bracket 52b is provided for a pair of beams 51a, a pair of linear motion parts 52a are provided for one bracket 52b. If a pair of linear motion parts 52a are provided for one bracket 52b, when moving the position of the bracket 52b by a drive part 53 described later, it is possible to suppress the bracket 52b from tilting and the movement of the linear motion part 52a from deteriorating.

[0059] The housing 52c has a box shape and can be provided, for example, on a pedestal 22a provided on the outer wall part 22 of the chamber 2. The linear motion part 52a and the bracket 52b can be provided in the internal space of the housing 52c.

[0060] As shown in FIG. 7, the drive part 53 can be provided on one of the pair of support parts 52. The drive part 53 reciprocates the holder 51 supported by the support part 52 in a direction intersecting the X direction. FIG. 9 is a schematic diagram for exemplifying the operation of the support part 52 by the drive part 53. As shown in FIGS. 7 to 9, the drive part 53 has, for example, a guide 53a, an arm 53b, a roller 53c, and a motor 53d.

[0061] The guide 53a can be provided at the end of the bracket 52b on the side opposite to the linear motion part 52a side. A groove 53a1 extending in a direction orthogonal to the direction in which the beam 51a extends is provided at the end of the guide 53a on the side opposite to the bracket 52b side.

[0062] The arm 53b has a plate shape and extends in one direction. The roller 53c is provided on the surface of the arm 53b on the guide 53a side near one end of the arm 53b. The motor 53d is provided, for example, on the outer surface of the housing 52c. The shaft of the motor 53d is connected near the other end of the arm 53b inside the housing 52c.

[0063] That is, the guide 53a, the arm 53b, and the roller 53c constitute a crank mechanism. Therefore, the rotational motion of the motor 53d can be converted into a linear reciprocating motion.

[0064] If the rotational motion of the motor 53d can be converted into a linear reciprocating motion, as shown in FIG. 9, the bracket 52b of the support portion 52 can be reciprocated. As shown in FIG. 7, the bracket 52b is provided with a pipe 41 having a plurality of nozzles 42 via a holder 51. Therefore, when the bracket 52b reciprocates, the position of the pipe 41, and thus the positions of the plurality of nozzles 42, can be reciprocated.

[0065] Therefore, by the movement of the substrate 100 in the X direction by the transport unit 3 and the movement of the plurality of nozzles 42 in a direction intersecting the X direction by the drive unit 53, a processing liquid 101 of an approximately equal amount can be supplied to the entire area of the upper surface of the substrate 100. Therefore, it is possible to suppress unevenness in the amount of the processing liquid 101 on the upper surface of the substrate 100 and a decrease in processing quality.

[0066] Further, as shown in FIG. 7, the support portion 52 is provided outside the chamber 2 (outside the outer wall portion 22). Here, particles may be generated when the linear motion portion 52a operates. Even if the linear motion portion 52a is a rolling bearing, slippage cannot be eliminated, so the generation of particles cannot be completely eliminated. In this case, if the generated particles adhere to the substrate 100, the processing quality of the substrate 100 may deteriorate.

[0067] In the substrate processing apparatus 1 according to the present embodiment, since the support portion 52 is provided outside the chamber 2 (outside the outer wall portion 22), compared with the case where the support portion 52 is provided inside the chamber 2 (inside the inner wall portion 21), it is possible to suppress the intrusion of the generated particles into the inside of the chamber 2 (inside the inner wall portion 21). Therefore, it is possible to suppress the generated particles from adhering to the substrate 100, and thus it is possible to improve the processing quality of the substrate 100.

[0068] Here, as described above, the processing liquid 101 is a chemical solution such as an aqueous solution of hydrogen fluoride. Therefore, it is preferable to prevent a part of the processing liquid 101 sprayed on the upper surface of the substrate 100 from leaking to the outside of the chamber 2 (outside the outer wall portion 22). Also, as described above, particles may be generated when the linear motion portion 52a operates. Therefore, it is preferable to prevent the generated particles from entering the inside of the chamber 2 (inside the inner wall portion 21).

[0069] Therefore, the substrate processing apparatus 1 according to the present embodiment is provided with a seal portion 54. FIG. 10 is a schematic enlarged view of a portion D in FIG. 7. FIG. 11 is a schematic enlarged view of a portion E in FIG. 10. As shown in FIG. 7, the arm 51c of the reciprocating holder 51 extends between the inside of the inner wall portion 21 of the chamber 2 and the outside of the outer wall portion 22. In this case, if the arm 51c is in contact with at least either the inner wall portion 21 or the outer wall portion 22 of the chamber 2, particles will be generated when the arm 51c reciprocates. Therefore, a gap is provided between the arm 51c and the inner wall portion 21 and the outer wall portion 22 of the chamber 2. However, if a gap is provided, leakage of the above-described processing liquid 101 and intrusion of particles are likely to occur.

[0070] Therefore, as shown in FIG. 7, the seal portion 54 is provided in a region of the chamber 2 through which the arm 51c of the holder 51 is inserted. One seal portion 54 can be provided for one arm 51c.

[0071] As shown in FIG. 7, the seal portion 54 has, for example, a container 54a, a capture plate 54b, a pressure applying portion 54c, and a storage portion 54d. The container 54a is provided between the inner wall portion 21 and the outer wall portion 22 of the chamber 2, and the holder 51 (arm 51c) is inserted therethrough. The container 54a has a cylindrical shape, and end plates 54a1 are provided at both ends. As shown in FIG. 10, the end plate 54a1 is provided with a hole 54a2 penetrating in the thickness direction. A slight gap is provided between the inner wall of the hole 54a2 and the arm 51c. Therefore, when the arm 51c reciprocates, it is possible to suppress the generation of particles due to rubbing between the inner wall of the hole 54a2 and the arm 51c. However, if a gap is provided, the mist-like processing liquid 101 may enter the inside of the container 54a through the gap.

[0072] Therefore, as shown in FIG. 7, a capture plate 54b is provided at a portion of the arm 51c located inside the container 54a. The capture plate 54b is provided inside the container 54a and the holder 51 (arm 51c) is inserted therethrough. The mist-like processing liquid 101 that has entered the inside of the container 54a is captured by the capture plate 54b and drips inside the container 54a. The processing liquid 101 that has dripped inside the container 54a is discharged to the inside of the chamber 2 (between the inner wall portion 21 and the outer wall portion 22) through a discharge hole 54a3 provided on the lower surface of the container 54a.

[0073] As shown in FIGS. 7 and 10, the pressure applying portion 54c is provided on the outer wall portion 22 of the chamber 2. The pressure applying portion 54c closes a hole 22b in which the container 54a of the outer wall portion 22 is provided. As shown in FIG. 10, the pressure applying portion 54c is provided with a hole 54c1 through which the arm 51c is inserted. A slight gap is provided between the inner wall of the hole 54c1 and the arm 51c. Therefore, when the arm 51c reciprocates, it is possible to suppress the generation of particles due to rubbing between the inner wall of the hole 54c1 and the arm 51c.

[0074] However, if a gap is provided, there is a possibility that particles generated when the linear motion portion 52a operates may enter the inside of the chamber 2 (inside the inner wall portion 21) through the gap and the internal space of the container 54a. There is also a possibility that the mist-like processing liquid 101 inside the container 54a may leak to the outside through the gap.

[0075] Therefore, as shown in FIG. 10, seal gas G is supplied through a pipe to a hole 54c2 provided above the pressure application portion 54c. The seal gas G can be, for example, dry air or the like.

[0076] As shown in FIG. 11, the seal gas G supplied to the gap between the pressure application portion 54c and the arm 51c through the hole 54c2 of the pressure application portion 54c and the hole 54d1a of the storage portion 54d described later flows along the arm 51c toward the inside of the chamber 2 and the outside of the pressure application portion 54c. Therefore, it is possible to suppress the intrusion of the processing liquid 101 from the inside of the chamber 2 and the intrusion of particles from the outside of the pressure application portion 54c. As shown in FIG. 10, the seal gas G supplied from the hole 54c2 provided above the pressure application portion 54c is discharged from a hole 54c2a provided below the pressure application portion 54c.

[0077] Also, it is preferable that the pressure in the gap between the portion of the pressure application portion 54c through which the holder 51 (arm 51c) is inserted and the holder 51 (arm 51c) is slightly higher than the pressure of the environment in which the substrate processing apparatus 1 is provided (for example, atmospheric pressure). In this way, as shown in FIG. 11, the flow of the seal gas G toward the inside of the chamber 2 and the flow of the seal gas G toward the outside of the pressure application portion 54c can be formed more reliably, so that the intrusion of the processing liquid 101 and particles can be suppressed more reliably. The environmental pressure is not limited to the pressure of the environment in which the substrate processing apparatus 1 is provided. For example, it can also be the pressure of the environment in which the processing of the substrate 100 in the chamber 2 is performed. In short, it is the pressure of the environment outside the pressure application portion 54c, and it is only necessary to set the pressure in the gap between the portion of the pressure application portion 54c through which the holder 51 (arm 51c) is inserted and the holder 51 (arm 51c) to be higher than this pressure.

[0078] Also, as shown in FIGS. 10 and 11, a storage portion 54d can be provided in the pressure application portion 54c. The storage portion 54d is, for example, embedded in the inner wall of the hole 54c1 of the pressure application portion 54c.

[0079] The storage part 54d has, for example, a main body part 54d1 and a flange part 54d2. The main body part 54d1 is cylindrical. The flange part 54d2 is annular and is provided at each of both ends of the main body part 54d1 in the direction in which the arm 51c extends.

[0080] As shown in FIG. 11, the gap between the inner wall of the cylindrical main body part 54d1 and the arm 51c can be made the same as, for example, the gap between the inner wall of the hole 54c1 of the pressure applying part 54c and the arm 51c. The gap between the inner wall of the annular flange part 54d2 and the arm 51c can be made smaller than, for example, the gap between the inner wall of the cylindrical main body part 54d1 and the arm 51c. In this case, the inner wall of the flange part 54d2 and the arm 51c are likely to come into contact with each other. Therefore, the material of the flange part 54d2 is preferably formed from a material that generates few particles due to rubbing, has high resistance to the processing liquid 101, and has self-lubricity. The flange part 54d2 can be formed from, for example, a fluororesin or the like.

[0081] Also, a plurality of holes 54d1a penetrating between the inner wall and the outer wall can be provided in the main body part 54d1. The holes 54d1a communicate with the holes 54c2 of the pressure applying part 54c. Therefore, the seal gas G supplied to the holes 54c2 of the pressure applying part 54c is supplied to the space surrounded by the main body part 54d1, the flange part 54d2, and the arm 51c through the holes 54d1a, and then flows toward the inside of the chamber 2 and the outside of the pressure applying part 54c. Therefore, the flow of the seal gas G can be stabilized.

[0082] The embodiments have been exemplified above. However, the present invention is not limited to these descriptions. Regarding the above-described embodiments, those in which those skilled in the art have appropriately made design changes are also included in the scope of the present invention as long as they have the features of the present invention. Also, the elements included in each of the above-described embodiments can be combined as much as possible, and those obtained by combining these are also included in the scope of the present invention as long as they include the features of the present invention.

Explanation of Symbols

[0083] 1 Substrate processing apparatus, 2 Chamber, 3 Conveyor, 4 Processing liquid supply unit, 5 Moving unit, 21 Inner wall part, 22 Outer wall part, 23 Bottom, 31 Shaft, 32 Roller, 41 Pipe, 42 Nozzle, 43 Tank, 44 Temperature control unit, 45 Detection unit, 46 Pump, 51 Holder, 51a Beam, 51b Pipe holding part, 51c Arm, 52 Support part, 53 Driving unit, 54 Seal part, 54a Container, 54b Capture plate, 54c Pressure applying part, 54d Reservoir part, 100 Substrate, 101 Processing liquid

Claims

1. A chamber having an outer wall portion; a transport unit provided inside the chamber and configured to transport a substrate in a first direction; a pipe provided inside the chamber, facing the transfer unit, extending in a second direction intersecting the first direction, and through which a processing liquid is supplied; a plurality of nozzles provided inside the chamber and arranged at predetermined intervals on a portion of the pipe facing the conveying unit; a holder extending in the second direction, holding the pipe inside the chamber, and having both ends outside the chamber; a support portion provided outside the chamber and supporting both end portions of the holder; a drive unit that reciprocates the holder supported by the support unit in the second direction; A substrate processing apparatus comprising:

2. a pressurized portion provided on the outer wall portion of the chamber and through which the holder is inserted; The substrate processing apparatus according to claim 1 , wherein the pressurizing unit makes a pressure in a gap between the holder and a portion of the pressurizing unit through which the holder is inserted higher than an environmental pressure.

3. a container provided between the inner wall portion and the outer wall portion of the chamber and through which the holder is inserted; a capture plate provided inside the container and through which the holder is inserted; Furthermore, 3. The substrate processing apparatus according to claim 1, wherein the atomized processing liquid that has entered the inside of the container is captured by the capturing plate and drips into the inside of the container.

4. a bottom portion provided inside the chamber on the opposite side of the transfer unit from the pipe side, the bottom portion receiving the processing liquid supplied from the plurality of nozzles toward the substrate; a tank for storing the treatment liquid received at the bottom; a pump that supplies the treatment liquid stored in the tank to the pipe; The substrate processing apparatus according to claim 1 or 2, further comprising:

5. a detection unit provided inside the tank and detecting a state of the treatment liquid stored in the tank; a temperature control unit that controls the temperature of the treatment liquid stored in the tank; Furthermore, 5. The substrate processing apparatus according to claim 4, wherein the detection unit is provided on the opposite side of the temperature control unit across the central portion of the tank.

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