Heat dissipation structure and electronic device

The heat dissipation structure for in-vehicle devices addresses the challenge of miniaturization by using a rail-and-rib system to efficiently transfer heat from the substrate to the case, ensuring effective heat dissipation and reducing component stress.

JP2026096296APending Publication Date: 2026-06-15NEC PLATFROMS LTD
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Patent Information

Application Number
JP2024210008
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-12-03
Publication Date
2026-06-15

AI Technical Summary

Technical Problem

Existing cooling structures for in-vehicle electronic devices, such as ECUs and TCUs, face challenges in miniaturization due to the size of the mechanism for flowing cooling air, which can damage components and hinder efficient heat dissipation.

Method used

A heat dissipation structure featuring a case with rails for substrate insertion, a cover with ribs for clamping, and heat dissipation components that allow efficient heat transfer from the substrate to the case, using materials with lower Young's modulus to reduce stress and facilitate smooth insertion.

Benefits of technology

The structure efficiently dissipates heat from the electronic circuit board to the outside, minimizing component damage and enabling device miniaturization while maintaining high heat dissipation efficiency.

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Abstract

The present invention provides a heat dissipation structure and electronic device having a structure that can efficiently dissipate the heat generated by an electronic circuit board from the case to the outside. [Solution] The heat dissipation structure of the present disclosure is a heat dissipation structure for an electronic device that houses a substrate on which an electronic circuit is mounted, and comprises a case in which rails for guiding the insertion of the substrate are arranged inside, and a cover provided with ribs for clamping and positioning the substrate, wherein the rails have steps configured to push up the substrate after it has been inserted into the case, and the case is configured to come into contact with the heat dissipation components provided on the substrate when the substrate is pushed up.
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