Laser beam machining device and laser beam machining method

Abstract

To provide a laser beam machining device and a laser beam machining method capable of performing machining by accurately irradiating a target position with a laser beam.SOLUTION: A laser beam machining device 100 includes a laser beam emitting unit 10 that emits a laser beam L toward a wiring pattern 2 that is a target object, a visible-light imaging unit 20 that acquires a visible-light image 50v by imaging a visualization member 50 that generates a position specification visible-light Lv at a position where the laser beam L is emitted, and a control unit 60 that performs laser machining of the wiring pattern 2 by adjusting a relative position between an emitted position of the laser beam L and the wiring pattern 2 such that the laser beam L is emitted to the wiring pattern 2 on the basis of a position of the position specification visible-light Lv captured in the visible-light image 50v.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a laser processing apparatus and a laser processing method, and more particularly to a laser processing apparatus and a laser processing method that adjust the irradiation position of laser light based on a visible light image. [Background technology]

[0002] BACKGROUND ART Conventionally, a laser processing apparatus and a laser processing method are known that adjust the irradiation position of laser light based on a visible light image (see, for example, Patent Document 1).

[0003] Patent Document 1 discloses a laser processing device that forms a processed groove on a wafer by irradiating the wafer with laser light along a street, which is the target position for processing. Patent Document 1 uses UV (ultraviolet light) with a wavelength of 400 nm or less, outside the visible light range, as the laser used for processing. The laser processing device of Patent Document 1 also performs alignment detection by capturing an image of the wafer with a digital camera and detecting the position of the street, which is the target position, based on the captured visible light observation image. The laser processing device of Patent Document 1 then uses the alignment detection result obtained based on the visible light observation image to align the optical axis of a focusing lens with one end of the street to be processed, thereby aligning the processing position where the laser light is irradiated. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2022-17863 Summary of the Invention [Problem to be solved by the invention]

[0005] As described above, Patent Document 1 discloses a configuration for aligning a processing position where laser light is irradiated by aligning the optical axis of a condenser lens with one end of a street on a workpiece using alignment detection results obtained based on a visible light observation image. However, the irradiation position of the laser irradiation light may change over time and due to changes in ambient temperature, which may cause the actual irradiation position of the laser light to deviate from the target irradiation position. In this case, if a laser processing device aligns the processing position by laser light irradiation using alignment detection results obtained based on a visible light observation image, as in Patent Document 1, it is considered that it cannot detect changes in the irradiation position of laser light, such as infrared laser light, which is not visible in the visible light image. Therefore, if alignment is performed without taking into account changes in the irradiation position of the laser light, the laser light may not be irradiated at the target irradiation position, particularly when the workpiece is very small, resulting in insufficient processing of the workpiece. Therefore, a laser processing device and a laser processing method are desired that can accurately irradiate infrared laser light at the target position to process the workpiece.

[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a laser processing apparatus and a laser processing method that are capable of precisely irradiating infrared laser light onto a target position to perform processing. [Means for solving the problem]

[0007] In order to achieve the above object, a laser processing apparatus according to a first aspect of the present invention includes a laser light irradiation unit that irradiates an infrared laser light toward an object, a visible light imaging unit that acquires a visible light image by imaging a visualization member that generates position-identifying visible light at the position irradiated with the infrared laser light, and a control unit that adjusts the relative position of the infrared laser light irradiation position and the object based on the position of the position-identifying visible light that appears in the visible light image so that the infrared laser light is irradiated onto the object, thereby performing laser processing of the object.

[0008] A laser processing device according to a first aspect of the present invention includes a control unit that adjusts the relative position of the infrared laser light irradiation position and the object so that the infrared laser light is irradiated on the object based on the position of the position-identifying visible light captured in the visible light image, thereby performing laser processing of the object. This makes it possible to confirm the irradiation position of the infrared laser light, which normally cannot be imaged by the visible light imaging unit, using the position-identifying visible light, and then adjust the relative position of the infrared laser light irradiation position and the object to an appropriate position. As a result, it is possible to accurately irradiate the infrared laser light at the target position and perform processing.

[0009] In the laser processing apparatus according to the above aspect, the control unit is preferably configured to acquire a positional relationship between a target position to be irradiated with the infrared laser light and an actual irradiation position based on the position of the position-identifying visible light captured in the visible light image, and thereby adjust the relative position of the irradiation position of the infrared laser light and the object so that the infrared laser light is irradiated onto the object. With this configuration, the position of the infrared laser light, which cannot normally be imaged by the visible light imaging unit, can be acquired using the position-identifying visible light, and the positional relationship, such as the deviation from the target position, can be acquired. As a result, information on how much the position should be adjusted can be acquired based on the positional relationship, and the relative position of the irradiation position of the infrared laser light and the object can be adjusted so that the object is appropriately irradiated with the infrared laser light.

[0010] In this case, the control unit is preferably configured to acquire the positional relationship based on the position of the position-identifying visible light shown in the visible light image and a reference position set in the visible light image. With this configuration, the positional relationship between the actual irradiation position of the infrared laser light and the reference position can be easily acquired by image processing. As a result, the relative position of the irradiation position of the infrared laser light and the target object can be easily adjusted.

[0011] In the laser processing device that acquires the positional relationship based on the position of the position-identifying visible light shown in the visible light image and a reference position set in the visible light image, the control unit is preferably configured to acquire corrected processing position information by correcting processing position information set for processing the object based on the positional relationship, and to adjust the relative position of the irradiation position of the infrared laser light and the object based on the acquired corrected processing position information so that the object is irradiated with infrared laser light. With this configuration, corrected processing position information can be acquired by correcting the processing position information set for processing the object based on the position-identifying visible light that indicates the laser light irradiation position. As a result, even if the laser light irradiator fails to irradiate the infrared laser light at the target position, the infrared laser light can be appropriately irradiated onto the object at the target position based on the corrected processing position information.

[0012] The laser processing apparatus according to the above aspect preferably further includes a stage on which the object and the visualization member are placed and which moves the positions of the visible light image capture unit and the visualization member relative to each other, wherein the control unit, when acquiring a visible light image, moves the stage so that the visualization member is positioned so that it is captured by the visible light image capture unit, and, when irradiating the object with infrared laser light, moves the stage so that the object is positioned so that it can be irradiated with the infrared laser light. With this configuration, since the visualization member is also placed on the stage on which the object is placed, correction processing for position adjustment and laser processing of the object can be performed smoothly.

[0013] The laser processing apparatus according to the above aspect preferably further includes an alignment camera that captures an image of the object to confirm the processing position on the object, and the alignment camera also serves as a visible light image capture unit. With this configuration, it is possible to obtain a visible light image for adjusting the relative position between the infrared laser light irradiation position and the object using the alignment camera for confirming the processing position, without providing a separate camera for adjusting the infrared laser light irradiation position. As a result, the apparatus can be made more compact.

[0014] The laser processing method according to this second aspect includes a visible light image acquisition step of acquiring a visible light image by imaging a visualization member that generates visible light for position identification at a position irradiated with infrared laser light, an adjustment step of adjusting the relative position between the irradiation position of the infrared laser light and the object based on the position of the visible light for position identification that appears in the visible light image so that the infrared laser light is irradiated onto the object, and a processing step of processing the object by irradiating it with infrared laser light.

[0015] As described above, the laser processing method according to the second aspect includes an adjusting step of adjusting the relative position between the irradiation position of the infrared laser light and the object based on the position of the position-identifying visible light captured in the visible light image so that the infrared laser light is irradiated onto the object, and a processing step of processing the object by irradiating the infrared laser light. This makes it possible to confirm the irradiation position of the infrared laser light, which cannot normally be imaged by the visible light imaging unit, using the position-identifying visible light, and then adjust the relative position between the irradiation position of the infrared laser light and the object to an appropriate position. As a result, it is possible to provide a laser processing method that can accurately irradiate the laser light at the target position to process the object. [Effects of the Invention]

[0016] According to the present invention, as described above, it is possible to provide a laser processing apparatus and a laser processing method that are capable of irradiating a target position with infrared laser light with high precision. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is a diagram showing a configuration of a laser processing apparatus according to an embodiment; [Figure 2] FIG. 2 is a diagram illustrating an object on a wafer according to an embodiment. [Figure 3] 1 is a flowchart illustrating a process of a laser processing method according to an embodiment. [Figure 4] 10A and 10B are diagrams for explaining a visualization member imaged by an alignment camera according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0019] [Embodiment] The configuration of a laser processing apparatus 100 according to this embodiment will be described with reference to FIG.

[0020] (Configuration of laser processing equipment) 1, the laser processing apparatus 100 includes a laser light irradiation unit 10, a mirror 11, a visible light camera 20, a mirror 21, a visible light illuminator 30, a mirror 31, a stage 40, a moving mechanism 41, a visualization member 50, and a control unit 60. In the drawing, the left-right direction of the laser processing apparatus 100 (one direction in a horizontal plane) is defined as the X direction. The up-down direction (vertical direction) of the laser processing apparatus 100 is defined as the Z direction. The direction perpendicular to the X and Z directions of the laser processing apparatus 100 (the other direction in a horizontal plane) is defined as the Y direction.

[0021] The laser light irradiation unit 10 is a light source that emits laser light L of a near-infrared wavelength (near-infrared light), for example, a wavelength of 780 nm or more and less than 2500 nm, and is configured to irradiate the laser light L onto the wiring pattern 2 of the wafer 1, which is the processing target. Note that the laser light L cannot be captured by a visible light imaging system such as a visible light camera 20. The laser light irradiation unit 10 is controlled by the control unit 60 and configured to intermittently emit the laser light L so that the irradiation time intervals are uniform. The spot diameter of the laser light L irradiated onto the wiring pattern 2 provided on the wafer 1, which is the processing target, is, for example, 3 μm. The laser light L is an example of "infrared laser light" in the claims.

[0022] The mirror 11 is, for example, a half mirror capable of reflecting and transmitting light with wavelengths in the infrared region, and has the function of reflecting part of the laser light L and transmitting part of it. The mirror 11 is also arranged so as to be able to reflect the laser light L so as to change the traveling direction of the laser light L by 90°. As a result, the laser light L emitted from the laser light emitting unit 10 in the X2 direction is reflected by the mirror 11 and irradiated in the Z2 direction. Furthermore, part of the laser light L reflected in the Z1 direction by the reflecting mirror 70 is transmitted through the mirror 11 in the Z1 direction. In this embodiment, the positional relationship and angle between the laser light emitting unit 10 and the mirror 11 are fixed.

[0023] The visible light camera 20 may be, for example, a digital camera, and is capable of capturing magnified images of the wafer 1 and the wiring pattern 2. The visible light camera 20 includes an internal imaging element (not shown) that is sensitive to light of visible wavelengths. The visible light camera 20 is also provided with an infrared filter (not shown) that blocks laser light L from entering the lens. This allows the visible light camera 20 to capture an image of the wafer 1, etc., reflected by the mirror 21, and obtain a visible light image 50v (see FIG. 4 ) showing the visualization member 50. The visible light camera 20 is also used for alignment detection to confirm the processing position of the wiring pattern 2 to be processed. The visible light camera 20 is an example of a "visible light imaging unit" or "alignment camera" in the claims.

[0024] The mirror 21 is disposed so as to allow reflected light reflected from the wafer 1 or the like to enter the visible light camera 20. The mirror 21 is, for example, a dichroic mirror that transmits light with wavelengths in the infrared region and reflects light with wavelengths in the visible region. Therefore, the mirror 21 transmits the laser light L irradiated from the Z1 direction and can reflect the visible light reflected from the Z2 direction so as to change the traveling direction of the reflected light by 90° in the Y direction.

[0025] The visible light illuminator 30 is a lighting device that irradiates light of at least visible wavelengths. The visible light illuminator 30 is configured to continuously irradiate visible light. The mirror 31 is, for example, a dichroic mirror that transmits light with wavelengths in the infrared region and reflects light with wavelengths in the visible region. The mirror 31 is also a half mirror for visible light, and has the function of reflecting and transmitting part of the visible light. Therefore, the mirror 31 transmits the laser light L irradiated from the Z1 direction in the Z2 direction, reflects the visible light irradiated from the X1 direction by the visible light illuminator 30 so as to change the traveling direction to the Z2 direction, and transmits the reflected visible light reflected from the Z2 direction in the Z1 direction.

[0026] The stage 40 has a flat top plate on which the wafer 1 can be placed. A visualization member 50 is fixed to the side of the stage 40 by a fastening member (not shown) or the like. The stage 40 also includes a movement mechanism 41, which is configured to be movable at least in the X and Y directions. This allows the movement mechanism 41, controlled by the control unit 60, to move the relative positions of the laser light L and the wafer 1 placed on the top plate of the stage 40.

[0027] The visualization member 50 is a member that generates position-identifying visible light Lv (see FIG. 4) at the position irradiated with the laser light L in order to identify the position irradiated with the laser light L. The visualization member 50 is configured to absorb and retain the light energy as electrons using the principle of electron trapping by irradiating a paint applied to the surface with short-wavelength light such as visible light. The visualization member 50 is also configured to excite the retained electrons and emit them as visible light by irradiating the paint with light such as near-infrared light, which has a longer wavelength than visible light. As a result, when irradiated with the laser light L, the visualization member 50 emits position-identifying visible light Lv (see FIG. 4) at the irradiated position Lc (see FIG. 4). The visualization member 50 also reflects the laser light L without transmitting it. The visualization member 50 is a replaceable member when deterioration such as surface burn-in occurs due to irradiation with the laser light L, and is replaced after a predetermined irradiation time, a predetermined number of irradiations, or periodically.

[0028] The control unit 60 includes, for example, a CPU (Central Processing Unit) as a processor, a ROM (Read Only Memory), a RAM (Random Access Memory), a GPU (Graphics Processing Unit), etc. The control unit 60 is configured to execute a program (software) to perform various controls of the laser light irradiation unit 10, the visible light camera 20, and the moving mechanism 41 in accordance with a laser processing process flow (see FIG. 3) described later. Details of the control performed by the control unit 60 will be described later.

[0029] (Laser processing method) Next, a laser processing method in this embodiment for irradiating a target position with laser light L with high precision will be described with reference to Figures 1 to 4. The following description will be given in accordance with the process flow of the laser processing method shown in Figure 3, which is executed by the control unit 60. In this embodiment, the series of steps S1 to S5 described above is performed, for example, every time the wafer 1 to be processed is replaced.

[0030] In this embodiment, as shown in FIG. 2, which is an enlarged view of the wafer 1 placed on the stage 40, the wafer 1 includes a wiring pattern 2 on its surface. The wiring pattern 2 is, for example, a pattern having a width of 10 μm in the X direction and 1 μm in the Y direction, and is electrically connected. Depending on the circuit configured on the surface of the wafer 1, it may be necessary to cut the wiring pattern 2. In this case, the control unit 60 stores the coordinates of a target point P, which is the center of gravity of the wiring pattern 2, acquired in advance as processing position information for performing laser processing by irradiating the wiring pattern 2 with laser light L to cut the wiring pattern 2. The wafer 1 includes multiple wiring patterns 2 (not shown), and the control unit 60 stores the coordinates of the multiple target points P in advance as laser processing position information.

[0031] The control unit 60 executes the following process when the operator inputs a command to start laser processing. First, as a movement step of step S1, the control unit 60 controls the movement mechanism 41 to move the stage 40 so that the laser light L emitted from the laser light emitting unit 10 is irradiated onto the visualization member 50. At this time, the visualization member 50 is positioned so that the laser light L reflected by the mirror 11 and irradiated in the Z2 direction is irradiated onto the center position (reference position) of the visualization member 50. At this point, the laser light emitting unit 10 is not emitting the laser light L. Then, the process proceeds to step S2.

[0032] Next, in step S2, a visible light image acquisition step, the control unit 60 acquires a visible light image 50v and acquires the position of the position-identifying visible light Lv. Specifically, the control unit 60 first turns on the visible light illuminator 30 and starts irradiating the laser light L using the laser light irradiator 10. The irradiation power (output) of the laser light L in step S2 is, for example, approximately 10% of the irradiation power used when actually processing the wiring pattern 2. At this time, the control unit 60 also causes the visible light camera 20 to capture the position-identifying visible light Lv emitted by the visualization member 50 via the mirror 31, thereby acquiring a visible light image 50v as shown in FIG. 4. In this embodiment, the control unit 60 acquires the visible light image 50v so that the center of the visualization member 50 coincides with the center of the visible light image 50v. The process then proceeds to step S4.

[0033] In the positional relationship acquisition step of step S3, the control unit 60 acquires the positional relationship of the irradiation position Lc of the laser light L with respect to the imaging area of ​​the visible light camera 20. Here, when the laser light irradiator 10 irradiates the laser light L at the center position of the visualization member 50 as intended, the irradiation position Lc, which is the center of the position-identifying visible light Lv, is displayed at the position of center point c1, which indicates the center position of the visualization member 50 and is located at the center of the visible light image 50v captured by the visible light camera 20. On the other hand, for example, if the laser light L irradiated by the laser light irradiator 10 shifts due to ambient temperature or the passage of time, as shown in FIG. 4, the irradiation position Lc, which is the center of the position-identifying visible light Lv in the visible light image 50v, is displayed at a position of coordinates (xa, ya) with respect to the center point c1. That is, the laser light L is irradiated with a shift of xa in the X direction and ya in the Y direction with respect to the target irradiation position (center point c1). Note that xa is a negative value and ya is a positive value. At this time, the control unit 60 acquires this amount of deviation as positional relationship information, and then proceeds to the processing of step S4.

[0034] In the processing position information correcting step of step S4, the control unit 60 corrects the coordinates of multiple target points P stored as laser processing position information based on the positional relationship information, and acquires corrected processing position information. Specifically, when the coordinates of the target point P stored as laser processing position information are (Px, Py), the control unit 60 acquires corrected coordinates (Px-xa, Py-ya) as corrected laser processing position information. Note that, if there is multiple pieces of stored laser processing position information, the above correction is made to each coordinate. Note that this processing position information correcting step is an example of an "adjusting step" in the claims. Thereafter, the process proceeds to step S5.

[0035] As the processing step of step S5, the control unit 60 controls the laser light irradiation unit 10 and the movement mechanism 41 to move the stage 40 so that the target point P of the wiring pattern 2 is located at the position of the corrected coordinates (Px-xa, Py-ya) acquired as the corrected processing position information. In addition, the control unit 60 performs laser processing such as cutting the wiring pattern 2 by irradiating it with laser light L. This completes the laser processing process.

[0036] (Effects of this embodiment) Next, the effects of this embodiment will be described.

[0037] The laser processing apparatus 100 of the above embodiment includes a control unit 60 that adjusts the relative position between the irradiation position Lc of the laser light L and the wiring pattern 2 so that the laser light L is irradiated onto the wiring pattern 2 based on the position of the position-identifying visible light Lv captured in the visible light image 50v, thereby performing laser processing of the wiring pattern 2. This makes it possible to confirm the irradiation position Lc of the laser light L, which cannot normally be captured by the visible light camera 20, using the position-identifying visible light Lv, and then adjust the relative position between the irradiation position Lc of the laser light L and the wiring pattern 2 to an appropriate position. As a result, the laser light L can be accurately irradiated onto the target position to perform processing.

[0038] In the above embodiment, the control unit 60 is configured to acquire the positional relationship between the target position to be irradiated with the laser light L and the actual irradiation position Lc based on the position of the position-identifying visible light Lv captured in the visible light image 50v, and thereby adjust the irradiation position Lc of the laser light L so that the laser light L is irradiated onto the wiring pattern 2. This makes it possible to acquire the irradiation position Lc of the laser light L, which cannot normally be captured by the visible light camera 20, using the position-identifying visible light Lv, and to acquire the positional relationship, such as the deviation from the target position. As a result, information on how much the position should be adjusted can be acquired based on the positional relationship, and therefore the relative position of the irradiation position Lc of the laser light L and the wiring pattern 2 can be adjusted so that the laser light L is appropriately irradiated onto the wiring pattern 2.

[0039] In the above embodiment, the control unit 60 is configured to acquire the positional relationship based on the position of the position-identifying visible light Lv in the visible light image 50v and a center point c1, which is a reference position set in the visible light image 50v. This makes it possible to easily acquire the positional relationship between the actual irradiation position Lc of the laser light L and the center point c1, which is the reference position, through image processing. As a result, the relative position between the irradiation position Lc of the laser light L and the wiring pattern 2 can be easily adjusted.

[0040] Furthermore, in the above embodiment, the control unit 60 is configured to acquire corrected processing position information obtained by correcting processing position information set for processing the wiring pattern 2 based on the positional relationship, and to adjust the irradiation position Lc of the laser light L based on the acquired corrected processing position information so that the laser light L is irradiated onto the wiring pattern 2. This makes it possible to acquire corrected processing position information obtained by correcting the processing position information set for processing the wiring pattern 2 based on the position-identifying visible light Lv that indicates the irradiation position Lc of the laser light L. As a result, even when the laser light irradiation unit 10 fails to irradiate the infrared laser light onto the target position, the laser light L can be appropriately irradiated onto the target object, which is the target position, based on the corrected processing position information.

[0041] Furthermore, the above embodiment further includes a stage 40 on which the wiring pattern 2 and the visualization member 50 are arranged and which moves the positions of the visible light camera 20 and the visualization member 50 relative to one another, and when acquiring a visible light image 50v, the control unit 60 moves the stage 40 so that the visualization member 50 is positioned so that it can be seen by the visible light camera 20, and when irradiating the wiring pattern 2 with laser light L, the control unit 60 moves the stage 40 so that the wiring pattern 2 is positioned so that it can be irradiated with the laser light L. With this configuration, the visualization member 50 is also arranged on the stage 40 on which the wafer 1 including the wiring pattern 2 is placed, so that correction processing for position adjustment and laser processing of the wiring pattern 2 can be performed smoothly.

[0042] In the above embodiment, the visible light camera 20 that captures an image of the wiring pattern 2 in order to confirm the processing position of the wafer 1 including the wiring pattern 2 also serves as the visible light imaging unit. With this configuration, it is possible to acquire a visible light image 50v for adjusting the irradiation position Lc of the laser light L using the visible light camera 20 for confirming the processing position, without providing a separate camera for positioning the irradiation position Lc of the laser light L. As a result, the laser processing apparatus 100 can be made smaller.

[0043] [Variations] The present invention is not limited to the above embodiments, but is illustrated by the claims, and includes all modifications within the scope of the claims.

[0044] For example, in the above embodiment, the control unit 60 acquires the positional relationship between the target position to be irradiated with the laser light L and the actual irradiation position Lc based on the position of the position-identifying visible light Lv shown in the visible light image 50v, and thereby adjusts the relative position of the irradiation position Lc of the laser light L and the wiring pattern 2 so that the laser light L is irradiated onto the wiring pattern 2. However, the present invention is not limited to this. In the present invention, for example, the positional relationship between the position of the position-identifying visible light Lv shown in the visible light image 50v and a mark provided on the visualization member 50 may be acquired, and the irradiation position Lc of the laser light L may be adjusted based on the positional relationship so that the laser light L is irradiated onto the wiring pattern 2.

[0045] In the above embodiment, the control unit 60 is configured to obtain the positional relationship based on the position of the position-identifying visible light Lv in the visible light image 50v and the center point c1, which is a reference position set at the center of the visible light image 50v, but the present invention is not limited to this. In the present invention, the reference position set in the visible light image 50v does not have to be the center point c1, and the reference position may be set anywhere as long as the coordinates of the reference position can be identified.

[0046] In the above embodiment, the control unit 60 acquires corrected processing position information obtained by correcting processing position information set for processing the wiring pattern 2 based on the positional relationship, and adjusts the irradiation position Lc of the laser light L based on the acquired corrected processing position information so that the laser light L is irradiated onto the wiring pattern 2. However, the present invention is not limited to this. In the present invention, for example, when processing is performed at a position confirmed in the visible light image 50v without setting processing position information, such as when there are few processing locations, the control unit 60 may irradiate the laser light L at a position adjusted to correspond to the positional relationship acquired by confirming the visible light image 50v, without acquiring the corrected processing position information.

[0047] Furthermore, in the above embodiment, an example has been shown in which the stage 40 is further provided on which the wiring pattern 2 and the visualization member 50 are arranged and which moves the positions of the visible light camera 20 and the visualization member 50 relative to one another, and the control unit 60 moves the stage 40 so that the visualization member 50 is positioned so as to be captured by the visible light camera 20 when acquiring the visible light image 50v, and moves the stage 40 so that the wiring pattern 2 is positioned so as to be irradiated with the laser light L when irradiating the wiring pattern 2 with laser light L, but the present invention is not limited to this. In the present invention, for example, the visualization member 50 may be provided separately from the stage 40, and may be positioned so as to be captured by the visible light camera 20 when acquiring the visible light image 50v.

[0048] In the above embodiment, an example has been shown in which the visible light camera 20 that captures an image of the wiring pattern 2 in order to confirm the processing position of the wafer 1 including the wiring pattern 2 is also used as the visible light imaging unit, but the present invention is not limited to this. In the present invention, an imaging device may be provided separately from the visible light camera 20.

[0049] In the above embodiment, an example has been shown in which the processing position information for the wiring pattern 2 provided on the wafer 1 is corrected every time the wafer 1 is replaced, but the present invention is not limited to this. In the present invention, the processing position information may be corrected at any timing, for example, every predetermined time or every time the control unit 60 is started. In addition, the object to be processed by the laser processing device 100 is not limited to the wiring pattern 2 provided on the wafer 1, and may be any material that can be melted by the energy of the laser light L.

[0050] Furthermore, in the above embodiment, an example has been shown in which the position of the laser light emitting unit 10 is fixed and the position of the stage 40 is changed by the moving mechanism 41 to change the irradiation position Lc of the laser light L, but the present invention is not limited to this. For example, the present invention may be configured such that a galvano control system consisting of a galvanometer mirror and an fθ lens is provided on the optical axis of the laser light L emitted from the laser light emitting unit 10, and the irradiation position Lc of the laser light L is changed by changing the orientation (angle) of the galvanometer mirror.

[0051] In the above embodiment, the laser light L emitted from the laser light irradiation unit 10 is near-infrared light, but the present invention is not limited to this. In the present invention, the laser light L emitted from the laser light irradiation unit 10 may be mid-infrared light with a wavelength of 2500 to 4000 nm, or may be far-infrared light with a wavelength of 4000 nm or more.

[0052] Furthermore, in the above embodiment, an example was shown in which the visible light image 50v was acquired so that the center of the visualization member 50 coincided with the center of the visible light image 50v, but the present invention is not limited to this. In the present invention, it is sufficient that the visualization member 50 appears in the visible light image 50v. If the center of the visible light image 50v does not coincide with the center of the visualization member 50, the positional relationship information may be corrected, for example, by providing a mark on the visualization member 50 for acquiring the positional relationship and acquiring the positional relationship of the irradiation position Lc of the laser light L with respect to the mark provided on the visualization member 50. [Explanation of symbols]

[0053] 1 wafer 2 Wiring (object) 10 Laser light irradiation unit 20 Alignment camera (visible light imaging unit) 30 visible light illumination 40 stages 50 Visualization components 50v visible light image 60 Control Unit L Laser light (infrared laser light) Lc: Irradiation position of infrared laser light Lv Position-specific visible light P target point

Claims

1. a laser light irradiation unit that irradiates an infrared laser light toward an object; a visible light imaging unit that captures an image of a visualization member that generates position-identifying visible light at a position irradiated with the infrared laser light, thereby acquiring a visible light image; and a control unit that adjusts the relative position of the infrared laser light irradiation position and the object so that the infrared laser light is irradiated onto the object based on the position of the position-identifying visible light that appears in the visible light image, thereby performing laser processing of the object.

2. 2. The laser processing device according to claim 1, wherein the control unit is configured to acquire a positional relationship between a target position to be irradiated with the infrared laser light and an actual irradiation position based on a position of the position-identifying visible light reflected in the visible light image, and thereby adjust a relative position between the irradiation position of the infrared laser light and the object so that the infrared laser light is irradiated onto the object.

3. 3. The laser processing device according to claim 2, wherein the control unit is configured to acquire the positional relationship based on a position of the position-identifying visible light shown in the visible light image and a reference position set in the visible light image.

4. 4. The laser processing device according to claim 3, wherein the control unit is configured to acquire corrected processing position information obtained by correcting processing position information set for processing the object based on the positional relationship, and to adjust the relative position between the irradiation position of the infrared laser light and the object based on the acquired corrected processing position information so that the infrared laser light is irradiated onto the object.

5. a stage on which the object and the visualization member are placed and which moves the positions of the visible light imaging unit and the visualization member relative to one another; 2. The laser processing apparatus according to claim 1, wherein, when acquiring the visible light image, the control unit moves the stage so that the visualization member is positioned so that it appears in the visible light imaging unit, and, when irradiating the object with the infrared laser light, moves the stage so that the object is positioned so that it can be irradiated with the infrared laser light.

6. 2. The laser processing apparatus according to claim 1, further comprising an alignment camera that captures an image of the object to confirm a processing position of the object, the alignment camera also serving as the visible light image capturing unit.

7. a visible light image acquisition step of acquiring a visible light image by capturing an image of a visualization member that generates visible light for position identification at a position irradiated with the infrared laser light; an adjusting step of adjusting a relative position between the irradiation position of the infrared laser light and the object based on a position of the position-identifying visible light shown in the visible light image so that the infrared laser light is irradiated onto the object; a processing step of processing the object by irradiating the object with the infrared laser light.

Images